DS14C232
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SNLS076C – OCTOBER 1999 – REVISED APRIL 2013
DS14C232 Low Power +5V Powered TIA/EIA-232 Dual Driver/Receiver
Check for Samples: DS14C232
FEATURES
DESCRIPTION
•
The DS14C232 is a low power dual driver/receiver
featuring an onboard DC to DC converter, eliminating
the need for ±12V power supplies. The device only
requires a +5V power supply. ICC is specified at 3.0
mA maximum, making the device ideal for battery
and power conscious applications. The drivers' slew
rate is set internally and the receivers feature internal
noise filtering, eliminating the need for external slew
rate and filter capacitors. The device is designed to
interface data terminal equipment (DTE) with data
circuit-terminating equipment (DCE). The driver
inputs and receiver outputs are TTL and CMOS
compatible. DS14C232C driver outputs and receiver
inputs meet TIA/EIA-232-E (RS-232) and CCITT V.28
standards.
1
2
•
•
•
•
•
•
•
•
Pin Compatible with Industry Standard
MAX232, LT1081, ICL232 and TSC232
Single +5V Power Supply
Low Power—ICC 3.0 mA Maximum
DS14C232C Meets TIA/EIA-232-E (RS-232) and
CCITT V.28 Standards
CMOS Technology
Receiver Noise Filter
Package Efficiency—2 Drivers and 2 Receivers
Available in Plastic DIP, Narrow and Wide
SOIC Packages
TIA/EIA-232 Compatible Extended Temperature
Range Option:
– DS14C232T −40°C to +85°C
– DS14C232E/J: −55°C to +125°C
Connection Diagram
Figure 1. 16-Pin PDIP (See NFG Package)- Top View
16-Pin SOIC (See D Package)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
DS14C232
SNLS076C – OCTOBER 1999 – REVISED APRIL 2013
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Functional Diagram
Figure 2. Functional Block Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings (1) (2)
−0.3V to 6V
Supply Voltage, VCC
V+ Pin
(VCC − 0.3)V to +14V
V− Pin
+0.3V to −14V
−0.3V to (VCC + 0.3V)
Driver Input Voltage
(V+ + 0.3V) to (V− − 0.3V)
Driver Output Voltage
Receiver Input Voltage
±25V
−0.3V to (VCC + 0.3V)
Receiver Output Voltage
Junction Temperature
+150°C
Maximum Package Power Dissipation @ 25°C (3)
NFG Package
1698 mW
D Package
1156 mW
Short Circuit Duration, DOUT
Continuous
−65°C to +150°C
Storage Temp. Range
Lead Temp. (Soldering, 4 sec.)
+260°C
ESD Rating
≥ 2.5 kV
(HBM, 1.5 kΩ, 100 pF)
(1)
(2)
(3)
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be verified. They are not meant to imply
that the devices should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Specifications for the 883 version of this product are listed separately on the following pages.
Ratings apply to ambient temperature at +25°C. Above this temperature derate: NFG Package 15.6 mW/°C, and D Package
10.6 mW/°C.
Recommended Operating Conditions
Min
Max
Units
4.5
5.5
V
DS14C232C
0
+70
°C
DS14C232T
−40
+85
°C
Supply Voltage, VCC
Operating Free Air Temp. (TA)
Electrical Characteristics (1)
Over recommended operating conditions, unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ (2)
Max
Unit
s
DC TO DC CONVERTER CHARACTERISTICS
V+
Positive Power Supply
RL = 3 kΩ, C1–C4 = 1.0 μF, DIN = 0.8V
9.0
V
V−
Negative Power Supply
RL = 3 kΩ, C1–C4 = 1.0 μF, DIN = 2.0V
−8.5
V
ICC
Supply (VCC) Current
No Load
1.0
3.0
mA
DRIVER CHARACTERISTICS
VIH
High Level Input Voltage
2
VCC
V
VIL
Low Level Input Voltage
GND
0.8
V
IIH
High Level Input Current
VIN ≥ 2.0V
−10
+10
μA
IIL
Low Level Input Current
VIN ≤ 0.8V
−10
+10
μA
VOH
High Level Output Voltage
RL = 3 kΩ
5.0
VOL
Low Level Output Voltage
RL = 3 kΩ
(1)
(2)
8.0
−7.0
V
−5.0
V
Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
unless otherwise specified.
All typicals are given for VCC = 5.0V.
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Electrical Characteristics(1) (continued)
Over recommended operating conditions, unless otherwise specified
Symbol
Parameter
Conditions
See
(3)
Min
Typ (2)
Max
Unit
s
−30
−15
−5.0
mA
11
30
mA
IOS+
Output High Short Circuit
Current
VO = 0V, VIN = 0.8V
IOS−
Output Low Short Circuit
Current
VO = 0V, VIN = 2V
5.0
RO
Output Resistance
−2V ≤ VO ≤ +2V,
VCC = 0V = GND
300
Ω
RECEIVER CHARACTERISTICS
VTH
Input High Threshold
Voltage
VTL
Input Low Threshold
Voltage
VHY
Hysteresis
RIN
Input Resistance
IIN
Input Current
VOH
High Level Output Voltage
VOL
(3)
Low Level Output Voltage
VCC = 5.0V
1.9
2.4
V
VCC = 5.0V ±10%
1.9
2.6
V
0.8
1.5
0.2
0.4
1.0
V
3.0
4.7
7.0
kΩ
VIN = +15V
+2.14
+3.75
+5.0
mA
VIN = +3V
+0.43
+0.64
+1.0
mA
VIN = −3V
−1.0
−0.64
−0.43
mA
VIN = −15V
−5.0
−3.75
−2.14
mA
VIN = −3V, IO = −3.2 mA
3.5
4.5
VIN = −3V, IO = −20 μA
4.0
4.9
−15V ≤ VIN ≤ +15V
VIN = +3V, IO = +3.2 mA
0.15
V
V
V
0.4
V
IOS+ and IOS− values are for one output at a time. If more than one output is shorted simultaneously, the device power dissipation may
be exceeded.
Switching Characteristics
Over recommended operating conditions, unless otherwise specified.
Symbol
Parameter
Conditions
Min Typ Ma
x
Units
1.0
4.0
μs
1.0
4.0
μs
0.1
1.0
μs
30
V/μs
DRIVER CHARACTERISTICS
tPLH
Propagation Delay Low to
High
tPHL
Propagation Delay High to
Low
tSK
Skew |tPLH − tPHL|
RL = 3 kΩ
CL = 50 pF
(Figure 5, Figure 6)
See
(1)
SR1
Output Slew Rate
RL = 3 kΩ to 7 kΩ, CL = 50 pF
SR2
Output Slew Rate
RL = 3 kΩ, CL = 2500 pF
4.0
4.5
V/μs
RECEIVER CHARACTERISTICS
tPLH
Propagation Delay Low to
High
Input Pulse Width > 10 μs
2.9
6.5
μs
tPHL
Propagation Delay High to
Low
CL = 50 pF
2.5
6.5
μs
tSK
Skew |tPLH − tPHL|
(Figure 7, Figure 8)
0.4
2.0
μs
tnw
Noise Pulse Width Rejected (Figure 7, Figure 8)
0.7
0.5
μs
(1)
4
Slew rate is defined as ΔV/Δt, measured between ±3V level.
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Absolute Maximum Ratings (1) (2)
−0.3V to 6V
Supply Voltage, VCC
V+ Pin
(VCC − 0.3)V to +14V
V− Pin
+0.3V to −14V
−0.3V to (VCC + 0.3V)
Driver Input Voltage
(V+ + 0.3V) to (V− − 0.3V)
Driver Output Voltage
Receiver Input Voltage
±25V
−0.3V to (VCC + 0.3V)
Receiver Output Voltage
Maximum Package Power Dissipation @ 25°C (3)
NFE Package
1520 mW
NAJ Package
2000 mW
Short Circuit Duration, DOUT
Continuous
−65°C to +150°C
Storage Temp. Range
Lead Temp. (Soldering, 4 sec.)
+260°C
ESD Rating
≥ 2.5 kV
(HMB, 1.5 kΩ, 100 pF)
(1)
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be verified. They are not meant to imply
that the devices should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
For complete Military Product Specifications, refer to the appropriate SMD or MDS.
Ratings apply to ambient temperature at +25°C. Above this temperature derate: NFE Package 12.2 mW/°C and NAJ Package
13.3 mW/°C.
(2)
(3)
Recommended Operating Conditions
Supply Voltage, VCC
Min
Max
Units
4.5
5.5
V
−55
+125
°C
Operating Free Air Temp. (TA)
DS14C232E/J
Electrical Characteristics (1)
Over recommended operating conditions, unless otherwise specified
Symbol
Parameter
Conditions
Min
Max
Units
8.0
mA
DEVICE CHARACTERISTICS (C1–C4 = 1.0 μF)
ICC
Supply (VCC) Current
No Load
DRIVER CHARACTERISTICS
VIH
High Level Input Voltage
VIL
Low Level Input Voltage
IIH
High Level Input Current
VIN ≥ 2.0V
IIL
Low Level Input Current
VIN = 0V
VOH
High Level Output Voltage
RL = 3 kΩ
VOL
Low Level Output Voltage
RL = 3 kΩ
IOS+
Output High Short Circuit
Current
VO = 0V
IOS−
Output Low Short Circuit
Current
VO = 0V
RO
Output Resistance
−2V ≤ VO ≤ +2V, TA = 25°C,
VCC = 0V = GND
(1)
(2)
2
V
0.8
V
100
μA
100
μA
5.0
V
−5.0
See
(2)
−25
25
300
V
mA
mA
Ω
All typicals are given for VCC = 5.0V.
IOS+ and IOS− values are for one output at a time. If more than one output is shorted simultaneously, the device power dissipation may
be exceeded.
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Electrical Characteristics(1) (continued)
Over recommended operating conditions, unless otherwise specified
Symbol
Parameter
Conditions
Min
Max
Units
3.0
V
RECEIVER CHARACTERISTICS (C1–C4 = 1.0 μF)
VTH
Input High Threshold Voltage
VTL
Input Low Threshold Voltage
VHY
Hysteresis
RIN
Input Resistance
VOH
High Level Output Voltage
VOL
Low Level Output Voltage
0.2
V
TA = 25°C, +125°C
0.1
1.0
TA = −55°C
0.05
1.0
V
VIN = ±3V and ±15V, TA = 25°C
3.0
7.0
kΩ
IO = −3.2 mA
3.5
IO = −20 μA
4.0
IO = +3.2 mA
V
V
V
0.4
V
Switching Characteristics
Over recommended operating conditions, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Max
Units
4.0
μs
4.0
μs
DRIVER CHARACTERISTICS (C1–C4 = 1.0 μF)
tPLH
Propagation Delay Low to High
tPHL
Propagation Delay High to Low
tSK
Skew |tPLH − tPHL|
SR1
Output Slew Rate
RL = 3 kΩ, CL = 50 pF
RL = 3 kΩ to 7 kΩ, CL = 2500 pF
(Figure 5, Figure 6)
See
(1)
1.5
1.0
μs
30
V/μs
RECEIVER CHARACTERISTICS (C1–C4 = 1.0 μF)
tPLH
Propagation Delay Low to High
Input Pulse Width > 10 μs
8.0
μs
tPHL
Propagation Delay High to Low
CL = 50 pF
8.0
μs
tSK
Skew |tPLH − tPHL|
(Figure 7, Figure 8)
2.0
μs
(1)
Slew rate is defined as ΔV/Δt, measured between ±3V level.
Connection Diagrams
Figure 3. 16-Lead CDIP
See NFE Package
Figure 4. 20-Lead LCCC
See NAJ Package
For Complete Military Product Specifications see MDS or SMD
6
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SNLS076C – OCTOBER 1999 – REVISED APRIL 2013
Parameter Measurement Information
Figure 5. Driver Load Circuit
Figure 6. Driver Switching Waveform
Figure 7. Receiver Load Circuit
A.
Receiver AC input waveform for test purposes: tr = tf = 200 ns, VIH = 3V, VIL = −3V, f = 30 kHz.
Figure 8. Receiver Propagation Delays and Noise Rejection
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PIN DESCRIPTIONS
VCC (Pin 16)
Power supply pin for the device, +5V (±10%).
V+ (Pin 2)
Positive supply for TIA/EIA-232-E drivers. Recommended external capacitor: C4-1.0 μF (6.3V). Capacitor value should be larger than 1 μF.
This supply is not intended to be loaded externally.
V− (Pin 6)
Negative supply for TIA/EIA-232-E drivers. Recommended external capacitor: C3-1.0 μF (16V). Capacitor value should be larger than 1 μF.
This supply is not intended to be loaded externally.
C1+, C1− (Pins 1, 3)
External capacitor connection pins. Recommended capacitor: 1.0 μF (6.3V). Capacitor value should be larger than 1 μF.
C2+, C2− (Pins 4, 5)
External capacitor connection pins. Recommended capacitor: 1.0 μF (16V). Capacitor value should be greater than 1 μF.
DIN1, DIN2 (Pins 11, 10)
Driver input pins are TTL/CMOS compatible. Inputs of unused drivers may be left open, an internal active pull-up resistor (500 kΩ minimum,
typically 5 MΩ) pulls input HIGH. Output will be LOW for open inputs.
DOUT1, DOUT2 (Pins 14, 7)
Driver output pins conform to TIA/EIA-232-E levels.
RIN1, RIN2 (Pins 13, 8)
Receiver input pins accept TIA/EIA-232-E input voltages (±25V). Receivers feature a noise filter and specified hysteresis of 100 mV.
Unused receiver input pins may be left open. Internal input resistor 4.7 kΩ pulls input low, providing a failsafe high output.
ROUT1, ROUT2 (Pins 12, 9)
Receiver output pins are TTL/CMOS compatible. Receiver output HIGH voltage is specified for both CMOS and TTL load conditions.
GND (Pin 15)
Ground Pin.
8
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TYPICAL APPLICATION INFORMATION
Figure 9. Application of DS14C232 and INS8250
Figure 10. Typical Connection Diagram
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Typical Performance Characteristics
DRIVER VOH & VOL vs
POWER SUPPLY VOLTAGE
DRIVER SLEW RATE
vs
POWER
SUPPLY VOLTAGE & LOAD
CAPACITANCE
Figure 11.
Figure 12.
VCC = 5.0V, RL = 3 kΩ, CL = 15 pF (includes jig and probe
capacitance), CP = 1 μF
Ta = 25°C, RL = 5 kΩ, CP = 1 μF, ƒ = 30 KHz
Figure 13.
Figure 14.
SR = 6V/t1 or 6V/t2, whichever is greater.
S1 = 2.0V, VO = VOL
Figure 15.
10
Figure 16.
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 10
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PACKAGE OPTION ADDENDUM
www.ti.com
5-Oct-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS14C232CM
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
0 to 70
DS14C232CM
DS14C232CM/NOPB
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
0 to 70
DS14C232CM
DS14C232CMX/NOPB
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
0 to 70
DS14C232CM
DS14C232CN/NOPB
OBSOLETE
PDIP
NFG
16
TBD
Call TI
Call TI
0 to 70
DS14C232CN
DS14C232TM
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
-40 to 85
DS14C232TM
DS14C232TM/NOPB
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
-40 to 85
DS14C232TM
DS14C232TMX
NRND
SOIC
D
16
TBD
Call TI
Call TI
-40 to 85
DS14C232TM
DS14C232TMX/NOPB
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
-40 to 85
DS14C232TM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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5-Oct-2016
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
NFG0016E
N0016E
N16E (Rev G)
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