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DS250DF810
SNLS513C – DECEMBER 2015 – REVISED OCTOBER 2019
DS250DF810 25 Gbps Multi-Rate 8-Channel Retimer
1 Features
2 Applications
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Octal-channel multi-rate retimer with integrated
signal conditioning
All channels lock independently from 20.2752 to
25.8 Gbps (including sub-rates like 10.3125 Gbps,
12.5 Gbps, and more)
Ultra-low latency: 10 MHz, sinusoidal
TrampVDD
VDD supply ramp time, from 0V to 2.375V
150
TJ
Operating junction temperature
-40
110
ºC
TA
Operating ambient temperature
-40
85 (2)
ºC
VIO2.5V
2.5 V I/O voltage (LVCMOS, CMOS and Analog)
2.375
2.625
V
VIO3.3V,INT_N
Open Drain LVCMOS I/O voltage (INT_N)
3.6
V
VIO3.3V
Open Drain LVCMOS I/O voltage (SDA, SDC)
3.6
V
(1)
(2)
2.375
μs
Steps must be taken to ensure the combined AC plus DC supply noise meets the specified VDD supply voltage limits.
Steps must be taken to ensure the operating junction temperature range is met.
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Copyright © 2015–2019, Texas Instruments Incorporated
Product Folder Links: DS250DF810
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DS250DF810
SNLS513C – DECEMBER 2015 – REVISED OCTOBER 2019
www.ti.com
8.4 Thermal Information
CONDITIONS/ ASSUMPTIONS (2)
THERMAL METRIC (1)
4-layer JEDEC
Board
10-layer 8in x
6in Board
20-layer 8in x
6in Board
30-layer 8in x
6in Board
RθJA
Junction-to-ambient thermal
resistance
26.4
9.3
8.5
8.2
RθJC(top)
Junction-to-case (top) thermal
resistance
1.6
-
-
-
RθJB
Junction-to-board thermal
resistance
9.3
-
-
-
ΨJT
Junction-to-top characterization
parameter
0.1
0.1
0.1
0.1
ΨJB
Junction-to-board characterization
parameter
9.3
5
4.9
4.6
(1)
(2)
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package-Thermal Metrics application report, SPRA953.
No heat sink or airflow was assumed for these estimations. Depending on the application, a heat sink, faster airflow, and/or reduced
ambient temperature (
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