DS30BA101SQ/NOPB

DS30BA101 www.ti.com SNLS403A – FEBRUARY 2012 – REVISED APRIL 2013 DS30BA101 3.125 Gbps Differential Buffer Check for Samples: DS30BA101 FEATURES DESCRIPTION • • • • The DS30BA101 is a high-speed differential buffer for cable driving, signal buffering, and signal repeating applications. Its fully differential signal path ensures exceptional signal integrity and noise immunity. The DS30BA101 drives both differential and single-ended transmission lines at data rates up to 3.125 Gbps. 1 2 Data Rates from DC to 3.125 Gbps Supports SD and HD Video Resolutions Power Consumption: 165 mW Typical Industrial Temperature Range: -40°C to +85°C APPLICATIONS • • • Cable Extension Signal Buffering and Repeating Security and Surveillance The output voltage amplitude is adjustable via a single external resistor for cable driving applications into 75Ω single-ended and 100Ω differential mode impedances. The DS30BA101 is powered from a single 3.3V supply and consumes 165 mW (typical). It operates over the full industrial temperature range of -40°C to +85°C and is available in a 4 x 4 mm 16-pin WQFN package. 150 Mbps to 3.125 Gbps 100: Differential Cable or 75: Coaxial Cable DS30BA101 DS30EA101 Max Cable Loss ~ 50 dB @ 1.5 GHz Deserializer Serializer Typical Application 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012–2013, Texas Instruments Incorporated DS30BA101 SNLS403A – FEBRUARY 2012 – REVISED APRIL 2013 www.ti.com VEE 3 RVO 4 NC NC NC 13 DS30BA101 (top view) 5 6 7 8 NC 2 14 NC IN- 15 VCC 1 16 NC IN+ NC Connection Diagram 12 OUT+ 11 OUT- 10 VEE 9 VCC DAP = VEE The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative power supply voltage. Figure 1. 16-Pin WQFN Package See Package Number RUM0016A PIN DESCRIPTIONS Pin Name I/O, Type Description 1 IN+ I, CML Non-inverting input. 2 IN- I, CML Inverting input. 3 VEE Ground Negative power supply (ground). 4 RVO I, Analog Output voltage level control. Connect a resistor between this pin and VCC to set the output voltage. 5 NC N/A No connect. Not bonded internally. 6 VCC Power Positive power supply (+3.3V). 7 NC N/A No connect. Not bonded internally. 8 NC N/A No connect. Not bonded internally. 9 VCC Power Positive power supply (+3.3V). 10 VEE Ground Negative power supply (ground). 11 OUT- O, Data Inverting output. 12 OUT+ O, Data Non-inverting output. 13 NC N/A No connect. Not bonded internally. 14 NC N/A No connect. Not bonded internally. 15 NC N/A No connect. Not bonded internally. 16 NC N/A No connect. Not bonded internally. DAP VEE Ground Connect exposed DAP to negative power supply (ground). These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: DS30BA101 DS30BA101 www.ti.com SNLS403A – FEBRUARY 2012 – REVISED APRIL 2013 Absolute Maximum Ratings (1) Supply Voltage: 3.6V −0.3V to VCC+0.3V Input Voltage (all inputs) Output Current 28 mA −65°C to +150°C Storage Temperature Range Junction Temperature +125°C Package Thermal Resistance θJA 16-pin WQFN θJC 16-pin WQFN +58°C/W +21°C/W ESD Rating (HBM) ≥±4.5 kV ESD Rating (MM) ≥±250V ≥±2 kV ESD Rating (CDM) (1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device my occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. Recommended Operating Conditions Supply Voltage (VCC): 3.3V ±5% Operating Free Air Temperature (TA) -40°C to +85°C DC Electrical Characteristics Over recommended supply voltage and operating temperature ranges, unless otherwise specified. Parameter VICM Input Common Mode Voltage VID Input Voltage Swing VOCM Output Common Mode Voltage VOUT Output Voltage ICC (1) (2) Test Conditions Reference Min IN+, IN- (1) (2) Typ 1.1 + VID/2 Differential 100 OUT+, OUT- Max Units VCC – VID/2 V 2200 mVP−P VCC – VOUT V Single-ended, 75Ω load, RVO = 750Ω 800 mVP-P Single-ended, 50Ω load, RVO = 953Ω 400 mVP-P Supply Current 50 59 mA The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured. Typical values represent most likely parametric norms at VCC = +3.3V, TA = +25°C, and at the Recommended Operating Conditions at the time of product characterization and are not ensured. AC Electrical Characteristics Over recommended supply voltage and operating temperature ranges, unless otherwise specified. Parameter DRIN tTLH Transition Time Low to High tTHL Transition Time High to Low (1) (2) (3) Test Conditions Input Data Rate Reference Min (1) (2) Typ Max Units 3125 Mbps 90 130 ps 90 130 ps IN+, IN20% - 80% (3) OUT+, OUT- The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured. Typical values represent most likely parametric norms at VCC = +3.3V, TA = +25°C, and at the Recommended Operating Conditions at the time of product characterization and are not ensured. Specification is ensured by characterization and is not tested in production. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: DS30BA101 3 DS30BA101 SNLS403A – FEBRUARY 2012 – REVISED APRIL 2013 www.ti.com DEVICE OPERATION INPUT INTERFACING The DS30BA101 accepts either differential or single-ended input. DC-coupled inputs must be kept within the specified common-mode range. OUTPUT INTERFACING The DS30BA101 uses current mode outputs. Single-ended output levels are 800 mVP-P into 75Ω AC-coupled coaxial cable with an RVO resistor of 750Ω, or 400 mVP-P (800 mVP-P differential) into 100Ω differential cable with an RVO resistor of 953Ω. The output voltage level is controlled by the value of the RVO resistor connected between the RVO pin and VCC. The RVO resistor should be placed as close as possible to the RVO pin. In addition, the copper in the plane layers below the RVO network should be removed to minimize parasitic capacitance. Figure 2 and Figure 3 show the typical configurations for differential output and single-ended output, respectively. For single-ended output, the unused output must be properly terminated as shown. APPLICATION INFORMATION CABLE EXTENDER APPLICATION The DS30BA101 together with the DS30EA101 form a cable extender chipset optimized for extending serial data streams from serializer/deseralizer (SerDes) pairs and FPGAs over 100Ω differential cables and 75Ω coaxial cables. Setting the correct DS30BA101 output amplitude and proper cable termination are essential for optimal operation. Figure 2 shows the recommended chipset configuration for 100Ω differential cable and Figure 3 shows the recommended chipset configuration for 75Ω coaxial cable. VCC 50: 953: IN+ 100: RVO 50: OUT+ 0.1 PF 1 PF 100: Differential TP Cable IN+ 100: DS30BA101 OUT+ DS30EA101 1 PF 1 PF IN- 1 PF IN- OUT- OUT- Figure 2. Cable Extender Chipset Application Circuit for 100Ω Differential Cable 4 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: DS30BA101 DS30BA101 www.ti.com SNLS403A – FEBRUARY 2012 – REVISED APRIL 2013 VCC 75: 750: IN+ 100: RVO OUT+ 75: 0.1 PF 75: Coaxial Cable 1 PF 1 PF IN+ DS30BA101 DS30EA101 75: 1 PF IN- OUT+ 1 PF IN- OUT75: OUT- 37.4: Figure 3. Cable Extender Chipset Application Circuit for 75Ω Coaxial Cable Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: DS30BA101 5 DS30BA101 SNLS403A – FEBRUARY 2012 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Original (April 2013) to Revision A • 6 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 5 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: DS30BA101 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) DS30BA101SQ/NOPB ACTIVE WQFN RUM 16 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 85 30BA101 DS30BA101SQE/NOPB ACTIVE WQFN RUM 16 250 RoHS & Green SN Level-3-260C-168 HR -40 to 85 30BA101 DS30BA101SQX/NOPB ACTIVE WQFN RUM 16 4500 RoHS & Green SN Level-3-260C-168 HR -40 to 85 30BA101 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of