DS89C21
www.ti.com
SNLS091C – JUNE 1998 – REVISED APRIL 2013
DS89C21 Differential CMOS Line Driver and Receiver Pair
Check for Samples: DS89C21
FEATURES
DESCRIPTION
•
The DS89C21 is a differential CMOS line driver and
receiver pair, designed to meet the requirements of
TIA/EIA-422-A (RS-422) electrical characteristics
interface standard. The DS89C21 provides one driver
and one receiver in a minimum footprint. The device
is offered in an 8-pin SOIC package.
1
2
•
•
•
•
•
•
Meets TIA/EIA-422-A (RS-422) and CCITT V.11
Recommendation
LOW POWER Design—15 mW Typical
Guaranteed AC Parameters:
– Maximum Driver Skew 2.0 ns
– Maximum Receiver Skew 4.0 ns
Extended Temperature Range: −40°C to
+85°C
Available in SOIC Packaging
Operates over 20 Mbps
Receiver OPEN Input Failsafe Feature
The CMOS design minimizes the supply current to 6
mA, making the device ideal for use in battery
powered or power conscious applications.
The driver features a fast transition time specified at
2.2 ns, and a maximum differential skew of 2 ns
making the driver ideal for use in high speed
applications operating above 10 MHz.
The receiver can detect signals as low as 200 mV,
and also incorporates hysteresis for noise rejection.
Skew is specified at 4 ns maximum.
The DS89C21 is compatible with TTL and CMOS
levels (DI and RO).
Connection Diagram
See Package Number D (R-PDSO-G8)
Truth Table Driver
Input
Outputs
DI
DO
H
H
DO*
L
L
L
H
Truth Table Receiver
Inputs
Output
RI–RI*
RO
VDIFF ≥ +200 mV
H
VDIFF ≤ −200 mV
L
OPEN
(1)
(1)
H
Non-terminated
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS89C21
SNLS091C – JUNE 1998 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2) (3)
Supply Voltage (VCC)
7V
−1.5V to VCC + 1.5V
Driver Input Voltage (DI)
Driver Output Voltage (DO, DO *)
−0.5V to +7V
Receiver Input Voltage—V CM
(RI, RI*)
±14V
Differential Receiver Input
±14V
*
Voltage—VDIFF (RI, RI )
Receiver Output Voltage (RO)
−0.5V to VCC +0.5V
Receiver Output Current (RO)
±25 mA
Storage Temperature Range
−65°C to +150°C
(TSTG)
Lead Temperature (TL)
+260°C
(Soldering 4 sec.)
Maximum Junction Temperature
150°C
Maximum Package Power Dissipation @+25°C
D Package
714 mW
Derate D Package
(1)
(2)
(3)
5.7 mW/°C above +25°C
Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that
the devices should be operated at these limits. The tables of Electrical Characteristics specify conditions for device operation.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
ESD Rating: HBM (1.5 kΩ, 100 pF) all pins ≥ 2000V.EIAJ (0Ω, 200 pF) ≥ 250V
Recommended Operating Conditions
Min
Max
Supply Voltage (VCC)
4.50
5.50
V
Operating Temperature (TA)
−40
+85
°C
500
ns
Input Rise or Fall Time (DI)
2
Submit Documentation Feedback
Units
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS89C21
DS89C21
www.ti.com
SNLS091C – JUNE 1998 – REVISED APRIL 2013
Electrical Characteristics
(1) (2)
Over recommended supply voltage and operating temperature ranges, unless otherwise specified.
Symbol
Parameter
Conditions
Pin
Min
DI
Typ
Max
Units
2.0
VCC
V
GND
0.8
V
±10
μA
−1.5
V
6.0
V
DRIVER CHARACTERISTICS
VIH
Input Voltage HIGH
VIL
Input Voltage LOW
IIH, IIL
Input Current
V IN = VCC, GND, 2.0V, 0.8V
VCL
Input Clamp Voltage
I IN = −18 mA
VOD1
Unloaded Output Voltage
No Load
VOD2
Differential Output Voltage
R L = 100Ω
ΔVOD2
Change in Magnitude of V OD2
0.05
DO,
DO*
4.2
2.0
3.0
5.0
V
400
mV
for Complementary Output States
VOD3
Differential Output Voltage
R L = 150Ω
2.1
3.1
V
VOD4
Differential Output Voltage
R L = 3.9 kΩ
4.0
6.0
VOC
Common Mode Voltage
R L = 100Ω
2.0
3.0
V
ΔVOC
Change in Magnitude of V OC
2.0
400
mV
V
for Complementary Output States
IOSD
Output Short Circuit Current
V OUT = 0V
IOFF
Output Leakage Current
VCC = 0V
−115
−150
mA
VOUT = +6V
−30
0.03
+100
μA
VOUT = −0.25V
−0.08
−100
μA
−200
±25
+200
mV
20
50
RECEIVER CHARACTERISTICS
VTL, VTH
Differential Thresholds
V IN = +7V, 0V, −7V
VHYS
Hysteresis
V CM = 0V
RIN
Input Impedance
V IN = −7V, +7V, Other = 0V
IIN
Input Current
Other Input = 0V,
VIN = +10V
VCC = 5.5V and
VIN = +3.0V
VCC = 0V
VIN = +0.5V
RI,
RI*
5.0
VIN = −3V
0
VIN = −10V
VOH
Output HIGH Voltage
IOH = −6 mA
VOL
Output LOW Voltage
I OL = +6 mA, VDIFF = −1V
IOSR
Output Short Circuit Current
V OUT = 0V
VDIFF = +1V
9.5
+1.0
0
VDIFF = OPEN
3.8
3.8
−25
kΩ
+1.5
mA
+0.22
mA
−0.04
mA
−0.41
−1.25
RO
mV
mA
−2.5
4.9
mA
V
4.9
V
0.08
0.3
V
−85
−150
mA
3.0
6
mA
3.8
12
mA
DRIVER AND RECEIVER CHARACTERISTICS
ICC
Supply Current
No Load
DI = VCC or GND
DI = 2.4V or 0.5V
(1)
(2)
VCC
Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
unless otherwise specified.
All typicals are given for VCC = 5.0V and T A = 25°C.
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS89C21
3
DS89C21
SNLS091C – JUNE 1998 – REVISED APRIL 2013
Switching Characteristics
www.ti.com
(1) (2)
Over recommended supply voltage and operating temperature ranges, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
2
4.9
10
ns
2
4.5
10
ns
0.4
2.0
ns
2.2
9
ns
2.1
9
ns
6
18
30
ns
6
17.5
30
ns
0.5
4.0
ns
2.5
9
ns
2.1
9
ns
DIFFERENTIAL DRIVER CHARACTERISTICS
tPLHD
Propagation Delay LOW to HIGH
RL = 100Ω
tPHLD
Propagation Delay HIGH to LOW
CL = 50 pF
tSKD
Skew, |tPLHD–t PHLD|
tTLH
Transition Time LOW to HIGH
tTHL
Transition Time HIGH to LOW
(Figure 2 Figure 3)
(Figure 2 Figure 4)
RECEIVER CHARACTERISTICS
tPLH
Propagation Delay LOW to HIGH
CL = 50 pF
tPHL
Propagation Delay HIGH to LOW
VDIFF = 2.5V
tSK
Skew, |tPLH–t PHL|
VCM = 0V
tr
Rise Time
tf
Fall Time
(1)
(2)
(Figure 5 Figure 6)
(Figure 7)
All typicals are given for VCC = 5.0V and T A = 25°C.
f = 1 MHz, tr and tf ≤ 6 ns.
Parameter Measurement Information
Figure 1. VOD and VOC Test Circuit
f = 1 MHz, tr and tf ≤ 6 ns.
Figure 2. Driver Propagation Delay Test Circuit
4
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS89C21
DS89C21
www.ti.com
SNLS091C – JUNE 1998 – REVISED APRIL 2013
Figure 3. Driver Differential Propagation Delay Timing
Figure 4. Driver Differential Transition Timing
f = 1 MHz, tr and tf ≤ 6 ns.
Figure 5. Receiver Propagation Delay Test Circuit
Figure 6. Receiver Propagation Delay Timing
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS89C21
5
DS89C21
SNLS091C – JUNE 1998 – REVISED APRIL 2013
www.ti.com
Figure 7. Receiver Rise and Fall Times
6
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS89C21
DS89C21
www.ti.com
SNLS091C – JUNE 1998 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 6
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS89C21
7
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
DS89C21TM/NOPB
ACTIVE
SOIC
D
8
95
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
DS89C
21TM
DS89C21TMX/NOPB
ACTIVE
SOIC
D
8
2500
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
DS89C
21TM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
很抱歉,暂时无法提供与“DS89C21TMX”相匹配的价格&库存,您可以联系我们找货
免费人工找货