DS90C031TM

DS90C031 DS90C031 LVDS Quad CMOS Differential Line Driver Literature Number: SNLS095A DS90C031 LVDS Quad CMOS Differential Line Driver General Description Features The DS90C031 is a quad CMOS differential line driver designed for applications requiring ultra low power dissipation and high data rates. The device is designed to support data rates in excess of 155.5 Mbps (77.7 MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. The DS90C031 accepts TTL/CMOS input levels and translates them to low voltage (350 mV) differential output signals. In addition the driver supports a TRI-STATE ® function that may be used to disable the output stage, disabling the load current, and thus dropping the device to an ultra low idle power state of 11 mW typical. The DS90C031 and companion line receiver (DS90C032) provide a new alternative to high power psuedo-ECL devices for high speed point-to-point interface applications. n n n n n n n n n > 155.5 Mbps (77.7 MHz) switching rates ± 350 mV differential signaling Ultra low power dissipation 400 ps maximum differential skew (5V, 25˚C) 3.5 ns maximum propagation delay Industrial operating temperature range Military operating temperature range option Available in surface mount packaging (SOIC) and (LCC) Pin compatible with DS26C31, MB571 (PECL) and 41LG (PECL) n Compatible with IEEE 1596.3 SCI LVDS standard n Conforms to ANSI/TIA/EIA-644 LVDS standard n Available to Standard Microcircuit Drawing (SMD) 5962-95833 Connection Diagrams Dual-In-Line LCC Package DS011946-1 Order Number DS90C031TM See NS Package Number M16A DS011946-33 Order Number DS90C031E-QML See NS Package Number E20A For Complete Military Specifications, refer to appropriate SMD or MDS. TRI-STATE ® is a registered trademark of National Semiconductor Corporation. © 2000 National Semiconductor Corporation DS011946 www.national.com DS90C031 LVDS Quad CMOS Differential Line Driver June 1998 DS90C031 Functional Diagram DS011946-2 DRIVER Enables Input Outputs EN EN* DIN DOUT+ L H X Z Z All other combinations L L H of ENABLE inputs H H L www.national.com DOUT− 2 Maximum Junction Temperature (DS90C031T) Maximum Junction Temperature (DS90C031E) ESD Rating (Note 7) (HBM, 1.5 kΩ, 100 pF) (EIAJ, 0 Ω, 200 pF) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) −0.3V to +6V −0.3V to (VCC + 0.3V) Input Voltage (DIN) Enable Input Voltage (EN, EN*) −0.3V to (VCC + 0.3V) −0.3V to (VCC + 0.3V) Output Voltage (DOUT+, DOUT−) Short Circuit Duration Continuous (DOUT+, DOUT−) Maximum Package Power Dissipation @ +25˚C M Package 1068 mW E Package 1900 mW Derate M Package 8.5 mW/˚C above +25˚C Derate E Package 12.8 mW/˚C above +25˚C Storage Temperature Range −65˚C to +150˚C Lead Temperature Range Soldering (4 sec.) +260˚C +150˚C +175˚C ≥ 3,500V ≥ 250V Recommended Operating Conditions Min +4.5 Supply Voltage (VCC) Operating Free Air Temperature (TA) DS90C031T −40 DS90C031E −55 Typ +5.0 Max +5.5 Units V +25 +25 +85 +125 ˚C ˚C Electrical Characteristics Over supply voltage and operating temperature ranges, unless otherwise specified. (Notes 2, 3) Symbol Parameter Conditions RL = 100Ω (Figure 1) VOD1 Differential Output Voltage ∆VOD1 Change in Magnitude of VOD1 for Complementary Output States VOS Offset Voltage ∆VOS Change in Magnitude of VOS for Complementary Output States VOH Output Voltage High VOL Output Voltage Low VIH Input Voltage High VIL Input Voltage Low II Input Current VIN = VCC, GND, 2.5V or 0.4V VCL Input Clamp Voltage ICL = −18 mA IOS Output Short Circuit Current VOUT = 0V (Note 8) IOZ Output TRI-STATE Current EN = 0.8V and EN* = 2.0V, VOUT = 0V or VCC ICC No Load Supply Current Drivers Enabled DIN = VCC or GND Loaded Supply Current Drivers Enabled RL = 100Ω All Channels VIN = VCC or GND (all inputs) No Load Supply Current Drivers Disabled DIN = VCC or GND EN = GND, EN* = VCC ICCL ICCZ Pin Min Typ Max Units DOUT−, DOUT+ 250 345 450 mV 4 35 |mV| 1.25 1.375 V 5 25 |mV| 1.41 1.60 1.125 RL = 100Ω 0.90 DIN, EN, EN* DOUT−, DOUT+ DS90C031T 1.07 V V 2.0 VCC V GND 0.8 V +10 µA −10 ±1 −1.5 −0.8 −10 VCC V −3.5 −5.0 mA ±1 +10 µA 1.7 3.0 mA 4.0 6.5 mA DS90C031T 15.4 21.0 mA DS90C031E 15.4 25.0 mA DS90C031T 2.2 4.0 mA DS90C031E 2.2 10.0 mA DIN = 2.5V or 0.4V Switching Characteristics VCC = +5.0V, TA = +25˚C DS90C031T. (Notes 3, 4, 6, 9) Symbol Parameter Conditions Min Typ Max Units RL = 100Ω, CL = 5 pF (Figure 2 and Figure 3) 1.0 2.0 3.0 ns 1.0 2.1 3.0 ns tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD – tPLHD| 0 80 400 ps tSK1 Channel-to-Channel Skew (Note 4) 0 300 600 ps 3 www.national.com DS90C031 Absolute Maximum Ratings (Note 1) DS90C031 Switching Characteristics (Continued) VCC = +5.0V, TA = +25˚C DS90C031T. (Notes 3, 4, 6, 9) Typ Max Units tTLH Symbol Rise Time Parameter Conditions Min 0.35 1.5 ns tTHL Fall Time 0.35 1.5 ns tPHZ Disable Time High to Z tPLZ Disable Time Low to Z tPZH Enable Time Z to High tPZL Enable Time Z to Low RL = 100Ω, CL = 5 pF (Figure 4 and Figure 5) 2.5 10 ns 2.5 10 ns 2.5 10 ns 2.5 10 ns Switching Characteristics VCC = +5.0V ± 10%, TA = −40˚C to +85˚C DS90C031T. (Notes 3, 4, 5, 6, 9) Symbol Parameter Conditions Min Typ Max Units RL = 100Ω, CL = 5 pF (Figure 2 and Figure 3) 0.5 2.0 3.5 ns 0.5 2.1 3.5 ns tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD – tPLHD| 0 80 900 ps tSK1 Channel-to-Channel Skew (Note 4) 0 0.3 1.0 ns tSK2 Chip to Chip Skew (Note 5) 3.0 ns tTLH Rise Time 0.35 2.0 ns tTHL Fall Time 0.35 2.0 ns tPHZ Disable Time High to Z tPLZ Disable Time Low to Z tPZH Enable Time Z to High tPZL Enable Time Z to Low RL = 100Ω, CL = 5 pF (Figure 4 and Figure 5) 2.5 15 ns 2.5 15 ns 2.5 15 ns 2.5 15 ns Switching Characteristics VCC = +5.0V ± 10%, TA = −55˚C to +125˚C DS90C031E. (Notes 3, 4, 5, 6, 9, 10) Symbol Parameter tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD – tPLHD| tSK1 Channel-to-Channel Skew (Note 4) tSK2 Chip to Chip Skew (Note 5) tPHZ Disable Time High to Z tPLZ Disable Time Low to Z tPZH Enable Time Z to High tPZL Enable Time Z to Low Conditions Min Typ Max Units RL = 100Ω, CL = 20 pF (Figure 3) CL Connected between each Output and GND 0.5 2.0 5.0 ns 0.5 2.1 5.0 ns 0 0.08 3.0 ns 0 0.3 3.0 ns 4.5 ns RL = 100Ω, CL = 5 pF (Figure 4 and Figure 5) Parameter Measurement Information DS011946-3 FIGURE 1. Driver VOD and VOS Test Circuit www.national.com 4 2.5 20 ns 2.5 20 ns 2.5 20 ns 2.5 20 ns DS90C031 Parameter Measurement Information (Continued) DS011946-4 FIGURE 2. Driver Propagation Delay and Transition Time Test Circuit DS011946-5 FIGURE 3. Driver Propagation Delay and Transition Time Waveforms DS011946-6 FIGURE 4. Driver TRI-STATE Delay Test Circuit 5 www.national.com DS90C031 Parameter Measurement Information (Continued) DS011946-7 FIGURE 5. Driver TRI-STATE Delay Waveform Typical Application DS011946-8 FIGURE 6. Point-to-Point Application nation be employed to terminate the signal and to complete the loop as shown in Figure 6. AC or unterminated configurations are not allowed. The 3.4 mA loop current will develop a differential voltage of 340 mV across the 100Ω termination resistor which the receiver detects with a 240 mV minimum differential noise margin neglecting resistive line losses (driven signal minus receiver threshold (340 mV – 100 mV = 240 mV)). The signal is centered around +1.2V (Driver Offset, VOS) with respect to ground as shown inFigure 7. Note that the steady-state voltage (VSS) peak-to-peak swing is twice the differential voltage (VOD) and is typically 680 mV. The current mode driver provides substantial benefits over voltage mode drivers, such as an RS-422 driver. Its quiescent current remains relatively flat versus switching frequency. Whereas the RS-422 voltage mode driver increases exponentially in most case between 20 MHz–50 MHz. This is due to the overlap current that flows between the rails of the device when the internal gates switch. Whereas the current mode driver switches a fixed current between its output without any substantial overlap current. This is similar to some ECL and PECL devices, but without the heavy static ICC requirements of the ECL/PECL designs. LVDS requires 80% less current than similar PECL devices. AC specifications for the driver are a tenfold improvement over other existing RS-422 drivers. The TRI-STATE function allows the driver outputs to be disabled, thus obtaining an even lower power state when the transmission of data is not required. Applications Information LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as is shown in Figure 6. This configuration provides a clean signaling environment for the quick edge rates of the drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair cable, a parallel pair cable, or simply PCB traces. Typically, the characteristic impedance of the media is in the range of 100Ω. A termination resistor of 100Ω should be selected to match the media, and is located as close to the receiver input pins as possible. The termination resistor converts the current sourced by the driver into a voltage that is detected by the receiver. Other configurations are possible such as a multi-receiver configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as well as ground shifting, noise margin limits, and total termination loading must be taken into account. The DS90C031 differential line driver is a balanced current source design. A current mode driver, generally speaking has a high output impedance and supplies a constant current for a range of loads (a voltage mode driver on the other hand supplies a constant voltage for a range of loads). Current is switched through the load in one direction to produce a logic state and in the other direction to produce the other logic state. The typical output current is mere 3.4 mA, a minimum of 2.5 mA, and a maximum of 4.5 mA. The current mode requires (as discussed above) that a resistive termi- www.national.com 6 DS90C031 Applications Information (Continued) The footprint of the DS90C031 is the same as the industry standard 26LS31 Quad Differential (RS-422) Driver. DS011946-9 FIGURE 7. Driver Output Levels Pin Descriptions Pin No. Name Pin No. Description (SOIC) 1, 7, 9, 15 DIN 2, 6, 10, 14 DOUT+ 3, 5, 11, 13 DOUT− 4 12 EN EN* Name Description (SOIC) Driver input pin, TTL/CMOS compatible 16 VCC Power supply pin, +5V ± 10% 8 GND Ground pin Ordering Information Non-inverting driver output pin, LVDS levels Operating Inverting driver output pin, LVDS levels Active high enable pin, OR-ed with EN* Active low enable pin, OR-ed with EN Package Type/ Order Number Temperature Number −40˚C to +85˚C SOP/M16A DS90C031TM −55˚C to +125˚C LCC/E20A DS90C031E-QML DS90C031E-QML (NSID) 5962-95833 (SMD) Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation. Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except: VOD1 and ∆VOD1. Note 3: All typicals are given for: VCC = +5.0V, TA = +25˚C. Note 4: Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event on the inputs. Note 5: Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays. Note 6: Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr ≤ 6 ns, and tf ≤ 6 ns. Note 7: ESD Ratings: HBM (1.5 kΩ, 100 pF) ≥ 3,500V EIAJ (0Ω, 200 pF) ≥ 250V Note 8: Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Note 9: CL includes probe and jig capacitance. Note 10: Guaranteed by characterization data (DS90C031E). 7 www.national.com DS90C031 Typical Performance Characteristics Power Supply Current vs Power Supply Voltage Power Supply Current vs Temperature DS011946-10 Power Supply Current vs Power Supply Voltage DS011946-11 Power Supply Current vs Temperature DS011946-12 Output TRI-STATE Current vs Power Supply Voltage DS011946-13 Output Short Circuit Current vs Power Supply Voltage DS011946-14 www.national.com DS011946-15 8 (Continued) Differential Output Voltage vs Power Supply Voltage Differential Output Voltage vs Ambient Temperature DS011946-16 Output Voltage High vs Power Supply Voltage DS90C031 Typical Performance Characteristics DS011946-17 Output Voltage High vs Ambient Temperature DS011946-18 Output Voltage Low vs Power Supply Voltage DS011946-19 Output Voltage Low vs Ambient Temperature DS011946-20 DS011946-21 9 www.national.com DS90C031 Typical Performance Characteristics (Continued) Offset Voltage vs Power Supply Voltage Offset Voltage vs Ambient Temperature DS011946-22 Power Supply Current vs Frequency DS011946-23 Power Supply Current vs Frequency DS011946-24 Differential Output Voltage vs Load Resistor DS011946-25 Differential Propagation Delay vs Power Supply Voltage DS011946-26 DS011946-27 www.national.com 10 (Continued) Differential Propagation Delay vs Ambient Temperature Differential Skew vs Power Supply Voltage DS90C031 Typical Performance Characteristics DS011946-29 DS011946-28 Differential Skew vs Ambient Temperature Differential Transition Time vs Power Supply Voltage DS011946-30 DS011946-31 Differential Transition Time vs Ambient Temperature DS011946-32 11 www.national.com DS90C031 Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Ceramic Leadless Chip Carrier, Type C Order Number DS90C031E-QML NS Package Number E20A 16-Lead (0.150" Wide) Molded Small Outline Package, JEDEC Order Number DS90C031TM NS Package Number M16A www.national.com 12 DS90C031 LVDS Quad CMOS Differential Line Driver Notes LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com www.national.com National Semiconductor Europe Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: ap.support@nsc.com National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated