DS90C401M

NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 DS90C401 Dual Low Voltage Differential Signaling (LVDS) Driver Check for Samples: DS90C401 FEATURES DESCRIPTION • • • • • The DS90C401 is a dual driver device optimized for high data rate and low power applications. This device along with the DS90C402 provides a pair chip solution for a dual high speed point-to-point interface. The DS90C401 is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized. The device is in a 8 lead small outline package. The differential driver outputs provides low EMI with its low output swings typically 340 mV. 1 2 Ultra Low Power Dissipation Operates Above 155.5 Mbps Standard TIA/EIA-644 8 Lead SOIC Package Saves Space Low Differential Output Swing typical 340 mV Connection Diagram See Package Number D (SOIC) Functional Diagram These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated NRND DS90C401 SNLS002C – JUNE 1998 – REVISED APRIL 2013 www.ti.com Absolute Maximum Ratings (1) (2) −0.3V to +6V Supply Voltage (VCC) Input Voltage (DIN) −0.3V to (VCC + 0.3V) Output Voltage (DOUT+, DOUT−) −0.3V to (VCC + 0.3V) Short Circuit Duration (DOUT+, DOUT−) Continuous Maximum Package Power Dissipation @ +25°C D Package 1068 mW Derate D Package 8.5 mW/°C above +25°C −65°C to +150°C Storage Temperature Range Lead Temperature Range Soldering (4 sec.) +260°C Maximum Junction Temperature +150°C ESD Rating (3) ≥ 3,500V (HBM, 1.5 kΩ, 100 pF) (EIAJ, 0 Ω, 200 pF) (1) (2) (3) ≥ 250V “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. ESD Ratings: HBM (1.5 kΩ, 100 pF) ≥ 3,500V EIAJ (0Ω, 200 pF) ≥ 250V Recommended OperatingConditions Min Typ Max Supply Voltage (VCC) +4.5 +5.0 +5.5 Units V Operating Free Air Temperature (TA) −40 +25 +85 °C Electrical Characteristics Over supply voltage and operating temperature ranges, unless otherwise specified. (1) (2) Symbol Parameter VOD1 Differential Output Voltage ΔVOD1 Change in Magnitude of VOD1 for Complementary Output States VOS Offset Voltage ΔVOS Change in Magnitude of VOS for Complementary Output States VOH Output Voltage High VOL Output Voltage Low Conditions RL = 100Ω (Figure 1) VIL Input Voltage Low II Input Current VIN = VCC, GND, 2.5V or 0.4V VCL Input Clamp Voltage ICL = −18 mA ICC No Load Supply Current DIN = VCC or GND VOUT = 0V mV 4 35 |mV| 1.25 1.375 V 5 25 |mV| 1.41 1.60 V RL = 100Ω All Channels VIN = VCC or GND (all inputs) 1.07 −3.5 DIN DIN = 2.5V or 0.4V 2 Units 450 (3) Input Voltage High (2) (3) Max 340 0.90 Output Short Circuit Current (1) Typ 250 RL = 100Ω VIH Loaded Supply Current Min 1.125 IOS ICCL Pin DOUT−, DOUT+ VCC V −5.0 mA 2.0 VCC V GND 0.8 V +10 μA 1.7 3.0 mA 3.5 5.5 mA 8 14.0 mA −10 ±1 −1.5 −0.8 V Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except: VOD1 and ΔVOD1. All typicals are given for: VCC = +5.0V, TA = +25°C. Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C401 NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 Switching Characteristics VCC = +5.0V ±10%, TA = −40°C to +85°C (1) (2) (3) (4) (5) Symbol Parameter Conditions RL = 100Ω, CL = 5 pF (Figure 2 and Figure 3) Min Typ Max Units 0.5 2.0 3.5 ns 0.5 2.1 3.5 ns tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD – tPLHD| 0 80 900 ps tSK1 Channel-to-Channel Skew (2) 0 0.3 1.0 ns (3) tSK2 Chip to Chip Skew 3.0 ns tTLH Rise Time 0.35 2.0 ns tTHL Fall Time 0.35 2.0 ns (1) (2) (3) (4) (5) All typicals are given for: VCC = +5.0V, TA = +25°C. Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event on the inputs. Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays. Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr ≤ 6 ns, and tf ≤ 6 ns. CL includes probe and jig capacitance. Parameter Measurement Information Figure 1. Driver VOD and VOS Test Circuit Figure 2. Driver Propagation Delay and Transition Time Test Circuit Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C401 3 NRND DS90C401 SNLS002C – JUNE 1998 – REVISED APRIL 2013 www.ti.com Figure 3. Driver Propagation Delay and Transition Time Waveforms 4 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C401 NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 TYPICAL APPLICATION Figure 4. Point-to-Point Application Applications Information LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as is shown in Figure 4. This configuration provides a clean signaling environment for the quick edge rates of the drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair cable, a parallel pair cable, or simply PCB traces. Typically, the characteristic impedance of the media is in the range of 100Ω. A termination resistor of 100Ω should be selected to match the media, and is located as close to the receiver input pins as possible. The termination resistor converts the current sourced by the driver into a voltage that is detected by the receiver. Other configurations are possible such as a multi-receiver configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as well as ground shifting, noise margin limits, and total termination loading must be taken into account. The DS90C401 differential line driver is a balanced current source design. A current mode driver, generally speaking has a high output impedance and supplies a constant current for a range of loads (a voltage mode driver on the other hand supplies a constant voltage for a range of loads). Current is switched through the load in one direction to produce a logic state and in the other direction to produce the other logic state. The typical output current is mere 3.4 mA, a minimum of 2.5 mA, and a maximum of 4.5 mA. The current mode requires (as discussed above) that a resistive termination be employed to terminate the signal and to complete the loop as shown in Figure 4. AC or unterminated configurations are not allowed. The 3.4 mA loop current will develop a differential voltage of 340 mV across the 100Ω termination resistor which the receiver detects with a 240 mV minimum differential noise margin neglecting resistive line losses (driven signal minus receiver threshold (340 mV – 100 mV = 240 mV)). The signal is centered around +1.2V (Driver Offset, VOS) with respect to ground as shown in Figure 5. Note that the steady-state voltage (VSS) peak-to-peak swing is twice the differential voltage (VOD) and is typically 680 mV. The current mode driver provides substantial benefits over voltage mode drivers, such as an RS-422 driver. Its quiescent current remains relatively flat versus switching frequency. Whereas the RS-422 voltage mode driver increases exponentially in most case between 20 MHz–50 MHz. This is due to the overlap current that flows between the rails of the device when the internal gates switch. Whereas the current mode driver switches a fixed current between its output without any substantial overlap current. This is similar to some ECL and PECL devices, but without the heavy static ICC requirements of the ECL/PECL designs. LVDS requires > 80% less current than similar PECL devices. AC specifications for the driver are a tenfold improvement over other existing RS-422 drivers. Figure 5. Driver Output Levels Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C401 5 NRND DS90C401 SNLS002C – JUNE 1998 – REVISED APRIL 2013 www.ti.com PIN DESCRIPTIONS Pin No. Name Description 4, 8 DIN 3, 7 DOUT+ TTL/CMOS driver input pins Non-inverting driver output pin 2, 6 DOUT− Inverting driver output pin 5 GND Ground pin 1 VCC Positive power supply pin, +5.0V ± 10% Truth Table (1) (1) 6 DIN DOUT+ DOUT− L L H H H L DIN > 0.8V and DIN < 2.0V X X H = Logic high level L = Logic low level X = Indeterminant state Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C401 NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 Typical Performance Characteristics Power Supply Current vs Power Supply Voltage Power Supply Current vs Temperature Figure 6. Figure 7. Power Supply Current vs Power Supply Voltage Power Supply Current vs Temperature Figure 8. Figure 9. Output Short Circuit Current vs Power Supply Voltage Differential Output Voltage vs Power Supply Voltage Figure 10. Figure 11. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C401 7 NRND DS90C401 SNLS002C – JUNE 1998 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 8 Differential Output Voltage vs Ambient Temperature Output Voltage High vs Power Supply Voltage Figure 12. Figure 13. Output Voltage High vs Ambient Temperature Output Voltage Low vs Power Supply Voltage Figure 14. Figure 15. Output Voltage Low vs Ambient Temperature Offset Voltage vs Power Supply Voltage Figure 16. Figure 17. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C401 NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Offset Voltage vs Ambient Temperature Power Supply Current vs Frequency Figure 18. Figure 19. Differential Output Voltage vs Load Resistor Differential Propagation Delay vs Power Supply Voltage Figure 20. Figure 21. Differential Propagation Delay vs Ambient Temperature Differential Skew vs Power Supply Voltage Figure 22. Figure 23. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C401 9 NRND DS90C401 SNLS002C – JUNE 1998 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Differential Skew vs Ambient Temperature Differential Transition Time vs Power Supply Voltage Figure 24. Figure 25. Differential Transition Time vs Ambient Temperature Figure 26. 10 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C401 NRND DS90C401 www.ti.com SNLS002C – JUNE 1998 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision B (April 2013) to Revision C • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 9 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C401 11 PACKAGE OPTION ADDENDUM www.ti.com 30-Sep-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) DS90C401M NRND SOIC D 8 95 Non-RoHS & Green Call TI Level-1-235C-UNLIM DS90C 401M DS90C401M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90C 401M DS90C401MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90C 401M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of