DS90LT012ATMF/NOPB

DS90LT012A, DS90LV012A www.ti.com SNLS141D – AUGUST 2002 – REVISED APRIL 2013 DS90LV012A /DS90LT012A 3V LVDS Single CMOS Differential Line Receiver Check for Samples: DS90LT012A, DS90LV012A FEATURES DESCRIPTION • • • • • The DS90LV012A and DS90LT012A are single CMOS differential line receivers designed for applications requiring ultra low power dissipation, low noise, and high data rates. The devices are designed to support data rates in excess of 400 Mbps (200 MHz) utilizing Low Voltage Differential Swing (LVDS) technology 1 2 • • • • • • • • • • • • Compatible with ANSI TIA/EIA-644-A Standard >400 Mbps (200 MHz) switching rates 100 ps differential skew (typical) 3.5 ns maximum propagation delay Integrated line termination resistor (102Ω typical) Single 3.3V power supply design (2.7V to 3.6V range) Power down high impedance on LVDS inputs Accepts small swing (350 mV typical) differential signal levels LVDS receiver inputs accept LVDS/BLVDS/LVPECL inputs Supports open, short and terminated input failsafe Pinout simplifies PCB layout Low Power Dissipation (10mW typical@ 3.3V static) SOT-23 5-lead package Leadless WSON-8 package (3x3 mm body size) Electrically similar to the DS90LV018A Fabricated with advanced CMOS process technology Industrial temperature operating range (−40°C to +85°C) The DS90LV012A and DS90LT012A accept low voltage (350 mV typical) differential input signals and translates them to 3V CMOS output levels. The receivers also support open, shorted, and terminated (100Ω) input fail-safe. The receiver output will be HIGH for all fail-safe conditions. The DS90LV012A has a pinout designed for easy PCB layout. The DS90LT012A includes an input line termination resistor for point-to-point applications. The DS90LV012A and DS90LT012A, and companion LVDS line driver provide a new alternative to high power PECL/ECL devices for high speed interface applications. Connection Diagram Figure 1. Top View See Package Number DBV (R-PDSO-G5) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002–2013, Texas Instruments Incorporated DS90LT012A, DS90LV012A SNLS141D – AUGUST 2002 – REVISED APRIL 2013 www.ti.com Figure 2. Top View See Package Number NGK0008A Functional Diagram Figure 3. DS90LV012A Figure 4. DS90LT012A Truth Table INPUTS OUTPUT [IN+] − [IN−] TTL OUT VID ≥ 0V H VID ≤ −0.1V L Full Fail-safe OPEN/SHORT or Terminated H These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LT012A DS90LV012A DS90LT012A, DS90LV012A www.ti.com SNLS141D – AUGUST 2002 – REVISED APRIL 2013 Absolute Maximum Ratings (1) −0.3V to +4V Supply Voltage (VDD) −0.3V to +3.9V Input Voltage (IN+, IN−) −0.3V to (VDD + 0.3V) Output Voltage (TTL OUT) −100mA Output Short Circuit Current Maximum Package Power Dissipation @ +25°C NGK Package 2.26 W Derate NGK Package 18.1 mW/°C above +25°C Thermal resistance (θJA) 55.3°C/W DBV Package 902mW Derate DBV Package 7.22 mW/°C above +25°C Thermal resistance (θJA) 138.5°C/W −65°C to +150°C Storage Temperature Range Lead Temperature Range Soldering (4 sec.) +260°C Maximum Junction Temperature +150°C ESD Ratings (1) (2) (2) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation. ESD Ratings: (a) DS90LV012A: (a) HBM (1.5 kΩ, 100 pF) ≥ 2kV (b) EIAJ (0Ω, 200 pF) ≥ 900V (c) CDM ≥ 2000V (d) IEC direct (330Ω, 150 pF) ≥ 5kV (b) DS90LT012A: (a) HBM (1.5 kΩ, 100 pF) ≥ 2kV (b) EIAJ (0Ω, 200 pF) ≥ 700V (c) CDM ≥ 2000V (d) IEC direct (330Ω, 150 pF) ≥ 7kV Recommended Operating Conditions Supply Voltage (VDD) Operating Free Air Temperature (TA) Min Typ Max Units +2.7 +3.3 +3.6 V −40 25 +85 °C Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (1) (2) (1) (2) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified (such as VID). All typicals are given for: VDD = +3.3V and TA = +25°C. Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LT012A DS90LV012A Submit Documentation Feedback 3 DS90LT012A, DS90LV012A SNLS141D – AUGUST 2002 – REVISED APRIL 2013 www.ti.com Electrical Characteristics (continued) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (1) (2) Symbol Parameter VTH Differential Input High Threshold VTL Differential Input Low Threshold VCM Common-Mode Voltage IIN Input Current (DS90LV012A) Conditions VCM dependant on VDD (3) Pin IN+, IN− −100 Change in Magnitude of IIN 0 mV −30 mV V 0.05 VDD - 0.3V V VIN = +2.8V −10 ±1 +10 μA −10 ±1 +10 μA +20 μA VDD = 3.6V or 0V VIN = +3.6V VDD = 0V VIN = +2.8V VDD = 3.6V or 0V −20 VDD = 0V Differential Input Current VIN+ = +0.4V, VIN− = +0V (DS90LT012A) VIN+ = +2.4V, VIN− = +2.0V Integrated Termination Resistor (DS90LT012A) CIN Input Capacitance IN+ = IN− = GND VOH Output High Voltage IOH = −0.4 mA, VID = +200 mV 3 4 μA 4 μA 4 μA 3.9 4.4 mA 102 Ω 3 pF 2.4 3.1 V IOH = −0.4 mA, Inputs terminated 2.4 3.1 V IOH = −0.4 mA, Inputs shorted 2.4 3.1 VOL Output Low Voltage IOL = 2 mA, VID = −200 mV IOS Output Short Circuit Current VOUT = 0V (4) VCL Input Clamp Voltage ICL = −18 mA IDD No Load Supply Current Inputs Open 4 −30 VDD = 3.0V to 3.6V, VID = 100mV RT (4) Units 2.35 VIN = +3.6V (3) Max 0.05 VIN = 0V IIND Typ VDD = 2.7V, VID = 100mV VIN = 0V ΔIIN Min TTL OUT VDD V 0.3 0.5 V −15 −50 −100 mA −1.5 −0.7 5.4 V 9 mA VDD is always higher than IN+ and IN− voltage. IN+ and IN− are allowed to have voltage range −0.05V to +2.35V when VDD = 2.7V and |VID| / 2 to VDD − 0.3V when VDD = 3.0V to 3.6V. VID is not allowed to be greater than 100 mV when VCM = 0.05V to 2.35V when VDD = 2.7V or when VCM = |VID| / 2 to VDD − 0.3V when VDD = 3.0V to 3.6V. Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not exceed maximum junction temperature specification. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LT012A DS90LV012A DS90LT012A, DS90LV012A www.ti.com SNLS141D – AUGUST 2002 – REVISED APRIL 2013 Switching Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. Symbol Parameter (1) (2) Conditions Min Typ Max Units tPHLD Differential Propagation Delay High to Low CL = 15 pF 1.0 1.8 3.5 ns tPLHD Differential Propagation Delay Low to High VID = 200 mV 1.0 1.7 3.5 ns tSKD1 Differential Pulse Skew |tPHLD − tPLHD| 0 100 400 ps tSKD3 Differential Part to Part Skew (4) 0 0.3 1.0 ns tSKD4 Differential Part to Part Skew (5) 0 0.4 1.5 ns tTLH Rise Time 350 800 ps tTHL Fall Time 175 800 ps fMAX (1) (2) (3) (4) (5) (6) Maximum Operating Frequency (3) (Figure 5 and Figure 6) (6) 200 250 MHz CL includes probe and jig capacitance. Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr and tf (0% to 100%) ≤ 3 ns for IN±. tSKD1 is the magnitude difference in differential propagation delay time between the positive-going-edge and the negative-going-edge of the same channel. tSKD3, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices at the same VDD and within 5°C of each other within the operating temperature range. tSKD4, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over the recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay. fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, differential (1.05V to 1.35 peak to peak). Output criteria: 60%/40% duty cycle, VOL (max 0.4V), VOH (min 2.4V), load = 15 pF (stray plus probes). The parameter is ensured by design. The limit is based on the statistical analysis of the device over the PVT range by the transition times (tTLH and tTHL). Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LT012A DS90LV012A Submit Documentation Feedback 5 DS90LT012A, DS90LV012A SNLS141D – AUGUST 2002 – REVISED APRIL 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure 5. Receiver Propagation Delay and Transition Time Test Circuit Figure 6. Receiver Propagation Delay and Transition Time Waveforms TYPICAL APPLICATIONS Balanced System Figure 7. Point-to-Point Application (DS90LV012A) Balanced System Figure 8. Point-to-Point Application (DS90LT012A) 6 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LT012A DS90LV012A DS90LT012A, DS90LV012A www.ti.com SNLS141D – AUGUST 2002 – REVISED APRIL 2013 APPLICATION INFORMATION General application guidelines and hints for LVDS drivers and receivers may be found in the following application notes: LVDS Owner's Manual (SNLA187), AN-808 (SNLA028), AN-977 (SNLA166), AN-971 (SNLA165), AN-916 (SNLA219), AN-805 (SNOA233), AN-903 (SNLA034). LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as is shown in Figure 7. This configuration provides a clean signaling environment for the fast edge rates of the drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair cable, a parallel pair cable, or simply PCB traces. Typically the characteristic impedance of the media is in the range of 100Ω. A termination resistor of 100Ω should be selected to match the media, and is located as close to the receiver input pins as possible. The termination resistor converts the driver output (current mode) into a voltage that is detected by the receiver. Other configurations are possible such as a multi-receiver configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as well as ground shifting, noise margin limits, and total termination loading must be taken into account. The DS90LV012A and DS90LT012A differential line receivers are capable of detecting signals as low as 100 mV, over a ±1V common-mode range centered around +1.2V. This is related to the driver offset voltage which is typically +1.2V. The driven signal is centered around this voltage and may shift ±1V around this center point. The ±1V shifting may be the result of a ground potential difference between the driver's ground reference and the receiver's ground reference, the common-mode effects of coupled noise, or a combination of the two. The AC parameters of both receiver input pins are optimized for a recommended operating input voltage range of 0V to +2.4V (measured from each pin to ground). The device will operate for receiver input voltages up to VDD, but exceeding VDD will turn on the ESD protection circuitry which will clamp the bus voltages. POWER DECOUPLING RECOMMENDATIONS Bypass capacitors must be used on power pins. Use high frequency ceramic (surface mount is recommended) 0.1μF and 0.001μF capacitors in parallel at the power supply pin with the smallest value capacitor closest to the device supply pin. Additional scattered capacitors over the printed circuit board will improve decoupling. Multiple vias should be used to connect the decoupling capacitors to the power planes. A 10μF (35V) or greater solid tantalum capacitor should be connected at the power entry point on the printed circuit board between the supply and ground. PC BOARD CONSIDERATIONS Use at least 4 PCB board layers (top to bottom): LVDS signals, ground, power, TTL signals. Isolate TTL signals from LVDS signals, otherwise the TTL signals may couple onto the LVDS lines. It is best to put TTL and LVDS signals on different layers which are isolated by a power/ground plane(s). Keep drivers and receivers as close to the (LVDS port side) connectors as possible. For PC board considerations for the WSON package, please refer to application note AN-1187 “Leadless Leadframe Package” (SNOA401). It is important to note that to optimize signal integrity (minimize jitter and noise coupling), the WSON thermal land pad, which is a metal (normally copper) rectangular region located under the package, should be attached to ground and match the dimensions of the exposed pad on the PCB (1:1 ratio). DIFFERENTIAL TRACES Use controlled impedance traces which match the differential impedance of your transmission medium (ie. cable) and termination resistor. Run the differential pair trace lines as close together as possible as soon as they leave the IC (stubs should be < 10mm long). This will help eliminate reflections and ensure noise is coupled as common-mode. In fact, we have seen that differential signals which are 1mm apart radiate far less noise than traces 3mm apart since magnetic field cancellation is much better with the closer traces. In addition, noise induced on the differential lines is much more likely to appear as common-mode which is rejected by the receiver. Match electrical lengths between traces to reduce skew. Skew between the signals of a pair means a phase difference between signals which destroys the magnetic field cancellation benefits of differential signals and EMI will result! (Note that the velocity of propagation, v = c/E r where c (the speed of light) = 0.2997mm/ps or 0.0118 in/ps). Do not rely solely on the autoroute function for differential traces. Carefully review dimensions to match differential impedance and provide isolation for the differential lines. Minimize the number of vias and other discontinuities on the line. Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LT012A DS90LV012A Submit Documentation Feedback 7 DS90LT012A, DS90LV012A SNLS141D – AUGUST 2002 – REVISED APRIL 2013 www.ti.com Avoid 90° turns (these cause impedance discontinuities). Use arcs or 45° bevels. Within a pair of traces, the distance between the two traces should be minimized to maintain common-mode rejection of the receivers. On the printed circuit board, this distance should remain constant to avoid discontinuities in differential impedance. Minor violations at connection points are allowable. TERMINATION DS90LV012A: Use a termination resistor which best matches the differential impedance or your transmission line. The resistor should be between 90Ω and 130Ω. Remember that the current mode outputs need the termination resistor to generate the differential voltage. LVDS will not work without resistor termination. Typically, connecting a single resistor across the pair at the receiver end will suffice. Surface mount 1% - 2% resistors are the best. PCB stubs, component lead, and the distance from the termination to the receiver inputs should be minimized. The distance between the termination resistor and the receiver should be < 10mm (12mm MAX). DS90LT012A: The DS90LT012A integrates the terminating resistor for point-to-point applications. The resistor value will be between 90Ω and 133Ω. THRESHOLD The LVDS Standard (ANSI/TIA/EIA-644-A) specifies a maximum threshold of ±100mV for the LVDS receiver. The DS90LV012A and DS90LT012A support an enhanced threshold region of −100mV to 0V. This is useful for fail-safe biasing. The threshold region is shown in the Voltage Transfer Curve (VTC) in Figure 9. The typical DS90LV012A or DS90LT012A LVDS receiver switches at about −30mV. Note that with VID = 0V, the output will be in a HIGH state. With an external fail-safe bias of +25mV applied, the typical differential noise margin is now the difference from the switch point to the bias point. In the example below, this would be 55mV of Differential Noise Margin (+25mV − (−30mV)). With the enhanced threshold region of −100mV to 0V, this small external failsafe biasing of +25mV (with respect to 0V) gives a DNM of a comfortable 55mV. With the standard threshold region of ±100mV, the external fail-safe biasing would need to be +25mV with respect to +100mV or +125mV, giving a DNM of 155mV which is stronger fail-safe biasing than is necessary for the DS90LV012A or DS90LT012A. If more DNM is required, then a stronger fail-safe bias point can be set by changing resistor values. Figure 9. VTC of the DS90LV012A and DS90LT012A LVDS Receivers 8 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LT012A DS90LV012A DS90LT012A, DS90LV012A www.ti.com SNLS141D – AUGUST 2002 – REVISED APRIL 2013 FAIL-SAFE FEATURE The LVDS receiver is a high gain, high speed device that amplifies a small differential signal (20mV) to CMOS logic levels. Due to the high gain and tight threshold of the receiver, care should be taken to prevent noise from appearing as a valid signal. The receiver's internal fail-safe circuitry is designed to source/sink a small amount of current, providing fail-safe protection (a stable known state of HIGH output voltage) for floating, terminated or shorted receiver inputs. 1. Open Input Pins. The DS90LV012A and DS90LT012A are single receiver devices. It is not required to tie the receiver inputs to ground or any supply voltage. Internal failsafe circuitry will ensure a HIGH, stable output state for open inputs. 2. Terminated Input. If the driver is disconnected (cable unplugged), or if the driver is in a power-off condition, the receiver output will again be in a HIGH state, even with the end of cable 100Ω termination resistor across the input pins. The unplugged cable can become a floating antenna which can pick up noise. If the cable picks up more than 10mV of differential noise, the receiver may see the noise as a valid signal and switch. To insure that any noise is seen as common-mode and not differential, a balanced interconnect should be used. Twisted pair cable will offer better balance than flat ribbon cable. 3. Shorted Inputs. If a fault condition occurs that shorts the receiver inputs together, thus resulting in a 0V differential input voltage, the receiver output will remain in a HIGH state. Shorted input fail-safe is not supported across the common-mode range of the device (GND to 2.4V). It is only supported with inputs shorted and no external common-mode voltage applied. External lower value pull up and pull down resistors (for a stronger bias) may be used to boost fail-safe in the presence of higher noise levels. The pull up and pull down resistors should be in the 5kΩ to 15kΩ range to minimize loading and waveform distortion to the driver. The common-mode bias point should be set to approximately 1.2V (less than 1.75V) to be compatible with the internal circuitry. The DS90LV012A and DS90LT012A are compliant to the original ANSI EIA/TIA-644 specification and is also compliant to the new ANSI EIA/TIA-644-A specification with the exception the newly added ΔIIN specification. Due to the internal fail-safe circuitry, ΔIIN cannot meet the 6µA maximum specified. This exception will not be relevant unless more than 10 receivers are used. Additional information on fail-safe biasing of LVDS devices may be found in AN-1194 (SNLA051). PROBING LVDS TRANSMISSION LINES Always use high impedance (> 100kΩ), low capacitance (< 2 pF) scope probes with a wide bandwidth (1 GHz) scope. Improper probing will give deceiving results. CABLES AND CONNECTORS, GENERAL COMMENTS When choosing cable and connectors for LVDS it is important to remember: Use controlled impedance media. The cables and connectors you use should have a matched differential impedance of about 100Ω. They should not introduce major impedance discontinuities. Balanced cables (e.g. twisted pair) are usually better than unbalanced cables (ribbon cable, simple coax) for noise reduction and signal quality. Balanced cables tend to generate less EMI due to field canceling effects and also tend to pick up electromagnetic radiation a common-mode (not differential mode) noise which is rejected by the receiver. For cable distances < 0.5M, most cables can be made to work effectively. For distances 0.5M ≤ d ≤ 10M, CAT 3 (category 3) twisted pair cable works well, is readily available and relatively inexpensive. Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LT012A DS90LV012A Submit Documentation Feedback 9 DS90LT012A, DS90LV012A SNLS141D – AUGUST 2002 – REVISED APRIL 2013 www.ti.com Pin Functions Pin Descriptions Package Pin Number 10 Pin Name Description SOT-23 WSON 4 1 IN− Inverting receiver input pin 3 3 IN+ Non-inverting receiver input pin 5 8 TTL OUT Receiver output pin 1 6 VDD Power supply pin, +3.3V ± 0.3V 2 2, 7 GND Ground pin 4, 5 NC No connect Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LT012A DS90LV012A DS90LT012A, DS90LV012A www.ti.com SNLS141D – AUGUST 2002 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision C (April 2013) to Revision D • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: DS90LT012A DS90LV012A Submit Documentation Feedback 11 PACKAGE OPTION ADDENDUM www.ti.com 30-Sep-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) DS90LT012ATMF NRND SOT-23 DBV 5 1000 Non-RoHS & Green Call TI Level-1-260C-UNLIM -40 to 85 N03 DS90LT012ATMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 N03 DS90LV012ATMF NRND SOT-23 DBV 5 1000 Non-RoHS & Green Call TI Level-1-260C-UNLIM -40 to 85 N02 DS90LV012ATMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 N02 DS90LV012ATMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 N02 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of