DS90LV011AQMF/NOPB

DS90LV011AQ www.ti.com SNLS296D – MAY 2008 – REVISED APRIL 2013 DS90LV011AQ Automotive LVDS Differential Driver Check for Samples: DS90LV011AQ FEATURES DESCRIPTION • • • • The DS90LV011AQ is an LVDS driver optimized for high data rate and low power applications. The DS90LV011AQ is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized. The device is designed to support data rates in excess of 400Mbps (200MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. 1 2 • • • • • • • • AECQ-100 Grade 1 Conforms to TIA/EIA-644-A Standard >400Mbps (200MHz) Switching Rates 700 ps (100 ps typical) Maximum Differential Skew 1.5 ns Maximum Propagation Delay Single 3.3V Power Supply ±350 mV Differential Signaling Power Off Protection (Outputs in TRI-STATE) Pinout Simplifies PCB Layout Low Power Dissipation (23 mW @ 3.3V Typical) SOT-23 5-Lead Package Pin Compatible with SN65LVDS1 The device is offered in a 5-lead SOT-23 package. The LVDS outputs have been arranged for easy PCB layout. The differential driver outputs provide low EMI with its typical low output swing of 350 mV. The DS90LV011AQ can be paired with its companion single line receiver, the DS90LT012AQ, or with any of TI's LVDS receivers, to provide a high-speed LVDS interface. Connection Diagram Figure 1. Top View See Package Number MF05A Functional Diagram 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2013, Texas Instruments Incorporated DS90LV011AQ SNLS296D – MAY 2008 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) −0.3V to 4.0V Supply Voltage (VDD) −0.3V to to (VDD + 0.3V) LVCMOS input voltage (TTL IN) −0.3V to +3.9V LVDS output voltage (OUT±) LVDS output short circuit current 24mA Maximum Package Power Dissipation @ +25°C DBV Package 794 mW Derate DBV Package 7.22 mW/°C above +25°C Package Thermal Resistance (4-Layer, 2 oz. Cu, JEDEC) θJA 138.5°C/Watt θJC 107.0°C/Watt −65°C to +150°C Storage Temperature Lead Temperature Range Soldering (4 sec.) +260°C Maximum Junction Temperature +135°C ESD Ratings HBM MM CDM (1) (2) (3) (4) (5) (3) ≥ 8kV (4) ≥ 250V (5) ≥ 1250V Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Human Body Model, applicable std. JESD22-A114C Machine Model, applicable std. JESD22-A115-A Field Induced Charge Device Model, applicable std. JESD22-C101-C Recommended Operating Conditions Min Typ Max Supply Voltage (VDD) 3.0 3.3 3.6 Units V Temperature (TA) −40 +25 +125 °C Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (1) (2) (3) Symbol Parameter |VOD| Output Differential Voltage ΔVOD VOD Magnitude Change VOS Offset Voltage ΔVOS Offset Magnitude Change IOFF Power-off Leakage Conditions (4) Output Short Circuit Current IOSD Differential Output Short Circuit Current (4) COUT Output Capacitance (2) (3) (4) 2 Min Typ Max Units 250 350 450 mV 3 35 mV 1.125 1.22 1.375 V 0 1 25 mV VOUT = 3.6V or GND, VDD = 0V ±1 ±10 μA VOUT+ and VOUT− = 0V −6 −24 mA VOD = 0V −5 −12 mA RL = 100Ω (Figure 2) IOS (1) Pin OUT+, OUT− RL = 100Ω (Figure 2 and Figure 3) 3 pF Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD. All typicals are given for: VDD = +3.3V and TA = +25°C. The DS90LV011AQ is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers outputs. Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS90LV011AQ DS90LV011AQ www.ti.com SNLS296D – MAY 2008 – REVISED APRIL 2013 Electrical Characteristics (continued) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)(3) Symbol Parameter Conditions Pin Min Max Units 2.0 VDD V GND 0.8 V TTL IN Typ VIH Input High Voltage VIL Input Low Voltage IIH Input High Current VIN = 3.3V or 2.4V ±2 ±10 μA IIL Input Low Current VIN = GND or 0.5V ±1 ±10 μA VCL Input Clamp Voltage ICL = −18 mA CIN Input Capacitance IDD Power Supply Current No Load −1.5 VIN = VDD or GND VDD −0.6 V 3 pF 5 8 mA 7 10 mA Min Typ Max Units RL = 100Ω Switching Characteristics Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified. (1) (2) (3) (4) Symbol Parameter Conditions tPHLD Differential Propagation Delay High to Low RL = 100Ω, CL = 15 pF 0.3 1.0 1.5 ns tPLHD Differential Propagation Delay Low to High (Figure 4 and Figure 5) 0.3 1.1 1.5 ns tSKD1 Differential Pulse Skew |tPHLD − tPLHD| 0 0.1 0.7 ns tSKD3 Differential Part to Part Skew (6) 0 0.2 1.0 ns tSKD4 Differential Part to Part Skew (7) 0 0.4 1.2 ns tTLH Transition Low to High Time 0.2 0.5 1.0 ns tTHL Transition High to Low Time 0.2 0.5 1.0 ns fMAX (1) (2) (3) (4) (5) (6) (7) (8) Maximum Operating Frequency (5) (8) 250 MHz All typicals are given for: VDD = +3.3V and TA = +25°C. These parameters are ensured by design. The limits are based on statistical analysis of the device performance over PVT (process, voltage, temperature) ranges. CL includes probe and fixture capacitance. Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr ≤ 1 ns, tf ≤ 1 ns (10%-90%). tSKD1, |tPHLD − tPLHD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel. tSKD3, Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This specification applies to devices at the same VDD and within 5°C of each other within the operating temperature range. tSKD4, part to part skew, is the differential channel to channel skew of any event between devices. This specification applies to devices over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay. fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, 0V to 3V. Output criteria: duty cycle = 45%/55%, VOD > 250mV. Parameter Measurement Information Figure 2. Differential Driver DC Test Circuit Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS90LV011AQ 3 DS90LV011AQ SNLS296D – MAY 2008 – REVISED APRIL 2013 www.ti.com Parameter Measurement Information (continued) Figure 3. Differential Driver Full Load DC Test Circuit Figure 4. Differential Driver Propagation Delay and Transition Time Test Circuit Figure 5. Differential Driver Propagation Delay and Transition Time Waveforms APPLICATION INFORMATION DEVICE PIN DESCRIPTIONS Package Pin Number SOT-23 4 Pin Name Description 5 TTL IN LVTTL/LVCMOS driver input pins 4 OUT+ Non-inverting driver output pin 3 OUT− Inverting driver output pin 2 GND Ground pin 1 VDD Power supply pin, +3.3V ± 0.3V Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS90LV011AQ DS90LV011AQ www.ti.com SNLS296D – MAY 2008 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision C (April 2013) to Revision D • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 4 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS90LV011AQ 5 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) DS90LV011AQMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N01Q DS90LV011AQMFE/NOPB ACTIVE SOT-23 DBV 5 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N01Q DS90LV011AQMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N01Q (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of