DS90LV017ATM/NOPB

DS90LV017A www.ti.com SNLS022C – MARCH 2000 – REVISED APRIL 2013 DS90LV017A LVDS Single High Speed Differential Driver Check for Samples: DS90LV017A FEATURES DESCRIPTION • • • • • • • • • • The DS90LV017A is a single LVDS driver device optimized for high data rate and low power applications. The DS90LV017A is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized. The device is designed to support data rates in excess of 600Mbps (300MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. 1 2 • • • >600 Mbps (300 MHz) Switching Rates 0.3 ns Typical Differential Skew 0.7 ns Maximum Differential Skew 1.5 ns Maximum Propagation Delay 3.3V Power Supply Design ±355 mV Differential Signaling Low Power Dissipation (23 mW @ 3.3V Static) Flow-Through Design Simplifies PCB Layout Interoperable with Existing 5V LVDS Devices Power Off Protection (Outputs in High Impedance) Conforms to TIA/EIA-644 Standard 8-Lead SOIC Package Saves Space Industrial Temperature Operating Range – (−40°C to +85°C) The device is in a 8-lead SOIC package. The DS90LV017A has a flow-through design for easy PCB layout. The differential driver outputs provides low EMI with its typical low output swing of 355 mV. The DS90LV017A can be paired with its companion single line receiver, the DS90LV018A, or with any of TI's LVDS receivers, to provide a high-speed point-topoint LVDS interface. Connection Diagram Figure 1. Dual-In-Line See Package Number D (R-PDSO-G8) Functional Diagram These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated DS90LV017A SNLS022C – MARCH 2000 – REVISED APRIL 2013 www.ti.com Absolute Maximum Ratings (1) −0.3V to +4V Supply Voltage (VCC) −0.3V to +3.6V Input Voltage (DI) −0.3V to +3.9V Output Voltage (DO±) Maximum Package Power Dissipation @ +25°C D Package 1190 mW Derate D Package 9.5 mW/°C above +25°C −65°C to +150°C Storage Temperature Range Lead Temperature Range Soldering (4 sec.) +260°C ≥ 8kV (HBM 1.5 kΩ, 100 pF) ESD Ratings (EIAJ 0 Ω, 200 pF) ≥ 1000V (CDM) ≥ 1000V (IEC direct 330 Ω, 150 pF) (1) ≥ 4kV “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation. Recommended Operating Conditions Min Typ Max Units Supply Voltage (VCC) 3.0 3.3 3.6 V Temperature (TA) −40 25 +85 °C Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1) (2) (3) Symbol Parameter Conditions Pin Min Typ Max Units DO+, DO− 250 355 450 mV 1 35 mV 1.4 1.6 V DIFFERENTIAL DRIVER CHARACTERISTICS VOD Output Differential Voltage ΔVOD VOD Magnitude Change RL = 100Ω (Figure 2) VOH Output High Voltage VOL Output Low Voltage VOS Offset Voltage ΔVOS Offset Magnitude Change IOXD Power-off Leakage IOSD Output Short Circuit Current VIH Input High Voltage VIL Input Low Voltage IIH Input High Current VIN = 3.3V or 2.4V IIL Input Low Current VIN = GND or 0.5V VCL Input Clamp Voltage ICL = −18 mA ICC Power Supply Current No Load (2) (3) 2 1.1 1.2 1.375 V 0 3 25 mV ±1 ±10 μA −5.7 −8 mA VCC V VOUT = VCC or GND, VCC = 0V DI 2.0 GND −1.5 VIN = VCC or GND RL = 100Ω (1) 0.9 1.125 VCC V 0.8 V ±2 ±10 μA ±1 ±10 μA −0.6 V 5 8 mA 7 10 mA Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD. All typicals are given for: VCC = +3.3V and TA = +25°C. The DS90LV017A is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers outputs. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS90LV017A DS90LV017A www.ti.com SNLS022C – MARCH 2000 – REVISED APRIL 2013 Switching Characteristics Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified (1) (2) (3) (4) Symbol Parameter Conditions Min Typ Max Units DIFFERENTIAL DRIVER CHARACTERISTICS tPHLD Differential Propagation Delay High to Low RL = 100Ω, CL = 15 pF 0.3 0.8 1.5 ns tPLHD Differential Propagation Delay Low to High (Figure 3 and Figure 4) 0.3 1.1 1.5 ns tSKD1 Differential Pulse Skew |tPHLD − tPLHD| (5) 0 0.3 0.7 ns tSKD3 Differential Part to Part Skew (6) 0 1.0 ns tSKD4 Differential Part to Part Skew (7) 0 1.2 ns tTLH Transition Low to High Time 0.2 0.5 1.0 ns tTHL Transition High to Low Time 0.2 0.5 1.0 fMAX Maximum Operating Frequency (8) (1) (2) (3) (4) (5) (6) (7) (8) 350 ns MHz All typicals are given for: VCC = +3.3V and TA = +25°C. These parameters are ensured by design. The limits are based on statistical analysis of the device performance over PVT (process, voltage, temperature) ranges. CL includes probe and fixture capacitance. Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr ≤ 1 ns, tf ≤ 1 ns (10%-90%). tSKD1, |tPHLD − tPLHD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel. tSKD3, Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range. tSKD4, part to part skew, is the differential channel to channel skew of any event between devices. This specification applies to devices over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay. fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, 0V to 3V. Output criteria: duty cycle = 45%/55%, VOD > 250mV. Parameter Measurement Information Figure 2. Differential Driver DC Test Circuit Figure 3. Differential Driver Propagation Delay and Transition Time Test Circuit Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS90LV017A 3 DS90LV017A SNLS022C – MARCH 2000 – REVISED APRIL 2013 www.ti.com Parameter Measurement Information (continued) Figure 4. Differential Driver Propagation Delay and Transition Time Waveforms APPLICATION INFORMATION Table 1. Device Pin Descriptions Pin # 4 Name Description 2 DI1 TTL/CMOS driver input pins 7 DO1+ Non-inverting driver output pin 8 DO1− Inverting driver output pin 4 GND Ground pin 1 VCC Positive power supply pin, +3.3V ± 0.3V 3, 5, 6 NC No connect Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS90LV017A DS90LV017A www.ti.com SNLS022C – MARCH 2000 – REVISED APRIL 2013 Typical Performance Curves Output High Voltage vs Power Supply Voltage Output Low Voltage vs Power Supply Voltage Figure 5. Figure 6. Output Short Circuit Current vs Power Supply Voltage Differential Output Voltage vs Power Supply Voltage Figure 7. Figure 8. Differential Output Voltage vs Load Resistor Offset Voltage vs Power Supply Voltage Figure 9. Figure 10. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS90LV017A 5 DS90LV017A SNLS022C – MARCH 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Curves (continued) 6 Power Supply Current vs Frequency Power Supply Current vs Power Supply Voltage Figure 11. Figure 12. Power Supply Current vs Ambient Temperature Differential Propagation Delay vs Power Supply Voltage Figure 13. Figure 14. Differential Propagation Delay vs Ambient Temperature Differential Skew vs Power Supply Voltage Figure 15. Figure 16. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS90LV017A DS90LV017A www.ti.com SNLS022C – MARCH 2000 – REVISED APRIL 2013 Typical Performance Curves (continued) Differential Skew vs Ambient Temperature Transition Time vs Power Supply Voltage Figure 17. Figure 18. Transition Time vs Ambient Temperature Figure 19. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS90LV017A 7 DS90LV017A SNLS022C – MARCH 2000 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision B (April 2013) to Revision C • 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS90LV017A PACKAGE OPTION ADDENDUM www.ti.com 30-Sep-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) DS90LV017ATM NRND SOIC D 8 95 Non-RoHS & Green Call TI Level-1-235C-UNLIM -40 to 85 LV17A TM DS90LV017ATM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LV17A TM DS90LV017ATMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LV17A TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of