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DS90UB927QSQ/NOPB

DS90UB927QSQ/NOPB

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    WQFN-40_6X6MM-EP

  • 描述:

    2.975Gbps-串行器-13-输入-1-输出-40-WQFN(6x6)

  • 数据手册
  • 价格&库存
DS90UB927QSQ/NOPB 数据手册
Sample & Buy Product Folder Support & Community Tools & Software Technical Documents DS90UB927Q-Q1 SNLS416D – JUNE 2012 – REVISED JANUARY 2015 DS90UB927Q-Q1 5-MHz to 85-MHz 24-bit Color FPD-Link III Serializer With Bidirectional Control Channel 1 Features • 1 • • • • • • • • • • • • • • • 3 Description The DS90UB927Q-Q1 serializer, in conjunction with a DS90UB928Q-Q1 or DS90UB926Q-Q1 deserializer, provides a complete digital interface for concurrent transmission of high-speed video, audio, and control data for automotive display and image sensing applications. 2 Bidirectional Control Channel Interface with I Ccompatible Serial Control Bus Low EMI FPD-Link Video Input Supports High Definition (720p) Digital Video Format 5-MHz to 85-MHz PCLK Supported RGB888 + VS, HS, DE and I2S Audio Supported Up to 4 I2S Digital Audio Inputs for Surround Sound Applications 4 Bidirectional GPIO Channels with 2 Dedicated Pins Single 3.3-V Supply with 1.8-V or 3.3-V Compatible LVCMOS I/O Interface AC-Coupled STP Interconnect Up to 10 Meters DC-Balanced and Scrambled Data With Embedded Clock Supports Repeater Application Internal Pattern Generation Low Power Modes Minimize Power Dissipation Automotive Grade Product: AEC-Q100 Grade 2 Qualified >8-kV HBM and ISO 10605 ESD Rating Backward Compatible Modes The chipset is ideally suited for automotive video display systens with HD formats and automotive vision systems with megapixel resolutions. The DS90UB927Q-Q1 incorporates an embedded bidirectional control channel and low latency GPIO controls. This device translates a FPD-Link video interface into a single-pair high-speed serialized interface. The FPD-Link III serial bus scheme supports full duplex, high speed forward channel data transmission and low-speed back channel communication over a single differential link. Consolidation of audio, video, and control data over a single differential pair reduces the interconnect size and weight, while also eliminating skew issues and simplifying system design. The DS90UB927Q-Q1 serializer embeds the clock and level shifts the signals to high-speed differential signaling. Up to 24 RGB data bits are serialized along with three video control signals, and up to four I2S data inputs. The FPD-Link data interface allows for easy interfacing with data sources while also minimizing EMI and bus width. EMI on the high-speed FPD-Link III bus is minimized using low voltage differential signaling, data scrambling and randomization, and DC-balancing. 2 Applications • • • • Automotive Displays for Navigation Rear Seat Entertainment Systems Automotive Driver Assistance Automotive Megapixel Camera Systems Device Information(1) PART NUMBER DS90UB927Q-Q1 PACKAGE WQFN (40) BODY SIZE (NOM) 6.00 mm x 6.00 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Application Diagram FPD-Link FPD-Link VDDIO VDD33 (3.3V) (1.8V or 3.3V) HOST Graphics Processor FPD-Link Display Interface VDD33 VDDIO (1.8V or 3.3V) (3.3V) RxIN3+/- RxIN1+/RxIN0+/RxCLKIN+/- TxOUT2+/- DOUT+ RIN+ DOUT- RIN100Q STP Cable DS90UB927Q-Q1 Serializer PDB INTB I2S 6 SCL SDA IDx TxOUT3+/- FPD-Link III 1 Pair/AC Coupled RxIN2+/- MAPSEL LFMODE REPEAT BKWD OEN OSS_SEL PDB MAPSEL LFMODE BISTEN MODE_SEL DS90UB928Q-Q1 Deserializer TxOUT1+/TxOUT0+/- RGB Display 720p 24-bit Color Depth TxCLKOUT+/INTB_IN LOCK PASS 6 I2S MCLK SCL SDA IDx 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DS90UB927Q-Q1 SNLS416D – JUNE 2012 – REVISED JANUARY 2015 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 5 6.1 6.2 6.3 6.4 6.5 6.6 6.7 Absolute Maximum Ratings ...................................... 5 ESD Ratings.............................................................. 5 Recommended Operating Conditions....................... 6 Thermal Information .................................................. 6 DC Electrical Characteristics .................................... 7 AC Electrical Characteristics..................................... 9 Electrical Characteristics: DC and AC Serial Control Bus ........................................................................... 10 6.8 Timing Requirements for the Serial Control Bus .... 11 6.9 Timing Requirements - DC and AC Serial Control Bus Characteristics .................................................. 11 6.10 Typical Characteristics .......................................... 14 7 Detailed Description ............................................ 15 7.1 Overview ................................................................. 15 7.2 7.3 7.4 7.5 7.6 8 Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ Programming........................................................... Register Maps ......................................................... 15 16 23 29 31 Application and Implementation ........................ 44 8.1 Application Information............................................ 44 8.2 Typical Application .................................................. 44 8.3 System Examples ................................................... 46 9 Power Supply Recommendations...................... 48 10 Layout................................................................... 48 10.1 Layout Guidelines ................................................. 48 10.2 Layout Example .................................................... 49 11 Device and Documentation Support ................. 51 11.1 11.2 11.3 11.4 Documentation Support ........................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 51 51 51 51 12 Mechanical, Packaging, and Orderable Information ........................................................... 51 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (October 2012) to Revision D • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 Changes from Revision B (June 2012) to Revision C • 2 Page Page Changed layout of National data sheet to tI format.............................................................................................................. 49 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: DS90UB927Q-Q1 DS90UB927Q-Q1 www.ti.com SNLS416D – JUNE 2012 – REVISED JANUARY 2015 5 Pin Configuration and Functions RxIN1- RxIN0- CAPLVD12 INTB VDD33_B LFMODE VDDIO MAPSEL BKWD REPEAT 29 28 27 26 25 24 23 22 21 30 RxIN0+ RTA Package 40-Pin WQFN With Exposed Thermal Pad Top View 31 DAP = GND 20 CMF 19 VDD33_A RxIN1+ 32 RxIN2- 33 18 PDB RxIN2+ 34 17 DOUT+ RxCLKIN- 35 16 DOUT- RxCLKIN+ 36 15 RES1 RxIN3- 37 14 CAPHS12 RxIN3+ 38 13 RES0 GPIO0 39 12 CAPP12 GPIO1 40 11 IDx 5 6 7 8 9 10 I2S_DC/GPI02 I2S_DD/GPI03 VDDIO CAPL12 SCL SDA 3 I2S_DA/GPIO_REG6 4 2 I2S_CLK/GPIO_REG8 I2S_DB/GPIO_REG5 1 I2S_WC/GPIO_REG7 DS90UB927Q-Q1 Pin Functions PIN NAME I/O NO. DESCRIPTION FPD-LINK INPUT INTERFACE RxCLKIN- 35 I, LVDS Inverting LVDS Clock Input The pair requires external 100-Ω differential termination for standard LVDS levels RxCLKIN+ 36 I, LVDS True LVDS Clock Input The pair requires external 100-Ω differential termination for standard LVDS levels RxIN[3:0]- 37, 33, 31, 29 I, LVDS Inverting LVDS Data Inputs Each pair requires external 100-Ω differential termination for standard LVDS levels RxIN[3:0]+ 38, 34, 32, 30 I, LVDS True LVDS Data Inputs Each pair requires external 100-Ω differential termination for standard LVDS levels LVCMOS PARALLEL INTERFACE BKWD GPIO[1:0] 22 40, 39 Backward Compatible Mode Select I, LVCMOS BKWD = 0, interfacing to DS90UH926/8Q-Q1 (Default) with pulldown BKWD = 1, interfacing to DS90UR906/8Q-Q1, DS90UR916Q Requires a 10-kΩ pullup if set HIGH I/O, LVCMOS General Purpose I/O with pulldown See Table 1 I2S_DA I2S_DB I2S_DC I2S_DD 3 4 5 6 I, LVCMOS Digital Audio Interface I2S Data Inputs with pulldown Shared with GPIO_REG6, GPIO_REG5, GPIO2, GPIO3 I2S_WC I2S_CLK 1 2 I, LVCMOS Digital Audio Interface I2S Word Clock and I2S Bit Clock Inputs with pulldown Shared with GPIO_REG7 and GPIO_REG8 (Table 3) Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: DS90UB927Q-Q1 3 DS90UB927Q-Q1 SNLS416D – JUNE 2012 – REVISED JANUARY 2015 www.ti.com Pin Functions (continued) PIN NAME I/O NO. DESCRIPTION 25 Low Frequency Mode Select I, LVCMOS LFMODE = 0, 15 MHz ≤ RxCLKIN ≤ 85 MHz (Default) with pulldown LFMODE = 1, 5 MHz ≤ RxCLKIN < 15 MHz Requires a 10-kΩ pullup if set HIGH MAPSEL 23 FPD-Link Input Map Select MAPSEL = 0, LSBs on RxIN3± (Default) I, LVCMOS MAPSEL = 1, MSBs on RxIN3± with pulldown See Figure 19 and Figure 20 Requires a 10-kΩ pullup if set HIGH REPEAT 21 Repeater Mode Select I, LVCMOS REPEAT = 0, Repeater Mode disabled (Default) with pulldown REPEAT = 1, Repeater Mode enabled Requires a 10-kΩ pullup if set HIGH LFMODE OPTIONAL PARALLEL INTERFACE GPIO[3:2] GPIO_REG [8:5] 6, 5 2, 1, 3, 4 I/O, LVCMOS General Purpose I/O with pulldown Shared with I2S_DD and I2S_DC (See Table 1) I/O, LVCMOS Register-Only General Purpose I/O with pulldown Shared with I2S_CLK, I2S_WC, I2S_DA, I2S_DB (See Table 2) CONTROL AND CONFIGURATION IDx 11 I, Analog I2C Address Select External pullup to VDD33 is required under all conditions. DO NOT FLOAT. Connect to external pullup to VDD33 and pulldown to GND to create a voltage divider. See Figure 25 and Table 4 PDB 18 Power-down Mode Input Pin Must be driven or pulled up to VDD33. Refer to Power Supply Recommendations. I, LVCMOS PDB = H, device is enabled (normal operation) with pulldown PDB = L, device is powered down. When the device is in the powered down state, the Driver Outputs are both HIGH, the PLL is shutdown, and IDD is minimized. Control Registers are RESET. SCL 9 I2C Clock Input / Output Interface I/O, LVCMOS Must have an external pullup to VDD33. DO NOT FLOAT. Open Drain Recommended pullup: 4.7 kΩ. 10 I2C Data Input / Output Interface I/O, LVCMOS Must have an external pullup to VDD33. DO NOT FLOAT. Open Drain Recommended pullup: 4.7 kΩ. 27 O, LVCMOS Open Drain SDA STATUS INTB Interrupt INTB = H, normal INTB = L, Interrupt request Recommended pullup: 4.7 kΩ to VDDIO. DO NOT FLOAT. FPD-LINK III SERIAL INTERFACE Common Mode Filter. Connect 0.1 µF to GND (required) CMF 20 Analog DOUT- 16 I/O, LVDS Inverting Output The output must be AC-coupled with a 0.1-µF capacitor. DOUT+ 17 I/O, LVDS True Output The output must be AC-coupled with a 0.1-µF capacitor. 4 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: DS90UB927Q-Q1 DS90UB927Q-Q1 www.ti.com SNLS416D – JUNE 2012 – REVISED JANUARY 2015 Pin Functions (continued) PIN NAME NO. I/O DESCRIPTION POWER (1) AND GROUND GND VDD33_A VDD33_B VDDIO DAP Ground Large metal contact at the bottom center of the device package Connect to the ground plane (GND) with at least 9 vias. 19 26 Power Power to on-chip regulator 3.0 V - 3.6 V. Each pin requires a 4.7-µF capacitor to GND 7, 24 Power LVCMOS I/O Power 1.8 V ±5% OR 3.0 V - 3.6 V. Each pin requires 4.7-µF capacitor to GND REGULATOR CAPACITOR CAPL12 8 CAP Decoupling capacitor connection for on-chip regulator Requires two 4.7-µF decoupling capacitors to GND CAPP12 CAPHS12 CAPLVD12 12 14 28 CAP Decoupling capacitor connection for on-chip regulator Each requires a 4.7-µF decoupling capacitor to GND. 15, 13 GND Reserved Connect to GND. OTHER RES[1:0] (1) The VDD (VDD33 and VDDIO) supply ramp should be faster than 1.5 ms with a monotonic rise. 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) (3) MIN MAX UNIT Supply Voltage – VDD33 −0.3 4.0 V Supply Voltage – VDDIO −0.3 4.0 V LVCMOS I/O Voltage −0.3 VDDIO + 0.3 V Serializer Output Voltage −0.3 2.75 V 150 °C 150 °C Junction Temperature −65 Storage Temperature, Tstg (1) (2) (3) For soldering specifications: see product folder at www.ti.com and SNOA549. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. 6.2 ESD Ratings VALUE V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002 (1) ±8000 Charged device model (CDM), per AEC Q100-011 ±1250 Machine model (MM) ±250 (IEC 61000-4-2, powered-up only) RD = 330 Ω, CS = 150 pF (ISO 10605) RD = 330 Ω, CS = 150 pF/330 pF RD = 2 kΩ, CS = 150 pF/330 pF (1) Air Discharge (Pin 16 and 17) ±15000 Contact Discharge (Pin 16 and 17) ±8000 Air Discharge (Pin 16 and 17) ±15000 Contact Discharge (Pin 16 and 17) ±8000 UNIT V AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: DS90UB927Q-Q1 5 DS90UB927Q-Q1 SNLS416D – JUNE 2012 – REVISED JANUARY 2015 www.ti.com 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Supply Voltage (VDD33) LVCMOS Supply Voltage (VDDIO) (1) MIN NOM MAX 3.0 3.3 3.6 Connect VDDIO to 3.3 V and use 3.3-V IOs 3.0 3.3 3.6 Connect VDDIO to 1.8 V and use 1.8-V IOs 1.71 1.8 1.89 −40 +25 +105 Operating Free Air Temperature (TA) PCLK Frequency 5 Supply Noise (2) (1) (2) UNIT V V °C 85 MHz 100 mVP-P VDDIO < VDD33 + 0.3 V Supply noise testing was done with minimum capacitors on the PCB. A sinusoidal signal is AC coupled to the VDD33 and VDDIO supplies with amplitude = 100 mVp-p measured at the device VDD33 and VDDIO pins. Bit error rate testing of input to the Ser and output of the Des with 10 meter cable shows no error when the noise frequency on the Ser is less than 50 MHz. The Des on the other hand shows no error when the noise frequency is less than 50 MHz. 6.4 Thermal Information DS90UB927Q-Q1 THERMAL METRIC (1) RTA (WQFN) UNIT 40 PINS RθJA Junction-to-ambient thermal resistance 29.0 RθJC(top) Junction-to-case (top) thermal resistance 14.4 RθJB Junction-to-board thermal resistance 5.1 ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter 5.1 RθJC(bot) Junction-to-case (bottom) thermal resistance 1.4 (1) 6 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: DS90UB927Q-Q1 DS90UB927Q-Q1 www.ti.com SNLS416D – JUNE 2012 – REVISED JANUARY 2015 6.5 DC Electrical Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. (1) (2) (3) PARAMETER TEST CONDITIONS PIN / FREQ MIN NOM MAX UNIT 2.0 VDDIO V GND 0.8 V LVCMOS I/O VIH High Level Input Voltage VDDIO = 3.0 V to 3.6 V (4) VIL Low Level Input Voltage VDDIO = 3.0 V to 3.6 V (4) IIN Input Current VIN = 0 V or VDDIO = 3.0 V to 3.6 V (4) −15 +15 μA High Level Input Voltage VDDIO = 3.0 V to 3.6 V 2.0 VDDIO V 0.65*VDDIO VDDIO V GND 0.8 V GND 0.35* VDDIO V VIH VDDIO = 1.71 V to 1.89 V VDDIO = 3.0 V to 3.6 V VIL Low Level Input Voltage IIN Input Current VOH High Level Output IOH = −4 mA Voltage VOL Low Level Output Voltage IOS Output Short Circuit Current VOUT = 0 V IOZ Tri-state Output Current VOUT = 0 V or VDDIO, PDB = L (1) (2) (3) (4) VDDIO = 1.71 V to 1.89 V VDDIO = 3.0 V to 3.6 V VIN = 0 V or VDDIO VDDIO = 1.71 V to 1.89 V IOL = +4 mA PDB GPIO[1:0] I2S_CLK I2S_WC I2S_D[A,B,C,D] LFMODE MAPSEL BKWD REPEAT ±1 −15 ±1 +15 μA −15 ±1 +15 μA VDDIO = 3.0 V to 3.6 V 2.4 VDDIO V VDDIO = 1.71 V to 1.89 V VDDIO 0.45 VDDIO V GND 0.4 V GND 0.45 V VDDIO = 3.0 V to 3.6 V VDDIO = 1.71 V to 1.89 V GPIO[3:0], GPO_REG[8:5] −55 −15 mA +15 μA The Electrical Characteristics tables list verified specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics conditions and/or notes. Typical specifications are estimations only and are not verified. Typical values represent most likely parametric norms at VDD33 = 3.3 V, VDDIO = 1.8 V or 3.3 V, TA = 25°C, and at the Recommended Operating Conditions at the time of product characterization and are not verified. Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground except VOD and ΔVOD, which are differential voltages. Supply noise testing was done with minimum capacitors on the PCB. A sinusoidal signal is AC coupled to the supply pins with amplitude = 100 mVp-p measured at the device VDD33 and VDDIO pins. Bit error rate testing of input to the serializer and output of the deserializer with 10 meter cable shows no error when the noise frequency is less than 50 MHz. PDB is specified to 3.3 V LVCMOS only and must be driven or pulled up to VDD33 or to VDDIO ≥ 3.0 V Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: DS90UB927Q-Q1 7 DS90UB927Q-Q1 SNLS416D – JUNE 2012 – REVISED JANUARY 2015 www.ti.com DC Electrical Characteristics (continued) Over recommended operating supply and temperature ranges unless otherwise specified.(1)(2)(3) PARAMETER TEST CONDITIONS PIN / FREQ MIN NOM MAX UNIT +100 mV FPD-LINK LVDS RECEIVER VTH Threshold High Voltage VTL Threshold Low Voltage |VID| Differential Input Voltage Swing VCM Common Mode Voltage IIN Input Current mV −100 VCM = 1.2 V RxCLKIN± RxIN[3:0]± 200 0 600 mV 2.4 V +10 μA 1000 1200 mVp-p 1 50 1.2 −10 FPD-LINK III CML DRIVER Differential Output VODp-p Voltage (DOUT+) RL = 100 Ω (Figure 1) – (DOUT-) ΔVOD Output Voltage Unbalance VOS Offset Voltage – Single-ended 800 2.5-0.25* VODp-p RL = 100 Ω (Figure 1) mV V (TYP) ΔVOS Offset Voltage Unbalance Single-ended IOS Output Short Circuit Current RT Internal Termination Resistance Differential DOUT± 1 DOUT+/- = 0 V, PDB = L or H (5) 50 −30 mV mA 100 120 Ω VDD33= 3.6 V 135 160 mA VDDIO = 3.6 V 100 500 μA VDDIO = 1.89 V 200 600 VDD33= 3.6 V 133 mA VDDIO = 3.6 V 100 μA VDDIO = 1.89 V 100 VDD33 = 3.6 V 1.2 2.4 mA VDDIO = 3.6 V 4 30 μA VDDIO = 1.89 V 5 30 μA VDD33 = 3.6 V 1 2.2 mA VDDIO = 3.6 V 8 20 μA VDDIO = 1.89 V 4 20 μA 80 SUPPLY CURRENT IDD1 IDDIO1 IDD2 Checkerboard Pattern (Figure 8) Supply Current RL = 100 Ω, PCLK = 85 MHz IDDIO2 IDDS IDDIOS Supply Current – Remote Auto Power Down Random Pattern PRBS7 reg_0x01[7]=1, Back channel Idle IDDZ IDDIOZ (5) 8 Supply Current – Power Down PDB = 0 V, All other LVCMOS inputs = 0 V μA μA IOS is not specified for an indefinite period of time. Do not hold in short circuit for more than 500 ms or part damage may result Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: DS90UB927Q-Q1 DS90UB927Q-Q1 www.ti.com SNLS416D – JUNE 2012 – REVISED JANUARY 2015 6.6 AC Electrical Characteristics over operating free-air temperature range (unless otherwise noted) (1) (2) (3) PARAMETER TEST CONDITIONS PIN / FREQ MIN TYP MAX UNIT RxCLKIN±, RXIN[3:0]± 0.25 0.5 0.75 UI 100 140 ps 100 140 ps 5 ms FPD-LINK LVDS INPUT tRSP Receiver Strobe Position See Figure 4 AC ELECTRICAL CHARACTERISTICS - FPD-LINK III CML IO tLHT CML Output Low-to-High Transition Time See Figure 3 tHLT CML Output High-to-Low Transition Time tPLD Serializer PLL Lock Time See Figure 5 (4) tSD Delay — Latency See Figure 6 tTJIT Output Total Jitter, Bit Error Rate ≤1E-9 Figure 7 (5) (6) (7) (8) (9) tIJIT Input Jitter Tolerance, Bit Error Rate ≤1E-9 (6) (10) Checkerboard Pattern PCLK=5 MHz, Figure 8 Checkerboard Pattern PCLK=85 MHz, Figure 8 f/40 < Jitter Freq < f/20, DES = DS90UB926Q-Q1 f/40 < Jitter Freq < f/20, DES = DS90UB928Q-Q1 DOUT+, DOUT- PCLK = 5MHz to 85MHz 146*T ns 0.17 0.2 UI 0.26 0.29 UI RxCLKIN± RxCLKIN±, f = 78 MHz 0.6 UI 0.5 UI >4/PCLK or >77 ns AC ELECTRICAL CHARACTERISTICS - I2S RECEIVER TI2S THC TLC I2S Clock Period (5) (11) RxCLKIN± f=5 MHz to 85 MHz I2S Clock High Time (11) I2S Clock Low Time (11) I2S_CLK, PCLK = 5 MHz to 85 MHz I2S_CLK 0.35 TI2S I2S_CLK 0.35 TI2S tsr I2S Set-up Time I2S_WC I2S_D[A,B,C,D] 0.2 TI2S thtr I2S Hold Time I2S_WC I2S_D[A,B,C,D] 0.2 TI2S AC ELECTRICAL CHARACTERISTICS - OTHER I/O tGPIO,FC GPIO Pulse Width, Forward Channel tGPIO,BC GPIO Pulse Width, Back Channel GPIO[3:0], PCLK = 5 MHz to 85 MHz GPIO[3:0] >2/PCLK s 20 µs (1) The Electrical Characteristics tables list verified specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics conditions and/or notes. Typical specifications are estimations only and are not verified. (2) Typical values represent most likely parametric norms at VDD33 = 3.3 V, VDDIO = 1.8 V or 3.3 V, TA = 25°C, and at the Recommended Operating Conditions at the time of product characterization and are not verified. (3) Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground except VOD and ΔVOD, which are differential voltages. Supply noise testing was done with minimum capacitors on the PCB. A sinusoidal signal is AC coupled to the supply pins with amplitude = 100 mVp-p measured at the device VDD33 and VDDIO pins. Bit error rate testing of input to the serializer and output of the deserializer with 10 meter cable shows no error when the noise frequency is less than 50 MHz. (4) tPLD is the time required by the device to obtain lock when exiting power-down state with an active PCLK. (5) Specification is verified by design and is not tested in production (6) Specification is verified by characterization and is not tested in production (7) UI – Unit Interval is equivalent to one ideal serialized bit width. The UI scales with PCLK frequency. (8) Output jitter specs are dependent upon the input clock jitter at the SER (9) tTJIT (@BER of 1E-9) specifies the allowable jitter on RxCLKIN±. (10) Jitter Frequency is specified in conjunction with DS90UB928Q-Q1 PLL bandwidth. (11) I2S specifications for tLC and tHC pulses must each be greater than 2 PCLK periods to verify sampling and supersedes the 0.35*TI2S_CLK requirement. tLC and tHC must be longer than the greater of either 0.35*TI2S_CLK or 2*PCLK Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: DS90UB927Q-Q1 9 DS90UB927Q-Q1 SNLS416D – JUNE 2012 – REVISED JANUARY 2015 www.ti.com AC Electrical Characteristics (continued) over operating free-air temperature range (unless otherwise noted)(1)(2)(3) PARAMETER TEST CONDITIONS PIN / FREQ MIN TYP MAX UNIT DC AND AC SERIAL CONTROL BUS CHARACTERISTICS tR SDA RiseTime – READ tF SDA Fall Time – READ SDA, RPU = 10 kΩ, Cb ≤ 400 pF, Figure 9 430 ns 20 ns 6.7 Electrical Characteristics: DC and AC Serial Control Bus Over 3.3-V supply and temperature ranges unless otherwise specified. (1) (2) (3) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT V VIH Input High Level SDA and SCL 0.7*VDDIO VDD33 VIL Input Low Level Voltage SDA and SCL GND 0.3*VDD33 VHY Input Hysteresis VOL SDA or SCL, IOL = 1.25 mA Iin Cin (1) (2) (3) 10 >50 SDA or SCL, Vin = VDDIO or GND Input Capacitance SDA or SCL 0 -10
DS90UB927QSQ/NOPB 价格&库存

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DS90UB927QSQ/NOPB
  •  国内价格
  • 1+48.23784
  • 10+46.45125
  • 100+42.16344
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