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User’s Guide
DS90UB95x-Q1 Serializer Evaluation Module
ABSTRACT
The Texas Instruments DS90UB95x-Q1EVM evaluation module (EVM) is a functional board design for
evaluating the DS90UB953-Q1 FPD-Link III serializer, the DS90UB635-Q1 low-cost FPD-Link III serializer,
and the TSER953 V3Link serializer. This document provides necessary details for the evaluation, such as a
brief product overview, quick-start guide, troubleshooting section, schematics, printed-circuit board (PCB) layout
details, and bill of materials (BOM).
The DS90UB953-Q1, DS90UB635-Q1, and TSER953 serializers represent the next generation in FPD-Link
III and V3Link serializers and are designed to support high-speed raw data sensors including 2-MP imagers
at 60 fps, as well as 4-MP, 30-fps cameras, satellite RADAR, LIDAR, and time-of-flight (ToF) sensors. The
chip delivers a 4-Gbps+ forward channel and an ultra-low latency, 50-Mbps bidirectional control channel. The
chip also supports power over a single coax (PoC) or shielded twisted-pair (STP) cable and connector. The
DS90UB953-Q1, DS90UB635-Q1, and TSER953 feature advanced data protection and diagnostic features to
support ADAS, autonomous driving, and industrial and medical imaging applications. Together with a companion
deserializer, the chip delivers precise multi-camera sensor clock and sensor synchronization. For a full list of
device characteristics, refer to the datasheet for each device.
Table of Contents
1 Introduction.............................................................................................................................................................................3
2 Quick Start Guide....................................................................................................................................................................4
3 Troubleshooting......................................................................................................................................................................7
4 Bill of Materials..................................................................................................................................................................... 39
5 PCB Schematics................................................................................................................................................................... 43
6 Board Layout.........................................................................................................................................................................47
7 Related Documentation........................................................................................................................................................53
8 Revision History................................................................................................................................................................... 53
List of Figures
Figure 1-1. DS90UB95x-Q1EVM Top View................................................................................................................................. 3
Figure 2-1. Typical Application Block Diagram Using DS90UB953-Q1 and DS90UB954-Q1 (or variant)...................................4
Figure 2-2. DS90UB95x-Q1EVM Major Components................................................................................................................. 5
Figure 2-3. DS90UB95x-Q1EVM With Installed Jumpers........................................................................................................... 5
Figure 2-4. DS90UB954-Q1EVM (or variant) With Jumpers Highlighted.................................................................................... 6
Figure 3-1. USB2ANY..................................................................................................................................................................7
Figure 3-2. I2C Pinout of USB2ANY Connector.......................................................................................................................... 8
Figure 3-3. Launching ALP........................................................................................................................................................ 10
Figure 3-4. Initial ALP Screen....................................................................................................................................................10
Figure 3-5. Follow-Up Screen.................................................................................................................................................... 11
Figure 3-6. ALP Information Tab................................................................................................................................................12
Figure 3-7. ALP Registers Tab...................................................................................................................................................13
Figure 3-8. ALP Device ID Selected.......................................................................................................................................... 14
Figure 3-9. ALP Device ID Expanded........................................................................................................................................15
Figure 3-10. Writing to Register 0x00 by Checking Bits in ALP.................................................................................................15
Figure 3-11. ALP Scripting Tab.................................................................................................................................................. 16
Figure 3-12. Pre-Defined Scripts............................................................................................................................................... 17
Figure 3-13. Custom Button Creation Step 1.............................................................................................................................18
Figure 3-14. Custom Button Creation Step 2.............................................................................................................................18
Figure 3-15. ALP Scripting Tab..................................................................................................................................................21
Figure 3-16. USB2ANY Setup................................................................................................................................................... 22
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Figure 3-17. Remove Incorrect Profile.......................................................................................................................................22
Figure 3-18. Add Correct Profile................................................................................................................................................ 23
Figure 3-19. Finish Setup.......................................................................................................................................................... 23
Figure 3-20. ALP No Devices Error........................................................................................................................................... 24
Figure 3-21. Windows 7, ALP USB2ANY Driver........................................................................................................................24
Figure 3-22. ALP in Demo Mode............................................................................................................................................... 25
Figure 3-23. ALP Preferences Menu......................................................................................................................................... 25
Figure 3-24. Error that States One Instance of This Application Can Be Active in ALP............................................................ 26
Figure 3-25. Ending MainGUI.exe in Task Manager..................................................................................................................26
Figure 3-26. Error That States That USB2ANY Firmware Must be Updated.............................................................................27
Figure 3-27. USB2ANY Firmware Loader Program Dialog....................................................................................................... 28
Figure 3-28. USB2ANY Without Enclosure............................................................................................................................... 29
Figure 3-29. USB2ANY With Enclosure.................................................................................................................................... 29
Figure 3-30. Verifying DS90UB95x Register............................................................................................................................. 30
Figure 3-31. Window for Setting up Scripts in ALP....................................................................................................................30
Figure 3-32. DS90UB954-Q1EVM (or variant) With Highlighted Jumpers................................................................................ 33
Figure 3-33. DS90UB95x-Q1EVM With Installed Jumpers....................................................................................................... 34
Figure 3-34. Test Setup............................................................................................................................................................. 35
Figure 3-35. Setting up Device Profiles in ALP..........................................................................................................................36
Figure 3-36. Navigating to DS90UB954 (or variant) Scripting Tab in ALP.................................................................................36
Figure 3-37. Reading I2C Device ID Within the Register Tab....................................................................................................37
Figure 3-38. Verifying Pass and Lock for DS90UB954 (or variant) in ALP................................................................................37
Figure 3-39. Verifying Camera Initialization in ALP................................................................................................................... 38
Figure 5-1. DS90UB95x-Q1EVM Schematic 1.......................................................................................................................... 43
Figure 5-2. DS90UB95x-Q1EVM Schematic 2.......................................................................................................................... 44
Figure 5-3. DS90UB95x-Q1EVM Schematic 3.......................................................................................................................... 45
Figure 5-4. DS90UB95x-Q1EVM Schematic 4.......................................................................................................................... 46
Figure 6-1. Top Layer PCB Layout............................................................................................................................................ 47
Figure 6-2. Top Overlay............................................................................................................................................................. 47
Figure 6-3. Top Paste................................................................................................................................................................ 48
Figure 6-4. Top Solder............................................................................................................................................................... 48
Figure 6-5. Signal Layer 1......................................................................................................................................................... 49
Figure 6-6. Signal Layer 2......................................................................................................................................................... 49
Figure 6-7. Signal Layer 3......................................................................................................................................................... 50
Figure 6-8. Signal Layer 4......................................................................................................................................................... 50
Figure 6-9. Bottom Layer PCB Layout.......................................................................................................................................51
Figure 6-10. Bottom Overlay......................................................................................................................................................51
Figure 6-11. Bottom Paste......................................................................................................................................................... 52
Figure 6-12. Bottom Solder........................................................................................................................................................52
List of Tables
Table 3-1. Equipment.................................................................................................................................................................31
Table 4-1. Bill of Materials..........................................................................................................................................................39
Trademarks
All trademarks are the property of their respective owners.
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Introduction
1 Introduction
Note
The demo board is not optimized for EMI testing. The demo board was designed for easy accessibility
to device pins with tap points for monitoring or applying signals, additional pads for termination, and
multiple connector options.
Figure 1-1. DS90UB95x-Q1EVM Top View
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Quick Start Guide
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2 Quick Start Guide
The quick start guide is intended to get the DS90UB95x-Q1EVM operational with the minimum amount of
information. See Section 3.5 in the troubleshooting section for in-depth, step-by-step instructions.
2.1 System Requirements
The major components of the DS90UB95x-Q1EVM are:
• DS90UB95x-Q1 Serializer Board
• On-board Power-over-Coax (PoC) interface
• FAKRA connector for digital video, power, and diagnostics
• On-board I2C programming interface
To demonstrate, TI recommends the following (not included):
• DS90UB954-Q1EVM (or variant)
• One DACAR/FAKRA coax cable
• DC power supply for DS90UB954-Q1EVM (or variant) only
• Power supply cables: for example, banana to coax, banana to grabber, and so forth.
• Two male USB-to-mini USB cables
• USB2ANY or an Aardvark I2C/SPI Host Adapter
• Analog LaunchPAD software (download Analog Launch PAD from TI.com (a myTI Login required). Steps for
installation can be found in Section 3.3). This software is not required if an external ECU is used.
2.2 Application Block Diagram
1.8 V
1.8 V
MIPI CSI-2
DS90UB953
D2+/-
Serializer
Full HD
Image Sensor
D1+/-
1920x1200
D0+/-
60fps
MIPI CSI-2
D3+/-
FPD-Link III
(over Coax or STP)
0.033 µF
0.033 µF
I2C
IDx
HS_GPIO
(SPI)
D3+/-
Deserializer
D2+/-
D0+/-
Image
Signal
Processor
CLK+/-
(ISP)
D1+/RIN0+
DOUT0+
CLK+/-
DS90UB954
0.015 µF
0.015 µF
DOUT0-
RIN050 Ÿ
50 Ÿ
I2C
IDx
HS_GPIO
(SPI)
Figure 2-1. Typical Application Block Diagram Using DS90UB953-Q1 and DS90UB954-Q1 (or variant)
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Quick Start Guide
2.3 Major Components of DS90UB95x-Q1EVM
Optional Daughter Card Connector
Figure 2-2. DS90UB95x-Q1EVM Major Components
2.4 Demo Instructions for DS90UB95x-Q1EVM
1. Ensure jumpers on J2, J4, and J15 for DS90UB95x-Q1EVM are installed as shown in Figure 2-3
Figure 2-3. DS90UB95x-Q1EVM With Installed Jumpers
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2. Ensure jumpers and switches for DS90UB954-Q1EVM (or variant) are configured like shown in Figure 2-4.
See the DS90UB954-Q1EVM User's Guide (SNLU223) for further details.
Figure 2-4. DS90UB954-Q1EVM (or variant) With Jumpers Highlighted
3. Connect the DACAR coax cable with FAKRA connector to RX0p from the DS90UB954-Q1EVM (or variant)
to J16 of the DS90UB95x-Q1EVM
4. Connect a mini USB to J2 on the DS90UB954-Q1EVM (or variant) and J9 on the DS90UB95x-Q1EVM to a
device with Analog LaunchPAD (ALP) software installed
5. Power the DS90UB954-Q1EVM (or variant) with 12 V through J1
6. Open ALP and assign the correct DS90UB953 and DS90UB954 (or variant) profiles to the appropriate USB
IDs
7. The DS90UB95x-Q1EVM and DS90UB954-Q1EVM (or variant) should now be linked and have established
connection. Go to information tab on the DS90UB954 (or variant) device window and confirm that Pass Sts
displays Pass and Linked has the appropriate frequency displayed. Also check if Pass and Lock LEDs are lit
8. Navigate back to the Scripting tab of the DS90UB954 (or variant) ALP profile and run the
953to954_patgen_YUV_1920x1080p-4Lanes-Working.py script to initialize a pattern generation test from
the 953. The script may be found by clicking on the "Run PreDef Script" button. If the DS90UB954-Q1 (or
variant) is not using an I2C address of 0x7A (8-bit form), the script should be modified to use the correct I2C
address. Go back to the information tab of the DS90UB954-Q1 (or variant) and confirm the horizontal and
vertical parameters read 3820 bytes and 1080 lines, respectively.
9. If there are any problems, consult Section 3.5 for an in-depth step-by-step guide to enable the pass and lock
2.5 Use With DS90UB935-Q1
The only modification required to use the DS90UB95x-Q1EVM to evaluate the DS90UB935-Q1 is to exchange
the DS90UB953-Q1 with the DS90UB935-Q1. No additional rework is required.
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Troubleshooting
3 Troubleshooting
3.1 Default Addresses
The default 9-bit I2C address of DS90UB95xis set to 0x30 (011 0000) using suitable resistor divider on ID[x] pin.
Also, 8-bit I2C address of DS90UB954 (or variant) is set to 0x7A (0111 1010) using suitable resistor dividers on
pins IDX[0] and IDX[1].
3.2 USB2ANY
The USB2ANY is required to work with any interactive GUI over I2C, such as ALP (Analog LaunchPAD).
Download and install ALP from: http://www.ti.com/tool/ALP.
The USB2ANY is shown in Figure 3-1. It is powered through the USB port of computer.
Figure 3-1. USB2ANY
There are two methods to use the USB2ANY to communicate with the 953/954 EVMs. The first method is to
simply connect the USB to Mini-USB cable to the USB port of your computer and the Mini-USB ports on the
EVMs, J9 for the 953 EVM (see Figure 2-2) and J2 on the 954 EVM. If using the first method, skip to Section 3.3.
The second method is to use the pinout of the USB2ANY. Figure 3-2 shows the USB2ANY pinout with the I2C
pins highlighted. Typically, jumper wires are used to connect these to the 953/954 EVMs.
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Figure 3-2. I2C Pinout of USB2ANY Connector
On the DS90UB954-Q1EVM (or variant), connect the other ends of the corresponding wires to pins 2, 3, and 4 of
J25 labeled SCL, SDA, and GND, respectively.
On the DS90UB95x-Q1EVM, connect the other ends of the corresponding wires to pins 1, 2, and 3 of J5 for 1.8
V, or J6 for 3.3 V labeled SCL, SDA, and GND, respectively. Note that these voltages refer to the pullup voltage
used in I2C communication. As a result, check the mode of the I2C adapter before plugging in to the adapter.
Connecting the Mini USB to USB cable from the port of the USB2ANY to the computer should allow ALP to
communicate with the EVM. However, if the EVMs are configured to have 1.8 V I2C signal levels (see J5 on
the 953 EVM and J16 on the 954 EVM), the USB2ANY must be configured to support the 1.8 V required
by the DS90UB95x-Q1EVM and DS90UB954-Q1EVM (or variant). To do this, the user must navigate to the
USB2ANY.py script and change the code. The path to the file is given below:
SPACER
C:\Program Files (x86)\Texas Instruments\Analog LaunchPAD
v1.56.0010\Drivers\i2c_controllers\usb2any\python
SPACER
Once the usb2any_lib.py script is found, open the script in a text editing program (for example, Notepad,
Wordpad, Notepad++, and so forth) and replace Line 61 from:
SPACER
self.usb2anydll.u2aI2C_Control(self.u2ahandle,1,0,0)
SPACER
To the following:
SPACER
self.usb2anydll.u2aI2C_Control(self.u2ahandle,1,0,1)
self.usb2anydll.u2aPower_WriteControl(self.u2ahandle,1,0)
SPACER
Save the script, close the program, and ALP will now recognize the connection from the board to the USB2ANY.
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Troubleshooting
3.3 ALP Software Setup
Note
The ALP Software Setup example used in this section refers to several FPD-Link parts. Specific
screenshots may not be for the DS90UB954-Q1 or DS90UB953-Q1, however, the process remains
the same for using the DS90UB95x-Q1EVM and DS90UB954-Q1EVM.
3.3.1 System Requirements
Operating System:
Windows 7 64-bit
USB:
USB2ANY
USB2ANY Firmware Version:
2.5.2.0
USB:
Aardvark I2C/SPI host adapter
p/n TP240141
3.3.2 Download Contents
The latest TI Analog LaunchPAD can be downloaded from: http://www.ti.com/tool/alp.
Download and extract the zip file to a temporary location that can be deleted later.
The following installation instructions are for a PC running Windows 7 64-bit Operating System.
3.3.3 Installation of the ALP Software
Execute the ALP Setup Wizard program called ALPF_setup_v_x_x_x.exe that was extracted to a temporary
location on the local drive of your PC.
There are 7 steps to the installation once the setup wizard is started:
1.
2.
3.
4.
5.
Select the Next button.
Select I accept the agreement and then select the Next button.
Select the location to install the ALP software and then select the Next button.
Select the location for the start menu shortcut and then select the Next button.
There will then be a screen that allows the creation of a desktop icon. After selecting the desired choices
select the Next button.
6. Select the Install button, and the software will then be installed to the selected location.
7. Uncheck Launch Analog LaunchPAD and select the Finish button. The ALP software will start if Launch
Analog LaunchPAD is checked, but it will not be useful until the USB driver is installed and board is attached.
Power the DS90UB95x-Q1 EVM board with a 12-VDC power supply.
3.3.4 Start-Up - Software Description
Make sure all the software has been installed and the hardware is powered on and connected to the PC.
Execute Analog LaunchPAD shortcut from the start menu. The default start menu location is under All Programs
> Texas Instruments > Analog LaunchPAD vx.x.x > Analog LaunchPAD to start MainGUI.exe.
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Figure 3-3. Launching ALP
The application should come up in the state shown in Figure 3-4. If it does not, see Section 3.4.
Under the Devices tab, click twice on the DS90UB95x to select the device to open the device profile and its
associated tabs. If the incorrect profile is shown, consult Section 3.4.1.
Figure 3-4. Initial ALP Screen
After selecting the DS90UB95x, the following screen shown in Figure 3-5 should appear.
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Figure 3-5. Follow-Up Screen
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3.3.5 Information Tab
The Information tab is shown in Figure 3-6.
Figure 3-6. ALP Information Tab
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3.3.6 Registers Tab
The Register tab is shown in Figure 3-7.
Figure 3-7. ALP Registers Tab
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3.3.7 Registers Tab - Address 0x00 Selected
Figure 3-8 shows Address 0x00 selected. Note that the Value: box,
of that register.
, will now show the hex value
Figure 3-8. ALP Device ID Selected
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3.3.8 Registers Tab - Address 0x00 Expanded
By double clicking on the Address bar
or a single click on
be expanded.
, the expanded Address 0x00 reveals contents by bits. Any register address displayed can
Figure 3-9. ALP Device ID Expanded
Any RW Type register,
, can be written into by writing the hex value into the Value: box,
or
putting the pointer into the individual register bit(s) box by a left mouse click to put a check mark (indicating a
1) or unchecking to remove the check mark (indicating a 0). Click the Apply button to write to the register, and
refresh to see the new value of the selected (highlighted) register.
Figure 3-10. Writing to Register 0x00 by Checking Bits in ALP
The box toggles on every mouse click.
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3.3.9 Scripting Tab
Figure 3-11 shows the Scripting tab. The script window provides a full Python scripting environment which can
be for running scripts and interacting with the device in an interactive or automated fashion. Commands may be
written directly into the Scripting tab or may be run from a .py file using the "Run" button. Example scripts may
be found using the "Run PreDef Script" button.
Figure 3-11. ALP Scripting Tab
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Figure 3-12. Pre-Defined Scripts
It is also possible to create custom buttons on the Scripting tab to run a desired script. To do so, click on the
"Setup" button, then say "Add", and select the desired name and script. To make the button appear in future
instances of ALP, click the "Set As Default" button.
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1
3
4
2
5
Figure 3-13. Custom Button Creation Step 1
7
6
Figure 3-14. Custom Button Creation Step 2
WARNING
Directly interacting with devices either through register modifications or calling device support library
functions can effect the performance and/or functionality of the user interface and may even crash
the ALP Framework application.
3.3.9.1 Example Functions
The following are Python functions commonly used to interact with FPD-Link devices.
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3.3.9.1.1 Local I2C Reads/Writes
These functions will perform reads and writes only for the I2C assigned to board.devAddr, which by default will
be the detected address for the DS90UB954-Q1 (or variant).
board.ReadReg(Register
Address , # of Bytes)
OR board.ReadReg(Register
Address)
I2C Read Command
board.WriteReg(Register
Address , Data)
I2C Write Command
•
•
•
Accepts both hex & decimal inputs
Number of bytes will default to 1 if omitted
Ex: board.ReadReg(0x00) will return the value in Register 0 for the local
device
•
•
Accepts both hex & decimal inputs
Ex: board.WriteReg(0x01, 0x01) will set Register 0 to have a value of 1
board.devAddr = [I2C Address] Assigns I2C address to be used for board.ReadReg and board.WriteReg
commands
•
•
•
•
Accepts both hex & decimal inputs
Uses the 8-bit form of the I2C address
Can be used to shorten read/write commands
Ex: board.devAddress = 0x60 sets the board address to 0x60
3.3.9.1.2 General I2C Reads/Writes:
These I2C commands will work for any I2C address on the local bus and remote devices configured in the Target
ID and Target alias registers of the device. The 8-bit form of I2C addresses should be used.
board.ReadI2C(Device Address, I2C Read Command
Register Address , # of Bytes) OR
• Accepts both hex & decimal inputs
board.ReadI2C(Device Address,
• Number of bytes will default to 1 if omitted
Register Address)
• Ex: board.ReadI2C(0x60, 0x00) will return the value in Register 0 for
the device with address 0x60 (8-bit form)
board.WriteI2C(Device Address,
Register Address , Data)
I2C Write Command
•
•
Accepts both hex & decimal inputs
Ex: board.WriteI2C(0x60, 0x01, 0x01) will set Register 1 of the device
with address 0x60 (8-bit form) to have a value of 1
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3.3.9.1.3 I2C Reads/Writes with Multi-Byte Register Addresses
These I2C commands will work for any I2C address on the local bus and remote devices configured in the Target
ID and Target alias registers of the device. The 8-bit form of I2C addresses should be used.
board.ReadI2C(Device Address,
Register Address Byte 2,[Register
Address Byte 1, # of Bytes])
OR board.ReadI2C(Device Address,
Register Address Byte 2, [Register
Address Byte 1])
I2C Read Command for devices with multi-byte register addresses
board.WriteI2C(Device Address,
Register Address Byte 2, [Register
Address Byte 1, Data])
I2C Write Command for devices with multi-byte register addresses
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•
•
•
•
•
•
Accepts both hex & decimal inputs
Number of bytes will default to 1 if omitted
Ex: board.ReadI2C(0x60, 0x30, [0x00]) will return the value in
Register 0x3000 for the device with address 0x60 (8-bit form)
Accepts both hex & decimal inputs
Number of bytes will default to 1 if omitted
• Ex: board.WriteI2C(0x60, 0x30, [0x01, 0x01]) will set Register
0x3000 of the device with address 0x60 (8-bit form) to have a
value of 1
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3.3.10 Scripting Tab
The Scripting tab is shown in Figure 3-15.
Figure 3-15. ALP Scripting Tab
The script window provides a full Python scripting environment which can be for running scripts and interacting
with the device in an interactive or automated fashion.
WARNING
Directly interacting with devices either through register modifications or calling device support library
functions can effect the performance and/or functionality of the user interface and may even crash
the ALP Framework application.
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3.4 Troubleshooting ALP Software
3.4.1 ALP Loads the Incorrect Profile
If ALP opens with the incorrect profile loaded the correct profile can be loaded from the USB2ANY/Aardvark
Setup found under the tools menu.
Figure 3-16. USB2ANY Setup
Highlight the incorrect profile in the Defined ALP Devices list and press the remove button.
Figure 3-17. Remove Incorrect Profile
Find the correct profile under the Select a Daughter Board list, highlight the profile and press Add.
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Figure 3-18. Add Correct Profile
Select Ok and the correct profile should now be loaded.
Figure 3-19. Finish Setup
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3.4.2 ALP Does Not Detect the EVM
If the following window opens after starting the ALP software, double check the hardware setup.
Figure 3-20. ALP No Devices Error
It may also be that the USB2ANY driver is not installed. Check the device manager. There should be a
HID-compliant device under the Human Interface Devices as shown below.
Figure 3-21. Windows 7, ALP USB2ANY Driver
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The software should start with only DS90UB95x in the Devices drop-down menu. If there are more devices then
the software is most likely in demo mode. When the ALP is operating in demo mode there is a (Demo Mode)
indication in the lower left of the application status bar as shown below.
Figure 3-22. ALP in Demo Mode
Disable the demo mode by selecting the Preferences drop-down menu and unchecking Enable Demo Mode.
Figure 3-23. ALP Preferences Menu
After demo mode is disabled, the ALP software will poll the ALP hardware. The ALP software will update and
have only DS90UB95x under the Devices drop-down menu.
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3.4.3 Error When Opening ALP: One Instance of this Application Can Be Active
Figure 3-24 shows the error message that states only one instance of this application can be active. This occurs
when ALP fails to shutdown correctly.
Figure 3-24. Error that States One Instance of This Application Can Be Active in ALP
To fix the error, click OK to continue. Access your task manager by pressing CTRL + Shift + ESC or CTRL +
ALT + DELETE and selecting task manager. Then, go to the processes tab, select the MainGUI.exe *32 process,
click end process shown in Figure 3-25.
Figure 3-25. Ending MainGUI.exe in Task Manager
You should now be able to open ALP normally. If the problem persists, restart your machine and follow the steps
again.
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3.4.4 Error Referring to USB2ANY Firmware Update
Figure 3-26 shows the error message that states that the connected USB2ANY does not have the correct
firmware. To update the firmware, follow the steps below:
Figure 3-26. Error That States That USB2ANY Firmware Must be Updated
Note
Newer versions of the USB2ANY API Library (USB2ANY.DLL) automatically check the firmware
version running on the USB2ANY and update it to the required version automatically, when necessary.
That is the preferred method.
In most cases, the USB2ANY Firmware Loader program is no longer required or recommended. It is
provided only for legacy applications.
1. Run the USB2ANY Firmware Loader program. The installation program will normally create an icon for it on
your desktop. By default, the program will be located in the bin folder of the TI USB2ANY SDK folder (for
example, C:\Program Files (x86)\TI USB2ANY SDK\bin).
The program dialog will look like this:
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Figure 3-27. USB2ANY Firmware Loader Program Dialog
2. Near the top of the dialog, you should see a list of available devices (there is usually only one device), with
the first device highlighted.
3. If more than one device is displayed, select the desired device using the mouse or arrow keys. If you
connect, re-connect, or change devices while the program is running, click the Refresh List button to update
the displayed list.
4. By default, the program will show the recommended firmware version in the Update to firmware version
drop-down list box. If you want to load an older version of firmware, click the down-arrow button to the right
of the list box to display a list of other available versions.
5. Click the Update Firmware button.
6. A confirmation dialog box will display the firmware version selected for the update and prompt to verify that
you want to proceed. Click the Yes button to continue.
7. A new dialog will appear. If the first line of text says The USB2ANY is ready for download, proceed to step 9
(that is, skip step 8).
8. The dialog will display instructions for preparing the USB2ANY for the firmware download. Follow the
instructions, referring to Figure 3-28 and Figure 3-29 for locations of the BSL button (S1 switch) and USB
connector. If the USB2ANY is in an enclosure, you will need to insert an implement (a paper clip works
great) into the small hole to press the button.
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Figure 3-28. USB2ANY Without Enclosure
Figure 3-29. USB2ANY With Enclosure
9. When the Update Firmware button appears, the USB2ANY is ready to be updated with the new firmware.
Click the Update Firmware button to start the update process.
10. The message Done! will appear in the status area when the update completes successfully.
11. Click the Close button to return to the previous dialog. If you want to update the firmware on another
USB2ANY, go back to Step 2.
12. When finished updating firmware, click the Done button.
3.4.5 Identifying USB IDs and Corresponding Devices
If you connected both devices to the same machine and are having trouble identifying which device belongs to
which USB port, close the USB2ANY/Aardvark Setup, and unplug one of the USB cables from the computer.
ALP should automatically update which USB port is still in use. Take note of the remaining USB ID and note
whether the 954EVM or 953EVM is connected to the port. Reconnect the other USB cable and assign the
appropriate profile to each ID.
Alternatively, arbitrarily assign profiles to each of the USB IDs and open the device page that is assigned to the
953 by double clicking the name. Select the registers tab, click register 0x00 label I2C_DEVICE_ID, and read the
value, shown in Figure 3-30.
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Figure 3-30. Verifying DS90UB95x Register
The default I2C Device ID for the 953 is 0x30. If the value is 0x00 instead of 0x30, you need to switch the
profiles for the assigned USB ID and re-verify the Device ID.
3.4.6 Set up File for Loading Scripts and Create Buttons for Each Script
ALP has a feature that allows the user to load multiple scripts by using one file and create buttons that run the
scripts when clicked. To configure this file, go the scripting tab in DS90UB954 (or variant) device page. After
navigating to the scripting tab, click Setup.
After clicking Add in the new window, ALP will bring up another separate window with Button Name and Script
fields. Using the Browse button, navigate to the script you would like to add and double click the file. In the
Button Name field, write in a name the script—note that this name will show up on the button that is created. For
example, in Figure 3-31, the script P954_SETUP_A0_4G is named Setup_4G.
Figure 3-31. Window for Setting up Scripts in ALP
After adding every script with an appropriate name, click save as and save the setup file in an appropriate
location. Whenever you open the program again, you can open this file and every script will be added to the
setup window. When done saving and adding scripts, press OK. The buttons should be added to the right-hand
side of the window under the Setup and Run buttons in the script tab.
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3.5 Additional Troubleshooting – Step-by-Step Guide
3.5.1 EVM Equipment
Table 3-1. Equipment
EQUIPMENT
SPECIFICATIONS
RECOMMENDED MODEL
DS90UB95x-Q1EVM
REV A1
DS90UB954-Q1EVM (or
variant)
REV A1
DC Power Supply
HP E3610A (or any DC Power
Supply capable of delivering 12 V)
DACAR/FAKRA coax cable
1 – Male DACAR/ FAKRA
coax to DACAR/ FAKRA
coax cable
USB2ANY (optional)
3 – Jumper Wires: 1 blue, 1
green, and 1 yellow (colors
do not matter)
USB to Mini USB Cables
2 – Male USB to Mini USB
cables
Banana to Coaxial cable
1 – Male, red and black
banana to male coax
PICTURE
USB2ANY
(Alternatively, use two male
banana to grabber wires, more
information in step 5 of Section
2.4).
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3.5.2 EVM Equipment Setup
1.
2.
3.
4.
5.
6.
Power ON the HP E3610A.
Verify that CC SET is not on which is indicated by the illuminated light next to CV.
Verify that RANGE is in 2-A mode which is indicated by the depressed RANGE button
Use the Voltage knob to adjust the voltage to 12 V.
Power OFF the HP E3610A
Connect the red and black banana to coax cable from the + and – output of the HP E3610A, respectively,
to the coax jack, J24, on the DS90UB954EVM (or variant) labeled 12 V. Alternatively, use the red and black
banana to grabber cables from the “+” and “-“ output of the supply to pin 1 and 2, respectively, of J20, on the
DS90UB954EVM (or variant) labeled GND and VDD_EXT near the lower left side of the board.
7. Connect the FPD Link III cable from CN1 on the DS90UB954EVM (or variant) to J11 on the
DS90UB953EVM. Ensure there is a click when connecting the cable to the connectors.
8. Connect the Mini USB to USB cable from J5 on the DS90UB954EVM (or variant) to the computer that will
use Analog Launch Pad (ALP).
9. Connect the Mini USB to USB cable from J9 on the DS90UB953EVM to the computer that will use Analog
Launch Pad (ALP).
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10. On the DS90UB954EVM (or variant), ensure that all jumpers are correctly covering the headers highlighted
in Figure 3-32.
Figure 3-32. DS90UB954-Q1EVM (or variant) With Highlighted Jumpers
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11. On the DS90UB953EVM, ensure that jumpers are covering the headers as shown in Figure 3-33.
Figure 3-33. DS90UB95x-Q1EVM With Installed Jumpers
12. Power ON the HP E3610A.
13. Verify that DS90UB953EVM is correctly powered by probing the banana jacks labeled PoC Voltage,
VDD3V3, and VDD1V8 using a Digital Multi-meter (DMM). The voltages should approximately read ≥7 V, 3.3
V, and 1.8 V, respectively.
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14. The setup should now look like what is shown in the Figure 3-34.
Figure 3-34. Test Setup
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15. Ensure Analog Launch PAD (ALP) software is downloaded and installed correctly. One can download
Analog Launch PAD from TI.com; note this requires a myTI Login. Steps for installation can be found in
Section 3.3
16. Open the ALP software. If you receive an error message about running the device in demonstration mode
consult Section 3.4.2. If you receive an error message about MainGUI.exe or having one instance of the
application open at once, consult Section 3.4.3.
If you receive an error message about updating the USB2ANY firmware, consult Section 3.4.4.
17. Double click the Tools bar, then the USB2ANY/Aardvark Setup, remove any devices that are not the 954 or
953 profiles by selecting them and clicking remove.
Note
Be sure NOT to remove the USB ID or you will have to consult Section 3.4.2.
Then select the appropriate device profile for the appropriate USB port using the scrolling menu on the right
and clicking add as shown in Figure 3-35.
Figure 3-35. Setting up Device Profiles in ALP
18. If you are having trouble identifying which USB ID corresponds to a connected device, consult Section 3.4.5.
3.5.3 Procedure
1. Open the DS90UB954 (or variant) device window by double clicking the profile and selecting to the scripting
tab as shown in Figure 3-36.
Figure 3-36. Navigating to DS90UB954 (or variant) Scripting Tab in ALP
2. If you would like to set up a file that loads all of the scripts and creates a button for running each script,
consult Section 3.4.6. Otherwise, you can run scripts by clicking the Run button and navigating to their file
location.
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3. If you would like to place the scripts in the default ALP script folder, move them to the file location:
SPACER
C:\Program Files (x86)\Texas Instruments\Analog LaunchPAD 1.56.0010
SPACER
4. Verify there is successful local I2C communication that the script worked by going to the register tab,
selecting register 0x00 labeled I2C_DEVICE_ID, and reading the value as shown in Figure 3-37. If the value
is not 0x7A, then the correct profile has not been assigned to the correct USB2ANY ID. Consult Section
3.4.5 for more information.
Figure 3-37. Reading I2C Device ID Within the Register Tab
5. Ensure that the devices are setup properly by checking that Pass Sts: displays Pass and Linked has a
frequency listed like shown in Figure 3-38. In addition, be sure that D3, labeled Lock, and D15 label Pass,
are illuminated on the DS90UB954EVM (or variant).
Figure 3-38. Verifying Pass and Lock for DS90UB954 (or variant) in ALP
6. Navigate back to the Scripting tab of the DS90UB954 (or variant) ALP profile and run the
953to954_patgen_YUV_1920x1080p-4Lanes-Working.py script to initialize a pattern generation from 953>954. The script may be found by clicking on the "Run PreDef Script" button. If the DS90UB954-Q1 (or
variant) is not using an I2C address of 0x7A (8-bit form), the script should be modified to use the correct I2C
address.
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7. Verify that the pattern has been enabled navigating to the information tab on the DS90UB954 (or variant),
and checking to the horizontal and vertical parameters for the appropriate resolution defined by the camera.
Figure 3-39 shows 3840 bytes and 1080 lines for the horizontal and vertical parameters, respectively. Also,
verify that the DC power supply, the HP E3610, is sourcing more current.
Figure 3-39. Verifying Camera Initialization in ALP
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Bill of Materials
4 Bill of Materials
Table 4-1. Bill of Materials
DESIGNATOR
QTY.
VALUE
DESCRIPTION
!PCB1
1
C1, C2, C3
3
1uF
CAP, CERM, 1 µF, 6.3 V, +/- 20%, X7R, 0402
C4, C5, C6, C9, C48, C64
6
0.01uF
C7
1
C8
PACKAGE REFERENCE
PART NUMBER
MANUFACTURER
Printed-Circuit Board
Any
0402
GRM155R70J105MA12D
MuRata
CAP, CERM, 0.01 µF, 50 V, +/- 5%, X7R,
0402
0402
C0402C103J5RACTU
Kemet
0.033uF
CAP, CERM, 0.033 µF, 6.3 V, +/- 10%, X5R,
0201
0201
GRM033R60J333KE01D
MuRata
1
0.015uF
CAP, CERM, 0.015 µF, 6.3 V, +/- 10%, X5R,
0201
0201
GRM033R60J153KE01D
MuRata
C10, C13, C16, C54, C55,
C62, C63
7
10uF
CAP, CERM, 10 µF, 6.3 V, +/- 10%, X7R,
0805
0805_HV
GRM21BR70J106KE76L
MuRata
C11, C14, C17
3
0.1uF
CAP, CERM, 0.1 µF, 50 V, +/- 20%, X7R,
AEC-Q200 Grade 1, 0402
0402
CGA2B3X7R1H104M050BB
TDK
C12, C15, C18
3
0.01uF
CAP, CERM, 0.01 µF, 10 V, +/- 10%, X7R,
AEC-Q200 Grade 1, 0201
0201_033
CGA1A2X7R1A103K030BA
TDK
C19
1
0.022uF
CAP, CERM, 0.022 µF, 6.3 V, +/- 10%, X5R,
0201
0201
GRM033R60J223KE01D
MuRata
C20
1
0.1uF
CAP, CERM, 0.1 µF, 6.3 V, +/- 10%, X5R,
0201
0201
C0603X5R0J104K030BC
TDK
C21, C40, C41, C45, C46,
C49, C60
7
1uF
CAP, CERM, 1 µF, 16 V, +/- 10%, X7R, 0603
0603
C1608X7R1C105K080AC
TDK
C22, C28, C34, C35
4
0.1uF
CAP, CERM, 0.1 µF, 16 V, +/- 5%, X7R, 0603
0603
0603YC104JAT2A
AVX
C23
1
2.2uF
CAP, CERM, 2.2 µF, 16 V, +/- 10%, X5R,
0805
0805_HV
0805YD225KAT2A
AVX
C24, C31
2
220pF
CAP, CERM, 220 pF, 50 V, +/- 1%, C0G/NP0, 0603
0603
06035A221FAT2A
AVX
C25
1
0.01uF
CAP, CERM, 0.01 µF, 50 V, +/- 10%, X7R,
0603
0603
C1608X7R1H103K080AA
TDK
C26
1
22uF
CAP, TA, 22uF, 25V, +/-20%, 0.7 ohm, SMD
7343-31
293D226X0025D2TE3
Vishay-Sprague
C27
1
1uF
CAP, CERM, 1 µF, 50 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
0805_HV
CGA4J3X7R1H105K125AB
TDK
C29, C30
2
30pF
CAP, CERM, 30 pF, 100 V, +/- 5%, C0G/NP0, 0603
0603
GRM1885C2A300JA01D
MuRata
C32
1
0.47uF
CAP, CERM, 0.47 µF, 10 V, +/- 10%, X7R,
0603
0603
GRM188R71A474KA61D
MuRata
C33
1
2200pF
CAP, CERM, 2200 pF, 50 V, +/- 10%, X7R,
0603
0603
C0603X222K5RACTU
Kemet
C36, C37, C38, C39
4
4700pF
CAP, CERM, 4700 pF, 100 V, +/- 10%, X7R,
0805
0805_HV
08051C472KAT2A
AVX
C42, C47
2
10uF
CAP, CERM, 10 µF, 16 V, +/- 10%, X7S, AEC- 0805_HV
Q200 Grade 1, 0805
CGA4J1X7S1C106K125AC
TDK
C43, C52, C58
3
4.7uF
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R,
0805
GRM21BR71C475KA73L
MuRata
Printed-Circuit Board
0805_HV
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Bill of Materials
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Table 4-1. Bill of Materials (continued)
DESIGNATOR
QTY.
VALUE
DESCRIPTION
PACKAGE REFERENCE
PART NUMBER
MANUFACTURER
C44, C50, C53, C57, C59
5
0.1uF
CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R,
0402
0402
C1005X7R1H104K050BB
TDK
C51
1
10uF
CAP, CERM, 10 µF, 35 V, +/- 10%, X7R,
1206_190
1206_190
GMK316AB7106KL-TR
Taiyo Yuden
C56
1
22uF
CAP, CERM, 22 µF, 6.3 V, +/- 10%, X7R,
AEC-Q200 Grade 1, 1206
1206_180
CGA5L1X7R0J226M160AC
TDK
C61
1
47pF
CAP, CERM, 47 pF, 50 V, +/- 5%, C0G/NP0,
0402
0402
885012005044
Wurth Elektronik
D9
1
7.5V
Diode, Zener, 7.5 V, 550 mW, SMB
SMB
1SMB5922BT3G
ON Semiconductor
D10, D11
2
Green
LED, Green, SMD
WL-SMCW_GREEN
150060VS75000
Wurth Elektronik eiSos
FB1
1
60 ohm
Ferrite Bead, 60 ohm @ 100 MHz, 0.8 A,
0603
0603
BK1608HS600-T
Taiyo Yuden
FID1, FID2, FID3
3
Fiducial mark. There is nothing to buy or
mount.
Fiducial10-20
Fiducial
N/A
J1
1
Receptacle, 0.5mm, 30x2, Gold, SMT
Samtec_SS5-30-3_50-x-D-K
SS5-30-3.50-L-D-K-TR
Samtec
J2, J4
2
Header, 100mil, 3x1, Gold, TH
Samtec_HTSW-103-07-G-S
I2C
Samtec
J3, J10
2
Header, 100mil, 4x2, Gold, TH
TSW-104-07-G-D
TSW-104-07-G-D
Samtec
J5
1
Header, 100mil, 3x1, Gold, TH
Samtec_HTSW-103-07-G-S
1.8V I2C
Samtec
J6
1
Header, 100mil, 3x1, Gold, TH
Samtec_HTSW-103-07-G-S
3.3V I2C
Samtec
J7
1
Header, 100mil, 2x1, Tin, TH
TE_5-146278-2
IDx/CLK_OUT
TE Connectivity
J8
1
Header, 100mil, 2x1, Tin, TH
TE_5-146278-2
MODE
TE Connectivity
J9
1
Connector, Receptacle, Mini-USB Type B,
R/A, Top Mount SMT
CONN_USB-MiniB-1734035-2
USB Mini Type B
TE Connectivity
J11
1
Header, 2.54mm, 5x2, Gold, Black, TH
Samtec_TSW-105-07-x-D
TSW-105-07-F-D
Samtec
J12
1
Header, 100mil, 2x2, Gold, TH
TSW-102-07-G-D
TSW-102-07-G-D
Samtec
J13
1
Header, 100mil, 2x1, Tin, TH
TE_5-146278-2
Disable 1V8
TE Connectivity
J14
1
Standard Banana Jack, Uninsulated, 8.9mm
Keystone575-8
VDD1V8
Keystone
J15
1
Header, 100mil, 2x1, Tin, TH
TE_5-146278-2
Enable PoC
TE Connectivity
J16
1
Connector, HF, 50 Ohm, TH
Rosenberger_59S10H-40ML
5-Z
59S10H-40ML5-Z
Rosenberger
J17
1
Header, 100mil, 2x1, Tin, TH
TE_5-146278-2
Disable 3V3
TE Connectivity
J18
1
Standard Banana Jack, Uninsulated, 8.9mm
Keystone575-8
GROUND
Keystone
J19
1
Standard Banana Jack, Uninsulated, 8.9mm
Keystone575-8
PoC Voltage
Keystone
J20
1
Standard Banana Jack, Uninsulated, 8.9mm
Keystone575-8
VDD3V3
Keystone
L1, L2, L3
3
1000 ohm
Ferrite Bead, 1000 ohm @ 100 MHz, 0.4 A,
0603
0603
BLM18AG102SN1D
MuRata
L4
1
47 ohm
Ferrite Bead, 47 ohm @ 100 MHz, 0.45 A,
0402
0402
MPZ1005F470ETD25
TDK
L5
1
330 ohm
Ferrite Bead, 330 ohm @ 100 MHz, 0.7 A,
0402
0402
MPZ1005S331ETD25
TDK
L6, R4, R5
3
0
RES, 0, 5%, 0.1 W, 0603
0603
CRCW06030000Z0EA
Vishay-Dale
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Bill of Materials
Table 4-1. Bill of Materials (continued)
DESIGNATOR
QTY.
VALUE
DESCRIPTION
PACKAGE REFERENCE
PART NUMBER
MANUFACTURER
L7
1
10uH
Inductor, Wirewound, Ferrite, 10 µH, 0.5 A,
0.57 ohm, SMD
LQH3NP_G0
LQH3NPN100NG0
MuRata
L8, L9
2
4.7uH
Inductor, Shielded, ?, 4.7uH, 2.3A, 0.092
ohm, SMD
MPI4040R3
MPI4040R3-4R7-R
Coiltronics
Q1
1
50V
MOSFET, N-CH, 50 V, 0.22 A, SOT-23
SOT-23
BSS138
Fairchild Semiconductor
R1
1
0
RES, 0, 5%, 0.05 W, 0201
0201M
ERJ-1GE0R00C
Panasonic
R2
1
49.9
RES, 49.9, 1%, 0.05 W, 0201
0201M
ERJ-1GEF49R9C
Panasonic
R3, R29
2
10.0k
RES, 10.0 k, 0.5%, 0.063 W, 0402
0402
CRCW040210K0DHEDP
Vishay-Dale
R6, R14
2
10.0k
RES, 10.0 k, 1%, 0.063 W, 0402
0402
CRCW040210K0FKED
Vishay-Dale
R7, R8
2
1.21k
RES, 1.21 k, 1%, 0.063 W, 0402
0402
CRCW04021K21FKED
Vishay-Dale
R9, R10
2
4.7k
RES, 4.7 k, 5%, 0.063 W, 0402
0402
CRCW04024K70JNED
Vishay-Dale
R11, R15
2
10.0k
RES, 10.0 k, 1%, 0.1 W, 0603
0603
CRCW060310K0FKEA
Vishay-Dale
R12
1
402
RES, 402, 1%, 0.1 W, 0603
0603
CRCW0603402RFKEA
Vishay-Dale
R13
1
40.2k
RES, 40.2 k, 0.1%, 0.1 W, 0603
0603
RT0603BRD0740K2L
Yageo America
R16, R17
2
33
RES, 33 ohm, 5%, 0.063W, 0402
0402
CRCW040233R0JNED
Vishay-Dale
R18
1
1.5k
RES, 1.5k ohm, 5%, 0.063W, 0402
0402
CRCW04021K50JNED
Vishay-Dale
R19, R23
2
33k
RES, 33k ohm, 5%, 0.063W, 0402
0402
CRCW040233K0JNED
Vishay-Dale
R20
1
1.2Meg
RES, 1.2 M, 5%, 0.1 W, 0603
0603
CRCW06031M20JNEA
Vishay-Dale
R21, R33
2
200
RES, 200, 1%, 0.1 W, 0603
0603
CRCW0603200RFKEA
Vishay-Dale
R22
1
0
RES, 0, 5%, 0.063 W, 0402
0402
ERJ-2GE0R00X
Panasonic
R24, R26, R28, R30
4
10.0k
RES, 10.0 k, 1%, 0.1 W, 0402
0402
ERJ-2RKF1002X
Panasonic
R25
1
4.02k
RES, 4.02 k, 1%, 0.1 W, 0603
0603
CRCW06034K02FKEA
Vishay-Dale
R27
1
1.00k
RES, 1.00 k, 1%, 0.063 W, 0402
0402
CRCW04021K00FKED
Vishay-Dale
R31
1
100k
RES, 100 k, 1%, 0.05 W, 0201
0201M
CRCW0201100KFKED
Vishay-Dale
R32
1
100k
RES, 100 k, 1%, 0.063 W, 0402
0402
CRCW0402100KFKED
Vishay-Dale
R34
1
40.2k
RES, 40.2 k, 1%, 0.063 W, 0402
0402
CRCW040240K2FKED
Vishay-Dale
S1
1
Switch, Tactile, SPST-NO, 0.05A, 12V, SMT
SW_TL1015AF160QG
TL1015AF160QG
E-Switch
S2
1
Switch, Normally open, 2.3N force, 200k
operations, SMD
KSR
KSR221GLFS
C and K Components
SH-J1, SH-J2, SH-J3
3
Shunt, 100mil, Gold plated, Black
SNT-100-BK-G
969102-0000-DA
3M
U1
1
FPD-Link III SerDes with CSI-2 interfaces for
2.3MP/60fps camera, RHB0032P (VQFN-32)
RHB0032P
DS90UB953QRHBQ1
Texas Instruments
U2
1
TCA9406 Dual Bidirectional 1-MHz I2C-BUS
and SMBus Voltage Level-Translator, 1.65 to
3.6 V, -40 to 85 degC, 8-pin US8 (DCU),
Green (RoHS & no Sb/Br)
DCU0008A_N
TCA9406DCUR
Texas Instruments
U3
1
ESD-Protection Array for High-Speed Data
Interfaces, 4 Channels, -40 to +85 degC, 6pin SON (DRY), Green (RoHS & no Sb/Br)
DRY0006A
TPD4E004DRYR
Texas Instruments
1x2
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Bill of Materials
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Table 4-1. Bill of Materials (continued)
DESIGNATOR
QTY.
U4
DESCRIPTION
PACKAGE REFERENCE
PART NUMBER
MANUFACTURER
1
500mA, Low Quiescent Current, Ultra-Low
Noise, High PSRR Low-Dropout Linear
Regulator, DRB0008A
DRB0008A
TPS73533DRBR
Texas Instruments
U5
1
25 MHz Mixed Signal Microcontroller with 128 PN0080A_N
KB Flash, 8192 B SRAM and 63 GPIOs, -40
to 85 degC, 80-pin QFP (PN), Green (RoHS
& no Sb/Br)
MSP430F5529IPN
Texas Instruments
U6
1
ULTRA LOW-NOISE, 250-mA LINEAR
REGULATOR FOR RF AND ANALOG
CIRCUITS REQUIRES NO BYPASS
CAPACITOR, DBV0005A
LP5907MFX-1.8/NOPB
Texas Instruments
U7
1
Ultra Low-Noise, 500-mA Linear Regulator for DRV0006A
RF and Analog Circuits - Requires No Bypass
Capacitor, DRV0006A (WSON-6)
LP5912-1.8DRVR
Texas Instruments
U8
1
Synchronous Buck Regulator for 650mA
Space Constraint Applications, DSX0010A
DSX0010A
LM536003QDSXRQ1
Texas Instruments
U9
1
Synchronous Buck Regulator for 650mA
Space Constraint Applications, DSX0010A
DSX0010A
LM53600AQDSXRQ1
Texas Instruments
Y1
1
OSC, 50MHz, 1.8 to 3.3V, SMD
Abracon_ASDMB
ASDMB-50.000MHZ-LC-T
Abracon Corportation
Y2
1
Crystal, 24 MHz, 18 pF, SMD
XTAL_ABM3
ABM3-24.000MHZ-D2Y-T
Abracon Corporation
42
VALUE
DBV0005A_N
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Bill of Materials
5 PCB Schematics
J13
Disable 1V8
1
2
POC_VOLTAGE
VDD1V8ENA
J14
R24
10.0k
J15
R25
L5
L7
R35
330 ohm
10µH
C40
1µF
1
R26
10.0k
R27
1.00k
C44
0.1µF
C43
4.7µF
VDD1V8
VDD1V8
U6
POC_SENSE
0
47 ohm
2
3
4
5
1
2
L4
1
VDD3V3
Enable POC
4.02k
J16
GND
VIN
3
C41
1µF
EN
4
FPD_OUT
VOUT
5
N/C
GND
C42
10µF
2
LP5907MFX-1.8/NOPB
GND
GND
GND
GND
GND
J17
VDD3V3
Disable 3V3
1
2
U7
J18
VDD3V3ENA
C45
1µF
GROUND
6
4
IN
OUT
EN
PG
NC
GND
PAD
1
3
11
J19
6
PoC Voltage
7
8
R31
9
100k
C51
10µF
C52
4.7µF
10
C53
0.1µF
RESET
R29
C46
1µF
10.0k
GND
PAD
POC_VOLTAGE
R30
10.0k
VDD3V3
AGND
EN
FB
VIN
VCC
SYNC/MODE
GND
BOOT
SW
5
2
GND
C48
0.01µF
J20
C47
10µF
5
7
LP5912-1.8DRVR
4
GND
C49
VDD3V3
3
C50
TP5
VDD1V8_IS
R28
10.0k
GND
1µF
2
GND
1
0.1µF
L8
4.7uH
GND
U8
LM536003QDSXRQ1
C54
10µF
VDD3V3
C55
10µF
C56
22µF
POC_VOLTAGE
U9
C57
2
8
D11
Green
GND
3
1
C58
4.7µF
C59
0.1µF
C60
1µF
GND
7
6
R33
9
VIN
BOOT
SW
EN
FB
RESET
BIAS
SYNC/MODE
GND
PAD
GND
J2
M1
M2
C36
4700pF
GND
M4
M3
C37
4700pF
GND
C38
4700pF
GND
1
2
3
C39
4700pF
L9
0.1µF
VCC
200
VDD_3V5
2
1
4.7uH
4
C61 R32
47pF 100k
5
C62
10µF
10
C63
10µF
11
C64
0.01µF
LM53600AQDSXRQ1
R34
40.2k
IMG_GP2
GPIO1
GND
GND
VSYNC
I2C
GND
J4
1
2
3
I2C
POC_SENSE
GPIO0
HSYNC
Figure 5-1. DS90UB95x-Q1EVM Schematic 1
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GPIO0
GPIO1
Imager_PWDN
Imager_RESET
VDD1V8
1
3
5
7
2
4
6
8
J3
L1
1000 ohm
L2
1000 ohm
L3
1000 ohm
GND
VDDPLL
VDD1V8
1
VDDDIG
12
C2
1µF
C3
1µF
2
C1
1µF
C4
0.01µF
GND
C6
0.01µF
C5
0.01µF
U1
25
11
C13
10µF
C14
0.1µF
C15
0.01µF
C11
0.1µF
VDD_CAP
15
VDDDRV_CAP
10
J5
1
2
DNP
3
C16
10µF
SCL
SDA
GND
R6
1.8V I2C
VDD1V8
R7
GND
R9 R10
4.7k 4.7k
C18
0.01µF
MODE
R8
1.21k 1.21k
SCL
SCL3V3
SDA
I2C_SCL
I2C_SDA
RES
VDDPLL_CAP
21
MODE
6
5
4
3
2
1
32
31
30
29
CSICLK_N
CSICLK_P
CSID0_N
CSID0_P
CSID1_N
CSID1_P
CSID2_N
CSID2_P
CSID3_N
CSID3_P
10.0k
VDD3V3
SDA3V3
C17
0.1µF
GPIO_0
GPIO_1
GPIO_2
GPIO_3
VDDDRV
26
C12
0.01µF
CLKIN
CSI_CLKN
CSI_CLKP
CSI_D0N
CSI_D0P
CSI_D1N
CSI_D1P
CSI_D2N
CSI_D2P
CSI_D3N
CSI_D3P
CLKOUT/IDx
PDB
RES
LPF1
LPF2
GND
U2
1
2
3
8
1
SCL_B
SDA_B
SCL_A
SDA_A
OE
3.3V I2C
2
GND
VCCA
VCCB
TCA9406DCUR
5
4
VDD1V8
6
VDDDIG
R11
10.0k
R12
402
R13
3
7
10.0k
40.2k
C21
1µF
0.033µF
GPIO0
17
18
27
28
24
23
22
C8
FPD_OUT
TP3
0.015µF
SCL
SDA
C9
0.01µF
GND
VDD
OUT
STANDBY
GND
3
R1 0
DNP
CLKIn
2
ASDMB-50.000MHZ-LC-T
50MHz
GND
R4
DNP
0
CLKIn
R5
0
RefCLK
PDB
TP4
C19
0.022µF
9
12
49.9
10.0k 1
IDX
19
7
R3
GPIO0
GPIO1
Imager_RESET
Imager_PWDN
20
8
4
R2
VDDPLL
C20 0.1µF
33
GND
J7
R15
DNP
10.0k
VDD1V8
1
2
1
S1
C7
IDX
PDB
R14
VDD3V3
14
13
SCL
SDA
MODE
2
J6
Y1
DOUTP
DOUTN
VDD_PLL
16
C10
10µF
DS90UB953QRHBQ1
VDD1
IDx/CLK_OUT
GND
J8
1
2
MODE
GND
Figure 5-2. DS90UB95x-Q1EVM Schematic 2
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Bill of Materials
POC_VOLTAGE
VDD_3V5 TP1
VDD1V8_IS
J1
VDD_1V8_SNSR
RefCLK
HSYNC
VSYNC
CSICLK_P
CSICLK_N
CSID0_P
CSID0_N
CSID1_P
CSID1_N
CSID2_P
CSID2_N
CSID3_P
CSID3_N
SCL
SDA
Imager_RESET
Imager_PWDN
IMG_GP2
IMG_GP3
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
TP2
IMG_GP4
IMG_GP5
IMG_GP6
GND
Figure 5-3. DS90UB95x-Q1EVM Schematic 3
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USB PORT
J9
1
2
3
4
5
VBUS
R16
33
33
U3
1
2
IO1
IO2
3
R19
VCC
IO4
GND
IO3
GPIO3/PWM2
GND
DP
GPIO7/PWM0
R18
PUR
GPIO11/VEREF+
1.5k
6
5
C22
0.1µF
1
3
5
7
GPIO8/ADC3
S2
4
VUSB
GND
TPD4E004DRYR
33k
DM
R17
+3.3V
GPIO10/VEREF-
U4
EFC0/GPIO12/CLOCK
8
J10
GPIO9/ADC2
BSL
R20
GND
DNP
2
4
6
8
FB1
DNL
C24
220pF
60 ohm
C26
22µF
1.2M
GND
5
VBUS
D9
GND
GND
7.5V
GND
GND
C27
1µF
2
6
7
IN
OUT
EN
NR
NC
NC
NC
GND
PAD
1
3
C25
0.01µF
4
9
GND
GND
C23
2.2µF
GND
TPS73533DRBR
GND
U5
2
4
6
8
10
TSW-105-07-F-D
GPIO11/VEREF+
GND
C28
0.1µF
GND
GPIO10/VEREF-
37
38
39
40
41
42
43
44
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
P3.5/TB0.5
P3.6/TB0.6
P3.7/TB0OUTH/SVMOUT
9
10
69
70
12
13
55
56
P5.0/A8/VREF+/VEREF+
P5.1/A9/VREF-/VEREFP5.2/XT2IN
P5.3/XT2OUT
P5.4/XIN
P5.5/XOUT
P5.6/TB0.0
P5.7/TB0.1
C29
2
30pF
Y2
24 MHz
1
C30
R22
DNP
0
5
6
7
8
57
58
59
60
30pF
P7.0/CB8/A12
P7.1/CB9/A13
P7.2/CB10/A14
P7.3/CB11/A15
P7.4/TB0.2
P7.5/TB0.3
P7.6/TB0.4
P7.7/TB0CLK/MCLK
67
20
C31
220pF
C32
0.47µF
VBUS
VUSB
+3.3V
65
66
11
18
50
GND
V18
VCORE
45
46
47
48
51
52
53
54
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
77
78
79
80
1
2
3
4
P8.0
P8.1
P8.2
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
PU.0/DP
PU.1/DM
PUR
VBUS
VUSB
AVCC1
DVCC1
DVCC2
29
30
31
32
33
34
35
36
P4.0/PM_UCB1STE/PM_UCA1CLK
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.6/PM_NONE
P4.7/PM_NONE
RST/NMI/SBWTDIO
TEST/SBWTCK
GND
GND
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
VSSU
AVSS1
AVSS2
DVSS1
DVSS2
15
16
17
GPIO6/PWM1/SPI(CS)
GPIO3/PWM2
GPIO2/SPI(SCLK)
SDA3V3
+3.3V
SCL3V3
GPIO4/SPI(SIMO)/UART(TXD)
2
J11
1
3
5
7
9
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
GPIO5/SPI(SOMI)/UART(RXD)
D10
Green
J12
VDD_1V8_SNSR
1
3
DNP
1
IMG_GP4
IMG_GP5
IMG_GP2
IMG_GP6
IMG_GP3
2
4
R21
TSW-102-07-G-D
GND
200
GPIO9/ADC2
3
GPIO7/PWM0
GPIO8/ADC3
1
Q1
2
21
22
23
24
25
26
27
28
EFC0/GPIO12/CLOCK
72
73
74
75
GND
76
71
62
64
63
61
14
68
19
49
DP
+3.3V
DM
PUR
R23
33k
C33
2200pF
MSP430F5529IPN
C34
0.1µF
C35
0.1µF
GND
GND
Figure 5-4. DS90UB95x-Q1EVM Schematic 4
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Board Layout
6 Board Layout
The board layout for the DS90UB95x-Q1EVM is shown in Figure 6-1 through Figure 6-12.
Figure 6-1. Top Layer PCB Layout
Figure 6-2. Top Overlay
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Board Layout
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Figure 6-3. Top Paste
Figure 6-4. Top Solder
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Board Layout
Figure 6-5. Signal Layer 1
Figure 6-6. Signal Layer 2
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Board Layout
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Figure 6-7. Signal Layer 3
Figure 6-8. Signal Layer 4
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Board Layout
Figure 6-9. Bottom Layer PCB Layout
Figure 6-10. Bottom Overlay
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Figure 6-11. Bottom Paste
Figure 6-12. Bottom Solder
52
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Related Documentation
7 Related Documentation
7.1 References
•
•
•
•
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DS90UB953-Q1
DS90UB953A-Q1
DS90UB635-Q1
DS90UB954-Q1
TSER953
8 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (April 2021) to Revision D (February 2023)
Page
• Updated Abstract section to include DS90UB635-Q1........................................................................................ 1
• Changed all instances of legacy terminology to controller and target where I2C is mentioned. ........................3
• Updated I2C terminology to align with latest inclusivity guidelines...................................................................19
• Added link to DS90UB635-Q1 product page.................................................................................................... 53
Changes from Revision B (September 2020) to Revision C (April 2021)
Page
• Updated Abstract section to include V3Link TSER953....................................................................................... 1
• Added link to TSER953 product page.............................................................................................................. 53
SNLU224D – SEPTEMBER 2017 – REVISED FEBRUARY 2023
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Copyright © 2023 Texas Instruments Incorporated
DS90UB95x-Q1 Serializer Evaluation Module
53
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.
www.ti.com
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
2
www.ti.com
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
3.3.2
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
https://www.ti.com/ja-jp/legal/notice-for-evaluation-kits-delivered-in-japan.html
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。https://www.ti.com/ja-jp/legal/notice-for-evaluation-kits-for-power-line-communication.html
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
3
www.ti.com
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
4
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
www.ti.com
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
5
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
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will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
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