TM4C Series TM4C129E Crypto Connected
LaunchPad Evaluation Kit
EK-TM4C129EXL
User's Guide
Literature Number: SPMU372A
September 2015 – Revised October 2016
Contents
1
Board Overview ................................................................................................................... 5
1.1
1.2
1.3
1.4
1.5
1.6
2
2.2
2.3
3.2
3.3
Secure IoT Demo...........................................................................................................
3.1.1 Software Description ..............................................................................................
3.1.2 Source Code Download and Build Instructions ...............................................................
TivaWare for C Series Software ..........................................................................................
3.2.1 Software Description ..............................................................................................
3.2.2 Source Code .......................................................................................................
3.2.3 Tool Options .......................................................................................................
Programming the Crypto Connected LaunchPad ......................................................................
23
23
23
23
23
24
24
24
References ........................................................................................................................ 25
4.1
A
Functional Description ...................................................................................................... 9
2.1.1 Microcontroller....................................................................................................... 9
2.1.2 Ethernet Connectivity ............................................................................................. 10
2.1.3 Crypto Accelerators ............................................................................................... 10
2.1.4 USB Connectivity .................................................................................................. 10
2.1.5 Motion Control ..................................................................................................... 10
2.1.6 User Switches and LED's ........................................................................................ 11
2.1.7 BoosterPacks and Headers ...................................................................................... 12
2.1.7.1
BoosterPack 1 ............................................................................................... 12
2.1.7.2
BoosterPack 2 ............................................................................................... 14
2.1.7.3
Breadboard Connection .................................................................................... 16
2.1.7.4
Other Headers and Jumpers .............................................................................. 20
Power Management........................................................................................................ 20
2.2.1 Power Supplies .................................................................................................... 20
2.2.2 Low Power Modes ................................................................................................ 21
2.2.3 Clocking ............................................................................................................ 21
2.2.4 Reset ................................................................................................................ 21
Debug Interface............................................................................................................. 21
2.3.1 In-Circuit Debug Interface (ICDI) ................................................................................ 21
2.3.2 External Debugger ................................................................................................ 22
2.3.3 Virtual COM Port .................................................................................................. 22
Software Development ........................................................................................................ 23
3.1
4
6
6
6
7
7
7
Hardware Description ........................................................................................................... 9
2.1
3
Kit Contents...................................................................................................................
Using the Crypto Connected LaunchPad ................................................................................
Features .......................................................................................................................
BoosterPacks .................................................................................................................
Energīa ........................................................................................................................
Specifications .................................................................................................................
References .................................................................................................................. 25
PCB Layout and Bill of Materials .......................................................................................... 26
A.1
A.2
Component Locations ..................................................................................................... 26
Bill of Materials ............................................................................................................. 27
B
Schematic
2
Contents
......................................................................................................................... 30
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Revision History .......................................................................................................................... 31
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Contents
3
www.ti.com
List of Figures
1-1.
TM4C Series Crypto Connected LaunchPad Evaluation Board ....................................................... 5
2-1.
TM4C Crypto Connected LaunchPad Evaluation Board Block Diagram ............................................. 9
2-2.
Default Jumper Locations ................................................................................................. 20
A-1.
Crypto Connected LaunchPad Dimensions and Component Locations ............................................ 26
List of Tables
1-1.
2-1.
2-2.
2-3.
2-4.
A-1.
4
.......................................................................................... 7
............................................................................... 12
BoosterPack 2 GPIO and Signal Muxing ............................................................................... 14
X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing .......................................... 16
X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing ......................................... 18
Crypto Connected LaunchPad Bill of Materials ........................................................................ 27
EK-TM4C129EXL Specifications
BoosterPack 1 GPIO and Signal Muxing
List of Figures
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Chapter 1
SPMU372A – September 2015 – Revised October 2016
Board Overview
The TM4C Series TM4C129E Crypto Connected LaunchPad™ Evaluation Board (EK-TM4C129EXL) is a
low-cost evaluation platform for ARM® Cortex®-M4F-based microcontrollers. The Crypto Connected
LaunchPad design highlights the TM4C129ENCPDT microcontroller with its on-chip crypto acceleration
hardware, 10/100 Ethernet MAC and PHY, USB 2.0, hibernation module, motion control pulse-width
modulation and a multitude of simultaneous serial connectivity. The Crypto Connected LaunchPad also
features two user switches, four user LEDs, dedicated reset and wake switches, a breadboard expansion
option and two independent BoosterPack XL expansion connectors. The pre-programmed out of the box
demo on the Crypto Connected LaunchPad also enables remote monitoring and control of the evaluation
board securely from an internet browser anywhere in the world. The web interface is provided by 3rd
party, Exosite. Each Crypto Connected LaunchPad is enabled on the Exosite platform allowing users to
create and customize their own secure Internet-of-Things (IoT) applications.
Figure 1-1 shows a photo of the Crypto Connected LaunchPad with key features highlighted.
Figure 1-1. TM4C Series Crypto Connected LaunchPad Evaluation Board
LaunchPad, TivaWare, Code Composer Studio are trademarks of Texas Instruments.
ARM, Cortex, RealView, IAR Embedded Workbench are registered trademarks of ARM Limited.
All other trademarks are the property of their respective owners.
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Board Overview
5
Kit Contents
1.1
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Kit Contents
The Crypto Connected LaunchPad Evaluation Kit contains the following items:
• TM4C Series TM4C129E Evaluation Board (EK-TM4C129EXL)
• Retractable Ethernet cable
• USB Micro-B plug to USB-A plug cable
• 90° 49x2 breadboard header
• Meet the TM4C Series TM4C129E Crypto LaunchPad Evaluation Kit (SPMZ862)
1.2
Using the Crypto Connected LaunchPad
The recommended steps for using the Crypto Connected LaunchPad Evaluation Kit are:
1. Follow the README First document included in the kit. The README First helps you get the
Crypto Connected LaunchPad up and running in minutes. Within just a few minutes you can be
controlling and monitoring the Crypto Connected LaunchPad through the internet using Exosite and the
pre-programmed out of the box demo.
2. Experiment with BoosterPacks. This evaluation kit conforms to the latest revision of the BoosterPack
pinout standard. It has two independent BoosterPack connections to enable a multitude of expansion
opportunities.
3. Take the first step towards developing your own applications. The Crypto Connected LaunchPad
is supported by TivaWare™ for C Series. All the applications that work on TM4C series TM4C1294
Connected LaunchPad Evaluation Board (EK-TM4C1294XL) will work on the Crypto Connected
LaunchPad. After installing TivaWare, look in the installation directory for examples\boards\EKTM4C1294XL. You can find pre-configured example applications for the Connected LaunchPad board
as well as for with selected BoosterPacks. These examples will work on the Crypto Connected
LaunchPad board. Alternately, use Energīa for a wiring framework-based cross-platform, fastprototyping environment that works with this and other TI LaunchPads. For more details about software
development, see Chapter 3 of this document. TivaWare can be downloaded from the TI website at
http://www.ti.com/tool/sw-tm4c. Energīa can be found at http://energia.nu.
4. Customize and integrate the hardware to suit your end application. This evaluation kit can be
used as a reference for building your own custom circuits based on TM4C microcontrollers or as a
foundation for expansion with your custom BoosterPack or other circuit. This manual can serve as a
starting point for this endeavor.
5. Get Trained. You can also download hours of written and video training materials on this and related
LaunchPads. For more information, visit the TM4C Series LaunchPad Workshop Wiki.
6. More Resources. For more information and the available BoosterPacks, see the TI MCU LaunchPad
web page (http://www.ti.com/tiva-c-launchpad).
1.3
Features
Your Crypto Connected LaunchPad includes the following features:
• TM4C129ENCPDT microcontroller
• Ethernet connectivity with fully integrated 10/100 Ethernet MAC and PHY motion control pulse width
modulation (PWM)
• Crypto acceleration hardware blocks
• USB 2.0 Micro A/B connector
• Four user LEDs
• Two user buttons
• One independent hibernate wake switch
• One independent microcontroller reset switch
6
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BoosterPacks
www.ti.com
•
•
•
•
1.4
Jumper for selecting power source:
– ICDI USB
– USB Device
– BoosterPack
Preloaded secure access of Internet-of-Things product to Exosite application
I/O brought to board edge for breadboard expansion
Two independent BoosterPack XL standard connectors featuring stackable headers to maximize
expansion through BoosterPack ecosystem
– For a complete list of BoosterPacks, see the TI MCU LaunchPad web page:
http://www.ti.com/launchpad
BoosterPacks
The Crypto Connected LaunchPad provides an easy and inexpensive way to develop applications with the
TM4C129ENCPDT microcontroller. BoosterPacks are add-on boards that follow a pin-out standard
created by Texas Instruments. The TI and third-party ecosystem of BoosterPacks greatly expands the
peripherals and potential applications that you can easily explore with the Crypto Connected LaunchPad.
You can also build your own BoosterPack by following the design guidelines on TI’s website. Texas
Instruments even helps you promote your BoosterPack to other members of the community. TI offers a
variety of avenues for you to reach potential customers with your solutions.
1.5
Energīa
Energīa is an open-source electronics prototyping platform started in January of 2012 with the goal of
bringing the Wiring and Arduino framework to the TI LaunchPad community. Energīa includes an
integrated development environment (IDE) that is based on Processing.
Together with Energīa, LaunchPads can be used to develop interactive objects, taking inputs from a
variety of switches or sensors, and controlling a variety of lights, motors, and other physical outputs.
LaunchPad projects can be stand-alone (only run on the target board, for example, your LaunchPad), or
they can communicate with software running on your computer (Host PC). Energīa projects are highly
portable between supported LaunchPad platforms.
More information is available at http://energia.nu.
1.6
Specifications
Table 1-1 summarizes the specifications for the Crypto Connected LaunchPad.
Table 1-1. EK-TM4C129EXL Specifications
Parameter
Board Supply Voltage
Dimensions
Value
4.75 VDC to 5.25 VDC from one of the following sources: See schematic symbol JP1 for
power input selection.
• Debug USB U22 (ICDI) USB Micro-B cable connected to PC or other compatible
power source.
• Target USB (U7) USB Micro-B cable connected to PC or other compatible power
source.
• BoosterPack 1 (X8-4)
• BoosterPack 2 (X6-4)
• Breadboard expansion header (X11-2 or X11-97).
4.9 in x 2.2 in x .425 in (12.45 cm x 5.59 cm x 10.8 mm) (L x W x H)
• 5 VDC to BoosterPacks, current limited by TPS2052B. Nominal rating 1 Amp.
Board input power supply limitations may also apply.
• 3.3 VDC to BoosterPacks, limited by output of TPS73733 LDO. This 3.3-V plane is
shared with on-board components. Total output power limit of TPS73733 is 1
Amp.
Break-out Power Output
RoHS Status
Compliant
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Board Overview
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Specifications
8
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Chapter 2
SPMU372A – September 2015 – Revised October 2016
Hardware Description
The Crypto Connected LaunchPad includes a TM4C129ENCPDT microcontroller with an integrated
10/100 Ethernet MAC and PHY and crypto acceleration blocks. This advanced ARM Cortex M4F MCU
has a wide range of peripherals that are made available to users via the on-board accessories and the
BoosterPack connectors. This chapter explains how those peripherals operate and interface to the
microcontroller.
Figure 2-1 provides a high-level block diagram of the Crypto Connected LaunchPad.
Debug USB
Power Select
and Generate
ICDI
JTAG IN
USB 2.0
Ethernet
Breadboard
Expansion
TM4C TM4C129ENCPDT
Target
BoosterPack XL
Connection 2
User
Switches
BoosterPack XL
Connection 1
LEDs
Figure 2-1. TM4C Crypto Connected LaunchPad Evaluation Board Block Diagram
2.1
Functional Description
2.1.1 Microcontroller
The TM4C129ENCPDT is a 32-bit ARM Cortex-M4F based microcontroller with 1024-kB Flash memory,
256-kB SRAM, 6-kB EEPROM, and 120 MHz operation; integrated 10/100 Ethernet MAC and PHY;
integrated hardware crypto accelerators; integrated USB 2.0 connectivity with external high-speed USB
3.0 PHY capability; a hibernation module, a multitude of serial connectivity and motion control PWM; as
well as a wide range of other peripherals. For more complete details, see the TM4C129ENCPDT
microcontroller data sheet.
Most of the microcontroller’s signals are routed to 0.1-in (2.54-mm) pitch headers or through-hole solder
pads. An internal multiplexor allows different peripheral functions to be assigned to each of these generalpurpose input/output (GPIO) pads. When adding external circuitry, consider the additional load on the
evaluation board power rails.
The TM4C129ENCPDT microcontroller is factory-programmed with an out of the box demo program. The
out of the box program resides in on-chip Flash memory and runs each time power is applied, unless the
out of the box application has been replaced with a user program. The out of the box application
automatically connects to https://ti.exosite.com when an internet connection is provided through the RJ45
Ethernet jack on the evaluation board.
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2.1.2 Ethernet Connectivity
The Crypto Connected LaunchPad is designed to connect directly to an Ethernet network using RJ45 style
connectors. The microcontroller contains a fully integrated Ethernet MAC and PHY. This integration
creates a simple, elegant and cost-saving Ethernet circuit design. Example code is available for both the
uIP and LwIP TCP/IP protocol stacks. The embedded Ethernet on this device can be programmed to act
as an HTTP server, client or both. The design and integration of the circuit and microcontroller also enable
users to synchronize events over the network using the IEEE1588 precision time protocol.
When configured for an Ethernet operation, it is recommended that the user configure LED D3 and D4 to
be controlled by the Ethernet MAC to indicate connection and transmit/receive status.
2.1.3 Crypto Accelerators
The Crypto Connected LaunchPad features the hardware acceleration blocks such as Advanced
Encryption Standard (AES), Data Encryption Standard (DES), and Secure Hash Algorithm/MD5 Message
Digest Algorithm (SHA/MD5) that offload data encryption and decryption functions from CPU. These
hardware cipher blocks support the µDMA operation and have improved performance over software cipher
blocks.
The AES block is a symmetric cipher module that supports multiple encrypt and decrypt operations,
feedback operating modes, authentication modes, key sizes (128 bit, 192 bit, or 256 bit) and key
scheduling in hardware. The DES block is also a symmetric cipher module with DES/3DES encryption and
decryption along with support for multiple feedback operating modes. The SHA/MD5 block is a hash
module that can run functions like MD5, SHA-1, SHA224, SHA256 and Hash message authentication
code (HMAC).
2.1.4 USB Connectivity
The Crypto Connected LaunchPad is designed to be USB 2.0 ready. A TPS2052B load switch is
connected to and controlled by the microcontroller USB peripheral, which manages power to the USB
micro A/B connector when functioning in a USB host. When functioning as a USB device, the entire
Crypto Connected LaunchPad can be powered directly from the USB micro A/B connector. Use JP1 to
select the desired power source.
USB 2.0 functionality is provided and supported directly out of the box with the target USB micro A/B
connector. High-speed USB 3.0 functionality can be enabled by adding an external USB PHY. The USB
external PHY control and data signals are provided on the breadboard expansion header X11.
2.1.5 Motion Control
The Crypto Connected LaunchPad includes the TM4C Series Motion Control PWM technology, featuring a
PWM module capable of generating eight PWM outputs. The PWM module provides a great deal of
flexibility and can generate simple PWM signals (for example, those signals required by a simple charge
pump, as well as paired PWM signals with dead-band delays such as those required by a half-H bridge
driver). Three generator blocks can also generate the full six channels of gate controls required by a 3phase inverter bridge.
A quadrature encoder interface (QEI) is also available to provide motion control feedback.
For details about the availability of these signals on the BoosterPack interfaces, see the BoosterPacks
and Headers of this document.
10
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2.1.6 User Switches and LED's
Two user switches are provided for input and control of the TM4C129ENCPDT software. The switches are
connected to GPIO pins PJ0 and PJ1.
A reset switch and a wake switch are also provided. The reset switch initiates a system reset of the
microcontroller whenever it is pressed and released. Pressing the reset switch also asserts the reset
signal to the BoosterPack and Breadboard headers. The wake switch is one way to bring the device out of
hibernate mode.
Four user LEDs are provided on the board. D1 and D2 are connected to GPIOs PN1 and PN0. These
LEDs are dedicated for use by the software application. D3 and D4 are connected to GPIOs PF4 and
PF0, which can be controlled by user’s software or the integrated Ethernet module of the microcontroller.
A power LED is also provided to indicate that 3.3 V power is present on the board.
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2.1.7 BoosterPacks and Headers
2.1.7.1
BoosterPack 1
The Crypto Connected LaunchPad features two fully independent BoosterPack XL connectors. BoosterPack 1, located around the ICDI portion of
the board, is fully compliant with the BoosterPack standard with the single exception of GPIO pin PA6 (X8-16), which does not provide analog
capability. PA6 is located near the bottom of the inner left BoosterPack XL header.
Inter-integrated circuit (I2C) is provided in both the original BoosterPack standard configuration as well as the updated standard location. Use of
I2C on the bottom left of the BoosterPack connections per the updated standard is highly encouraged whenever possible.
Motion control advanced PWM connections are provided on the inner right connector for motion control applications.
Table 2-1 provides a complete listing of the BoosterPack pins and the GPIO alternate functions available on each pin. The TM4C129ENCPDT
GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. ‘A’
and ‘D’ make up the outer BoosterPack standard pins, ‘B’ and ‘C’ make up the inner BoosterPack XL standard pins.
Table 2-1. BoosterPack 1 GPIO and Signal Muxing
Pin
Standard
Function
A1
1
+3.3 V
A1
2
Analog
PE4
123
AIN9
U1RI
-
-
A1
3
UART RX
PC4
25
C1-
U7Rx
-
-
A1
4
UART TX
PC5
24
C1+
U7Tx
-
A1
5
GPIO
PC6
23
C0+
U5Rx
A1
6
Analog
PE5
124
AIN8
-
A1
7
SPI CLK
PD3
4
AIN12
-
A1
8
GPIO
PC7
22
C0-
U5Tx
A1
9
I2C SCL
PB2
91
-
-
A1
10
I2C SDA
PB3
92
-
-
I2C0SDA
B1
1
+5 volts
B1
2
Ground
B1
3
Analog
PE0
15
AIN3
U1RTS
-
-
B1
4
Analog
PE1
14
AIN2
U1DSR
-
B1
5
Analog
PE2
13
AIN1
U1DCD
B1
6
Analog
PE3
12
AIN0
U1DTR
B1
7
Analog
PD7
128
AIN4
B1
8
Analog
PA6
40
B1
9
A out
PM4
74
B1
10
A out
PM5
73
TMPR2
12
GPIO
MCU
Pin
Digital Function (GPIOPCTL Bit Encoding)
Header
Analog
1
2
3
5
6
7
8
11
13
14
15
-
-
-
-
-
-
-
SSI1XDAT0
-
-
-
-
-
-
-
EPI0S7
-
-
-
RTCCLK
-
-
-
-
EPI0S6
-
-
-
-
-
-
-
-
-
EPI0S5
-
-
-
-
-
-
-
-
-
SSIXDAT1
I2C8SDA
T1CCP1
-
-
-
-
-
-
-
SSI2CLk
-
-
-
-
-
-
-
-
-
EPI0S4
I2C0SCL
T5CCP0
-
-
-
-
-
-
USB0STP
EPI0S27
T5CCP1
-
-
-
-
-
-
USB0CLK
EPI0S28
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
U2CTS
-
T4CCP1
USB0PFLT
-
-
NMI
-
-
-
SSI2XDAT2
-
U2Rx
I2C6SCL
T3CCP0
USB0EPEN
-
-
-
-
SSI0XDAT2
-
EPI0S8
TMPR3
U0CTS
-
T4CCP0
-
-
-
-
-
-
-
-
U0DCD
-
T4CCP1
-
-
-
-
-
-
-
-
3.3 V
5V
GND
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Table 2-1. BoosterPack 1 GPIO and Signal Muxing (continued)
Digital Function (GPIOPCTL Bit Encoding)
Header
Pin
Standard
Function
GPIO
MCU
Pin
Analog
1
2
3
5
6
7
8
11
13
14
15
C1
1
PWM
PF1
43
-
-
-
-
EN0LED2
M0PWM1
-
-
-
-
SSI3XDAT0
TRD1
C1
2
PWM
PF2
44
-
-
-
-
-
M0PWM2
-
-
-
-
SSI3Fss
TRD0
C1
3
PWM
PF3
45
-
-
-
-
-
M0PWM3
-
-
-
-
SSI3Clk
TRCLK
C1
4
PWM
PG0
49
-
-
I2C1SCL
-
EN0PPS
M0PWM4
-
-
-
-
-
EPI0S11
C1
5
Capture
PL4
85
-
-
-
T0CCP0
-
-
-
-
-
-
USB0D4
EPI0S26
C1
6
Capture
PL5
86
-
-
-
T0CCP1
-
-
-
-
-
-
USB0D5
EPI0S33
C1
7
GPIO
PL0
81
-
-
I2C2SDA
-
-
M0FAULT3
-
-
-
-
USB0D0
EPI0S16
C1
8
GPIO
PL1
82
-
-
I2C2SCL
-
-
PhA0
-
-
-
-
USB0D1
EPI0S17
C1
9
GPIO
PL2
83
-
-
-
-
C0o
PhB0
-
-
-
-
USB0D2
EPI0S18
C1
10
GPIO
PL3
84
-
-
-
-
C1o
IDX0
-
-
-
-
USB0D3
EPI0S19
D1
1
Ground
D1
2
PWM
PM3
75
-
-
-
T3CCP1
-
-
-
-
-
-
-
EPI0S12
D1
3
GPIO
PH2
31
-
U0DCD
-
-
-
-
-
-
-
-
-
EPI0S2
D1
4
GPIO
PH3
32
-
U0DSR
-
-
-
-
-
-
-
-
-
EPI0S3
D1
5
Reset
D1
6
SPI MOSI
PD1
2
AIN14
-
I2C7SDA
T0CCP1
C1o
-
-
-
-
-
-
SSI2XDAT0
D1
7
SPI MISO
PD0
1
AIN15
-
I2C7SCL
T0CCP0
C0o
-
-
-
-
-
-
SSI2XDAT1
D1
8
GPIO
PN2
109
-
U1DCD
U2RTS
-
-
-
-
-
-
-
-
EPI0S29
D1
9
GPIO
PN3
110
-
U1DSR
U2CTS
-
-
-
-
-
-
-
-
EPI0S30
D1
10
GPIO
PP2
103
-
U0DTR
-
-
-
-
-
-
-
-
USB0NXT
EPI0S29
GND
RESET
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BoosterPack 2
The second BoosterPack XL interface is located near the middle of the board. This interface is fully compliant with the BoosterPack standard and
adds features not covered by the BoosterPack standard that enable operation with additional BoosterPacks.
An additional analog signal is provided on the outer left header (X6-9). This signal can be used to monitor the touch panel on the popular Kentec
EB-LM4F120-L35 BoosterPack.
Using the jumpers JP4 and JP5, Controller Area Network (CAN) digital receive and transmit signals can be optionally routed to the BoosterPack 2
interface. The location of these signals is consistent with the CAN interface on the TM4C Series TM4C123G LaunchPad and the Stellaris
LM4F120 LaunchPad. In the default configuration, UART0 is used for the ICDI virtual UART and CAN is not present on the BoosterPack headers.
In this configuration, the ROM serial bootloader can be used over the ICDI virtual UART. When the jumpers are configured for CAN on the
BoosterPack, then UART2 must be used for the ICDI virtual UART.
To comply with both the original and the new BoosterPack standard, I2C is provided on both sides of the BoosterPack connection. Use of I2C on
the bottom left of the BoosterPack connection is highly encouraged where possible, to be in compliance with the new BoosterPack standard. To
provide I2C capability on the right side of the connector, per the original standard, two zero-ohm resistors (R19 and R20) are used to combine the
SPI and I2C signals. These signals are not shared with any other pins on the LaunchPad and therefore removal of these zero-ohm resistors
should not be required. Software should be certain that unused GPIO signals are configured as inputs.
Table 2-2 provides a complete listing of the BoosterPack pins and the GPIO alternate functions available at each pin. The TM4C129ENCPDT
GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. ‘A’
and ‘D’ make up the outer BoosterPack standard pins, ‘B’ and ‘C’ make up the inner BoosterPack XL standard pins.
Table 2-2. BoosterPack 2 GPIO and Signal Muxing
Header Pin
14
Standard
Function
GPIO
MCU
Pin Analog
Digital Function (FPIOPCTL Bit Encoding)
1
2
3
5
7
8
11
13
14
-
-
-
-
-
-
SSI2Fss
-
-
-
-
-
-
SSI3XDAT2
-
-
-
-
-
-
-
SSI3XDAT3
T3CCP0
-
-
-
-
-
-
-
SSI1XDAT2
T0CCP0
-
-
CANORx
-
-
-
-
-
-
T3CCP1
-
-
-
-
-
-
-
SSI1XDAT3
I2C9SDA
T0CCP1
-
-
CAN0Tx
-
-
-
-
EPI0S20
A2
1
A2
2
Analog
PD2
3
AIN13
-
I2C8SCL
T1CCP0
C2o
A2
3
UART RX
PP0
118
C2+
U6Rx
-
-
-
A2
4
UART TX
PP1
119
C2-
U6Tx
-
-
A2
5
GPIO
(See JP4)
PD4
125
AIN7
U2Rx
-
PA0
33
-
U0Rx
I2C9SCL
126
AIN6
U2Tx
PA1
34
-
U0Tx
6
15
3.3 V
A2
6
Analog
(See JP5)
PD5
A2
7
SPI CLK
PQ0
5
-
-
-
-
-
-
-
-
-
-
SSI3Clk
A2
8
GPIO
PP4
105
-
U3RTS
U0DSR
-
-
-
-
-
-
-
USB0D7
-
A2
9
I2C SCL
PN5
112
-
U1RI
U3CTS
I2C2SCL
-
-
-
-
-
-
-
EPIO0S35
A2
10
I2C SDA
PN4
111
-
U1DTR
U3RTS
I2C2SDA
-
-
-
-
-
-
-
EPIO0S34
B2
1
5V
B2
2
GND
B2
3
-
-
-
-
-
SSI1Fss
Analog
PB4
121
AIN10
U0CTS
I2C5SCL
-
-
-
Hardware Description
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Functional Description
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Table 2-2. BoosterPack 2 GPIO and Signal Muxing (continued)
Header Pin
Standard
Function
GPIO
MCU
Pin Analog
Digital Function (FPIOPCTL Bit Encoding)
1
2
3
5
6
7
8
11
13
14
15
B2
4
Analog
PB5
120
AIN11
U0RTS
I2C5SDA
-
-
-
-
-
-
-
-
SSI1Clk
B2
5
Analog
PK0
18
AIN16
U4Rx
-
-
-
-
-
-
-
-
-
EPI0S0
B2
6
Analog
PK1
19
AIN17
U4Tx
-
-
-
-
-
-
-
-
-
EPI0S1
B2
7
Analog
PK2
20
AIN18
U4RTS
-
-
-
-
-
-
-
-
-
EPI0S2
B2
8
Analog
PK3
21
AIN19
u4CTS
-
-
-
-
-
-
-
-
-
EPI0S3
B2
9
A out
PA4
37
-
U3Rx
I2C7SCL
T2CCP0
-
-
-
-
-
-
-
SSI0XDAT0
B2
10
A out
PA5
38
-
U3Tx
I2C7SDA
T2CCP1
-
-
-
-
-
-
-
SSI0XDAT1
C2
1
PWM
PG1
50
-
-
I2C1SDA
-
-
M0PWM5
-
-
-
-
-
EPI0S10
C2
2
PWM
PK4
63
-
-
I2C3SCL
-
EN0LED0
M0PWM6
-
-
-
-
-
EPI0S32
C2
3
PWM
PK5
62
-
-
I2C3SDA
-
EN0LED2
M0PWM7
-
-
-
-
-
EPI0S31
C2
4
PWM
PM0
78
-
-
-
T2CCP0
-
-
-
-
-
-
-
EPI0S15
C2
5
Capture
PM1
77
-
-
-
T2CCP1
-
-
-
-
-
-
-
EPI0S14
C2
6
Capture
PM2
76
-
-
-
T3CCP0
-
-
-
-
-
-
-
EPI0S13
C2
7
GPIO
PH0
29
-
U0RTS
-
-
-
-
-
-
-
-
-
EPI0S0
C2
8
GPIO
PH1
30
-
U0CTS
-
-
-
-
-
-
-
-
-
EPI0S1
C2
9
GPIO
PK6
61
-
-
I2C4SCL
-
EN0LED1
M0FAULT1
-
-
-
-
-
EPI0S25
C2
10
GPIO
PK7
60
-
U0RI
I2C4SDA
-
RTCCLK
M0FAULT2
-
-
-
-
-
EPI0S24
D2
1
D2
2
PWM
PM7
71
TMPR0
U0RI
-
T5CCP1
-
-
-
-
-
-
-
-
D2
3
GPIO
PP5
106
-
U3CTS
I2C2SDL
-
-
-
-
-
-
-
USB0D6
-
D2
4
GPIO
PA7
41
-
U2Tx
I2C6SDA
T3CCP1
USB0PFLT
-
-
-
USB0EPEN
SSI0XDAT3
-
EPI0S9
D2
5
D2
6
D2
7
D2
GND
RESET
SPI MOSI
PQ2
11
-
-
-
-
-
-
-
-
-
-
SSI3XDAT0
EPI0S22
I2C
PA3
36
-
U4Tx
I2C8SDA
T1CCP1
-
-
-
-
-
-
-
SSI0Fss
SPI MISO
PQ3
27
-
-
-
-
-
-
-
-
-
-
SSI3XDAT1
EPI0S23
I2C
PA2
35
-
U4Rx
I2C8SCL
T1CCP0
-
-
-
-
-
-
-
SSI0Clk
8
GPIO
PP3
104
-
U1CTS
U0DCD
-
-
-
-
-
-
-
USB0DIR
EPI0S30
D2
9
GPIO
PQ1
6
-
-
-
-
-
-
-
-
-
-
SSI3Fss
EPI0S21
D2
10
GPIO
PM6
72
TMPR1
U0DSR
-
T5CCP0
-
-
-
-
-
-
-
-
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Functional Description
2.1.7.3
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Breadboard Connection
The breadboard adapter section of the board is a set of 98 holes on a 0.1 inch grid. Properly combined with a pair of right angle headers, the
entire Crypto Connected LaunchPad can be plugged directly into a standard 300 mil (0.3 inch) wide solder-less breadboard. The right angle
headers and breadboard are not provided with this kit. Suggested part numbers are Samtec TSW-149-09-L-S-RE and TSW-149-08-L-S-RA right
angle pin headers and Twin industries TW-E40-1020 solder-less breadboard. Samtec TSW-149-09-F-S-RE and TSW-149-09-F-S-RA may be
substituted.
A detailed explanation of how to install the headers is available on the TI LaunchPad Wiki or at
http://users.ece.utexas.edu/~valvano/EE345L/Labs/Fall2011/LM3S1968soldering.pdf.
Nearly all microcontroller signals are made available at the breadboard adapter holes (X11). These signals are grouped by function, where
possible. For example, all EPI signals are grouped on one side of the connector. Many of the analog signals are grouped near VREF, and UART,
SSI and I2C signals are grouped by peripheral to make expansion and customization simpler.
Table 2-3 and Table 2-4 show the GPIO pin and signal muxing for the X11 breadboard adapter pads.
Table 2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing
Pin
Port
MCU
PIN
Digital Function (GPIOPCTL Bit Encoding)
Analog
1
2
3
5
1
3
7
8
11
13
14
15
GND
5
PB4
121
AIN10
U0CTS
I2C5SCL
-
-
-
-
-
-
-
-
SSI1Fss
7
PB5
120
AIN11
U0RTS
I2C5SDA
-
-
-
-
-
-
-
-
SSI1Clk
9
PH0
29
-
U0RTS
-
-
-
-
-
-
-
-
-
EPI0S0
11
PH1
30
-
U0CTS
-
-
-
-
-
-
-
-
-
EPI0S1
13
PH2
31
-
U0DCD
-
-
-
-
-
-
-
-
-
EPI0S2
15
PH3
32
-
U0DSR
-
-
-
-
-
-
-
-
-
EPI0S3
17
PC7
22
C0-
U5Tx
-
-
-
-
-
-
-
-
-
EPI0S4
19
PC6
23
C0+
U5Rx
-
-
-
-
-
-
-
-
-
EPI0S5
21
PC5
24
C1+
U7Tx
-
-
-
-
RTCCLK
-
-
-
-
EPI0S6
23
PC4
25
C1-
U7Rx
-
-
-
-
-
-
-
-
-
EPI0S7
25
PA6
40
-
U2Rx
I2C6SCL
T3CCP0
USB0EPEN
-
-
-
-
SSI0XDAT2
-
EPI0S8
27
PA7
41
-
U2Tx
I2C6SDA
T3CCP1
USB0PFLT
-
-
-
USB0EPEN
SSI0XDAT3
-
EPI0S9
29
PG1
50
-
-
I2C1SDA
-
-
M0PWM5
-
-
-
-
-
EPI0S10
31
PG0
49
-
-
I2C1SCL
-
EN0PPS
M0PWM4
-
-
-
-
-
EPI0S11
33
PM3
75
-
-
-
T3CCP1
-
-
-
-
-
-
-
EPI0S12
35
16
6
3V3
GND
37
PM2
76
-
-
-
T3CCP0
-
-
-
-
-
-
-
EPI0S13
39
PM1
77
-
-
-
T2CCP1
-
-
-
-
-
-
-
EPI0S14
Hardware Description
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Table 2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing (continued)
Digital Function (GPIOPCTL Bit Encoding)
Pin
Port
MCU
PIN
Analog
1
41
PM0
78
-
43
PL0
81
-
45
PL1
82
47
PL2
49
51
53
2
3
5
6
7
8
11
13
14
15
-
-
T2CCP0
-
I2C2SDA
-
-
-
-
-
-
-
M0FAULT3
-
-
-
-
-
EPI0S15
-
USB0D0
-
-
I2C2SCL
-
-
PhA0
-
-
EPI0S16
-
-
USB0D1
83
-
-
-
-
C0o
PhB0
-
EPI0S17
-
-
-
USB0D2
EPI0S18
PL3
84
-
PQ0
5
-
-
-
-
C1o
IDX0
-
-
-
-
-
-
-
-
-
USB0D3
EPI0S19
-
-
-
-
SSI3Clk
PQ1
6
-
-
-
-
-
EPI0S20
-
-
-
-
-
SSI3Fss
EPI0S21
55
PQ2
57
PQ3
11
-
-
-
-
27
-
-
-
-
-
-
-
-
-
-
SSI3XDAT0
EPI0S22
-
-
-
-
-
-
SSI3XDAT1
59
PK7
60
-
U0RI
I2C4SDA
-
EPI0S23
-
-
-
-
-
EPI0S24
63
PK6
61
-
-
I2C4SCL
-
EN0LED1
M0FAULT1
65
PL4
85
-
-
-
T0CCP0
-
-
-
-
-
EPI0S25
-
-
-
-
-
-
USB0D4
67
PB2
91
-
-
I2C0SCL
EPI0S26
T5CCP0
-
-
-
-
-
-
USB0STP
EPI0S27
69
PB3
92
-
-
71
PP2
103
-
U0DTR
I2C0SDA
T5CCP1
-
-
-
-
-
-
USB0CLK
EPI0S28
-
-
-
-
-
-
-
-
USB0NXT
73
PP3
104
-
EPI0S29
U1CTS
U0DCD
-
-
-
RTCCLK
-
-
-
USB0DIR
EPI0S30
75
PK5
62
77
PK4
63
-
-
I2C3SDA
-
EN0LED2
M0PWM7
-
-
-
-
-
EPI0S31
-
-
I2C3SCL
-
EN0LED0
M0PWM6
-
-
-
-
-
79
PL5
EPI0S32
86
-
-
-
T0CCP1
-
-
-
-
-
-
USB0D5
EPI0S33
81
83
PN4
111
-
U1DTR
U3RTS
I2C2SDA
-
-
-
-
-
-
-
EPI0S34
PN5
112
-
U1RI
U3CTS
I2C2SCL
-
-
-
-
-
-
-
EPI0S35
85
PN0
107
-
U1RTS
-
-
-
-
-
-
-
-
-
-
87
PN1
108
-
U1CTS
-
-
-
-
-
-
-
-
-
-
89
PN2
109
-
U1DCD
U2RTS
-
-
-
-
-
-
-
-
EPI0S29
91
PN3
110
-
U1DSR
U2CTS
-
-
-
-
-
-
-
-
EPI0S30
93
PQ4
102
-
U1Rx
-
-
-
-
-
DIVSCLK
-
-
-
-
61
GND
95
WAKE
97
5V
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Functional Description
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Table 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing
Pin
Port
MCU
PIN
Digital Function (GPIOPCTL Bit Encoding)
Analog
1
2
3
5
2
4
7
8
11
13
14
15
GND
6
PA2
35
-
U4Rx
I2C8SCL
T1CCP0
-
-
-
-
-
-
-
SSI0Clk
8
PA3
36
-
U4Tx
I2C8SDA
T1CCP1
-
-
-
-
-
-
-
SSI0Fss
10
PA4
37
-
U3Rx
I2C7SCL
T2CCP0
-
-
-
-
-
-
-
SSI0XDAT0
12
PA5
38
-
U3Tx
I2C7SDA
T2CCP1
-
-
-
-
-
-
-
SSI0XDAT1
14
PE0
15
AIN3
U1RTS
-
-
-
-
-
-
-
-
-
-
16
PE1
14
AIN2
U1DSR
-
-
-
-
-
-
-
-
-
-
18
PE2
13
AIN1
U1DCD
-
-
-
-
-
-
-
-
-
-
20
PE3
12
AIN0
U1DTR
-
-
-
-
-
-
-
-
-
-
22
PE4
123
AIN9
U1RI
-
-
-
-
-
-
-
-
-
SSI1XDAT0
24
PE5
124
AIN8
-
-
-
-
-
-
-
-
-
-
SSI1XDAT1
26
PK0
18
AIN16
U4Rx
-
-
-
-
-
-
-
-
-
EPI0S0
28
PK1
19
AIN17
U4Tx
-
-
-
-
-
-
-
-
-
EPI0S1
30
PK2
20
AIN18
U4RTS
-
-
-
-
-
-
-
-
-
EPI0S2
32
PK3
21
AIN19
U4CTS
-
-
-
-
-
-
-
-
-
EPI0S3
34
VREF
36
GND
38
PD5
126
AIN6
U2Tx
-
T3CCP1
-
-
-
-
-
-
-
SSI1XDAT3
40
PD4
125
AIN7
U2Rx
-
T3CCP0
-
-
-
-
-
-
-
SSI1XDAT2
42
PD7
128
AIN4
U2CTS
-
T4CCP1
USB0PFLT
-
-
NMI
-
-
-
SSI2XDAT2
44
PD6
127
AIN5
U2RTS
-
T4CCP0
USB0EPEN
-
-
-
-
-
-
SSI2XDAT3
46
PD3
4
AIN12
-
I2C8SDA
T1CCP1
-
-
-
-
-
-
-
SSI2Clk
48
PD1
2
AIN14
-
I2C7SDA
T0CCP1
C1o
-
-
-
-
-
-
SSI2XDAT0
50
PD0
1
AIN15
-
I2C7SCL
T0CCP0
C0o
-
-
-
-
-
-
SSI2XDAT1
52
PD2
3
AIN13
-
I2C8SCL
T1CCP0
C2o
-
-
-
-
-
-
SSI2Fss
54
PP0
118
C2+
U6Rx
-
-
-
-
-
-
-
-
-
SSI3XDAT2
56
PP1
119
C2-
U6Tx
-
-
-
-
-
-
-
-
-
SSI3XDAT3
58
PB0
95
USB0ID
U1Rx
I2C5SCL
T4CCP0
-
-
CAN1Rx
-
-
-
-
-
60
PB1
96
USB0VBUS
U1Tx
I2C5SDA
T4CCP1
-
-
CAN1Tx
-
-
-
-
-
62
18
6
5V
GND
64
PF4
46
-
-
-
-
EN0LED1
M0FAULT0
-
-
-
-
SSI3XDAT2
TRD3
66
PF0
42
-
-
-
-
EN0LED0
M0PWM0
-
-
-
-
SSI3XDAT1
TRD2
Hardware Description
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Functional Description
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Table 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing (continued)
Digital Function (GPIOPCTL Bit Encoding)
Pin
Port
MCU
PIN
Analog
1
2
3
5
6
7
8
11
13
14
15
68
PF1
43
-
-
-
-
EN0LED2
M0PWM1
-
-
-
-
SSI3XDAT0
TRD1
70
PF2
44
-
-
-
-
-
M0PWM2
-
-
-
-
SSI3Fss
TRD0
72
PF3
45
-
-
-
-
-
M0PWM3
-
-
-
-
SSI3Clk
TRCLK
74
PA0
33
-
U0Rx
I2C9SCL
T0CCP0
-
-
CAN0Rx
-
-
-
-
-
76
PA1
34
-
U0Tx
I2C9SDA
T0CCP1
-
-
CAN0Tx
-
-
-
-
-
78
PP4
105
-
U3RTS
U0DSR
-
-
-
-
-
-
-
USB0D7
-
80
PP5
106
-
U3CTS
I2C2SCL
-
-
-
-
-
-
-
USB0D6
-
82
PJ0
116
-
U3Rx
-
-
-
-
-
-
-
-
-
84
PJ1
117
-
U3Tx
-
-
-
-
-
-
-
-
-
-
86
PM7
71
TMPR0
U0RI
-
T5CCP1
-
-
-
-
-
-
-
-
88
PM6
72
TMPR1
U0DSR
-
T5CCP0
-
-
-
-
-
-
-
-
90
PM5
73
TMPR2
U0DCD
-
T4CCP1
-
-
-
-
-
-
-
-
92
PM4
74
TMPR3
U0CTS
-
T4CCP0
-
-
-
-
-
-
-
-
94
RESET
96
GND
98
3V3
SPMU372A – September 2015 – Revised October 2016
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19
Power Management
2.1.7.4
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Other Headers and Jumpers
JP1 is provided to select the power input source for the Crypto Connected LaunchPad. The top position is
for BoosterPack power; this position also disconnects both USB voltages from the board’s primary 5-V
input. In the top position, the TPS2052B does not limit current so additional care should be exercised. The
middle position draws power from the USB connector on the left side of the board near the Ethernet jack.
The bottom position is the default, in which power is drawn from the ICDI (Debug) USB connection.
JP2 separates the MCU 3.3-V power domain from the rest of the 3.3-V power on the board allowing an
ammeter to be used to obtain more accurate measurements of microcontroller power consumption.
JP3 isolates the output of the TPS73733 LDO from the board’s 3.3-V power domain.
JP4 and JP5 are used to configure CAN signals to the BoosterPack 2 interface. In the default horizontal
configuration, CAN is not present on the BoosterPack. UART2 goes to the BoosterPack and UART 0 goes
to the ICDI virtual serial port to provide ROM serial bootloader capability. In the vertical CAN-enabled
configuration, UART2 goes to the ICDI virtual serial port and CAN signals are available on the
BoosterPack. The ROM serial bootloader is not available to the ICDI virtual serial port while the jumpers
are in the CAN position.
Figure 2-2 shows the default configuration and relative location of the jumpers on the board.
Figure 2-2. Default Jumper Locations
2.2
Power Management
2.2.1 Power Supplies
The Crypto Connected LaunchPad can be powered from three different input options:
• On-board ICDI USB cable (Debug, Default)
• Target USB cable
• BoosterPack or Breadboard adapter connection
The JP1 power-select jumper is used to select one of the power sources.
In addition, the JP3 power jumper can be used to isolate the 3.3-V output of the TPS73733 from the
board’s 3.3-V rail.
A TPS2052B load switch is used to regulate and control power to the Target USB connector when the
microcontroller is acting in USB host mode. This load switch also limits current to the BoosterPack and
Breadboard adapter headers when the JP1 jumper is in the ICDI position.
20
Hardware Description
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Power Management
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2.2.2 Low Power Modes
The Crypto Connected LaunchPad demonstrates several low power microcontroller modes. In run mode,
the microcontroller can be clocked from several sources such as the internal precision oscillator or an
external crystal oscillator. Either of these sources can then optionally drive an internal PLL to increase the
effective frequency of the system up to 120 MHz. In this way, the run mode clock speed can be used to
manage run mode current consumption.
The microcontroller also provides sleep and deep sleep modes and internal voltage adjustments to the
flash and SRAM to further refine power consumption when the processor is not in use but peripherals
must remain active. Each peripheral can be individually clock gated in these modes so that current
consumption by unused peripherals is minimized. A wide variety of conditions from internal and external
sources can trigger a return to run mode.
The lowest power setting of the microcontroller is hibernation, which requires a small amount of supporting
external circuitry available on the Crypto Connected LaunchPad. The Crypto Connected LaunchPad can
achieve microcontroller current consumption modes under 2 micro-Amps using hibernate VDD3ON mode.
Hibernation with VDD3ON mode is not supported on this board. The Crypto Connected LaunchPad can
be woken from hibernate by several triggers including the dedicated wake button, the reset button, an
internal RTC timer and a subset of the device GPIO pins. The hibernation module provides a small area of
internal SRAM that can preserve data through a hibernate cycle.
2.2.3 Clocking
The Crypto Connected LaunchPad uses a 25 MHz crystal (Y1) to drive the main TM4C129ENCPDT
internal clock circuit. Most software examples use the internal PLL to multiply this clock to higher
frequencies up to 120 MHz for core and peripheral timing. The 25-MHz crystal is required when using the
integrated Ethernet MAC and PHY.
The Hibernation module is clocked from an external 32.768-KHz crystal (Y3).
2.2.4 Reset
The RESET signal to the TM4C129ENCPDT microcontroller connects to the RESET switch, BoosterPack
connectors, Breadboard adapter and to the ICDI circuit for a debugger-controller reset.
External reset is asserted (active low) under the following conditions:
• Power-on reset (filtered by and R-C network)
• RESET switch is held down.
• By the ICDI circuit when instructed by the debugger (this capability is optional, and may not be
supported by all debuggers)
• By an external circuit attached to the BoosterPack or Breadboard connectors.
2.3
Debug Interface
2.3.1 In-Circuit Debug Interface (ICDI)
The Crypto Connected LaunchPad comes with an on-board ICDI. The ICDI allows for the programming
and debugging of the TM4C129ENCPDT using LM Flash Programmer and/or any of the supported tool
chains. Note that ICDI only supports JTAG debugging at this time. It is possible to use other JTAG
emulators instead of the on board ICDI, by connecting to U6. When the ICDI detects an external debug
adapter connection on the JTAG connector U6 and disables the ICDI outputs to allow the external debug
adapter to drive the debug circuit. For more information, see Section 2.3.2.
Debug out of the ICDI is possible by removing resistors R6, R7, R8, R10, R11, R15, R16 and R40 from
the Crypto Connected LaunchPad and use the ICDI to drive JTAG signals out on U6 for the purpose of
programming or debugging other boards. To restore the connection to the on-board TM4C129ENCPDT
microcontroller, install jumpers from the odd to even pins of X1 or re-install the resistors. Removal of R40
disables the detection of an attached external debugger. R40 must be installed to use an external debug
adapter to program or debug the Crypto Connected LaunchPad.
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Hardware Description
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Debug Interface
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2.3.2 External Debugger
The connector U6 is provided for the attachment of an external debug adapter such as the IAR J-Link or
Keil ULINK. This connector follows the ARM standard 10-pin JTAG pinout. This interface can use either
JTAG or SWD if supported by the external debug adapter.
2.3.3 Virtual COM Port
When plugged into a USB host, the ICDI enumerates as both a debugger and a virtual COM port. JP4 and
JP5 control the selection of which UART from the TM4C129ENCPDT is connected to the virtual COM
port. In the default configuration, UART0 maps to the virtual COM port of the ICDI. In the CAN jumper
configuration, UART2 maps to the virtual COM port of the ICDI.
22
Hardware Description
SPMU372A – September 2015 – Revised October 2016
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Chapter 3
SPMU372A – September 2015 – Revised October 2016
Software Development
This chapter provides general information on software development as well as instructions for flash
memory programming.
3.1
Secure IoT Demo
3.1.1 Software Description
The out-of-box “Secure IoT” application demonstrates the use of Transport Layer Security/Secure Sockets
Layer (TLS/SSL) protocol to connect an IoT product to a cloud server securely. This application runs on
TI-RTOS and uses WolfSSL library for TLS/SSL support. The WolfSSL library uses the hardware
encryption accelerators, available on the Crypto Connected LaunchPad board, which enables the
development of connected applications with data encryption (for secure communication) at relatively
higher performance. This application connects to Exosite’s cloud server using HTTPS protocol.
The “Secure IoT” application records information about the Crypto Connected LaunchPad and user activity
on this board, which is securely reported to Exosite cloud server. A command-line interface is provided to
interact with the application. With the command-line interface one can control the eval board like changing
the state of the LED or play a game of tic-tac-toe either locally or with a remote user.
For more details about example usage, see the “Readme.txt” file available with the “Secure IoT”
application.
3.1.2 Source Code Download and Build Instructions
The source code and binary files for the “Secure IoT” application are provided as part of an installer at
http://www.ti.com/lit/zip/spmc022.
Instructions for downloading and installing TI-RTOS and WolfSSL along with detailed instructions on
building WolfSSL libraries for TI-RTOS are provided at
http://processors.wiki.ti.com/index.php/Using_wolfSSL_with_TI-RTOS. This application works with TIRTOS v2.14.00.10 or later and WolfSSL v3.6.6 or later.
After building the WolfSSL libraries for TI-RTOS with support for TM4C hardware ciphers, follow the
instructions under “Build Details - Application” in the “Readme.txt” file available with the “Secure IoT”
application’s installation.
3.2
TivaWare for C Series Software
3.2.1 Software Description
The TivaWare software provides drivers for all of the peripheral devices supplied in the design. The TM4C
Series Peripheral Driver Library is used to operate the on-chip peripherals as part of TivaWare.
TivaWare includes a set of example applications that use the TivaWare Peripheral Driver Library. These
applications demonstrate the capabilities of the TM4C129ENCPDT microcontroller, as well as provide a
starting point for the development of the final application for use on the Crypto Connected LaunchPad
evaluation board. Example applications provided for the TM4C Series TM4C1294 Connected LaunchPad
and examples paired with selected BoosterPacks will work with the Crypto Connected LaunchPad.
SPMU372A – September 2015 – Revised October 2016
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Software Development
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TivaWare for C Series Software
www.ti.com
3.2.2 Source Code
The complete source code including the source code installation instructions are provided at
http://www.ti.com/tool/sw-tm4c. The source code and binary files are installed in the TivaWare software
tree.
3.2.3 Tool Options
The source code installation includes directories containing projects, makefiles, and binaries for the
following tool-chains:
• Keil ARM RealView® Microcontroller Development System
• IAR Embedded Workbench® for ARM
• Generic GNU C Compiler
• Texas Instruments' Code Composer Studio™ IDE
Download evaluation versions of these tools from the Tools & Software section of www.ti.com/tiva. Due to
code size restrictions, the evaluation tools may not build all example programs. A full license is necessary
to re-build or debug all examples.
For detailed information on using the tools, see the documentation included in the tool chain installation or
visit the website of the tools supplier.
3.3
Programming the Crypto Connected LaunchPad
The TivaWare software package includes pre-built binaries for each of the example applications. If you
installed the TivaWare software to the default installation path of C:\ti\TivaWare_C_Series_, you
can find the example applications in C:\ti\TivaWare_C_Series-\examples\boards\ek-tm4c1294xl.
The on-board ICDI is used with the LM Flash Programmer tool to program applications on the Crypto
Connected LaunchPad.
Follow these steps to program example applications into the Crypto Connected LaunchPad evaulation
board using the ICDI:
1. Install LM Flash Programmer on a PC running Microsoft Windows.
2. Place JP1 into the ICDI position on the Crypto Connected LaunchPad.
3. Connect the USB-A cable plug in to an available USB port on the PC and plug the Micro-B plug to the
Debug USB port (U22) on the Crypto Connected LaunchPad.
4. Verify that LED D0 at the top of the board is illuminated.
5. Install Windows ICDI and Virtual COM Port drivers if prompted. Installation instructions can be found in
the Stellaris® In-Circuit Debug Interface (ICDI) and Virtual COM Port Driver Installation Instructions
(SPMU287).
6. Run the LM Flash Programmer application on the PC.
7. In the Configuration tap, use the Quick Set control to select “TM4C1294XL LaunchPad”.
8. Move to the Program tab and click the Browse button. Navigate to the example applications directory
(the default location is C:\ti\TivaWare_C_Series_\examples\boards\EK-TM4C1294XL\).
9. Each example application has its own directory. Navigate to the example directory that you want to
load and then into the sub-directory for one of the supported tool chains that contains the binary (*.bin)
file. Select the binary file and click Open.
10. Set the Erase Method to Erase Necessary Pages, check the Verify After Program box, and check
Reset MCU After Program. The example program starts execution once the verify process is complete.
24
Software Development
SPMU372A – September 2015 – Revised October 2016
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Chapter 4
SPMU372A – September 2015 – Revised October 2016
References
4.1
References
In
•
•
•
•
•
•
•
•
•
•
addition to this document the following references are available for download at www.ti.com.
TivaWare for C Series (http://www.ti.com/tool/sw-tm4c)
TivaWare Peripheral Driver Library Users' Guide (SPMU298)
Quick Start Guide: Crypto Connected LaunchPad Evaluation Kit (EK-TM4C129EXL) (SPMZ862)
LM Flash Programmer Tool (http://www.ti.com/lmflashprogrammer)
TPS73733 Low-Dropout Regulator with Reverse Current Protection
(http://www.ti.com/product/tps79733)
Texas Instruments Code Composer Studio website (http://www.ti.com/ccs)
Tiva TM4C129ENCPDT Microcontroller Data Sheet (SPMS441)
Build Your Own BoosterPack information regarding the BoosterPack standard (http://www.ti.com/byob)
Stellaris® In-Circuit Debug Interface (ICDI) and Virtual COM Port Driver Installation Instructions
(SPMU287)
TI-RTOS (http://www.ti.com/tool/TI-RTOS)
Additional Support:
• Keil RealView MDK-ARM (http://www.keil.com/arm/mdk.asp)
• IAR Embedded Workbench for ARM (http://iar.com/ewarm/)
• Sourcery CodeBench development tools (http://www.mentor.com/embedded-software/sourcerytools/sourcery-codebench/overview)
• Exosite (http://ti.exosite.com)
• WolfSSL (http://wolfssl.com)
SPMU372A – September 2015 – Revised October 2016
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References
25
Appendix A
SPMU372A – September 2015 – Revised October 2016
PCB Layout and Bill of Materials
A.1
Component Locations
Figure A-1 is a dimensioned drawing of the Crypto Connected LaunchPad that shows the location of
selected features of the board, as well as the component locations.
Figure A-1. Crypto Connected LaunchPad Dimensions and Component Locations
26
PCB Layout and Bill of Materials
SPMU372A – September 2015 – Revised October 2016
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Bill of Materials
www.ti.com
A.2
Bill of Materials
Table A-1 is the Crypto Connected LaunchPad bill of materials list.
Table A-1. Crypto Connected LaunchPad Bill of Materials
Item
Ref
Qty
Description
Mfg
Part Number
Kemet
C1210C102MGRACTU
1
C1
1
Capacitor, 1000 pF, 2kV,
20%, X7R, 1210
2
C3, C4, C5, C10, C11, C12,
C13, C16, C17, C18, C19,
C21, C22, C23, C24, C25,
C26, C27, C28, C29, C30,
C40, C41, C42, C43, C46
26
Capacitor, 0.1 µF 16 V,
10%, 0402 X7R
Taiyo Yuden
EMK105B7104KV-F
3
C31
1
Capacitor, 4700 pF, 2kV,
10%, X7R, 1812
AVX
1812GC472KAT1A
4
C32, C33
2
Capacitor, 3300 pF, 50 V,
10%, X7R, 0603
TDK
C1608X7R1H332K
5
C6, C14
2
Capacitor, 1 µF, X5R, 10 V,
low ESR, 0402
Johanson
Dielectrics Inc
100R07X105KV4T
6
C7, C15, C20
3
Capacitor, 2.2 µF, 16 V,
10%, 0603, X5R
Murata
GRM188R61C225KE15D
7
C8, C9, C44,
C45, C47, C48
6
Capacitor, 12 pF, 50 V,
5%, 0402, COG
Murata
GRM1555C1H120JZ01D
8
D0, D1, D2, D3, D4
5
Green LED 0603
Everlight
19-217/G7C-AL1M2B/3T
7
Jumper, 0.100, Gold,
Black, Open
3M
969102-0000-DA
Kobiconn
151-8000-E
FCI
67996-206HLF
3M
961102-6404-AR
FCI
68001-102HLF
Anyone
1x2-head
9
J1, J2, J3,
J4, J5, J6, J7
10
JP1
1
Header, 2x3, 0.100, T-hole,
vertical unshrouded,
0.230 mate, gold
11
JP2, JP3
2
Header, 1x2, 0.100, T-hole,
vertical unshrouded, 0.220 mate
FCI
67997-104HLF
4UCON
00998
8
Resistor, 10k Ω, 1/10W,
5%, 0402 thick film
Yageo
RC0402FR-0710KL
R17, R26, R36
3
100k 5% 0402 resistor SMD
Rohm
MCR01MRTJ104
R18, R51
2
Resistor 0402 100 Ω 5%
Rohm
MCR1MRTJ101
16
R23, R21, R22, R24
4
Resistor 49.9 Ω 0402. 1 %
Rohm
MCR01MRTF49R9
17
R25
1
Resistor 4.87k 1% 0402 SMD
Rohm
MCR01MRTF4871
Panasonic
ERJ-2GEJ562X
2
Header, 2x2, 0.100, T-hole,
vertical unshrouded, 0.230 mate
13
R1, R2, R3, R4,
R5, R29, R35, R44
14
15
12
JP4, JP5
18
R28
1
Resistor, 5.6k Ω,
1/10W, 5%, 0402
19
R32, R43, R45, R46
4
Resistor 75 Ω 0402 5%
Rohm
MCR01MRTJ750
20
R34, R52
2
Resistor, 1M OH,
1/10W, 5% 0603 SMD
Panasonic
ERJ-3GEYJ105V
21
R38
1
Resistor, 51 Ω,
1/10W, 5%, 0402
Panasonic
ERJ-2GEJ510X
SPMU372A – September 2015 – Revised October 2016
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PCB Layout and Bill of Materials
27
Bill of Materials
www.ti.com
Table A-1. Crypto Connected LaunchPad Bill of Materials (continued)
Item
Ref
Qty
Description
Mfg
Part Number
Rohm
MCR01MRTF1004
22
R42
1
Resistor, 1M Ω,
1/10W, 5%, 0402
23
R47
1
RES 1M Ω 5% 1206 TF
Panasonic
ERJ-8GEYJ105V
Panasonic
ERJ-3GEYJ202V
24
R49, R50
2
Resistor, 2.0k Ω,
1/10W, 5%, 0402
25
R6, R7, R8, R10, R11,
R15, R16, R19, R20, R39,
R40, R41
12
Resistor, 0 Ω,
1/10W, 5%, 0402
Panasonic
ERJ-2GE0R00X
26
R9, R27, R30, R31, R33
5
Resistor, 330 Ω,
1/10W, 5%, 0402
Yageo
RC0402FR-07330RL
27
RESET, USR_SW1,
USR_SW2, WAKE
4
Switch, Tact 6mm SMT, 160gf
Omron
B3S-1000
28
U1
1
TM4C, MCU
TM4C129ENCPDT 128 QFP
with cryptographic modules and
Ethernet MAC + PHY
Texas Instruments
TM4C129ENCPDT
29
U10
1
Transformer, Ethernet, 1 to 1.
SOIC 16
Pulse Electronics
HX1198FNL
30
U13
1
Diode, 8 chan, ±15KV, ESD
protection array, SO-8
Semtech
SLVU2.8-4.TBT
31
U14
1
Connector, RJ45 NO MAG,
shielded THRU HOLE
TE Connectivity
1-406541-5
32
U2, U3
2
IC 4CH ESD solution w/clamp
6SON
Texas Instruments
TPD4S012DRYR
33
U20
1
Stellaris TM4C MCU
TM4C123GH6PMI
Texas Instruments
TM4C123GH6PMI
34
U22
1
USB Micro B receptacle
right angle with guides
FCI
10118194-0001LF
35
U4
1
Fault protected power switch,
dual channel, 8-SON
Texas Instruments
TPS2052BDRBR
36
U5
1
3.3 V LDO TI TPS73733DRV
fixed out 5 V in
Texas Instruments
TPS73733DRV
37
U6
1
Header 2x5, 0.050, SM,
vertical shrouded
38
U7
1
USB Micro AB receptacle. Right
angle with through guides
39
X6, X7, X8, X9
4
Header, 2x10, T-hole vertical
unshrouded stacking
40
Y1
1
41
Y2
42
Y3
28
PCB Layout and Bill of Materials
Samtec
SHF-105-01-S-D-SM
Don Connex
Electronics
C44-10BSA1-G
Hirose
ZX62D-AB-5P8
Samtec
SSW-110-23-S-D
Major League
Electronics
SSHQ-110-D-08-F-LF
Crystal 25 MHz 3.2 x 2.5 mm
NDK
nx3225ga-25.000m-std-crg-2
1
Crystal 16 MHz 3.2 x 2.5 mm
4 pin
NDK
NX3225GA-16.000M-STD-CRG-2
1
Crystal, 32.768 KHz radial CAN
Citizen Finetech
Miyota
CMR200T-32.768KDZY-UT
SPMU372A – September 2015 – Revised October 2016
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Bill of Materials
www.ti.com
Table A-1. Crypto Connected LaunchPad Bill of Materials (continued)
Item
Ref
Qty
Description
Mfg
Part Number
PCB Do Not Populate List (Shown for information only)
43
C2
1
Capacitor, 0.1 µF 16 V,
10%, 0402 X7R
Taiyo Yuden
EMK105B7104KV-F
44
H1, H4, H6
3
Screw, #4 x 0.625" Pan head,
sheet metal, Phillips/slotted
(for fan)
McMaster
90077A112
45
R12, R13, R14
3
Resistor, 5.6k Ω,
1/10W, 5%, 0402
Panasonic
ERJ-2GEJ562X
46
R48
1
Resistor 0402 1% 52.3k
Rohm
TRR01MZPF5232
47
TP1, TP2, TP3, TP4, TP5,
TP6, TP7, TP8, TP9,
TP10, TP11, TP12, TP13,
TP14, TP15, TP16, TP17
17
Terminal, test point miniature
loop, red, T-hole
Keystone
5000
48
X1
1
Header, 2x7, 0.100, T-hole,
vertical, unshrouded, 0.230
mate
FCI
67997-114HLF
49
X11A
1
Valvano style bread board
connect. Right angle extended,
1 x 49 0.100 pitch.
Samtec
TSW-149-09-F-S-RE
50
X11B
1
Valvano style breadboard
header
Samtec
TSW-149-08-F-S-RA
SPMU372A – September 2015 – Revised October 2016
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PCB Layout and Bill of Materials
29
Appendix B
SPMU372A – September 2015 – Revised October 2016
Schematic
This section contains the complete schematics for the TM4C Series TM4C129E Crypto Connected
LaunchPad.
• Microcontroller, USB, Buttons, and LED's
• BoosterPack connectors
• Breadboard connector
• Ethernet and Ethernet LED's
• Power
• In-Circuit Debug Interface
30
Schematic
SPMU372A – September 2015 – Revised October 2016
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SPMU372A – September 2015 – Revised October 2016
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Copyright © 2015–2016, Texas Instruments Incorporated
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31
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
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TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
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You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
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