EQ50F100LRE/NOPB

EQ50F100LRE/NOPB

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    WSON6

  • 描述:

    EQ50F100LRE/NOPB

  • 详情介绍
  • 数据手册
  • 价格&库存
EQ50F100LRE/NOPB 数据手册
EQ50EVK - EQ50F100 Evaluation Kit User Manual Rev. 1.0 EQ50F100 6.25Gbps Backplane Equalizer Evaluation Kit User Manual Part Number: EQ50EVK Oct 2004 Communication Interface Division National Semiconductor Corporation Document Revision 1.0 1 of 7 EQ50EVK - EQ50F100 Evaluation Kit User Manual Rev. 1.0 Table of Contents Application Evaluation Board ................................................ 3 Evaluation Board................................................................... 4 Overview ............................................................................... 5 Troubleshooting .................................................................... 6 Other Resources ................................................................... 7 2 of 7 EQ50EVK - EQ50F100 Evaluation Kit User Manual Rev. 1.0 Introduction The National Semiconductor EQ50F100 evaluation kit (EQ50EVK) demonstrates the performance of the 6.25Gbps Backplane Equalizer. The printed circuit board (PCB) is optimized for giga-bit operation. The CML differential traces impedance is 100 Ohms differential and it is equipped with ACcoupling capacitors on both input and output trace. All CML traces have matched trace lengths for low skew. This evaluation kit can be used to test and verify the performance of the EQ50F100 equalizer in backplane and cable application. Application TX parallel Data Input ASIC TX Serial Data Output TX parallel Clock Input RX parallel Data Output SerDes RX parallel Clock Output Clock Distribution RX Serial Data Input EQ50F100 Reference Clock Backplane Switch Fabric Card Line Card TX parallel Data Input ASIC RX parallel Data Output RX parallel Clock Output Clock Distribution TX Serial Data Output TX parallel Clock Input SerDes RX Serial Data Input EQ50F100 Reference Clock The diagram above illustrates the use of the EQ50EVK along with a Backplane SerDes, in a giga-bit backplane transmission application. Please refer to datasheet for information. 3 of 7 EQ50EVK - EQ50F100 Evaluation Kit User Manual Rev. 1.0 Evaluation Board 4 of 7 EQ50EVK - EQ50F100 Evaluation Kit User Manual Rev. 1.0 Setup The setup of EQ50EVK evaluation board is very straightforward. To start using the evaluation kit, follow these steps: 1) Connect signal source positive output to EQ50EVK positive input (J2). 2) Connect signal source negative output to EQ50EVK negative input (J3). 3) Connect EQ50EVK positive output (J4) to the positive input of SerDes/ASIC/FPGA/Test Equipment. 4) Connect EQ50EVK positive output (J5) to negative input of SerDes/ASIC/FPGA/Test Equipment. 5) Apply power (+1.8V) and ground to EQ50EVK PWR section (P2). See Figure 1 for detail. GND 1.8V PWR P2 Connection to Ground Connection to 1.8V power Figure 1 Overview The EQ50EVK has total of 4 layers: 1) Signal layer, 2) GND layer, 3) +1.8V power layer and 4) bottom layer. The total board thickness is 62mil. The highspeed CML signal traces are 20mil wide with impedance of 100-Ohm differential. The CML input and output of the EQ50F100 is access through SMA connector (J2 – J5). Power and ground are supplied through 2mm Header-pin connector P2. See Figure 1 for detail. Tantalum 10uF capacitors (C3) placed near the power connection provide bulk energy storage. In addition to excellent bypassing provided by the closely sandwiched power and ground planes, a network of 10nF (C5) and 100pF (C7) bypass capacitors is placed between Vcc and ground to provide additional bypassing near the device. 5 of 7 EQ50EVK - EQ50F100 Evaluation Kit User Manual Rev. 1.0 Troubleshooting If the demo boards are not performing properly, use the following as a guide for quick solutions to common problems. If the problem persists, contact the hotline number listed under Additional Information section of this document. Check the following: 1. Power and Ground are connected to the power connections of the board. 2. Supply voltage (+1.8V) and current (It's around 40mA). 3. Input signal to input SMA connectors. 4. Connection and signal to the input SMA connectors (J2, J3) on the board. 5. Connection from the output SMA connectors (J4, J5) on the board. 6. Soldering on the input and output SMA connectors. 6 of 7 EQ50EVK - EQ50F100 Evaluation Kit User Manual Rev. 1.0 Other Resources For more information on High Speed Backplane Solution, refer to the National’s LVDS website at: LVDS.national.com © National Semiconductor, 2003. National Semiconductor and the “N” logo are registered trademarks of National Semiconductor Corporation. All other brand or product names are trademarks of their respective owners. All rights reserved. 7 of 7
EQ50F100LRE/NOPB
物料型号:EQ50F100 器件简介:EQ50F100是一款6.25Gbps背板均衡器,用于高速数据传输。

引脚分配:EQ50F100通过SMA连接器(J2-J5)进行CML输入和输出,电源和地通过2mm头针连接器P2提供。

参数特性:高速CML信号迹线宽度为20mil,差分阻抗为100欧姆。

功能详解:EQ50F100评估套件(EQ50EVK)展示了EQ50F100在背板和电缆应用中的性能,用于测试和验证EQ50F100均衡器的性能。

应用信息:EQ50EVK与背板SerDes一起使用,用于千兆位背板传输应用。

封装信息:评估板共有4层,包括信号层、地层、+1.8V电源层和底层,总板厚为62mil。


以上信息摘自EQ50F100评估套件用户手册。
EQ50F100LRE/NOPB 价格&库存

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EQ50F100LRE/NOPB
  •  国内价格 香港价格
  • 250+83.44662250+10.80926

库存:0

EQ50F100LRE/NOPB
    •  国内价格
    • 1+58.19040
    • 250+22.51800
    • 500+21.72960
    • 1000+21.34080

    库存:0