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HD3SS213-1-2MUXEVM

HD3SS213-1-2MUXEVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    Module

  • 描述:

    EVALMODULEFORHD3SS213-1-2MUX

  • 数据手册
  • 价格&库存
HD3SS213-1-2MUXEVM 数据手册
User's Guide SLAU534 – September 2013 HD3SS213 Evaluation Module This is the user’s guide for the evaluation module (EVM) of the HD3SS213. The purpose of this user’s guide is to facilitate an easy evaluation process of the HD3SS213 DisplayPort switch. The contents of this user’s guide are meant to provide an overview of the HD3SS213, which includes highlighting its key features, operating conditions, and how to setup this EVM for use in a system level evaluation. The construction of the HD3SS213 EVM also serves as a reference design that can be easily modified for any intended application. Target applications include Notebooks, Desktops and Docking Stations. Schematic and layout information is included at the end of this manual. 1 2 3 4 5 6 7 8 Contents Introduction .................................................................................................................. 2 HD3SS213 EVM Kit Contents ............................................................................................. 2 Description of EVM Board ................................................................................................. 2 Power for the HD3SS213 EVM ........................................................................................... 3 Monitoring the Device Current ............................................................................................ 3 PCB Construction ........................................................................................................... 3 6.1 HD3SS213 EVM Board Schematics ............................................................................. 3 6.2 HD3SS213 EVM Board Layout .................................................................................. 8 HD3SS213 EVM Board Construction .................................................................................... 9 HD3SS213 EVM Material Listing ........................................................................................ 10 List of Figures 1 HD3SS213 EVM Simple System Block Diagram ....................................................................... 2 2 HD3SS213 EVM Picture [Top Side] ...................................................................................... 3 3 HD3SS213 EVM Schematic Source Port C ............................................................................. 4 4 HD3SS213 EVM Schematic Sink Ports A and B ....................................................................... 5 5 HD3SS213 EVM Control ................................................................................................... 6 6 HD3SS213 EVM Power .................................................................................................... 7 7 HD3SS213 EVM Layout Layer 1 [Top]................................................................................... 8 8 HD3SS213 EVM Layout Layer 2 [GND] ................................................................................. 8 9 HD3SS213 EVM Layout Layer 3 [VCC].................................................................................. 9 10 HD3SS213 EVM Layout Layer 4 [Bottom] ............................................................................... 9 1 HD3SS213 EVM Jumper Description and Settings .................................................................... 3 2 EVM Bill of Materials ...................................................................................................... 10 List of Tables SLAU534 – September 2013 Submit Documentation Feedback HD3SS213 Evaluation Module Copyright © 2013, Texas Instruments Incorporated 1 Introduction 1 www.ti.com Introduction The HD3SS213 is a high-speed passive switch capable of switching two full DisplayPort 4 lane ports from one of two sources to one target location in an application or one source to one of two targets. For DisplayPort Applications the HD3SS213 also supports switching of the Auxiliary (AUX), Display Data Channel (DDC) and Hot Plug Detect (HPD) signals. This EVM was designed to be used as a medium connection between one DisplayPort source and one of two DisplayPort sinks. The interface to the EVM consists of a standard DisplayPort connector to connect the EVM to your system set up via standard DisplayPort cables. Your test setup should look similar to Figure 1 DisplayPort Device/Sink 1 DisplayPort Device/Sink 2 DisplayPort Cables Port A Connector Port B Connector HD3SS213 EVM Port C Connector DisplayPort Cable DisplayPort Host/Source Figure 1. HD3SS213 EVM Simple System Block Diagram 2 HD3SS213 EVM Kit Contents This EVM kit should contain the following items: • HD3SS213 EVM board • 9V DC Power Supply • This user’s manual 3 Description of EVM Board The HD3SS213 EVM is designed to provide easy evaluation of the HD3SS213 device. It is also meant to serve as a reference design to show a practical example of how to use the device in a mass-production system. Table 1 highlights the EVM jumper functionality and configuration. 2 HD3SS213 Evaluation Module SLAU534 – September 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Power for the HD3SS213 EVM www.ti.com Figure 2. HD3SS213 EVM Picture [Top Side] Table 1. HD3SS213 EVM Jumper Description and Settings Jumper Configuration 4 JMP10 VDD Selection No Connect for Nominal 3.3V Supply Voltage Jumper pins 1-2 for 3.6V Supply Voltage Jumper pins 2-3 for 3.0V Supply Voltage JMP11 HD3SS213 Output Enable Jumper pins 1-2 to enable device outputs (Default) Jumper pins 2-3 to disable device outputs JMP4 HD3SS213 AUX SEL Jumper pins 1-2 to enable Port B to C Connection Jumper pins 2-3 to enable Port A to C Connection JMP13 HD3SS213 Dx SEL Jumper pins 1-2 to enable Port B to C Connection Jumper pins 2-3 to enable Port A to C Connection Power for the HD3SS213 EVM The HD3SS213 EVM kit comes with a +9V DC power supply that plugs into a wall socket. 5 Monitoring the Device Current To observe current consumption of the HD3SS213 in the device evaluation, the HD3SS213 EVM includes the option of monitoring the current draw of the device. In order to enable this feature, the following steps must be taken: 1. Un-install the ferrite bead located at L2. 2. Obtain a power supply with the ability to display its current draw (or connect a current meter in series to the power supply) and connect to JMP 9 Turn on the power supply and observe the measured current on the power supply display (or current meter). 6 PCB Construction This section discusses the construction of the EVM boards. It includes the board schematics and layout files to show how the board was built. 6.1 HD3SS213 EVM Board Schematics This section shows the board schematic sheets for the EVM. SLAU534 – September 2013 Submit Documentation Feedback HD3SS213 Evaluation Module Copyright © 2013, Texas Instruments Incorporated 3 PCB Construction www.ti.com Figure 3. HD3SS213 EVM Schematic Source Port C 4 HD3SS213 Evaluation Module SLAU534 – September 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated PCB Construction www.ti.com Figure 4. HD3SS213 EVM Schematic Sink Ports A and B SLAU534 – September 2013 Submit Documentation Feedback HD3SS213 Evaluation Module Copyright © 2013, Texas Instruments Incorporated 5 PCB Construction www.ti.com Figure 5. HD3SS213 EVM Control 6 HD3SS213 Evaluation Module SLAU534 – September 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated PCB Construction www.ti.com Figure 6. HD3SS213 EVM Power SLAU534 – September 2013 Submit Documentation Feedback HD3SS213 Evaluation Module Copyright © 2013, Texas Instruments Incorporated 7 PCB Construction 6.2 www.ti.com HD3SS213 EVM Board Layout This EVM was designed to show the implementation of this device on a 4-layer board. Figure 7. HD3SS213 EVM Layout Layer 1 [Top] Figure 8. HD3SS213 EVM Layout Layer 2 [GND] 8 HD3SS213 Evaluation Module SLAU534 – September 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated HD3SS213 EVM Board Construction www.ti.com Figure 9. HD3SS213 EVM Layout Layer 3 [VCC] Figure 10. HD3SS213 EVM Layout Layer 4 [Bottom] 7 HD3SS213 EVM Board Construction The HD3SS213 EVM board is a 4-layer board constructed of FR4 – TurboClad 370 material. The board stack-up consists of a signal layer on top, a ground layer, power layer, and a signal layer on bottom. NOTE: Note: To achieve the desired impedance, it is recommended that you consult the board manufacturer for their process and design requirements. SLAU534 – September 2013 Submit Documentation Feedback HD3SS213 Evaluation Module Copyright © 2013, Texas Instruments Incorporated 9 HD3SS213 EVM Material Listing 8 www.ti.com HD3SS213 EVM Material Listing Table 2. EVM Bill of Materials 10 Item Quantity Reference Value 1 2 C20, C37 1.0uF 2 3 C65, C68, C69 0.1uF 3 3 C66, C70, C71 0.01uF 4 1 C67 1.0uF 5 2 C73, C74 1.0 uF 6 1 D3 GREEN 7 1 D4 10V, 3A 8 1 JMP4 4 Pin-T Berg Jumper 9 1 JMP9 DNI 10 1 JMP10 DNI 11 2 JMP11, JMP13 Header 3x1 12 1 J18 DP Plug Source 13 2 J21, J22 Display_Port_Connector_Source 14 1 L2 HI1206N101R-00 15 1 P1 RAPC722 16 1 R2 DNI 100k 17 5 R3, R14, R17, R33, R45 100K 18 28 R4, R6, R16, R18, R25, R27, R34, R35, R42, R43, R49, R57, R58, R59, R60, R61, R62, R63, R64, R65, R66, R67, 0 R68, R69, R70, R71, R72, R73 19 3 R5 R20, R44 DNI 0 20 2 R7, R8 DNI 2K 21 1 R9 DNI 27K 22 1 R10 DNI 5M 23 2 R11, R46 1M 24 8 R22, R24, R28, R29, R30, R31, R47, R48 4.64K 25 4 R23, R36, R39, R74 DNI 0 26 1 R50 75 27 1 R51 23.2K 28 2 R52, R53 150K 29 1 R54 DNI 30 1 R55 64.9K 31 1 R56 13K 32 1 R75 0 33 1 R76 0 34 18 R111, R112, R113, R114, R115, R116, R117, R118, R119, R120, R121, R122, R123, R124, R125, R126, R129, R131 DNI 10K 35 2 R127, R128 DNI 1M 36 14 TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP9, TP10, TP11, TP12, TP13, TP14 Test Point 37 1 U4 REG104-A 38 1 U5 HD3SS213_ZQE HD3SS213 Evaluation Module SLAU534 – September 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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HD3SS213-1-2MUXEVM 价格&库存

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