0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
HD3SS215EVM

HD3SS215EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    HD3SS215 - Video, Video Switch Evaluation Board

  • 数据手册
  • 价格&库存
HD3SS215EVM 数据手册
User's Guide SLAU578B – April 2014 – Revised March 2017 HD3SS215 Evaluation Module This is the user’s guide for the evaluation module (EVM) of the HD3SS215. The purpose of this user's guide is to facilitate an easy evaluation process for the HD3SS215 HDMI switch. The contents of this user’s guide are meant to provide an overview of the HD3SS215, which includes highlighting its key features, operating conditions, and how to setup this EVM for use in a system-level evaluation. The construction of the HD3SS215 EVM also serves as a reference design that can be easily modified for any intended application. Target applications include notebooks, desktops, and docking stations. Schematics and layout information are included near the end. 1 2 3 4 5 6 7 8 Contents Introduction ................................................................................................................... 2 HD3SS215 EVM Kit Contents.............................................................................................. 2 Description of EVM Board .................................................................................................. 3 Power for the HD3SS215 EVM ............................................................................................ 3 Monitoring the Device Current ............................................................................................. 3 PCB Construction ............................................................................................................ 4 HD3SS215 EVM Board Construction .................................................................................... 10 HD3SS215 EVM Material Listing ......................................................................................... 11 1 HD3SS215 EVM Simple System Block Diagram ........................................................................ 2 2 HD3SS215 EVM (Top Side)................................................................................................ 3 3 HD3SS215 EVM Schematic Source Port C .............................................................................. 4 4 HD3SS215 EVM Schematic Sink Ports A and B ........................................................................ 5 5 HD3SS215 EVM Control.................................................................................................... 7 6 HD3SS215 EVM Power..................................................................................................... 8 7 HD3SS215 EVM Layout Layer 1 (Top) ................................................................................... 9 8 HD3SS215 EVM Layout Layer 2 (GND) .................................................................................. 9 9 HD3SS215 EVM Layout Layer 3 (VCC) 10 HD3SS215 EVM Layout Layer 4 (Bottom) .............................................................................. 10 List of Figures ................................................................................ 10 List of Tables 1 HD3SS215 EVM Jumper Description and Settings ..................................................................... 3 2 Section A BOM Changes ................................................................................................... 6 3 Switch Control Logic 4 5 ........................................................................................................ 6 AUX/DDC Switch Control Logic............................................................................................ 6 EVM Bill of Materials ...................................................................................................... 11 SLAU578B – April 2014 – Revised March 2017 Submit Documentation Feedback HD3SS215 Evaluation Module Copyright © 2014–2017, Texas Instruments Incorporated 1 Introduction 1 www.ti.com Introduction The HD3SS215 is a high-speed passive switch capable of switching two full 4-lane ports from one of two sources to one target location in an application or from one source to one of two targets. The signal pass through the switch can be DisplayPort or HDMI/DVI signal. For DisplayPort applications, the HD3SS215 also supports switching of the auxiliary (AUX), display data channel (DDC), and hot plug detect (HPD) signals. This EVM was designed to be used as a medium connection between one HDMI source and one of two HDMI sinks. The interface to the EVM consists of a standard HDMI connector to connect the EVM to your system setup with standard HDMI cables. Your test setup should look similar to Figure 1. HDMI SINK DEVICE 1 HDMI SINK DEVICE 2 HDMI Cable HDMI Cable PORT B CONNECTOR PORT A CONNECTOR HD3SS215 EVM PORT C CONNECTOR HDMI Cable HDMI SOURCE DEVICE Figure 1. HD3SS215 EVM Simple System Block Diagram 2 HD3SS215 EVM Kit Contents This EVM kit should contain the following items: • HD3SS215 EVM board • User’s guide 2 HD3SS215 Evaluation Module SLAU578B – April 2014 – Revised March 2017 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated Description of EVM Board www.ti.com 3 Description of EVM Board The HD3SS215 EVM is designed to provide easy evaluation of the HD3SS215 device. It is also meant to serve as a reference design to show a practical example of how to use the device in a mass-production system. Table 1 highlights the EVM jumper functionality and configuration. Figure 2. HD3SS215 EVM (Top Side) Table 1. HD3SS215 EVM Jumper Description and Settings Jumper 4 Description Jumper Configuration JMP10 VDD selection No Connect for Nominal 3.3-V supply voltage Jumper pins 1 to 2 for 3.6-V supply voltage Jumper pins 2 to 3 for 3.0-V supply voltage JMP11 HD3SS215 output enable Jumper pins 1 to 2 to enable device outputs (default) Jumper pins 2 to 3 to disable device outputs JMP4 HD3SS215 AUX SEL Jumper pins 1 to 2 to enable Port B to C connection Jumper pins 2 to 3 to enable Port A to C connection JMP13 HD3SS215 Dx SEL Jumper pins 1 to 2 to enable Port B to C connection Jumper pins 2 to 3 to enable Port A to C connection Power for the HD3SS215 EVM The EVM should be powered with a +9-V DC power supply. 5 Monitoring the Device Current To observe current consumption of the HD3SS215 in the device evaluation, the HD3SS215 EVM includes the option to monitor the current draw of the device. To enable this feature, take the following steps: 1. Uninstall the ferrite bead located at L2. 2. Obtain a power supply with the ability to display its current draw (or connect a current meter in series to the power supply) and connect to JMP9. 3. Turn on the power supply and observe the measured current on the power supply display (or current meter). SLAU578B – April 2014 – Revised March 2017 Submit Documentation Feedback HD3SS215 Evaluation Module Copyright © 2014–2017, Texas Instruments Incorporated 3 PCB Construction 6 www.ti.com PCB Construction This section discusses the construction of the EVM boards. It includes the board schematics and layout files to show how the board was built. 6.1 HD3SS215 EVM Board Schematics This section shows the board schematics for the EVM. NOTE: R111-R126 are placeholders for setting the common mode voltage for device test under DP specific requirements 215 HDMI CONNECTOR, DO NOT INPUT R111-- R126 R125 R124 R126 DNI 10 kΩ DNI 10 kΩ DNI 10 kΩ R123 DNI 10 kΩ J18 3P3V R122 R121 R119 DNI 10 kΩ DNI 10 kΩ DNI 10 kΩ R111 R112 R113 R114 R115 R116 R117 R118 R120 DNI 10 kΩ DNI 10 kΩ DNI 10 kΩ DNI 10 kΩ DNI 10 kΩ DNI 10 kΩ DNI 10 kΩ DNI 10 kΩ DNI 10 kΩ U5A CLKp CLKn GND4 DDC GND CEC Utility SCL SDA Ch_GND1 Ch_GND2 Ch_GND3 Ch_GND4 5V HPD 10 12 Source_TMDS_ML_1n F2 F1 Source_CLK_p Source_CLK_n 13 14 15 16 R72 R127 DNI 1MΩ R131 R129 DNI 10 kΩ DNI 10 kΩ R128 DNI 1 MΩ DC_2_P DC_2_N DC_1_P DC_1_N DC_0_P DC_0_N DC_3_P DC_3_N DC_AUX_P DC_AUX_N DC_DDC_CLK DC_DDC_SDA DC_HPD HD3SS215_ZQE R2 DNI 100 kΩ 5V/3P3V R6 5V/3P3V H2 H1 J1 0 R5 SHOULD NOT INSTALLED. L2 SHOULD BE REMOVED. Source_DP_AUX_p_C Source_DP_AUX_n_C Source_HPD_C R134 1 MΩ R5 DNI 0 J3 J7 18 19 3P3V 5V/3P3V DNI 0 R73 Source_TMDS_CLK_p Source_TMDS_SDA_n HDMI Female C75 1.0 µF B2 B1 Source_TMDS_ML_2p Source_TMDS_ML_2n R127, R131, R129, R128, CAN BE INSTALLED FOR DIFFERENT APPLICAION, BUT ARE NOT NEEDED FOR STANDARD HDMI INTERFACES R2 SHOULD BE INSTALLED IN A NON-EVM INVIRONMENT (SOURCE SHOULD ALREADY HAVE THIS SIGNAL PULLED DOWN.) 2 kΩ D0p D0n 7 9 D2 D1 Source_TMDS_ML_1p R8 20 21 22 23 GND3 4 6 2 kΩ 17 GND2 E2 E1 Source_TMDS_ML_0p Source_TMDS_ML_0n R7 11 D1p D1n 1 3 0 8 D2p D2n 0 5 GND1 R4 2 Source_DDC_CLK Source_DDC_SDA 215 WITH DP CONNECTOR: R72 DC BLOCKING CAPS AND R73 ARE PLACEHOLDERS FOR POSSIBLE 215 WITH HDMI CONNECTOR: DNI R72, R73 R9 DNI 27 kΩ see note A CEC R10 DNI 5 MΩ Copyright © 2016, Texas Instruments Incorporated A For CEC, also see Figure 4. Figure 3. HD3SS215 EVM Schematic Source Port C 4 HD3SS215 Evaluation Module SLAU578B – April 2014 – Revised March 2017 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated PCB Construction www.ti.com 3P3V R49, R57, R58, R59, R60, R61, R62, AND R63 ARE PLACEHOLDERS FOR POSSIBLE DC BLOCKING CAPS IF NEEDED R14 100 kΩ J21 7 2 9 4 5 6 1 8 3 10 11 12 13 14 15 16 17 18 19 U5B DA_0_P DA_0_N DA_1_P DA_1_N DA_2_P DA_2_N DA_3_P DA_3_N DA_AUX_P DA_AUX_N DA_DDCCLK DA_DDCDAT DA_HPD B4 A4 B5 A5 B6 A6 A8 A9 DA_0p DA_0n DA_1p DA_1n DA_2p DA_2n DA_CLKp DA_CLKn H9 J9 AUX_SINK_OUTPUT_P AUX_SINK_OUTPUT_N R18 DNI 0 AUX_SINK_OUTPUT_P_DDC_SCL R16 DNI 0 AUX_SINK_OUTPUT_N_DDC_SDA H8 J8 DDC_SCL DDC_SDA R74 0 AUX_SINK_OUTPUT_P_DDC_SCL AUX_SINK_OUTPUT_N_DDC_SDA R23 0 J2 R49 0 R57 0 R58 R59 0 0 R60 0 R61 0 R62 0 R63 0 CEC see note A 0 DA_HPD R27 0 DA_HPD_R R25 R17 100 kΩ 3P3V R64, R65, R66, R67, R68, R69, R70, AND R71 ARE PLACEHOLDERS FOR POSSIBLE DC BLOCKING CAPS IF NEEDED D0p GND1 D0n D1p GND2 D1n D2p GND3 D2n CLKp GND4 CLKn CEC Utility SCL SDA DDC GND 5V HPD Ch_GND1 Ch_GND2 Ch_GND3 Ch_GND4 DB_AUX_P DB_AUX_N DB_DDCCLK DB_DDCDBT DB_HPD DB_AUX_SINK_OUTPUT_P DB_AUX_SINK_OUTPUT_N H5 J5 DB_DDC_SCL DB_DDC_SDA H3 C20 1.0 µF R11 1 MΩ 5V/3P3V R20 0 B8 B9 D8 D9 E8 E9 F8 F9 H6 J6 SGND2 HDMI Female R45 100 kΩ DB_0_P DB_0_N DB_1_P DB_1_N DB_2_P DB_2_N DB_3_P DB_3_N 20 21 22 23 R34 R36 DB_0p DB_0n DB_1p DB_1n DB_2p DB_2n DB_CLKp DB_CLKn DNI 0 DB_AUX_SINK_OUTPUT_P_or_DDC_SCL DB_AUX_SINK_OUTPUT_P_or_DDC_SCL 0 R35 DNI 0 DB_AUX_SINK_OUTPUT_N_or_SDA DB_AUX_SINK_OUTPUT_N_or_SDA R39 0 R64 J22 0 R65 0 R66 R67 0 0 R68 0 R69 R70 0 0 R71 0 CEC see note A DB_HPD R43 R33 100 kΩ R42 0 DB_HPD_R 0 7 2 9 4 5 6 1 8 3 10 11 12 13 14 15 16 17 18 19 D0p GND1 D0n D1p GND2 D1n D2p GND3 D2n CLKp GND4 CLKn CEC Utility SCL SDA DDC GND 5V HPD Ch_GND1 Ch_GND2 Ch_GND3 Ch_GND4 20 21 22 23 HDMI Female SGND3 C37 1.0 µF R46 1 MΩ R44 0 HD3SS215_ZQE R44, R20 can be installed to provide 5V on DDC and CEC Copyright © 2016, Texas Instruments Incorporated A For CEC, also see Figure 3. B See Table 2. Figure 4. HD3SS215 EVM Schematic Sink Ports A and B SLAU578B – April 2014 – Revised March 2017 Submit Documentation Feedback HD3SS215 Evaluation Module Copyright © 2014–2017, Texas Instruments Incorporated 5 PCB Construction www.ti.com Table 2. Section A BOM Changes Reference Designator DP Value HDMI Value C21 0.1 µF 0 C22 0.1 µF 0 C23 0.1 µF 0 C24 0.1 µF 0 C25 0.1 µF 0 C26 0.1 µF 0 C27 0.1 µF 0 C28 0.1 µF 0 R14 100 k R15 0 R16 0 R17 100 k R18 DNI 0 R19 DNI 0 R21 0 R23 DNI R25 0 R26 DNI 0 0 R27 0 R32 DNI R13 1M J13 DP Rect HDMI Rect J14 DP Rect HDMI Rect 0 Table 3. Switch Control Logic (1) (2) Control Lines (1) (2) Switched I/O Pins Dx_SEL DCz(p) Pin z = 0, 1, 2, or 3 DCz(n) Pin z = 0, 1, 2, or 3 HDPC Pin CADC Pin (RSH) L DAz(p) DAz(n) HPDA CADA H DBz(p) DBz(n) HPDB CADB OE pin – For normal operation, drive OE high. Driving the OE pin low will disable the switch. Note: The ports which are not selected by the control lines will be in high impedance state. Table 4. AUX/DDC Switch Control Logic Control Lines 6 AUX_SEL Dx_SEL L L Switched I/O Pins AUXA AUXB AUXC 213 / 215 To or from AUXC Z To or from AUXA L H 213 / 215 Z To or from AUXC To or from AUXB H L 213 / 215 Z Z To or from DDCA H H 213 / 215 Z Z To or from DDCB M L 213 To or from DDCC Z Z HD3SS215 Evaluation Module SLAU578B – April 2014 – Revised March 2017 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated PCB Construction www.ti.com 3P3V R28 4.64 kΩ R48 4.64 kΩ AUX_SEL_MID AUX SEL Mid SILKSCREEN AUX_SEL_PU AUX_SEL AUX_SEL_PD JMP4 1 2 3 4 AUX SEL Pull Up AUX SEL AUX SEL Pull Down 4 Pin-T Berg Jumper R47 4.64 kΩ R30 4.64 kΩ 3P3V R29 4.64 kΩ U5C JMP13 SILKSCREEN Dx_SEL Pull-Up Dx_SEL Dx_SEL Pull-Down 1 C2 Dx SEL Pull Up Dx_SEL A1 Dx SEL Pull Down B7 Header 3x1 R31 4.64 kΩ AUX_SEL DX_SEL OE HD3SS215_ZQE 3P3V R22 4.64 kΩ SILKSCREEN OE Pull-Up OE OE Pull-Down JMP11 1 OE Pull Up Output Enable OE Pull Down Header 3x1 R24 4.64 kΩ Copyright © 2016, Texas Instruments Incorporated A See Table 3 and Table 4. Figure 5. HD3SS215 EVM Control SLAU578B – April 2014 – Revised March 2017 Submit Documentation Feedback HD3SS215 Evaluation Module Copyright © 2014–2017, Texas Instruments Incorporated 7 PCB Construction www.ti.com P1 1 2 SLEEVE D4 TIP 3 2 9V_WALL_IN SHUNT 1 9V_DC_IN 10 V, 3 A RAPC722 SILK = +9 V U4 6 REG104-A 1 3P3V 2 JMP9 HI1206N101R-00 C74 1.0 µF C73 1.0 µF C65 0.1 µF 1 2 C66 0.01 µF DNI C67 1.0 µF NOM VDD R51 23.2 kΩ SILKSCREEN L2 3P3V_REG 1 2 3 4 5 Vin Vout GND2 GND1 NR/Adjust Enable R52 150 kΩ R53 150 kΩ R54 DNI R55 64.9 kΩ NOTE: PLACE BULK DECOUPLING CAPACITORS NEAR THE REGULATOR AND FERRITE BEAD. JMP10 R56 13 kΩ HIGH VDD 1 2 3 4 NOM VDD HIGH VDD LOW VDD LOW VDD DNI NOTE: REMOVE R52 IF JMP10 IS INSTALLED. 3P3V 3P3V 5V/3P3V R75 0 R133 U5D DNI 0 R50 75 Ω PLACE DECOUPLING CAPS CLOSE TO U5 TP1 1 Test Point 1 TP2 TP3 TP10 1 HD3SS215_ZQE 1 TP7 1 1 TP12 TP13 1 1 Test Point R132 100 Ω D3 GREEN TP4 Test Point 1 TP5 TP6 1 1 TP8 1 TP11 TP9 1 1 TP14 C76 0.1 µF C77 0.1 µF C78 0.01 µF C79 0.01 µF 2 GND GND GND GND GND GND D5 GREEN 215 WITH DP CONNECTOR: 1 VCC VCC C71 0.01 µF 2 C70 0.01 µF NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 NOTE: C69 0.1 µF A3 A7 C1 D6 C9 D5 E4 E5 E6 F4 F5 F6 G1 G9 C68 0.1 µF B3 C8 G2 G8 H4 H7 1 A2 J4 3P3V_R DNI: R132, D5 215 WITH HDMI CONNECTOR : DNI: R133 Test Point Copyright © 2016, Texas Instruments Incorporated Figure 6. HD3SS215 EVM Power 8 HD3SS215 Evaluation Module SLAU578B – April 2014 – Revised March 2017 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated PCB Construction www.ti.com 6.2 HD3SS215 EVM Board Layout This EVM was designed to show the implementation of this device on a 4-layer board. Figure 7. HD3SS215 EVM Layout Layer 1 (Top) Figure 8. HD3SS215 EVM Layout Layer 2 (GND) SLAU578B – April 2014 – Revised March 2017 Submit Documentation Feedback HD3SS215 Evaluation Module Copyright © 2014–2017, Texas Instruments Incorporated 9 HD3SS215 EVM Board Construction www.ti.com Figure 9. HD3SS215 EVM Layout Layer 3 (VCC) Figure 10. HD3SS215 EVM Layout Layer 4 (Bottom) 7 HD3SS215 EVM Board Construction The HD3SS215 EVM board is a 4-layer board constructed of FR4 – TurboClad 370 material. The board stack-up consists of a signal layer on top, a ground layer, power layer, and a signal layer on bottom. NOTE: To achieve the desired impedance, TI recommends that the user consult the board manufacturer for their process and design requirements. 10 HD3SS215 Evaluation Module SLAU578B – April 2014 – Revised March 2017 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated HD3SS215 EVM Material Listing www.ti.com 8 HD3SS215 EVM Material Listing Table 5. EVM Bill of Materials Item Quantity 1 4 C20,C37,C67,C75 Reference 1.0uF 2 5 C65,C68,C69,C76,C77 0.1uF 3 5 C66,C70,C71,C78,C79 0.01uF 4 2 C73,C74 1.0 uF 5 2 D3,D5 GREEN 6 1 D4 10V, 3A 7 1 JMP4 4 Pin-T Berg Jumper 8 3 JMP9, JMP10, R54 DNI 9 2 JMP11, JMP13 Header 3x1 10 1 J18 HDMI Female C 11 1 J21 HDMI Female A 12 1 J22 HDMI Female B 13 1 L2 HI1206N101R-00 14 1 P1 RAPC722 15 1 R2 DNI 100k 16 30 R4, R5, R6, R20, R23, R25, R27, R36, R39, R42, R43, R44, R49, R57, R58, R59, R60, R61, R62, R63, R64, R65, R66, R67, R68, R69, R70, R71, R74, R75 0 17 2 R7, R8 2K 18 1 R9 DNI 27K 19 1 R10 DNI 5M 20 3 R11, R46, R134 1M 21 4 R14, R17, R33, R45 100K 22 7 R16, R18, R34, R35, R72, R73, R133 DNI 0 23 8 R22, R24, R28, R29, R30, R31, R47, R48 4.64K 24 1 R50 75 25 1 R51 23.2K 26 2 R52, R53 150K 27 1 R55 64.9K 28 1 R56 13K 29 18 R111, R112, R113, R114, R115, R116, R117, R118, R119, R120, R121, R122, R123, R124, R125, R126, R129, R131 DNI 10K 30 2 R127, R128 DNI 1M 31 1 R132 100 32 14 TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP9, TP10, TP11, TP12, TP13, TP14 Test Point 33 1 U4 REG104-A 34 1 U5 HD3SS213/5_ZQE 35 1 U5 HD3SS213/5_ZQE SLAU578B – April 2014 – Revised March 2017 Submit Documentation Feedback HD3SS215 Evaluation Module Copyright © 2014–2017, Texas Instruments Incorporated Part 11 Revision History www.ti.com Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (April 2014) to A Revision .......................................................................................................... Page • Changed Figure 3, terminal B2 To: DC_0_P, B1 To: DC_0_N and E2 To: DC_2_P, E1 To: DC_2_N ....................... 4 Revision History Changes from A Revision (April 2016) to B Revision .................................................................................................... Page • • 12 Deleted list item: "9-V DC power supply" from Section 2 ............................................................................ 2 Changed the sentence in Section 4 .................................................................................................... 3 Revision History SLAU578B – April 2014 – Revised March 2017 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated STANDARD TERMS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM. User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10) business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected. 2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User): 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/ /www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 3.4 European Union 3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures. 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice. This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services. These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation modules, and samples (http://www.ti.com/sc/docs/sampterms.htm). Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated
HD3SS215EVM 价格&库存

很抱歉,暂时无法提供与“HD3SS215EVM”相匹配的价格&库存,您可以联系我们找货

免费人工找货