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HD3SS2522EVM

HD3SS2522EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    EVAL MOD HD3SS2522

  • 数据手册
  • 价格&库存
HD3SS2522EVM 数据手册
User's Guide SLLU215A – February 2015 – Revised June 2015 HD3SS2522 EVM This document describes how to use and configure the HD3SS2522 EVM. 1 2 3 4 5 6 7 Contents Overview ...................................................................................................................... 2 1.1 HD3SS2522 EVM Introduction .................................................................................... 2 1.2 HD3SS2522 EVM Contents ....................................................................................... 2 1.3 HD3SS2522 EVM Board Description ............................................................................ 2 Hardware Description ....................................................................................................... 3 2.1 Connectors .......................................................................................................... 4 2.2 Power ................................................................................................................. 4 2.3 Reset ................................................................................................................. 4 2.4 LED ................................................................................................................... 4 2.5 DIP Switch ........................................................................................................... 5 Quick Start Guide ............................................................................................................ 5 AC Coupling Cap Placement Recommendation ......................................................................... 6 References ................................................................................................................... 7 EVM Schematics ............................................................................................................. 8 Bill of Materials ............................................................................................................. 11 List of Figures 1 HD3SS2522 EVM (Top Side) .............................................................................................. 2 2 HD3SS2522 EVM Block Diagram ......................................................................................... 3 3 HD3SS2522 USB Host Implementation Example With 0 V < SSTX/RX Vcm < 2 V ................................ 6 4 HD3SS2522 USB Upstream Implementation Example With 0 V < SSTX/RX Vcm < 2 V 5 HD3SS2522 USB Host With SS USB Vcm > 2 V Example ............................................................ 7 6 HD3SS2522 USB Upstream With SS USB Vcm > 2 V Example ...................................................... 7 7 Schematic (Page 1 of 3) .................................................................................................... 8 8 Schematic (Page 2 of 3) .................................................................................................... 9 9 Schematic (Page 3 of 3)................................................................................................... 10 SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback ......................... HD3SS2522 EVM Copyright © 2015, Texas Instruments Incorporated 6 1 Overview www.ti.com 1 Overview 1.1 HD3SS2522 EVM Introduction The HD3SS2522 EVM is a printed-circuit board (PCB) created to help customers evaluate the Type C interface. This EVM can also be used as a hardware reference design for any implementation using the HD3SS2522 with a Type C connector. PCB design files can be provided upon request to aid with PCB design using the HD3SS2522. The layout files (available upon request) can be used as a guideline to implement the HD3SS2522 with illustrations of the routing/placement rules. Note that the EVM design includes test components for evaluation purposes which may not be applicable for production. This EVM includes on-board connectors for legacy USB connection for evaluation purposes. The EVM can be plugged into any systems with a Type A receptacle to evaluate the Type C implementation using the HD3SS2522. 1.2 HD3SS2522 EVM Contents The major components of the EVM follow: • HD3SS2522 • USB3 Standard Type A Plug • USB3 Type C Receptacle • DIP SW for Type C current configuration 1.3 HD3SS2522 EVM Board Description Figure 1 illustrates the HD3SS2522 EVM board. USB3 Type A Plug HD3SS2522 USB3 Type C Receptacle Figure 1. HD3SS2522 EVM (Top Side) 2 HD3SS2522 EVM SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Hardware Description www.ti.com 2 Hardware Description TPS25910 VBUS 5V TPS2056A 5V CC1 CC2 CC Switch Type C CC_OUT Options for Different CC Resistor Values With DIP SW Type A Plug CC_SEL CC_IN Digital Logic VCTRL2 VCTRL1 ID SS_SEL SS_EN TX1 RX1 TX 2:1 Switch TX2 RX RX2 HD3SS2522 D+ D- Figure 2. HD3SS2522 EVM Block Diagram SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback HD3SS2522 EVM Copyright © 2015, Texas Instruments Incorporated 3 Hardware Description 2.1 www.ti.com Connectors The EVM has two USB connectors: USB3 standard Type A plug and USB3 Type C receptacle, J2 and J3, respectively. The EVM can be plugged into any USB host system with a Type A receptacle to evaluate Type C implementations with HD3SS2522. 2.2 2.2.1 Power VBUS The EVM operates off of the 5-V VBUS input from the legacy Type A USB connection. The VBUS input from the legacy connection J2 is passed through to the Type C connector through the power switch U5 which is enabled only if the ID is driven low by the HD3SS2522. VBUS can be supplied externally via J18 to test higher than legacy USB current (500 mA or 900 mA) delivery over Type C connection. Current limiting over VBUS is configurable by changing the value of R26. Refer to TPS25910 (SLUSAR6D) datasheet for configuration details. 2.2.2 VCONN The EVM can provide VCONN over a CC pin based upon Type C plug orientation and Ra detection. The HD3SS2522 determines the plug orientation and enables VCONN over unused CC pin upon detection of Ra. The default voltage for VCONN is 5 V. If other VCONN voltage levels are to be tested, voltage can be supplied via J4. 2.3 Reset C6 and R1 are placed to control the RST ramp time to the digital logic part of the HD3SS2522 device. A reset switch SW1 is also provided for manual reset after the device has been powered on. 2.4 LED An LED is provided to indicate the status of the HD3SS2522 based upon the CC configuration of the device. The default LED configurations are listed in Table 1, but the EVM or HD3SS2522 firmware can be reconfigured to have the LED report other status. Table 1. Default LED Configurations LED_COLOR Control Signal LED Status Description LED_RED (1) VCTRL1# VCONN is provided on CC1 LED_YLW VCTRL2# VCONN is provided on CC2 LED_GRN ID VBUS is provided as the port is identified as DFP (1) 4 If the red LED is on, it blocks out other colors. HD3SS2522 EVM SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Hardware Description www.ti.com 2.5 DIP Switch DIP switch is provided to configure CC for different Type C current mode operations. Using the DIP switch, the HD3SS2522 can be configured to support default, mid- or high-current mode: 500 mA/900 mA, 1.5 A, or 3 A, respectively. The IMODE must be configured to match the CC resistor setting for the corresponding current configuration. Table 2 shows the DIP switch setting for each mode of operation. Table 2. DIP Switch Settings Selection SW Pin SW Position for Default Current Operation SW Position for 1.5-A Current Operation CC2_3A SW2.1 OFF OFF ON CC2_1_5A SW2.2 OFF ON OFF CC2_DEFAULT SW2.3 ON OFF OFF CC1_3A SW2.4 OFF OFF ON CC1_1_5A SW2.5 OFF ON OFF CC1_DEFAULT SW2.6 ON OFF OFF IMODE1 (1) SW2.7 OFF OFF ON (1) SW2.8 OFF ON ON IMODE2 (1) 2.5.1 SW Position for 3-A Current Operation Silk Screen label on these signals are incorrect. CC_SEL should be IMODE1, SS_SEL should be IMODE2. CC Selection If CC resistance outside the range provided in the EVM needs to be tested, CC resistance can be provided via J19 and/or J20. These headers must be left open if the DIP SW is used for CC resistance selection as shown in Table 2. If external resistance is to be provided through J19 and/or J20, the corresponding DIP switch must be flipped to the OPEN/OFF position. HD3SS2522 EVM Type C USB Host Type C Quick Start Guide Type A 3 USB3 Device 1. Plug the EVM into a USB host with a Type A receptacle via J2 2. Plug a USB device or hub over Type C cable and/or connector SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback HD3SS2522 EVM Copyright © 2015, Texas Instruments Incorporated 5 AC Coupling Cap Placement Recommendation 4 www.ti.com AC Coupling Cap Placement Recommendation The EVM does not have AC capacitors as the EVM is intended to be used with systems that have capacitors placed per the corresponding interface specification. This section describes guidelines for placing the components including AC coupling capacitors in a system implementation with HD3SS2522. Figure 3 through Figure 5 depict the AC coupling capacitor placement examples. It is recommended to place the capacitors as shown for the backward compatibility and interoperability purposes as some of the existing USB systems may present Vcm, exceeding the typical range of 0–2 V on SS differential pairs. No AC Coupling Caps SSTX SSRX USB3 Host SSRX+ SSRX> HD3SS2522 TX1+ TX1> 0.1 µF TX2+ TX2> 0.1 µF RX2+ RX2> Type C Connector SSTX+ SSTX> No AC Coupling Caps RX1+ RX1> Figure 3. HD3SS2522 USB Host Implementation Example With 0 V < SSTX/RX Vcm < 2 V RX1+ RX1> Type C Connector 0.1 µF TX1+ TX1> TX2+ TX2> HD3SS2522 No AC Coupling Caps 0.1 µF SSTX+ SSTX> SSRX+ SSRX> USB3 Upstream Port RX2+ RX2> Figure 4. HD3SS2522 USB Upstream Implementation Example With 0 V < SSTX/RX Vcm < 2 V 6 HD3SS2522 EVM SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated References www.ti.com Vcm > 2.0 V 500 nF 100 lQ 500 nF 100 lQ 100 lQ SSTX 100 lQ SSRX HD3SS2522 TX1+ TX1> 0.1 µF TX2+ TX2> 0.1 µF Type C Connector RX1+ RX1> RX2+ RX2> Figure 5. HD3SS2522 USB Host With SS USB Vcm > 2 V Example Vcm > 2.0 V 500 nF 100 lQ RX1+ RX1> Type C Connector 0.1 µF 100 lQ 100 lQ SSTX 100 lQ SSRX TX1+ TX1> TX2+ TX2> 0.1 µF 500 nF HD3SS2522 RX2+ RX2> Figure 6. HD3SS2522 USB Upstream With SS USB Vcm > 2 V Example 5 References 1. HD3SS2522 USB Type C SS MUX with DFP Controller Datasheet (SLLSEM6) SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback HD3SS2522 EVM Copyright © 2015, Texas Instruments Incorporated 7 EVM Schematics 6 www.ti.com EVM Schematics The following pages contain schematics for the HD3SS2522 EVM. VCTRL VCONN Switch Ctrl Signals USB Type A Plug SS TX_RX Type C Connector HD3SS2522 CC1/CC2 SS TX_RX DP DM ID VBUS VBUS Switch Figure 7. Schematic (Page 1 of 3) 8 HD3SS2522 EVM SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated EVM Schematics www.ti.com TP7 SILKSCREEN TP1 SILKSCREEN 1 1 GPIO1 GPIO1 GND 3P3V TEST POINT 40-mil TEST PAD 3P3V TP2 TP8 GND GPIO2 1 SILKSCREEN 1 3P3V_VCC J1 GPIO2 FB1 TEST POINT Place near the part 1 2 3 4 40-mil TEST PAD 220 @ 100MHZ C1 0.1uF C2 0.1uF C3 0.1uF 10V C4 C5 0.1uF 0.1uF R1 47K TEST NOTE: PLACE R133 AND C227 CLOSE TO HD3SS2522 RST 10V USB Legacy Host Connection VBUS_TypeA 2 D1 1 GND SSTXN SSTXP GND_SHIELD SSRXN USB2_P0 U1 D2 LED Green 0805 C7 4 R2 330 0402 5% 10uF 8 USB3_TX0N 9 USB3_TX0P Connect to USB3 Host USB3_TX0N USB3_TX0P 2 3 USB3_RX0N USB3_RX0P 5 6 7 5 6 VBUS B0P B0N C0P C0N B1P B1N A1P A1N C1P C1N SS_SEL USB3_RX0P 0 R5 NC, 100K 10 3P3V CC_OUT 11 CC_IN 18 12 3P3V MODE_LED Add headers and pull GPIO1 ups on GPIOs for GPIO2 field upgradability SYS_COM_REQ 660R CC2 CC_OUT CC1 CC_IN CC_OE#_IN SS_OE#_IN CC_SEL_IN CC_OE#_OUT/VConnEnPol SS_OE#_OUT/VBUSEnPol CC_SEL_OUT IMODE1 IMODE2 100K D3 R6 19 LED Green R9 15 28 29 25 TP9 MODE_LED GPIO1 GPIO2 SYS_COM_REQ VBUS_EN VCTRL1# VCTRL2# VCONN_FAULT# VBUS_FAULT# 1 30 RST 10 36 38 31 33 39 53 48 47 CTX2P CTX2N 44 43 CTX1N CTX1P 46 45 CRX2P CRX2N 42 41 Connect to Type C USB3 TX/RX pins 3P3V CRX1P CRX1N SS_SEL 7 GND CC2 37 CC1 9 8 CC_OE# SS_OE# CC2 CC1 R8 100K R7 100K 26 27 IMODE1 IMODE2 A2 B11 SSRXP1 SSRXP2 A3 B10 SSRXN1 SSRXN1 Connect to pg3 Type C CC pins and VCONN pg3 switch 21 ID 22 23 VCTRL1# VCTRL2# pg2,3 pg2,3 A4 B9 VBUS CC1 A5 B8 SBU2 A6 B7 DN2 DN1 A7 B6 DP2 SBU1 A8 B5 CC2 VBUS A9 B4 VBUS SSRXN2 SSRXN1 A10 B3 SSTXN2 SSTXN1 SSRXP2 SSRXP1 A11 B2 SSTXP2 SSTXP1 GND A12 B1 GND VCONN_FAULT# Connect to Vconn/VBUS switch VBUS_FAULT# for fault condition detection 17 16 VBUS DP1 Configured for Active Low Vconn_EN and VBUS_EN Pull-up or pull-down resistor based upon current configuration Connect to Vconn/VBUS switch control signal GND SSTXN1 SSTXN2 3P3V 32 34 B12 SSTXP1 SSTXP2 20 35 A1 A4 A9 B4 B9 VBUS1 VBUS2 VBUS3 VBUS4 A5 B5 CC1 CC2 A8 B8 SBU1 SBU2 A7 A6 DN1 DP1 10uF CSBU1 CSBU2 USB2_N0 USB2_P0 TP5 B6 B7 DP2 DN2 SSTXP1 SSTXN1 1 A2 A3 CTX1P CTX1N A11 A10 CRX2P CRX2N B2 B3 CTX2N CTX2P B11 B10 CRX1P CRX1N CSBU1 15-mil TEST PAD TP6 SSRXP2 SSRXN2 8 7 6 5 4 3 2 1 C8 CC1 CC2 SSTXP2 SSTXN2 Shield8 Shield7 SSRXP1 Shield6 SSRXN1 Shield5 Shield4 GND0 Shield3 GND1 Shield2 GND2 Shield1 GND3 1 CSBU2 15-mil TEST PAD A1 A12 B1 B12 USB_TypeC_Receptacle_ 57 NC7 NC8 NC9 RSVD PAD NC NC0 NC1 NC2 NC3 NC4 NC5 NC6 RST Resets CC Control logic GND GND GND R10 100K 1 24 49 50 51 54 55 56 40-mil TEST PAD SS_SEL_IN SS_SEL_OUT 3P3V R4 J3 TypeC Connector Pin Mapping A0P A0N USB3_RX0N gnd SSRXP 3 R3 DP USB2_N0 VCC VCC VCC VCC VCC DM 2 NC, 100K 2 4 13 14 40 52 1 RB161M-20TR gnd 1 3 1 J2 VBUS 11 C6 0.0022uF 3P3V_VCC 5V_COM TP3 SILKSCREENTEST POINT VBUS_TypeA USB3_STANDARD_TYPE_A_PLUG 4 SW1 SWITCH SPST-NO HEADER 4 HD3SS2522 TEST ESD Components TEST PURPOSE ONLY NOTE: ALL DIFF PAIRS ARE ROUTED 85 TO 90 OHMS DIFFERENTIAL AND 50 OHMS COMMON MODE. ALL OTHER TRACES ARE 50 OHM. U2 1 2 3 4 5 CTX1N CTX1P CRX1P CRX1N D1+ NC10 D1NC9 GND GND D2+ NC7 D2NC6 10 9 8 7 6 CTX1N CTX1P 10 9 8 7 6 CTX2P CTX2N CRX1P CRX1N TPD4E05U06 U3 DIP Switch 1 2 3 4 5 CTX2P CTX2N 3P3V LED J19 CRX2P CRX2N 3P3V J20 D1+ NC10 D1NC9 GND GND D2+ NC7 D2NC6 CRX2P CRX2N TPD4E05U06 3P3V 1 2 3P3V 3P3V R12 660R 3P3V 3P3V 1 2 U4 3 Red 2 Yellow 4 1 GREEN LED_RED LED_YLW LED_GRN R35 R32 R36 R33 R37 R34 0 NC, 0 0 NC, 0 NC, 0 0 GPIO1 VCTRL1# pg2,3 VCONN_FAULT# pg3 VCTRL2# pg2,3 VBUS_FAULT# pg3 ID pg3 SMP4-RGY R19 12K +/- 5% R20 4.7K +/-5% CC2_4_7K CC2_12K CC2_36K CC1_4_7K CC1_12K CC1_36K IMODE1 IMODE2 1K R18 36K +/- 5% 1K R17 4.7K +/-5% R22 R16 12K +/- 5% R21 R14 100K R11 D4 100K R13 100K HEADER 1x2 100-mil HEADER 1x2 100-mil R15 36K +/- 5% CC1 CC2 SW2 8-POS 50-MIL SMT C&K (ITT-CANNON) TDA08H0SK1R 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 USB2_P0 USB2_N0 CC2 CC1 SilkScreen: CC2 3A CC2_1_5A CC2_DEFAULT CC1_3A CC1_1_5A CC1_DEFAULT IMODE1 IMODE2 CSBU2 CSBU1 1 2 3 4 5 6 7 NC1 NC2 NC3 NC4 GND NC5 NC6 D1+ D1D2+ D2GND D3+ D3- 14 13 12 11 10 9 8 CC1 CC2 USB2_P0 USB2_N0 CSBU2 CSBU1 TPD6E05U06 Figure 8. Schematic (Page 2 of 3) SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback HD3SS2522 EVM Copyright © 2015, Texas Instruments Incorporated 9 EVM Schematics www.ti.com 5V_COM SILKSCREEN: VBUS_IN VBUS J18 1 2 3P3V Populate Jumper by default HEADER 1x2 100-mil Populate by default R23 10K R24 10K VBUS_IN U5 pg2 ID VBUS_FAULT# D5 SMAJ20A 17 R25 1M EN# FLT# OUT OUT OUT GND GND GND 1 2 3 4 5 6 8 7 IN IN IN GATE GND GND GND ILIM PWPD pg2 16 15 10 11 12 14 13 9 C9 47uF TPS25910_GATE2 25910_ILIM R26 29.4K TPS25910RSA C10 47nF Power - 5V to 3P3V 3P3V VCONN Switch 3P3V 3P3V 5V_COM Populate Jumper by default Header 1x2 50-mil SILKSCREEN: VCONN_IN J4 VCTRL1# VCTRL2# R39 10K R29 U7_PG 5V_COM U6 IN EN1# EN2# GND 178K OUT1 OUT2 OC1# OC2# 7 6 8 5 OC1# OC2# R30 R31 CC1 CC2 0 0 U7 pg2 pg2 VCONN_FAULT# 8 pg2 C12 TPS2046B 10uF 1 3 VIN SW VOS 7 C11 10uF U7_SW 1uH EN MODE GND 9 2 L1 6 2 3 4 1 PG pg2 pg2 R38 10K PwPd R28 10K 2 1 R27 10K FB 5 4 C13 22uF TPS62082DSGT Figure 9. Schematic (Page 3 of 3) 10 HD3SS2522 EVM SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Bill of Materials www.ti.com 7 Bill of Materials Table 3 lists the HD3SS2522 bill of materials (BOM). Table 3. HD3SS2522 Bill of Materials Line # QTY Value Designators PKG/ Case T.COEFF/ PWR Volt Rated Description Manufacturer MFG Part # DigiKey Part# 1 1 2200pF C6 0201 X7R 25V Capacitors Panasonic Electronic Components ECJ-ZEB1E222K PCC2386CT-ND 2 5 0.1µF C1, C2, C3, C4, C5 0402 X7R 16V Capacitors TDK Corporation C1005X7R1C104K 445-4952-1-ND 3 1 47000pF C10 0402 X7R 25V Capacitors Murata Electronics North America GRM155R71E473KA88D 490-3254-1-ND 4 2 10µF C7, C8 0805 X7R 10V Capacitors Murata Electronics North America GRM21BR71A106KE51L 490-3905-1-ND 5 2 10µF C11, C12 0805 X7R 10V Capacitors Murata Electronics North America GRM21BR71A106KE51L 490-3905-1-ND 6 1 22µF C13 0805¥ X5R 6.3V Capacitors TDK Corporation C2012X5R0J226M/1.25 445-1422-1-ND 7 1 47µF C9 1206 X5R 10V Capacitors Taiyo Yuden LMK316BJ476ML-T 587-1780-1-ND 28 6 0.0 (Zero Ohm) R4, R30, R31, R34, R35, R36 0201 1/20W 50V Resistors Vishay Dale CRCW02010000Z0ED 541-0.0AGCT-ND 29 2 1.00K R21, R22 0201 1/20W Resistors Panasonic Electronic Components ERJ-1GEF1001C P1.00KABCT-ND 30 7 100K R6, R7, R8, R10, R11, R13, R14 0201 1/20W Resistors Venkel CR0201-20W-1003FT CR0201-20W-1003FT 31 1 47.0K R1 0201 1/20W Resistors Panasonic Electronic Components ERJ-1GEF4702C P47.0KABCT-ND 32 1 665 ohm R9 0201 1/20W Resistors Panasonic Electronic Components ERJ-1GEF6650C P665ABCT-ND 33 1 1.00M R25 0402 1/16W Resistors Vishay Dale CRCW04021M00FKED 541-1.00MLCT-ND 34 6 10.0K R23, R24, R27, R28, R38, R39 0402 1/10W Resistors Panasonic Electronic Components ERJ-2RKF1002 P10.0KLCT-ND 35 2 12.0K R16, R19 0402 1/16W Resistors Yageo RC0402FR-0712KL 311-12.0KLRCT-ND 36 1 178K R29 0402 1/10W Resistors Panasonic Electronic Components ERJ-2RKF1783X P178KLCT-ND 37 1 29.4K R26 0402 1/16W Resistors Stackpole RMCF0402FT29K4 RMCF0402FT29K4CT-ND 38 1 330 R2 0402 ±100ppm/°C 1/10W Resistors Panasonic Electronic Components ERJ-2RKF3300X P330LCT-ND 39 2 36.0K R15, R18 0402 1/16W 50V Resistors Yageo RC0402FR-0736KL 311-36.0KLRCT-ND 40 2 4.70K R17, R20 0402 1/16W Resistors Vishay Dale CRCW04024K70FKED 541-4.70KLCT-ND 41 1 665 R12 0402 1/16W 75V Resistors Venkel CR0402-16W-6650FT CR0402-16W-6650FT 8 1 TPD6E05U06RVZR U4 14-UFDFN 14V Circuit Protection Texas Instruments TPD6E05U06RVZR TPD6E05U06RVZR-ND 16 1 220 FB1 0603 2A Filters Murata Electronics North America BLM18EG221SN1D 490-3992-1-ND 19 1 1µH L1 SMDV3.0X3.0X1.5mm 2.1A Inductors_Coils_Chokes Taiyo Yuden NR3015T1R0N 587-1647-1-ND 25 1 LED - Green Clear D2 0805 35mcd 2V Optoelectronics Lite-On Inc LTST-C170KGKT 160-1414-1-ND 26 1 LED - Green Clear D3 0805 35mcd 2V Optoelectronics Lite-On Inc LTST-C170KGKT 160-1414-1-ND 27 1 Green, Red, Yellow D4 4-PLCC 20mA 1.9V Green, 1.85V Red, 1.9V Yellow Optoelectronics Bivar Inc SMP4-RGY 492-1226-1-ND 14 1 DIODE TVS D5 SMA 400W 20V Discrete Semiconductor Products Littelfuse SMAJ20A SMAJ20ADICT-ND 15 1 Single - Schottky D1 SOD-123F 1A 20V Discrete Semiconductor Products ROHM Semiconductor USA, LLC RB161M-20TR RB161M-20CT-ND 20 1 HD3SS2522 U1 56-WQFN Integrated Circuits Texas Instruments HD3SS2522 21 1 TPS2046B U6 8-SOIC Integrated Circuits Texas Instruments TPS2046B 22 1 TPS62082DSGT U7 8-WSON Integrated Circuits Texas Instruments TPS62082DSGT 75V SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback 296-29647-1-ND HD3SS2522 EVM Copyright © 2015, Texas Instruments Incorporated 11 Bill of Materials www.ti.com Table 3. HD3SS2522 Bill of Materials (continued) Line # QTY Value Designators PKG/ Case Description Manufacturer MFG Part # DigiKey Part# 23 1 TPS25910RSA U5 24 2 TPD4E05U06DQAR U2, U3 QFN-16 Integrated Circuits Texas Instruments TPS25910RSA TPS25910RSA SON-10 Integrated Circuits Texas Instruments TPD4E05U06DQA 42 1 SPST-NO Off-Mom SW1 3.00mm x 2.60mm 0.05A 43 1 8 SPST SW2 8 pos 0.025A 32V Switches C&K Components KMT211NG HF LFS CKN9433CT-ND 24VDC Switches ITT Cannon TDA08H0SK1 44 3 TESTPOINT TERMINAL TP1, TP2, TP3 .335"L CKN1365-ND Test Equipment Keystone Electronics 1035 1035K-ND 9 1 4 pos J1 0.1 10 3 1X2 J18, J19, J20 0.1" Connectors TE Connectivity 5-104363-3 A32565-ND Connectors Samtec Inc HTSW-150-07-G-S 11 1 1X2 J4 HTSW-150-07-G-S-ND 1.27MM Connectors Sullins Connector Solutions GRPB501VWVN-RC 12 1 USB-TYPE C S9014E-50-ND J3 SMT Connectors Foxconn UT12113-11601-7H 13 1 17 1 USB TYPE A 3.0 R/A J2 SMT Edge mount Connectors Wurth Electronics Inc 692112030100 732-3157-ND Closed Top- Shunt Shunt 0.050" High Temp Hardware Sullins Connector Solutions NPB02SVAN-RC 18 S9345-ND 1 Shunt Shunt 0.1" SP High Temp Hardware Kobiconn 151-8000-E 151-8000-E 45 5 DNI R3, R5, R32, R33, R37 DNI DNI DNI Undefined Category DNI DNI DNI 47 5 DNI TP5, TP6, TP7, TP8, TP9 DNI DNI DNI Undefined Category DNI DNI DNI 12 T.COEFF/ PWR Volt Rated High Temp HD3SS2522 EVM SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Revision History www.ti.com Revision History Changes from Original (February 2015) to A Revision .................................................................................................. Page • • Added AC Coupling Cap Placement Recommendation section..................................................................... 6 Changed Figure 7 through Figure 9..................................................................................................... 8 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. SLLU215A – February 2015 – Revised June 2015 Submit Documentation Feedback Revision History Copyright © 2015, Texas Instruments Incorporated 13 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated spacer IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated
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