HD3SS3412RUAR

Order Now Product Folder Technical Documents Support & Community Tools & Software HD3SS3412 SLAS828F – FEBRUARY 2012 – REVISED JULY 2018 HD3SS3412 4-Channel High-Performance Differential Switch 1 Features 3 Description • The HD3SS3412 device is a high-speed passive switch capable of switching four differential channels, including applications such as two full PCI Express x1 lanes from one source to one of two target locations in a PC/server application. With its bidirectional capability the HD3SS3412 also supports applications that allow connections between one target and two source devices, such as a shared peripheral between two platforms. The HD3SS3412 has a single control line (SEL pin) which can be used to control the signal path between Port A and either Port B or Port C. 1 • • • • • • • Compatible With Multiple Interface Standards Operating up to 12 Gbps Including PCI Express Gen III and USB 3.0 Wide –3dB Differential BW of over 8 GHz Excellent Dynamic Characteristics (at 4 GHz) – Crosstalk = –35 dB – Off Isolation = –19 dB – Insertion Loss = –1.5 dB – Return Loss = –11 dB Bidirectional "MUX/De-MUX" Type Differential Switch VDD Operating Range 3.3 V ±10% Small 3.5-mm × 9.0-mm, 42-Pin WQFN Package Common Industry Standard Pinout Supports XAUI and SGMII Device Information(1) PART NUMBER 2 Applications • • • • The HD3SS3412 is offered in an industry standard 42-pin WQFN package available in a common footprint shared by several other vendors. The device is specified to operate from a single supply voltage of 3.3 V over the full temperature range of -40°C to 85ºC. HD3SS3412 Desktop and Notebook PCs Server and Storage Area Networks PCI Express Backplanes Shared I/O Ports WQFN (42) 9.00 mm × 3.50 mm HD3SS3412 Switch Flow Through Routing GND VDD GND BODY SIZE (NOM) (1) For all available packages, see the orderable addendum at the end of the data sheet. HD3SS3412 Pinout NC PACKAGE 39 40 B0± 41 B0+ 37 42 38 2 A0± 3 36 B1+ GND 4 35 B1± VDD 5 34 C0+ A1+ 6 33 C0± A1± 7 32 C1+ 31 C1± 30 VDD NC 8 SEL 9 GND 10 29 B2+ A2+ 11 28 B2± A2± 12 27 B3+ Thermal Pad A3± 16 23 C3+ GND 17 22 C3± GND VDD NC GND 21 C2± 20 24 19 15 18 C2+ A3+ 21 B3± 25 22 26 14 18 13 17 VDD GND 1 1 A0+ 38 39 42 GND Not to scale 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. HD3SS3412 SLAS828F – FEBRUARY 2012 – REVISED JULY 2018 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Description (continued)......................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8 9 1 1 1 2 4 5 7 Absolute Maximum Ratings ...................................... 7 ESD Ratings.............................................................. 7 Recommended Operating Conditions....................... 7 Thermal Information .................................................. 7 Electrical Characteristics........................................... 8 Dissipation Ratings ................................................... 8 Typical Characteristics ............................................ 10 Parameter Measurement Information ................ 11 Detailed Description ............................................ 13 9.1 Overview ................................................................. 13 9.2 Functional Block Diagram ....................................... 13 9.3 Feature Description................................................. 14 9.4 Device Functional Modes........................................ 14 10 Application and Implementation........................ 15 10.1 Application Information.......................................... 15 10.2 Typical Application ................................................ 16 11 Power Supply Recommendations ..................... 18 12 Layout................................................................... 18 12.1 Layout Guidelines ................................................. 18 12.2 Layout Example .................................................... 18 13 Device and Documentation Support ................. 19 13.1 13.2 13.3 13.4 13.5 Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 19 19 19 19 19 14 Mechanical, Packaging, and Orderable Information ........................................................... 19 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (January 2015) to Revision F Page • Changed temperature range to –40°C to 85ºC from 0°C to 70ºC. ........................................................................................ 1 • Changed TA To: –40°C MIN and 85°C MAX From: 0°C MIN and 70°C MAX in the Recommended Operating Conditions table ...................................................................................................................................................................... 7 • Changed the PD values From: MIN = 15.5, MAX = 21.6 To: MIN = 2.8, MAX = 4.4 in the Dissipation Ratings table ........... 8 Changes from Revision D (December 2015) to Revision E • Changed "over the full industrial temperature range of –40°C to 70°C" To: "over the commercial temperature range of 0°C to 70°C" in the Overview section............................................................................................................................... 13 Changes from Revision C (July 2015) to Revision D • Page Page Changed "full industrial temperature range of –40°C to 85°C" To: "full industrial temperature range of 0°C to 70°C" in the Overview section ........................................................................................................................................................ 13 Changes from Revision B (November 2013) to Revision C Page • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 • Removed Ordering Information table ..................................................................................................................................... 1 Changes from Revision A (February 2012 ) to Revision B Page • Added additional feature: bidirectional "MUX/de-MUX" type differential switch ..................................................................... 1 • Added that the device supports XAUI and SGMII .................................................................................................................. 1 • Changed temperature range from –40°C to 85ºC to 0°C to 70ºC and deleted "industrial" in Description section. ............... 1 2 Submit Documentation Feedback Copyright © 2012–2018, Texas Instruments Incorporated Product Folder Links: HD3SS3412 HD3SS3412 www.ti.com SLAS828F – FEBRUARY 2012 – REVISED JULY 2018 • Changed pin description of NC From: Electrically not connected. To: Electrically not connected. May connect to VDD or GND, or leave unconnected ...................................................................................................................................... 6 • Added the Application Information section ........................................................................................................................... 15 Changes from Original (January 2012 ) to Revision A Page • Changed Differential BW Feature bullet from "7.5GHZ" to "8GHz"........................................................................................ 1 • Changed Dynamic Characteristics Feature sub-bullet from "Isolation" to "Off Isolation" ....................................................... 1 • Changed Dynamic Characteristics sub-bullet Return Loss from "–9 dB" to "–11 dB" ........................................................... 1 • Deleted Dynamic Characteristics sub-bullet "Max Intra-Pair (Bit-Bit) Skew".......................................................................... 1 • Changed ESD, Human body model, MAX voltage from "±2000" to "±4,000" in Absolute Maximum Ratings table .............. 7 • Changed ILK spec (Diff I/O pins) MAX value from "4 µA" to "130 µA" and added [Ports B and C] and [Port A] to Conditions statements. ........................................................................................................................................................... 8 • Changed tPD spec MAX delay from "50" ps to "85" ps in Device Parameters table............................................................... 8 • Changed SEL-to-switch Ton and Toff spec TYP values from "175" ns to "70" ns; in the Device Parameters table................ 8 • Changed TSKEW_Inter and TSKEW_Intra spec MAX values from "5 ps" and "4 ps" respectively, to "20 ps" and "8 ps" respectively, in Electrical Characteristics table....................................................................................................................... 8 • Changed RL spec TYP value from "–25" and "–9" dB to "–28" and "–11" dB for f=0.3 MHz and f=4000 MHz, respectively, in Electrical Characteristics table. .................................................................................................................... 8 • Changed OIRR spec TYP value from "–70" to "–75" dB for f=0.3 MHz, in Electrical Characteristics table. .......................... 8 • Changed BW spec TYP value from "7.5" GHz to "8" GHz in Electrical Characteristics table. .............................................. 8 • Changed graphic image for Figure 3.................................................................................................................................... 10 • Changed graphic image for Figure 4.................................................................................................................................... 10 Submit Documentation Feedback Copyright © 2012–2018, Texas Instruments Incorporated Product Folder Links: HD3SS3412 3 HD3SS3412 SLAS828F – FEBRUARY 2012 – REVISED JULY 2018 www.ti.com 5 Description (continued) The HD3SS3412 is a generic 4-CH high-speed MUX/de-MUX type of switch that can be used for routing highspeed signals between two different locations on a circuit board. Although it was designed specifically to address PCI Express Gen III applications, the HD3SS3412 will also support several other high-speed data protocols with a differential amplitude of