User's Guide
SLLU214D – February 2015 – Revised May 2016
HD3SS460EVM-SRC
The HD3SS460 is a high-speed passive crosspoint switch designed to support low- and high-speed signal
switching required for Type C, with Alternate mode applications. This guide describes how to bring up the
EVM and includes schematics that can be used as reference design for the Alternate mode
implementations of the host systems with the HD3SS460 device.
3
4
5
Contents
HD3SS460EVM-SRC ....................................................................................................... 2
HD3SS460EVM-SRC Configuration ...................................................................................... 4
2.1
Jumper Configuration .............................................................................................. 4
2.2
Power ................................................................................................................. 4
2.3
External PD/CC Controller Connection .......................................................................... 4
HD3SS460 AC Coupling Cap Placement Recommendation .......................................................... 5
HD3SS460EVM-SRC Schematics......................................................................................... 7
Bill of Materials ............................................................................................................. 10
1
HD3SS460EVM-SRC ....................................................................................................... 2
2
Test Board Setup ............................................................................................................ 2
3
Alternate Mode Over Type C Specification
1
2
List of Figures
4
5
6
7
8
9
10
..............................................................................
HD3SS460 USB Host/DP Source Implementation Example With 0 V < SSTX/RX Vcm < 2 V ...................
HD3SS460 USB Upstream/DP Sink Implementation Example With 0 V < SSTX/RX Vcm < 2 V ................
HD3SS460 USB Host/DP Source With SS USB Vcm > 2 V Example ...............................................
HD3SS460 USB Upstream/DP Sink Implementation Example ........................................................
Schematic (Page 1 of 3) ....................................................................................................
Schematic (Page 2 of 3) ....................................................................................................
Schematic (Page 3 of 3) ....................................................................................................
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HD3SS460EVM-SRC
3
5
5
6
6
7
8
9
1
HD3SS460EVM-SRC
1
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HD3SS460EVM-SRC
USB3
5-V Power micro-B
DisplayPort
Input
HD3SS460
USB3
Type C
Figure 1. HD3SS460EVM-SRC
Type C
DP
DP
Type C Device
USB
460 Source Board
Type C
DP Source
USB Host
USB
The HD3SS460EVM-SRC can be used with a legacy DP Source and/or USB Host system to evaluate the
Type C implementation. Figure 2 is a typical test set-up.
USB Hub/Device
DP Branch/Sink
Figure 2. Test Board Setup
The EVM comes with a legacy USB receptacle to connect to legacy USB systems and a DisplayPort
receptacle to connect to DisplayPort capable source. There is no on-board CC/PD controller. The board
has test headers that can be used to connect CC and other necessary signals to an external Type-C
controller to evaluate the Type-C implementation.
The EVM schematics shown in this document are based upon the pin assignment defined in the Alternate
mode over Type C specification as shown in Figure 3.
2
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B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
Source
Assignment C/D/E/F: USB C to USB C
Receptacle Interface(Front View)
GND
GND
RX1+/ML3+
TX1+/ML2+
RX1‐/ML3‐
TX1‐/ML2‐
VBUS
VBUS
SBU2/AUX
CC1
D‐2
D+1
D+2
D‐1
CC2
SBU1/AUX
VBUS
VBUS
TX2‐/ML1‐
RX2‐/ML0‐
TX2+/ML1+
RX2+/ML0+
GND
GND
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
Sink
Assignment C/D: USB C to USB C
Receptacle Interface(Front View)
GND
GND
RX1+/ML2+
TX1+/ML3+
RX1‐/ML2‐
TX1‐/ML3‐
VBUS
VBUS
SBU2/AUX
CC1
D‐2
D+1
D+2
D‐1
CC2
SBU1/AUX
VBUS
VBUS
TX2‐/ML0‐
RX2‐/ML1‐
TX2+/ML0+
RX2+/ML1+
GND
GND
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
Figure 3. Alternate Mode Over Type C Specification
The following tables represent the example pin mapping to the HD3SS460 for the DP Source pin
assignments C ,D, E and F, and DP Sink pin assignments C and D.
SOURCE Pin Assignment Option
POL = H
AMSEL = H
EN = H
460 Pin
460 Pin
mapping to mapping to
Receptacle Type C
DP
Pin Number Connector
Source(GPU)
A11/10
CRX2
LnD(ML3)
A2/3
CTX1
LnB(ML1)
B11/10
CRX1
LnA(ML0)
B2/3
CTX2
LnC(ML2)
A8
CSBU1
SBU2(AUXN)
B8
CSBU2
SBU1(AUXP)
C/E
POL = L
AMSEL = H
EN = H
460 Pin
mapping to
DP
Source(GPU)
LnA(ML0)
LnC(ML2)
LnD(ML3)
LnB(ML1)
SBU1(AUXP)
SBU2(AUXN)
SINK Pin Assignment Option C
POL = H
POL = L
AMSEL = H
AMSEL = H
EN = H
EN = H
460 Pin
mapping to 460 Pin
460 Pin
Receptacle Type C
mapping to
mapping to
Pin Number Connector
DP Sink
DP Sink
A11/10
CRX2
LnD(ML2)
LnA(ML1)
A2/3
CTX1
LnB(ML0)
LnC(ML3)
B11/10
CRX1
LnA(ML1)
LnD(ML2)
B2/3
CTX2
LnC(ML3)
LnB(ML0)
A8
CSBU1
SBU2(AUXP) SBU1(AUXN)
B8
CSBU2
SBU1(AUXN) SBU2(AUXP)
SOURCE Pin Assignment Option
POL = H
AMSEL = L
EN = H
460 Pin
460 Pin
mapping to mapping to
Receptacle Type C
DP
Pin Number Connector
Source(GPU)
A11/10
CRX2
SSRX
A2/3
CTX1
LnB(ML1)
B11/10
CRX1
LnA(ML0)
B2/3
CTX2
SSTX
A8
CSBU1
SBU2(AUXN)
B8
CSBU2
SBU1(AUXP)
D/F
POL = L
AMSEL = L
EN = H
460 Pin
mapping to
DP
Source(GPU)
LnA(ML0)
SSTX
SSRX
LnB(ML1)
SBU1(AUXP)
SBU2(AUXN)
SINK Pin Assignment Option D
POL = H
POL = L
AMSEL = L
AMSEL = L
EN = H
EN = H
460 Pin
mapping to 460 Pin
460 Pin
Receptacle Type C
mapping to
mapping to
Pin Number Connector
DP Sink
DP Sink
A11/10
CRX2
SSRX
LnA(ML1)
A2/3
CTX1
LnB(ML0)
SSTX
B11/10
CRX1
LnA(ML1)
SSRX
B2/3
CTX2
SSTX
LnB(ML0)
A8
CSBU1
SBU2(AUXP) SBU1(AUXN)
B8
CSBU2
SBU1(AUXN) SBU2(AUXP)
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HD3SS460EVM-SRC Configuration
2
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HD3SS460EVM-SRC Configuration
This section provides the configuration options available in the HD3SS460EVM-SRC.
2.1
Jumper Configuration
Following JMPs are provided for mux/board configuration purposes.
Reference Designator
JMP Control
Config
JMP1
POL
SHUNT on pin 2–4
JMP2
AMSEL
See table below
JMP3
EN
SHUNT on pin 2–3
J5
3.3V
SHUNT on pin 1–2
JMP2 is provided to configure the HD3SS460 for 4-lanes of DisplayPort or 2-lanes of DisplayPort + SS
TX/RX. Make sure JMP2 is configured to match the configuration of the connected Type-C device. The
JMP2 configuration must match between two nodes for correct operation.
JMP2
2.2
ML 2-lane + USB SS
(Pin Assignment C)
ML 4-lane + USB HS only
(Pin Assignment D)
SHUNT on pin 1–2
SHUNT on pin 2–3
Power
The EVM is designed to operate off of the VBUS from a USB host connected via USB micro connector J2.
No external power to be via J6 unless standalone operation is desired.
2.3
External PD/CC Controller Connection
Headers J11 and J12 are provided in case there is a need for external PD/CC controller connection. Refer
to the EVM schematics for the pinout of the headers.
4
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HD3SS460 AC Coupling Cap Placement Recommendation
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3
HD3SS460 AC Coupling Cap Placement Recommendation
The EVM does not have AC capacitors as the EVM is intended to be used with systems that have
capacitors placed per the corresponding interface specification.
This section describes guidelines for placing the components, including AC coupling caps in a system
implementation with the HD3SS460.
Figure 4 and Figure 5 depict the AC coupling cap placement examples. TI recommends placing the
capacitors as shown in the illustrations for the backward compatibility and interoperability purposes as
some of the existing USB systems may present Vcm, exceeding the typical range of 0–2 V on SS
differential pairs.
USB3 Host
No AC Coupling Caps
SSTX
SSRX
ML1+
ML1>
ML2+
ML2>
HD3SS460
ML3+
ML3>
TX1+
TX1>
0.1 µF
TX2+
TX2>
0.1 µF
RX2+
RX2>
Type C
Connector
RX1+
RX1>
No AC
Coupling Caps
ML0+
ML0>
Figure 4. HD3SS460 USB Host/DP Source Implementation Example With 0 V < SSTX/RX Vcm < 2 V
USB3 Upstream Port
No AC Coupling Caps
SSRX
Type C
Connector
0.1 µF
0.1 µF
SSTX
RX1+
RX1>
ML0+
ML0>
TX1+
TX1>
ML1+
ML1>
TX2+
TX2>
HD3SS460
RX2+
RX2>
DP Sink
ML2+
ML2>
ML3+
ML3>
Figure 5. HD3SS460 USB Upstream/DP Sink Implementation Example With 0 V < SSTX/RX Vcm < 2 V
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HD3SS460 AC Coupling Cap Placement Recommendation
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Figure 6 and Figure 7 depict the AC coupling cap recommendations in case the upstream or downstream
port connected internally to the HD3SS460 presents Vcm greater than 2 V.
Vcm > 2.0 V
500 nF
100 lQ
500 nF
100 lQ
100 lQ
SSTX
DP Source
RX1+
RX1>
0.1 µF
ML1+
ML1>
HD3SS460
ML2+
ML2>
ML3+
ML3>
TX1+
TX1>
0.1 µF
TX2+
TX2>
0.1 µF
Type C
Connector
ML0+
ML0>
100 lQ
SSRX
RX2+
RX2>
0.1 µF
Figure 6. HD3SS460 USB Host/DP Source With SS USB Vcm > 2 V Example
Vcm > 2.0 V
500 nF
100 lQ
100 lQ
RX1+
RX1>
Type C
Connector
0.1 µF
100 lQ
SSTX
SSRX
100 lQ
ML0+
ML0>
TX1+
TX1>
TX2+
TX2>
0.1 µF
500 nF
ML1+
ML1>
HD3SS460
DP Sink
ML2+
ML2>
RX2+
RX2>
ML3+
ML3>
Figure 7. HD3SS460 USB Upstream/DP Sink Implementation Example
6
HD3SS460EVM-SRC
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4
HD3SS460EVM-SRC Schematics
Figure 8 through Figure 10 illustrate the HD3SS460EVM-SRC schematics.
ML Lanes 0
ML Lanes 1
ML Lanes 2
DP
Connector
ML Lanes 3
SBU1
HD3SS460
SBU2
ML lanes/
SS TX_RX
Type C Connector
SBU1
SBU2
EN
POL
Daughtercard
Conn
AMSEL
DP/DM
CC1/CC2
DP/DM
CC1/CC2
VBUS
SS TX/RX
USB micro B
Connector
EN#
VBUS
Power barrel
VBUS
Power
Switch
VBUS
5 to 3.3V
Figure 8. Schematic (Page 1 of 3)
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HD3SS460EVM-SRC Schematics
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5
4
3
2
1
3P3V
3P3V
3P3V
SILKSCREEN
3P3V
TP2
CC options shown here are for
eval purpose to support the
flippability using the EVM
standalone. CCs must be
connected to a control logic per
USB Type C spec definition.
1
GND
TEST POINT
SILKSCREEN
J1
AUXN
AUXP
1
2
APU_DP_AUXN
APU_DP_AUXP
1
2
CSBU1
CSBU2
TP3
3P3V
R3
NC, 10K
CC2
3P3V
R1
10K
R4
1M
CC1
POL_R
0
1
GND
R8
10K
TEST POINT
POL_H
POL
POL_L
1
2
3
4
D
TP5
Default Jumper Installation
C1
1uF
HDR3X1 M .1
PU
AMSEL
PD
HPD
POL_R R171
VBUS
TypeC Connector and Source Pin Mapping
NC, 0
Header option for test purpose only
POL
ESD Components
GND
SSTXP1
SSTXP2
A2
B11
SSRXP1
SSRXP2
SSTXN1
SSTXN2
SSRXN1
SSRXN1
A3
B10
VBUS
A4
B9
VBUS
CC1
A5
B8
SBU2
DP1
B7
A6
ML3N
ML0N
DN1
A7
B6
DP2
SSRXP2
SSRXN2
AUXP
AUXN
SBU1
A8
B5
CC2
SSTXP2
SSTXN2
A9
B4
VBUS
ML0N
ML3N
SSRXN2
SSRXN1
A10
B3
SSTXN2
SSTXN1
ML1N
ML2N
ML0P
ML3P
SSRXP2
SSRXP1
A11
B2
SSTXP2
SSTXP1
ML1P
ML2P
GND
A12
B1
GND
C
VBUS
g6
g5
g4
g3
g2
g1
CRX1N
CRX1P
USB2_N0
USB2_P0
10
9
8
7
6
U9
CRX2P
CRX2N
CRX2P
CRX2N
B2
B3
CTX2P
CTX2N
B11
B10
CRX1P
CRX1N
C3
C4
0.1uF
0.01uF
TPD4E05U06
CTX1P
CTX1N
A11
A10
SSRXP1
Shield6 SSRXN1
Shield5
Shield4
GND0
Shield3
GND1
Shield2
GND2
Shield1
GND3
SILKSCREEN
D1+ NC10
D1NC9
GND GND
D2+
NC7
D2NC6
1
2
3
4
5
CTX2P
CTX2N
A2
A3
SSTXP1
SSTXN1
1
2
3
4
5
CTX1N
CTX1P
pg3
pg3
B6
B7
DP2
DN2
DN2
CC1
CC2
CSBU1
CSBU2
A7
A6
DN1
DP1
AUXN
AUXP
U8
A8
B8
SBU1
SBU2
3P3V
LP2
LP3
0R
10uF
A5
B5
CC1
CC2
ML3P
ML0P
R153
22
B12
C8
D1+ NC10
D1NC9
GND GND
D2+
NC7
D2NC6
10
9
8
7
6
CRX1N
CRX1P
1
2
CTX1N
CTX1P
4
5
CTX2N
CTX2P
6
7
CRX2N
CRX2P
9
10
TPD4E05U06
POL
AMSEL
EN
SSTXN
SSTXP
CRX1P
CRX1N
SSRXN
SSRXP
CTX1P
CTX1N
LNAN
LNAP
CTX2P
CTX2N
LNBN
LNBP
CRX2P
CRX2N
LNCN
LNCP
LNDN
LNDP
U12
A1
A12
B1
B12
1
2
3
4
5
6
7
USB_TypeC_Receptacle_
NC1
NC2
NC3
NC4
GND
NC5
NC6
D1+
D1D2+
D2GND
D3+
D3-
14
13
12
11
10
9
8
CC1
CC2
CSBU1 R160
CSBU2 R161
USB2_P0
USB2_N0
0
0
CSBU1_R11
CSBU2_R12
CSBU1
CSBU2
CSBU1
CSBU2
460_3P3V
3P3V
GND
U2
VCC
A1
Current
Measurement
purpose only
LP1
SBU1
SBU2
Connect to control
logic to select
POL pg3
swtich
AMSEL pg3 configuration(i.e. CC
control logic)
EN pg3
3
8
17
25
26
USB3_TX0N
USB3_TX0P
27
28
USB3_RX0N
USB3_RX0P
15
16
APU_DP_TX0P
APU_DP_TX0N
18
19
APU_DP_TX1P
APU_DP_TX1N
20
21
APU_DP_TX2P
APU_DP_TX2N
23
24
APU_DP_TX3P
APU_DP_TX3N
13
14
SBU1
SBU2
PAD
ML2N
ML1N
GND
Header option for test purpose only
3P3V_460
- Install R164 and R13 if HPD is
controlled by PD via the header
connection on page3.
- Install (R165 and R13)or(R164 and
R14) for single ended AUX to operate
EVM standalone without PD controller.
- Install R183 and R184 to route
AUXP/N through the header connection
on page3.
R183
R184
R164
R165
NC, 0
NC, 0
NC, 0
0
APU_DP_AUXP
HPD
R13
R14
0
NC, 0
APU_DP_AUXN
HPD
Share Pads:
R183 and R164
Share Pads:
R184 and R13
HD3SS460
29
ML2P
ML1P
A4
A9
B4
B9
VBUS1
VBUS2
VBUS3
VBUS4
Header option for test purpose only
HD3SS460
J2
D
PU
EN
PD
J10
1
2
R12
10K
SILKSCREEN
TEST POINT
HPD
GND
EN_H
EN
EN_L
3
2
1
EN
R173
NC, 10K
R11
10K
SILKSCREEN
PU
POL
PD
1
GND
JMP3
HDR3X1 M .1
R10
10K
SILKSCREEN
R6
10K
R5
10K
AMSEL_H
AMSEL
AMSEL_L
3
2
1
4 Pin-T Berg Jumper
R9
NC, 1M
3P3V
R172
NC, 10K
JMP2
JMP1
R7
J7
CSBU1
CSBU2
R2
10K
TPD6E05U06
C
APU_DP_AUXP_R
APU_DP_AUXN_R
pg3
pg3
USB Host Connection
TP4
TEST POINT
1
VBUS_micB
DisplayPort Source Connection
D1
2
3P3V
5V_COM
1
RB161M-20TR
J3
APU_DP_TX1N
APU_DP_TX1P
B
VBUS
APU_DP_AUXP
APU_DP_AUXN
R174
1
3
5
7
9
11
APU_CFG1P 13
15
17
DP_PWR_RTN19
NC, 0R
Share Pads:
R174 and R170
R174 to be populated
for DockPort POWER ONLY
ML_LANE3(n)
ML_LANE3(p)
GND4
ML_LANE1(n)
ML_LANE1(p)
GND3
CONFIG1
AUX_CH(p)
AUX_CH(n)
RTN_DP_PWR
R170
0R
GND
ML_LANE2(n)
ML_LANE2(p)
GND1
ML_LANE0(n)
ML_LANE0(p)
CONFIG2
GND2
HPD
DP_PWR
2
4
6
8
10
12
14
16
18
20
APU_DP_TX2N
APU_DP_TX2P
R162
NC, 10K
SILKSCREEN:
EN
1
NC, 5M
4
pg3
2
R178
USB3_RX0N
USB3_RX0P
SW2
B3SN-3012
NC, 0R
R155 to be populated
for DockPort POWER ONLY
R177
USB2_P0_micB
EN
VBUS
HPD_OUT
USB3_TX0N
USB3_TX0P
3
C219
1uF
R163
0R
D2
LED Green 0805
J4
USB2_N0_micB
APU_DP_TX0N
APU_DP_TX0P
APU_CFG2M
R188
NC, 0 HPD_OUT
R187
0
HPD
DP_PWR
R155
21
22 Shld
23 Shld
24 Shld
Shld
APU_DP_TX3N
APU_DP_TX3P
DP SINK-SIDE CONNECTOR
0
ID
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
VBUS
DD+
ID
GND
MicB_SSTXMicB_SSTX+
SGND
MicB_SSRXMicB_SSRX+
Shield
Shield
Shield
Shield
Shield
Shield
C5
Share Pads:
R15, R175 and R179
R16, R176 and R180
Share Pads:
R175 and R181
USB3_micB_Recpt
R179
R175
NC, 0R
R15
R16
NC, 0R
0R
NC, 0R
R176
R180
1
3P3V
10uF
1
3
SW
7
2
C2
10uF
U3_SW
MODE
GND
VOS
FB
4
pg3
CSBU1
CSBU2
R156
NC, 100k
R158
NC, 100k
DC_POWER_JACK
C7
22uF
NOTE: ALL DIFF PAIRS ARE
ROUTED 85 TO 90 OHMS
DIFFERENTIAL AND 50 OHMS
COMMON MODE. ALL OTHER
TRACES ARE 50 OHM.
TPS62082DSGT
460 DP Source/USB Host
SIZE
C
SCALE: NONE
5
pg3
USB2_N0_header
A
5V DC Input
2
5
USB2_N0_micB_header
- Install R175 and R176 for standalone default operation
- Install R15 and R16 for proprietary operation to enable
Alternate Mode.
- Install R179 and R180, R181 and R182 for muxing USB2 DP/DM with
a daughtercard through the header connection on page3.
R159
NC, 100k
1
3
1uH
EN
NC, 0R
USB2_N0_micB
3P3V
R157
NC, 100k
2
1
5V_IN
L1
6
VIN
9
2
PG
U7
8
C6
PwPd
A
pg3
NC, 0R
3P3V
J6
178K
pg3
USB2_P0_micB_header
Share Pads:
R176 and R182
D3
RB161M-20TR
J5
R18
U3_PG
5V_COM
0R
NC, 0R
APU_CFG1P
APU_CFG2M
R182
5V_COM
NOTE: POPULATE JUMPER BY DEFAULT
USB2_P0_header
USB2_P0_micB
R181
USB2_P0
USB2_N0
Power
B
R17
330
0402
5%
10uF
4
3
2
DWG NO:
Tuesday, February 17, 2015
Sheet
2
of 3
1
Figure 9. Schematic (Page 2 of 3)
8
HD3SS460EVM-SRC
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HD3SS460EVM-SRC Schematics
www.ti.com
VBUS
Daughtercard
Connection
Mechanical Standoff
VBUS_micB
SILKSCREEN:
GND: Even Pins
J11
pg2
pg2
USB2_N0_micB_header
USB2_P0_micB_header
pg2
pg2
APU_DP_AUXN_R
APU_DP_AUXP_R
pg2 POL
pg2 AMSEL
1
3
5
7
9
11
13
15
17
19
21
J12
2
4
6
8
10
12
14
16
18
20
22
USB2_N0_header
USB2_P0_header
pg2
pg2
pg2
CC1
CC2
VBUS_micB_EN#
EN
1
3
5
7
9
11
13
15
17
19
21
23
25
27
HPD_OUT
pg2
pg2
pg2
HDR11x2 M .1
2
4
6
8
10
12
14
16
18
20
22
24
26
28
HDR14x2 M .1
SILKSCREEN:
External Control Conn
VBUS_micB
3P3V
3P3V
VBUS
R186
NC, 100K
C100
0.1uF
2
3
VBUS_micB_EN#
R185
100K
R87
10K
U13
5
4
1
11
IN
IN
EN#
ILIM_SEL
GND
PAD
OUT
OUT
FAULT#
ILIM0
ILIM1
9
8
10
FAULT#
7
6
ILIM
TPS2555
R88
33.2K
1%
C101
0.1uF
+
C102
150uF
Figure 10. Schematic (Page 3 of 3)
SLLU214D – February 2015 – Revised May 2016
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9
Bill of Materials
5
www.ti.com
Bill of Materials
Table 1 lists the HD3SS460EVM-SRC bill of materials (BOM).
Table 1. HD3SS460 Bill of Materials
Part #
Qty.
Value
Designators
PKG/ Case
T.COEFF/
PWR
Volt
Rated
Description
Dist P/N
MFG
MFG Part #
A1
1
0.1µF
C3
0201
X5R
10V
Capacitors
587-2241-2-ND
Taiyo Yuden
LMK063BJ104KP-F
A1
1
10000pF
C4
0201
X7R
10V
Capacitors
490-3194-2-ND
Murata Electronics
North America
GRM033R71A103KA01D
19293
B 5 / Corner 1
2
0.1µF
C100, C101
0402
X5R
25V
Capacitors
GRM188R71E474KA12D
TDK Corporation
C1005X5R1E104K
12900
B 6/INTEL- 4
1
1.0µF
C1
0402
X5R
10V
Capacitors
587-1454-2-ND
Taiyo Yuden
LMK105BJ105KV-F
11068
C1
1
1.0µF
C219
0603
X7R
16V
Capacitors
445-1604-2-ND
TDK Corporation
C1608X7R1C105K
11013
D6
2
10µF
C2, C6
0805
X5R
16V
Capacitors
478-5165-2-ND
Taiyo Yuden
EMK212BJ106KG-T
11013
D6
2
10µF
C5, C8
0805
X5R
16V
Capacitors
478-5165-2-ND
Taiyo Yuden
EMK212BJ106KG-T
12360
D7
1
22µF
C7
0805
X5R
6.3V
Capacitors
445-1422-2-ND
TDK Corporation
C2012X5R0J226M/1.25
29503
K4
1
150µF
C102
P2.5 D6.3 H16
-55°C ~
105°C
16V
Capacitors
493-5014-1-ND
Nichicon
UPJ1C151MED1TD
11539
L1
6
0.0 (0 Ω)
R13, R160, R161, R165,
R178, R187
0201
1/20W
50V
Resistors
P0.0AGTR-ND
Vishay Dale
CRCW02010000Z0ED
11074
M 20/Corner 1/
INTEL- 5
5
0.0 (0 Ω)
R7, R153, R163, R175,
R176
0402
1/16W
Resistors
311-0.0JRTR-ND
Yageo
RC0402JR-070RL
11074
M 20/Corner 1/
INTEL- 5
1
0.0 (0 Ω)
R163
0402
1/16W
Resistors
311-0.0JRTR-ND
Yageo
RC0402JR-070RL
11481
M4
1
1.00M
R4
0402
1/16W
Resistors
541-1.00MLTR-ND
Vishay Dale
CRCW04021M00FKED
14220
M 14 /
INTEL - 6
9
10.0K
R1, R2, R5, R6, R8,
R10–R12, R87
0402
1/10W
Resistors
P10.0KLTR-ND
Panasonic Electronic
Components
ERJ-2RKF1002
11016
M1/
INTEL 13
1
100K
R186
0402
1/16W
Resistors
311-100KLRTR-ND
Yageo
RC0402FR-07100KL
26416
M 31
1
178K
R18
0402
1/10W
Resistors
P178KLTR-ND
Panasonic Electronic
Components
ERJ-2RKF1783X
11322
M4
1
33.2K
R88
0402
1/16W
50V
Resistors
P33.2KLTR-ND
Panasonic Electronic
Components
ERJ-2RKF3322X
21035
M 24
1
330
R17
0402
±100ppm/°C
1/10W
Resistors
P330LTR-ND
Panasonic Electronic
Components
ERJ-2RKF3300X
34546
Q1
1
0.0
R170
1210
2W
1/2W
Resistors
RMCF1210ZT0R00CT-ND
Stackpole
RMCF1210ZT0R00
31419
U 260/U 233
1
TPD6E05U06RVZR
U12
14-UFDFN
14V
Circuit Protection
TPD6E05U06RVZR
TI
TPD6E05U06RVZR
23970
Y 51
1
1µH
L1
SMDV
3.0X3.0X1.5mm
2.1A
Inductors_Coils_
Chokes
587-1647-1-ND
Taiyo Yuden
NR3015T1R0N
11522
Z1
1
LED - Green Diffused
D2
0805
20mA
2V
Optoelectronics
67-1553-2-ND
Lumex Opto
Components Inc
SML-LXT0805GW-TR
28591
AE 42
2
Single - Schottky
D1, D3
SOD-123F
1A
20V
Discrete
Semiconductor
Products
RB161M-20CT-ND
Rohm
Semiconductor Usa,
Llc
RB161M-20TR
28387
U 174
1
TPS2555DRC
U13
10-SON
14V
Integrated Circuits
TPS2555DRCT
TI
TPS2555DRC
34379
U 286
1
HD3SS460
U2
28-QFN
Integrated Circuits
HD3SS460-
TI
HD3SS460-
26427
U 228
1
TPS62082DSGT
U7
8-WSON
Integrated Circuits
TPS62082DSGT
TI
TPS62082DSGT
33617
U 279
2
TPD4E05U06DQAR
U8, U9
SON-10
Integrated Circuits
TPD4E05U06DQAR
TI
TPD4E05U06DQA
KS
Customer
18461
11320
10
1/10W
HD3SS460EVM-SRC
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Bill of Materials
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Table 1. HD3SS460 Bill of Materials (continued)
Part #
Qty.
T.COEFF/
PWR
Value
Designators
PKG/ Case
1
PB SPST-NO Off-Mom
SW2
6.50mm x 6.00mm
AH 4
3
Test Loop - Red
LP1, LP2, LP3
0.040
AM 2/Corner 3
1
1×4
JMP1
0.1"
High Temp
11087-3
AM 2/Corner 3
2
1×3
JMP2, JMP3
0.1"
11087-1
AM 2/Corner 3
4
1×1
TP2, TP3, TP4, TP5
11087-2
AM 2/Corner 3
1
1×2
19280-11
AM 68
1
19280-14
AM 68
19004
Volt
Rated
Description
Dist P/N
MFG
MFG Part #
Switches
SW261CT-ND
Omron Electronics
Inc-Emc Div
B3SN-3012P
Test Equipment
5000
Keystone Electronics
5000
Connectors
HTSW-150-07-G-S
Samtec Inc
HTSW-150-07-G-S
High Temp
Connectors
HTSW-150-07-G-S
Samtec Inc
HTSW-150-07-G-S
0.1"
High Temp
Connectors
HTSW-150-07-G-S
Samtec Inc
HTSW-150-07-G-S
J5
0.1"
High Temp
Connectors
HTSW-150-07-G-S
Samtec Inc
HTSW-150-07-G-S
2 × 11
J11
0.1x0.1"
High_Temp
Connectors
HTSW-150-14-G-D
Samtec Inc
HTSW-150-14-G-D
1
2 × 14
J12
0.1x0.1"
High_Temp
Connectors
HTSW-150-14-G-D
Samtec Inc
HTSW-150-14-G-D
AM 126
6
50 pin
J1, J7, J10
1.27MM
High Temp
Connectors
S9014E-50-ND
Sullins Connector
Solutions
GRPB501VWVN-RC
24057
AM 105
1
R/A
J6
2.1mm ID,
5.5mm OD
-25°C ~
85°C
Connectors
CP-202AH-ND
Cui
PJ-202AH
12502
AM 20 / BB 1
1
Display Port
J3
20 Pin
Connectors
47272-0001
Molex-Waldom
Electronics
Corporation
47272-0001
1
USB-TYPE C
J2
SMT
Connectors
UT12123-1A501-7H
Foxconn
UT12123-1A501-7H
1
USB - microUSB 3
Type B
J4
SMT T/H version
Connectors
798-ZX360D-B-10P
Hirose
ZX360D-B-10P
Hardware
151-8000-E
Kobiconn
151-8000-e
DNI
DNI
KS
Customer
20654
AF 18
12926
11087-4
34373
14V
31416
AM 31
14560
HW/Corner 2
3
Shunt
Note
0.1" SP
High Temp
DNI
-
25
DNI
R3, R162, R172, R173,
R9, R14, R164, R171,
R188, R179, R180, R182,
R182, R155, R174, R15,
R16, R155, R174, R156,
R157, R158, R159, R185,
R177
DNI
DNI
5A
DNI
Undefined Category
SLLU214D – February 2015 – Revised May 2016
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Copyright © 2015–2016, Texas Instruments Incorporated
11
Revision History
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from C Revision (January 2016) to D Revision ............................................................................................... Page
•
•
•
•
12
Changed title of the HD3SS460 USB Host/DP Source Implementation Example With 0 V < SSTX/RX Vcm < 2 V
image. .......................................................................................................................................
Changed title and HD3SS460 USB Upstream/DP Sink Implementation Example With 0 V < SSTX/RX Vcm < 2 V
image. .......................................................................................................................................
Changed title and HD3SS460 USB Host/DP Source With SS USB Vcm > 2 V Example image. ..............................
Changed HD3SS460 USB Upstream/DP Sink Implementation Example image. .................................................
Revision History
5
5
6
6
SLLU214D – February 2015 – Revised May 2016
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Copyright © 2015–2016, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
SPACER
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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