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HDC2010
ZHCSGL3C – JULY 2017 – REVISED MAY 2019
HDC2010 低功耗湿度和温度数字传感器
1 特性
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3 说明
相对湿度范围：0% 至 100%
湿度精度：±2%
休眠电流：50nA
平均电源电流（每秒测量 1 次）
– 仅 RH（11 位）：300nA
– RH（11 位）+ 温度（11 位）：550nA
温度范围：
– 运行温度：–40°C 至 85°C
– 可正常工作的温度：–40°C 至 125°C
温度精度：±0.2°C（典型值）
电源电压：1.62V 至 3.6V
可编程采样率（5Hz、2Hz、1Hz、0.2Hz、
0.1Hz、1/60Hz、1/120Hz）或按需触发
I2C 接口
2 应用
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HDC2010 是一款采用超紧凑 WLCSP（晶圆级芯片级
封装）的集成式湿度和温度传感器，能够以超低功耗提
供高精度测量。HDC2010 的传感元件位于器件底部，
有助于 HDC2010 免受粉尘、灰尘以及其他环境污染物
的影响，从而更加稳定可靠。电容式传感器包括新的集
成数字 特性 和用于消散冷凝和湿气的加热元件。
HDC2010 数字 特性 包括可编程中断阈值，可提供警
报/系统唤醒，而无需微控制器持续监控系统。同
时，HDC2010 具有可编程采样间隔、低固有功耗，并
且支持 1.8V 电源电压，非常适合电池供电系统。
HDC2010 为各种环境监测应用 和物联网 (IoT) （如智
能恒温器、智能家居助理和可穿戴设备）提供高精度测
量功能。HDC2010 还可用于为冷链运输和易腐货物的
储存提供临界温度和湿度数据，以帮助确保食品和药物
等产品新鲜送达。
HDC2010 经过工厂校准，温度精度为 0.2°C，相对湿
度精度为 2%，并配备了加热元件，可消除冷凝和湿
气，从而增加可靠性。HDC2010 支持的工作温度范围
为 -40°C 至 125°C，相对湿度范围为 0% 至 100%。
智能恒温器
智能家居助理
冰箱
冷藏运输
洗衣机/烘干机
HVAC 系统
气体检测
通信设备
环境标签
烟雾和热量探测器
喷墨打印机
监控摄像头
CPAP 呼吸机
可穿戴设备
器件信息(1)
器件型号
封装
封装尺寸（标称值）
1.5 mm × 1.5 mm ×
0.675 mm
DSBGA（6 凸点）
HDC2010
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
典型应用
RH 精度
10
Typical
9
Accuracy (r%RH)
8
7
6
5
4
3
2
1
0
0
10
20
30
40
50
60
70
80
90
100
RH (%RH)
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SNAS693
HDC2010
ZHCSGL3C – JULY 2017 – REVISED MAY 2019
www.ti.com.cn
目录
1
2
3
4
5
6
7
特性 ..........................................................................
应用 ..........................................................................
说明 ..........................................................................
修订历史记录 ...........................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
4
4
4
4
4
6
6
7
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
I2C Interface Electrical Characteristics .....................
I2C Interface Timing Requirements...........................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
7.4 Device Functional Modes........................................ 15
7.5 Programming .......................................................... 15
7.6 Register Maps ......................................................... 17
8
Application and Implementation ........................ 28
8.1 Application Information............................................ 28
8.2 Typical Application ................................................. 28
9 Power Supply Recommendations...................... 30
10 Layout................................................................... 30
10.1 Layout Guidelines ................................................. 30
10.2 Layout Example .................................................... 31
11 器件和文档支持 ..................................................... 32
11.1
11.2
11.3
11.4
11.5
11.6
文档支持 ...............................................................
接收文档更新通知 .................................................
社区资源................................................................
商标 .......................................................................
静电放电警告.........................................................
Glossary ................................................................
32
32
32
32
32
32
12 机械、封装和可订购信息 ....................................... 33
4 修订历史记录
Changes from Revision B (August 2018) to Revision C
Page
•
Added pin type description for DRDY/INT pin ........................................................................................................................ 3
•
Changed description of behavior of TH_STATUS bit when INT_MODE is set to 1............................................................. 11
•
Changed description of behavior of TH_STATUS bit when INT_MODE is set to 0............................................................. 11
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Changed description of behavior of TL_STATUS bit when INT_MODE is set to 1 ............................................................. 12
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Changed description of behavior of TL_STATUS bit when INT_MODE is set to 0 ............................................................. 12
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Changed description of behavior of HH_STATUS bit when INT_MODE is set to 1 ............................................................ 13
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Changed description of behavior of HH_STATUS bit when INT_MODE is set to 0 ............................................................ 13
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Changed description of behavior of HL_STATUS bit when INT_MODE is set to 1 ............................................................. 14
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Changed description of behavior of HL_STATUS bit when INT_MODE is set to 0 ............................................................. 14
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Changed the units for Humidity threshold low from: °C to: %RH......................................................................................... 24
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Changed the temperature resolution decoding from: 8 bit to: 9 bit ...................................................................................... 26
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Changed the humidity resolution decoding from: 8 bit to: 9 bit ........................................................................................... 26
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Changed the measurement configuration "10" bit encoding from: Humidity Only to: NA for field MEAS_CONFIG[1:0] ..... 26
Changes from Revision A (March 2018) to Revision B
•
Page
Changed the HDC2010 Detailed Description section, Application and Implementation section, Power Supply
Recommendations section, and Layout section to align with the HDC2010 data sheet........................................................ 8
Changes from Original (July 2017) to Revision A
Page
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将特性 项目从“自动采样率”更改为“可编程采样率” .................................................................................................................. 1
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将特性 项目从“按需”更改为“按需触发” .................................................................................................................................... 1
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Changed HL_MASK to HL_ENABLE in Humidity Low......................................................................................................... 14
2
Copyright © 2017–2019, Texas Instruments Incorporated
HDC2010
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ZHCSGL3C – JULY 2017 – REVISED MAY 2019
5 Pin Configuration and Functions
WLCSP (DSBGA)
6 Pin YPA
Top View
Pin Functions
PIN
I/O TYPE (1)
DESCRIPTION
NAME
NO.
VDD
A1
P
Positive Supply Voltage
ADDR
B1
I
Address select pin – hardwired to VDD or GND.
GND: slave address: 1000000
VDD: slave address: 1000001
GND
C1
G
Ground
SDA
A2
I/O
Serial data line for I2C, open-drain; requires a pullup resistor to VDD
SCL
B2
I
Serial clock line for I2C, open-drain; requires a pullup resistor to VDD
DRDY / INT
C2
O
Data ready/Interrupt. Push-pull output
(1)
P=Power, G=Ground, I=Input, O=Output
Copyright © 2017–2019, Texas Instruments Incorporated
3
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ZHCSGL3C – JULY 2017 – REVISED MAY 2019
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6 Specifications
6.1 Absolute Maximum Ratings (1)
MIN
MAX
UNIT
VDD
Input Voltage
-0.3
3.9
V
GND
Input Voltage
-0.3
3.9
V
ADDR
Input Voltage
-0.3
3.9
V
SCL
Input Voltage
-0.3
3.9
V
SDA
Input Voltage
-0.3
3.9
V
Tstg
Storage temperature
-65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001, all pins (1)
±2000
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins (2)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating range (unless otherwise noted)
MIN
VDD
Voltage Supply
NOM
1.62
MAX
UNIT
3.6
V
6.4 Thermal Information
HDC2010
THERMAL METRIC
(1)
DSBGA (YPA)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
114.8
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
0.8
°C/W
Junction-to-board thermal resistance
35.2
°C/W
ΨJT
Junction-to-top characterization parameter
0.6
°C/W
ΨJB
Junction-to-board characterization parameter
35.4
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
at TA = 30°C, VDD = 1.8 V, 20% ≤ RH ≤ 80% (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ELECTRICAL SPECIFICATION
VDD
4
Supply Voltage
Operating Range
1.62
3.6
V
Copyright © 2017–2019, Texas Instruments Incorporated
HDC2010
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ZHCSGL3C – JULY 2017 – REVISED MAY 2019
Electrical Characteristics (continued)
at TA = 30°C, VDD = 1.8 V, 20% ≤ RH ≤ 80% (unless otherwise noted)
PARAMETER
TEST CONDITIONS
RH measurement
MIN
(1)
650
890
550
730
Sleep Mode
0.05
0.1
0.3
Average at 1 measurement every 10 seconds, RH (11
bit) + temperature (11 bit) (1) (2)
Heater (3)
μA
0.55
Average at 1 measurement every 2 seconds, RH (11
bit) + temperature (11 bit) (1) (2)
IDDHEAT
UNIT
0.3
Average at 1 measurement/second, RH (11 bit) +
temperature (11 bit) (1) (2)
Supply current
MAX
Temperature measurement (1)
Average at 1 measurement/second, RH or temperature
only (1) (2)
IDD
TYP
0.105
Startup (average on startup time)
80
VDD = 3.3 V
90
mA
RELATIVE HUMIDITY SENSOR
RHACC
Accuracy (4)
RHREP
Repeatability (7)
RHHYS
Hysteresis (8)
RHRT
RHCT
RHOR
RHLTD
(5) (6)
Response Time
(9)
Conversion-time (7)
Operating range
Long-term Drift
±2
14 bit resolution
t63% step
(10)
%RH
%RH
8
s
275
11 bit accuracy
400
14 bit accuracy
660
Non-condensing (11)
%RH
±1
9 bit accuracy
0
(12)
±3
±0.1
µs
100
±0.25
%RH
%RH/yr
TEMPERATURE SENSOR
TEMPOR
Operating range
TEMPACC
Accuracy (7)
5°C < TA < 60°C
-40
±0.2
TEMPREP
Repeatability (7)
14 bit resolution
±0.1
9 bit accuracy
225
TEMPCT
Conversion-time (7)
11 bit accuracy
350
14 bit accuracy
610
125
°C
±0.4
°C
°C
µs
(1)
(2)
(3)
(4)
(5)
I2C read/write communication and pull up resistors current through SCL, SDA not included.
Average current consumption while conversion is in progress.
Heater operating range – 40°C to 85°C.
Excludes hysteresis and long-term drift.
Excludes the impact of dust, gas phase solvents and other contaminants such as vapors from packaging materials, adhesives, or tapes,
etc.
(6) Limits apply over the humidity operating range 20 to 80% RH (non-condensing) from 0 to 60°C.
(7) This parameter is specified by design and/or characterization and is not tested in production.
(8) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point.
(9) Actual response times will vary dependent on system thermal mass and air-flow.
(10) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity.
(11) Recommended humidity operating range is 20 to 80% RH (non-condensing) over 0 to 60°C. Prolonged operation beyond these ranges
may result in a shift of sensor reading, with slow recovery time.
(12) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents,
outgassing tapes, adhesives, packaging materials, etc.
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Electrical Characteristics (continued)
at TA = 30°C, VDD = 1.8 V, 20% ≤ RH ≤ 80% (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
HUMIDITY AND TEMPERATURE
On demand
5
2
ODR
Output Data Rate
1
Selectable Output data rate
0.2
Hz
0.1
1/60
1/120
6.6 I2C Interface Electrical Characteristics
At TA = 30°C, VDD = 3.3 V (unless otherwise noted)
PARAMETER
VIH
Input High Voltage
VIL
Input Low Voltage
VOL
Output Low Voltage
TEST CONDITIONS
MIN
TYP
MAX
0.7 x
VDD
V
Sink current 3 mA
0.3 x
VDD
V
0.4
V
0.1 x
VDD
HYS
Hysteresis
CIN
Input Capacitance on all digital pins
UNIT
V
0.5
pF
6.7 I2C Interface Timing Requirements
At TA = 30°C, VDD = 1.8 V (unless otherwise noted)
MIN
NOM
MAX
UNIT
400
kHz
fSCL
Clock Frequency
10
tLOW
Clock Low Time
1.3
µs
tHIGH
Clock High Time
0.6
µs
tSP
Pulse width of spikes that be suppressed by input filter
tSTART
Shutdown entry delay
(1)
(1)
10
50
ns
15
ms
This parameter is specified by design and/or characterization and it is not tested in production.
SDA
tLOW
tSP
SCL
tHIGH
START
REPEATED
START
STOP
START
图 1. I2C Timing
6
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ZHCSGL3C – JULY 2017 – REVISED MAY 2019
6.8 Typical Characteristics
Unless otherwise noted. TA = 30°C, VDD = 1.8 V.
1
10
Typical
9
0.9
8
0.8
7
0.7
Accuracy (r°C)
Accuracy (r%RH)
Typical
6
5
4
0.6
0.5
0.4
3
0.3
2
0.2
1
0.1
0
-40
0
0
10
20
30
40
50
60
70
80
90
100
-25
-10
5
20
T = -40°C
T = -20°C
T = 0°C
T = 25°C
T = 85°C
T = 125°C
700
700
95
110
125
650
IDD (nA)
IDD (nA)
80
VDD = 1.62V
VDD = 1.8V
VDD = 2.5V
VDD = 3V
VDD = 3.3V
VDD = 3.6V
750
650
600
600
550
550
500
500
450
450
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
400
-40
3.6
-15
10
35
60
85
110
125
Temp (°C)
VDD (V)
图 4. Supply Current vs. Supply Voltage, Average at 1
Measurement/Second, RH (11 Bit) + Temperature (11 Bit)
图 5. Supply Current vs. Temperature, Average at 1
Measurement/Second, RH (11 Bit) + Temperature (11 Bit)
400
400
T = -40°C
T = -20°C
T = 0°C
T = 25°C
T = 50°C
T = 85°C
T = 125°C
350
300
VDD = 1.62V
VDD = 1.8V
VDD = 2.5V
VDD = 3V
VDD = 3.3V
VDD = 3.6V
350
300
250
IDD (nA)
250
IDD (nA)
65
800
750
200
200
150
150
100
100
50
50
0
1.6
50
图 3. Temperature Accuracy vs. Temperature
图 2. RH Accuracy vs. RH
800
400
1.6
35
Temp (°C)
RH (%RH)
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VDD (V)
图 6. Supply Current vs. Supply Voltage, Sleep Mode
版权 © 2017–2019, Texas Instruments Incorporated
0
-40
-15
10
35
60
85
110
125
Temp (°C)
图 7. Supply Current vs. Temperature, Sleep Mode
7
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7 Detailed Description
7.1 Overview
The HDC2010 is a highly integrated digital humidity and temperature sensor that incorporates both humiditysensing and temperature-sensing elements, an analog-to-digital converter, calibration memory, and an I2C
interface that are all contained in a 1.5mm x 1.5mm DSBGA package. The HDC2010 provides excellent
measurement accuracy with very low power consumption and features programmable resolution for both
humidity and temperature:
• Temperature resolution [9, 11, 14]
• Humidity resolution [9, 11, 14]
The conversion time during measurements is dependent upon the configured resolution for humidity and
temperature, which can be configured for optimal power consumption.
The HDC2010 device incorporates a state-of-the-art polymer dielectric to provide capacitive-sensing
measurements. As with most relative humidity sensors that include this type of technology, the user must meet
certain application requirements to ensure optimal device performance for the sensing element. The user must:
• Follow the correct storage and handling procedures during board assembly. See Humidity Sensor: Storage
and Handling Guidelines (SNIA025) for these guidelines.
• Protect the sensor from contaminants during board assembly and operation.
• Reduce prolonged exposure to both high temperature and humidity extremes that may impact sensor
accuracy.
• Follow the correct layout guidelines for best performance. See Optimizing Placement and Routing for
Humidity Sensors (SNAA297) for these guidelines.
7.2 Functional Block Diagram
VDD
HDC2010
SCL
RH
Sensor
ADC
Temperature
Sensor
Registers
+
Logic
SDA
2
IC
DRDY/INT
ADDR
Calibration
GND
7.3 Feature Description
7.3.1 Sleep Mode Power Consumption
One key feature of the HDC2010 is the low power consumption of the device, which makes the HDC2010
suitable in battery-powered or energy-harvesting applications. In these applications, the HDC2010 spends most
of the time in sleep mode that has a typical current consumption of 50 nA. This minimizes the average power
consumption and self-heating.
7.3.2 Measurement Modes: Trigger on Demand vs. Auto Measurement
Two types of measurement modes are available on the HDC2010: Trigger on Demand and Auto Mode.
Trigger on Demand is when each measurement reading are initiated through an I2C command on an as-needed
basis. After the measurement is converted, the device remains in sleep mode until another I2C command is
received.
8
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ZHCSGL3C – JULY 2017 – REVISED MAY 2019
Feature Description (接
接下页)
Auto Measurement Mode is when the HDC2010 is programmed to perform measurement readings on a periodic
basis, thus eliminating the need to initiate a measurement request through an I2C command and improves power
consumption. The user can adjust the Soft Reset and Interrupt Configuration register to select one of 7 different
sampling rates (the range spans from 1 sample every 2 minutes to 5 samples/second). In Auto Measurement
Mode, the HDC2010 wakes up from sleep to measurement mode based on the selected sampling rate.
7.3.3 Heater
The HDC2010 includes an integrated heating element that can be switched on briefly to prevent or remove any
condensation that may build up in high humidity environments. Additionally, the heater can be used to verify
functionally of the integrated temperature sensor. The operating range of the heater should be limited to –40°C to
85°C. For 3.3-V operation, the heater will have a typical current draw of 90 mA, and 55 mA at 1.8-V operation.
7.3.4 Interrupt Description
注
When multiple bits are enabled, the DRDY/INT pin can only reflect the status of one
interrupt bit at a time. The DRDY/INT pin DOES NOT function as the logical ‘OR’ of
interrupt bits that have been enabled.
The highest priority is given to TH_ENABLE bit, followed by TL_ENABLE, HH_ENABLE,
and HL_ENABLE bits in descending order. Therefore, programming recommendations are
provided as below:
• The DRDY/INT will track the HL_ENABLE if enabled and all other ENABLE bits are
disabled.
• The DRDY/INT will track the HH_ENABLE if enabled and the TH_ENABLE and
TL_ENABLE are disabled.
• The DRDY/INT will track the TL_ENABLE if enabled and the TH_ENABLE is disabled.
• The DRDY/INT will track the TH_ENABLE if enabled and is independent of other
ENABLE bit settings.
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Feature Description (接
接下页)
7.3.4.1 DRDY
When DRDY_ENABLE is enabled and a humidity and/or temperature conversion is complete, the
DRDY_STATUS bit asserts to 1. To enable the DRDY/INT pin of HDC2010, the DRDY/INT_EN bit (0x0E bit[2])
must be set to 1 and the INT_MOD bit should be set to 0. If these bits are not configured, the pin will be left in
high impedance. The INT_POL bit of this register defines the interrupt polarity of the DRDY/INT pin. 图 8 and 图
9 display the output behavior of the DRDY/INT pin for both interrupt polarity cases: INT_POL= 0 and INT_POL=
1.
Previous Data
New Data Available
1
DRDY_STATUS
0
VDD
DRDY/INT
[INT_POL = 1]
0
图 8. Data Ready Interrupt - Active High (INT_POL = 1)
Previous Data
New Data Available
1
DRDY_STATUS
0
VDD
DRDY/INT
[INT_POL = 0]
0
图 9. Data Ready Interrupt - Active Low (INT_POL = 0)
10
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Feature Description (接
接下页)
7.3.5 INTERRUPT on Threshold
7.3.5.1 Temperature High
When TH_ENABLE is enabled and the temperature is over the programmed threshold level stored in the
Temperature Threshold HIGH register, the TH_STATUS bit asserts to 1. The polarity and interrupt mode of the
TH_STATUS bit and the DRDY/INT pin can be configured through the INT_POL and INT_MODE bits of Register
0x0E.
The INT_MODE bit sets the threshold to either comparator mode or a level sensitive alarm.
When INT_MODE is set to 1 the TH_STATUS bit is based on the current temperature conversion. The polarity of
the DRDY/INT pin is set by INT_POL.
When INT_MODE is set to 0 the TH_STATUS bit remains set to 1 until it is read. The polarity of the DRDY/INT
pin is set by INT_POL
T [°C]
Temperature Threshold High
Time
1
TH_STATUS
[INT_MODE = 0]
TH_STATUS Bit Read
0
VDD
DRDY/INT
[INT_MODE = 0]
[INT_POL = 1]
0
VDD
DRDY/INT
[INT_MODE = 0]
[INT_POL = 0]
0
1
TH_STATUS
[INT_MODE = 1]
0
VDD
DRDY/INT
[INT_MODE = 1]
[INT_POL = 1]
0
VDD
DRDY/INT
[INT_MODE = 1]
[INT_POL = 0]
0
图 10. INTERRUPT on Threshold - Temperature High
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Feature Description (接
接下页)
7.3.5.2 Temperature Low
When TL_ENABLE is set and the temperature is under the threshold value program in the Temperature
Threshold LOW register, the TL_STATUS bit is set to 1. The TL_STATUS bit and the DRDY/INT pin behave
based on the INT_POL and INT_MODE bits.
The INT_MODE bit sets the threshold to either comparator mode or a level sensitive alarm.
When INT_MODE is set to 1, the TL_STATUS bit is based on the current temperature conversion. The polarity of
the DRDY/INT pin is set by INT_POL.
When INT_MODE is set to 0, the TL_STATUS bit remains set to 1 until it is read. The polarity of the DRDY/INT
pin is set by INT_POL
T [°C]
Temperature Threshold Low
Time
1
TL_STATUS
[INT_MODE = 0]
TL_STATUS Bit Read
0
VDD
DRDY/INT
[INT_MODE = 0]
[INT_POL = 1]
0
VDD
DRDY/INT
[INT_MODE = 0]
[INT_POL = 0]
0
1
TL_STATUS
[INT_MODE = 1]
0
VDD
DRDY/INT
[INT_MODE = 1]
[INT_POL = 1]
0
VDD
DRDY/INT
[INT_MODE = 1]
[INT_POL = 0]
0
图 11. INTERRUPT on Threshold - Temperature Low
12
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Feature Description (接
接下页)
7.3.5.3 Humidity High
When HH_ENABLE is set and the humidity is over the threshold value program in the Humidity Threshold HIGH
register, the HH_STATUS bit is set to 1. The HH_STATUS bit and the DRDY/INT pin behave based on the
INT_POL and INT_MODE bits.
The INT_MODE bit sets the threshold to either comparator mode or a level sensitive alarm.
When INT_MODE is set to 1, the HH_STATUS bit is based on the current humidity conversion. The polarity of
the DRDY/INT pin is set by INT_POL.
When INT_MODE is set to 0, the HH_STATUS bit remains set to 1 until it is read. The polarity of the DRDY/INT
pin is set by INT_POL.
H [%RH]
Humidity Threshold High
Time
1
HH_STATUS
[INT_MODE = 0]
HH_STATUS Bit Read
0
VDD
DRDY/INT
[INT_MODE = 0]
[INT_POL = 1]
0
VDD
DRDY/INT
[INT_MODE = 0]
[INT_POL = 0]
0
1
HH_STATUS
[INT_MODE = 1]
0
VDD
DRDY/INT
[INT_MODE = 1]
[INT_POL = 1]
0
VDD
DRDY/INT
[INT_MODE = 1]
[INT_POL = 0]
0
图 12. INTERRUPT on Threshold - Humidity High
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Feature Description (接
接下页)
7.3.5.4 Humidity Low
When HL_ENABLE is set and the humidity is over the threshold value program in the Humidity Threshold LOW
register the HL_STATUS bit is set to 1. The HL_STATUS bit and the DRDY/INT pin behave based on the
INT_POL and INT_MODE bits.
The INT_MODE bit sets the threshold to either comparator mode or a level sensitive alarm.
When INT_MODE is set to 1 the HL_STATUS bit is based on the current humidity conversion. The polarity of the
DRDY/INT pin is set by INT_POL.
When INT_MODE is set to 0 the HL_STATUS bit remains set to 1 until it is read. The polarity of the DRDY/INT
pin is set by INT_POL.
H [%RH]
Humidity Threshold Low
Time
1
HL_STATUS
[INT_MODE = 0]
HL_STATUS Bit Read
0
VDD
DRDY/INT
[INT_MODE = 0]
[INT_POL = 1]
0
VDD
DRDY/INT
[INT_MODE = 0]
[INT_POL = 0]
0
1
HL_STATUS
[INT_MODE = 1]
0
VDD
DRDY/INT
[INT_MODE = 1]
[INT_POL = 1]
0
VDD
DRDY/INT
[INT_MODE = 1]
[INT_POL = 0]
0
图 13. INTERRUPT on Threshold - Humidity Low
14
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7.4 Device Functional Modes
The HDC2010 has two modes of operation: Sleep Mode and Measurement Mode.
7.4.1 Sleep Mode vs. Measurement Mode
After power up, the HDC2010 defaults to Sleep Mode and waits for an I2C instruction to set programmable
conversion times, trigger a measurement or conversion, or read or write valid data. When a measurement is
triggered, the HDC2010 switches to Measurement Mode that converts temperature or humidity values from
integrated sensors through an internal ADC and stores the information in their respective data registers. The
DRDY/INT pin can be monitored to verify if data is ready after measurement conversion. The DRDY/INT pin
polarity and interrupt mode are set according to the configuration of the Interrupt Enable and DRDY/INT
Configuration registers. After completing the conversion, the HDC2010 returns to Sleep Mode.
7.5 Programming
7.5.1 I2C Serial Bus Address Configuration
To communicate with the HDC2010, the master must first address slave devices through a slave address byte.
The slave address byte consists of seven address bits and a direction bit that indicates the intent to execute a
read or write operation. The HDC2010 features an address pin to allow up to 2 devices to be addressed on a
single bus. 表 1 describes the pin logic levels used to connect up to two devices. ADDR should be set before any
activity on the interface occurs and remain constant while the device is powered up.
表 1. HDC2010 I2C Slave Address
ADDR
ADDRESS (7-BIT ADDRESS)
GND
1000000
VDD
1000001
7.5.2 I2C Interface
The HDC2010 operates only as a slave device on the I2C bus interface. It is not allowed to have multiple devices
on the same I2C bus with the same address. Connection to the bus is made through the open-drain I/O lines,
SDA, and SCL. The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to
minimize the effects of input spikes and bus noise. After power-up, the sensor needs at most 3 ms, to be ready
to start RH and temperature measurement. After power-up the sensor is in sleep mode until a communication or
measurement is performed. All data bytes are transmitted MSB first.
7.5.3 Serial Bus Address
To communicate with the HDC2010, the master must first address slave devices through a slave address byte.
The slave address byte consists of seven address bits, and a direction bit that indicates the intent to execute a
read or write operation.
7.5.4 Read and Write Operations
Address registers, which hold data pertaining to the status of the device, can be accessed through a pointer
mechanism and can be accessed and modified with the following write and read procedures. The register
address value is the first byte transferred after the device slave address byte with the R/W bit low. Every write
operation to the HDC2010 requires a value for the register address (refer to 表 2).
When reading from the HDC2010, the current pointer location is used to determine which register is read by a
read operation -- the pointer location points to the last written register address. To change the address for a read
operation, a new value must be written to the pointer. This transaction is accomplished by issuing the slave
address byte with the R/W bit set to '0', followed by the pointer byte. No additional data is required (refer to 表 4).
The master can then generate a START condition and send the slave address byte with the R/W bit set to 1 to
initiate the read command. The address register is incremented automatically to enable the multibyte read and
write operation (refer to 表 3 and 表 5). Note that register bytes are sent MSB first, followed by the LSB. A write
operation in a read-only register such as DEVICE ID, MANUFACTURER ID, or SERIAL ID returns a NACK after
each data byte. A read or write operation to an unused address returns a NACK after the pointer, and a read or
write operation with incorrect I2C address returns a NACK after the I2C address.
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表 2. Write Single Byte
Master
START
Slave address (W)
Address
Slave
DATA
ACK
STOP
ACK
ACK
表 3. Write Multi Byte
Master
START
Slave address (W)
Slave
Address
ACK
DATA
ACK
DATA
ACK
………
ACK
STOP
表 4. Read Single Byte
Master
START
Slave address (W)
Slave
Address
Start
ACK
Slave address (R)
ACK
NACK
ACK
STOP
DATA
表 5. Read Multi Byte
Master START
Slave
16
Slave
address (W)
Address
ACK
Start
ACK
Slave
address (R)
ACK
ACK
DATA
ACK
……
NACK
STOP
DATA
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7.6 Register Maps
The HDC2010 contains data registers that hold configuration information, temperature and humidity
measurement results, and status information.
表 6. Register Map
ADDRESS (HEX)
NAME
RESET VALUE
DESCRIPTION
0x00
TEMPERATURE LOW
00000000
Temperature [7:0]
0x01
TEMPERATURE HIGH
00000000
Temperature [15:8]
0x02
HUMIDITY LOW
00000000
Humidity [7:0]
0x03
HUMIDITY HIGH
00000000
Humidity [15:8]
0x04
INTERRUPT/DRDY
00000000
DataReady and interrupt configuration
0x05
TEMPERATURE MAX
00000000
Maximum measured temperature
(Not supported in Auto Measurement Mode)
0x06
HUMIDITY MAX
00000000
Maximum measured humidity
(Not supported in Auto Measurement Mode)
0x07
INTERRUPT ENABLE
00000000
Interrupt Enable
0x08
TEMP_OFFSET_ADJUST
00000000
Temperature offset adjustment
0x09
HUM_OFFSET_ADJUST
00000000
Humidity offset adjustment
0x0A
TEMP_THR_L
00000000
Temperature Threshold Low
Temperature Threshold High
0x0B
TEMP_THR_H
11111111
0x0C
RH_THR_L
00000000
Humidity threshold Low
0x0D
RH_THR_H
11111111
Humidity threshold High
0x0E
RESET&DRDY/INT CONF
00000000
Soft Reset and Interrupt Configuration
0x0F
MEASUREMENT CONFIGURATION
00000000
Measurement configuration
0xFC
MANUFACTURER ID LOW
01001001
Manufacturer ID Low
0xFD
MANUFACTURER ID HIGH
01010100
Manufacturer ID High
0xFE
DEVICE ID LOW
11010000
Device ID Low
0xFF
DEVICE ID HIGH
00000111
Device ID High
7.6.1 Address 0x00 Temperature LSB
表 7. Address 0x00 Temperature LSB Register
7
6
5
4
3
2
1
0
TEMP[7:0]
表 8. Address 0x00 Temperature LSB Field Descriptions
BIT
FIELD
[7:0]
TEMPERATURE [7:0]
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TYPE
R
RESET
00000000
DESCRIPTION
Temperature LSB
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7.6.2 Address 0x01 Temperature MSB
The temperature register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The
result of the acquisition is always a 14-bit value, while the resolution is related to one selected in Measurement
Configuration register. The temperature must be read LSB first.
表 9. Address 0x01 Temperature MSB Register
7
6
5
4
3
2
1
0
TEMP[15:8]
表 10. Address 0x01 Temperature MSB Field Descriptions
BIT
FIELD
[15:8]
TYPE
TEMPERATURE [15:8]
RESET
R
00000000
DESCRIPTION
Temperature MSB
The temperature can be calculated from the output data with 公式 1:
§ TEMPERATURE [15 : 0] ·
¨
¸ u 165 40
©
¹
216
Temperature (qC)
(1)
7.6.3 Address 0x02 Humidity LSB
表 11. Address 0x02 Humidity LSB Register
7
6
5
4
3
2
1
0
HUMIDITY[7:0]
表 12. Address 0x02 Humidity LSB Field Descriptions
BIT
FIELD
[7:0]
TYPE
HUMIDITY [7:0]
RESET
R
00000000
DESCRIPTION
Humidity LSB
7.6.4 Address 0x03 Humidity MSB
The humidity register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The result
of the acquisition is always a 14-bit value, while the resolution is related to one selected in Measurement
Configuration register. The humidity measurement must be read LSB first.
表 13. Address 0x03 Humidity MSB Register
7
6
5
4
3
HUMIDITY[15:8]
2
1
0
表 14. Address 0x03 Temperature MSB Field Descriptions
BIT
[15:8]
FIELD
HUMIDITY[15:8]
TYPE
R
RESET
00000000
DESCRIPTION
Humidity MSB
The humidity can be calculated from the output data with 公式 2:
Humidity (%RH)
18
§ HUMIDITY [15 : 0] ·
¨
¸ u 100
216
©
¹
(2)
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7.6.5 Address 0x04 Interrupt DRDY
表 15. Address 0x04 Interrupt DRDY Register
7
DRDY_STATUS
6
TH_STATUS
5
TL_STATUS
4
HH_STATUS
3
HL_STATUS
2
RES
1
RES
0
RES
表 16. Address 0x04 Interrupt DRDY Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
7
DRDY_STATUS
R/W
0
DataReady bit status
0 = Data Not Ready
1 = Data Ready
DRDY_STATUS is cleared to 0 when read
6
TH_STATUS
R/W
0
Temperature threshold HIGH Interrupt status
0 = No interrupt
1 = Interrupt
TH_STATUS is cleared to 0 when read
5
TL_STATUS
R/W
0
Temperature threshold LOW Interrupt status
0 = No interrupt
1 = Interrupt
TL_STATUS is cleared to 0 when read
4
HH_STATUS
R/W
0
Humidity threshold HIGH Interrupt status
0 = No interrupt
1 = Interrupt
HH_STATUS is cleared to 0 when read
3
HL_STATUS
R/W
0
Humidity threshold LOW Interrupt status
0 = No interrupt
1 = Interrupt
HL_STATUS is cleared to 0 when read
2
RES
0
Reserved
1
RES
0
Reserved
0
RES
0
Reserved
DRDY_STATUS indicates that temperature and/or humidity conversion is terminated. This bit is cleared when the
Interrupt/DRDY register is read or the output registers TEMPERATURE_HIGH, TEMPERATURE_LOW,
HUMIDITY_HIGH and HUMIDITY_LOW are read.
The TL_STATUS indicates that the Temperature Threshold LOW value is exceeded. The behavior is defined by
0x0E Configuration register value. The bit is cleared when the register Interrupt DRDY is read.
The TH_STATUS indicates that the Temperature Threshold HIGH value is exceeded. The behavior is defined by
0x0E Configuration register value. The bit is cleared when the register Interrupt DRDY is read.
The HH_STATUS indicates that the Humidity Threshold HIGH value is exceeded. The behavior is defined by
0x0E Configuration register value. The bit is cleared when the register Interrupt DRDY is read.
The HL_STATUS indicates that the Humidity Threshold LOW value is exceeded. The behavior is defined by
0x0E Configuration register value. The bit is cleared when the register Interrupt DRDY is read.
DRDY/INT pin behaves like the STATUS bits based on the 0x0E Configuration register value.
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7.6.6 Address 0x05 Temperature MAX
This register implements temperature peak detector function. It stores the highest temperature value converted
after the power up. Value is reset at power up and/or with soft reset procedure.
表 17. Address 0x05 Temperature MAX Register
7
6
5
4
3
TEMPERATUREMAX[7:0]
2
1
0
表 18. Address 0x05 Temperature Max Field Descriptions
BIT
FIELD
[7:0]
TYPE
TEMPERATUREMAX[7:0]
R/W
RESET
00000000
DESCRIPTION
Stores maximum temperature measurement from all I2C read
requests for temperature
Not supported in Auto Measurement Mode
The temperature can be calculated from the output data with 公式 3:
Temperature (qC)
§ TEMPERATURE>7 : 0@ ·
¨
¸ u 165 40
28
©
¹
(3)
7.6.7 Address 0x06 Humidity MAX
This register implements humidity peak detector function. It stores the highest humidity value converted after the
power up. Value is reset at power up and/or with soft reset procedure.
表 19. Address 0x06 Humidity MAX Register
7
6
5
4
3
HUMIDITYMAX[7:0]
2
1
0
表 20. Address 0x06 Humidity MAX Field Descriptions
BIT
[7:0]
FIELD
HUMIDITYMAX[7:0]
TYPE
R/W
RESET
00000000
DESCRIPTION
Stores maximum humidity measurement from all I2C read
requests for humidity
Not supported in Auto Measurement Mode
The humidity can be calculated from the output data with 公式 4:
§100 ·
Humidity (%RH) = HUMIDITYMAX>7 : 0@ u ¨ 8 ¸
©2 ¹
20
(4)
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7.6.8 Address 0x07 Interrupt Configuration
表 21. Address 0x07 Interrupt Configuration Register
7
DRDY_ENABLE
6
TH_ENABLE
5
TL_ENABLE
4
HH_ENABLE
3
HL_ENABLE
2
RES
1
RES
0
RES
表 22. Address 0x07 Interrupt Configuration Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
7
DRDY_ENABLE
R/W
0
DataReady Interrupt enable
0 = DataReady Interrupt generator disable
1 = DataReady Interrupt generator enable
6
TH_ENABLE
R/W
0
Temperature threshold HIGH Interrupt enable
0 = Temperature high Interrupt generator disable
1 = Temperature high Interrupt generator enable
5
TL_ENABLE
R/W
0
Temperature threshold LOW Interrupt enable
0 = Temperature low Interrupt generator disable
1 = Temperature low Interrupt generator enable
4
HH_ENABLE
R/W
0
Humidity threshold HIGH Interrupt enable
0 = Humidity high Interrupt generator disable
1 = Humidity high Interrupt generator enable
3
HL_ENABLE
R/W
0
Humidity threshold LOW Interrupt enable
0 = Humidity low Interrupt generator disable
1 = Humidity low Interrupt generator enable
2
RES
0
Reserved
1
RES
0
Reserved
0
RES
0
Reserved
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7.6.9 Address 0x08 Temperature Offset Adjustment
表 23. Address 0x08 Temperature Offset Adjustment Register
7
6
5
4
3
TEMP_OFFSET_ADJUST[7:0]
2
1
0
表 24. Address 0x08 Temperature Offset Adjustment Field Descriptions
BIT
[7:0]
FIELD
TYPE
TEMP_OFFSET_ADJUST [7:0]
R/W
RESET
00000000
DESCRIPTION
Temperature offset adjustment. Added to the converted
Temperature value
The temperature can be adjusted adding the following values that are enable settings the equivalents bits:
7
–20.62°C
6
+10.32°C
5
+5.16°C
4
+2.58°C
3
+1.28°C
2
+0.64°C
1
+0.32°C
0
+0.16°C
The value is added to the converted temperature value for offset adjustment as shown in 图 14
Converted Value
+
Temperature Output
User Temperature Offset
图 14. Temperature Output Calculation
The resulting temperature offset is a summation of the register bits that have been enabled (that is, programmed
to 1). Some examples:
1. Programming TEMP_OFFSET_ADJUST to 00000001 adjusts the reported temperature by +0.16°C.
2. Programming TEMP_OFFSET_ADJUST to 00000111 adjusts the reported temperature by +1.12°C.
3. Programming TEMP_OFFSET_ADJUST to 00001101 adjusts the reported temperature by +2.08°C.
4. Programming TEMP_OFFSET_ADJUST to 11111111 adjusts the reported temperature by –0.16°C.
5. Programming TEMP_OFFSET_ADJUST to 11111001 adjusts the reported temperature by –1.12°C.
6. Programming TEMP_OFFSET_ADJUST to 11110011 adjusts the reported temperature by –2.08°C.
22
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7.6.10 Address 0x09 Humidity Offset Adjustment
表 25. Address 0x09 Humidity Offset Adjustment Register
7
6
5
4
3
HUM_OFFSET_ADJUST [7:0]
2
1
0
表 26. Address 0x09 Humidity Offset Adjustment Field Descriptions
BIT
[7:0]
FIELD
TYPE
HUM_OFFSET_ADJUST [7:0]
R/W
RESET
00000000
DESCRIPTION
Humidity offset adjustment. Added to the converted Humidity
value
The humidity can be adjusted adding the following values that are enable settings the equivalents bits:
7
–25%RH
6
+12.5%RH
5
+6.3%RH
4
+3.1%RH
3
+1.6%RH
2
+0.8%RH
1
+0.4%RH
0
+0.2%RH
The value is added to the converted temperature value for offset adjustment as shown in 图 15
Converted Value
+
Humidity Output
User Humidity Offset
图 15. Humidity Output Calculation
The resulting humidity offset is a summation of the register bits that have been enabled (i.e. programmed to 1).
Some examples:
1. Programming HUM_OFFSET_ADJUST to 00000001 adjusts the reported humidity by +0.20%RH.
2. Programming HUM_OFFSET_ADJUST to 00000101 adjusts the reported humidity by +1.00%RH.
3. Programming HUM_OFFSET_ADJUST to 00001010 adjusts the reported humidity by +2.00%RH.
4. Programming HUM_OFFSET_ADJUST to 11111111 adjusts the reported humidity by –0.10%RH.
5. Programming HUM_OFFSET_ADJUST to 11111011 adjusts the reported humidity by –0.90%RH.
6. Programming HUM_OFFSET_ADJUST to 11110101 adjusts the reported humidity by –2.10%RH.
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7.6.11 Address 0x0A Temperature Threshold LOW
表 27. Address 0x0A Temperature Threshold LOW Register
7
6
5
4
3
TEMP_THRES_LOW[7:0]
2
1
0
表 28. Address 0x0A Temperature Threshold LOW Field Descriptions
BIT
FIELD
[7:0]
TYPE
TEMP_THRES_LOW[7:0]
R/W
RESET
00000000
DESCRIPTION
Temperature threshold LOW value
The Temperature Threshold LOW can be calculated from the output data with 公式 5:
Temperature threshold low (qC)
§ TEMP_THRES_LOW [7 : 0] ·
¨
¸ u 165 40
©
¹
28
(5)
7.6.12 Address 0x0B Temperature Threshold HIGH
表 29. Address 0x0B Temperature Threshold HIGH Register
7
6
5
4
3
TEMP_THRES_HIGH[7:0]
2
1
0
表 30. Address 0x0B Temperature Threshold HIGH Field Descriptions
BIT
FIELD
[7:0]
TYPE
TEMP_THRES_HIGH[7:0]
R/W
RESET
11111111
DESCRIPTION
Temperature threshold HIGH value
The Temperature Threshold HIGH can be calculated from the output data with 公式 6:
Temperature threshold high (qC)
§ TEMP_THRES_HIGH [7 : 0] ·
¨
¸ u 165 40
©
¹
28
(6)
7.6.13 Address 0x0C Humidity Threshold LOW
表 31. Address 0x0C Humidity Threshold LOW Register
7
6
5
4
3
HUMI_THRES_LOW[7:0]
2
1
0
表 32. Address 0x0C Humidity Threshold LOW Field Descriptions
BIT
[7:0]
FIELD
HUMI_THRES_LOW[7:0]
TYPE
R/W
RESET
00000000
DESCRIPTION
Humidity threshold LOW value
The Humidity Threshold LOW can be calculated from the output data with 公式 7:
§ HUMI_THRES_LOW>7 : 0@ ·
Humidity threshold low (%RH) = ¨
¸ u 100
28
©
¹
24
(7)
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7.6.14 Address 0x0D Humidity Threshold HIGH
表 33. Address 0x0D Humidity Threshold HIGH Register
7
6
5
4
3
HUMI_THRES_HIGH[7:0]
2
1
0
表 34. Address 0x0D Humidity Threshold HIGH Field Descriptions
BIT
[7:0]
FIELD
TYPE
HUMI_THRES_HIGH[7:0]
R/W
RESET
11111111
DESCRIPTION
Humidity threshold HIGH value
The Humidity Threshold HIGH can be calculated from the output data with 公式 8:
Humidity threshold high (%RH)
§ HUMI_THRES_HIGH [7 : 0] ·
¨
¸ u 100
©
¹
28
(8)
7.6.15 Address 0x0E Reset and DRDY/INT Configuration Register
表 35. Address 0x0E Configuration Register
7
SOFT_RES
6
AMM[2]
5
AMM[1]
4
AMM[0]
3
HEAT_EN
2
DRDY/INT_EN
1
INT_POL
0
INT_MODE
表 36. Address 0x0E Configuration Field Descriptions
BIT
7
FIELD
TYPE
RESET
DESCRIPTION
SOFT_RES
R/W
0
0 = Normal Operation mode, this bit is self-clear
1 = Soft Reset
EEPROM value reload and registers reset
[6:4]
AMM[2:0]
R/W
000
Auto Measurement Mode (AMM)
000 = Disabled. Initiate measurement via I2C
001 = 1/120Hz (1 samples every 2 minutes)
010 = 1/60Hz (1 samples every minute)
011 = 0.1Hz (1 samples every 10 seconds)
100 = 0.2 Hz (1 samples every 5 second)
101 = 1Hz (1 samples every second)
110 = 2Hz (2 samples every second)
111 = 5Hz (5 samples every second)
3
HEAT_EN
R/W
0
0 = Heater off
1 = Heater on
2
DRDY/INT_EN
R/W
0
DRDY/INT_EN pin configuration
0 = High Z
1 = Enable
1
INT_POL
R/W
0
Interrupt polarity
0 = Active Low
1 = Active High
0
INT_MODE
R/W
0
Interrupt mode
0 = Level sensitive
1 = Comparator mode
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25
HDC2010
ZHCSGL3C – JULY 2017 – REVISED MAY 2019
www.ti.com.cn
7.6.16 Address 0x0F Measurement Configuration
表 37. Address 0x0F Measurement Configuration Register
7
TRES[1]
6
TRES[0]
5
HRES[1]
4
HRES[0]
3
RES
2
MEAS_CONF[1]
1
MEAS_CONF[0]
0
MEAS_TRIG
表 38. Address 0x0F Measurement Configuration Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
7:6
TRES[1:0]
R/W
00
Temperature resolution
00: 14 bit
01: 11 bit
10: 9 bit
11: NA
5:4
HRES[1:0]
R/W
00
Humidity resolution
00: 14 bit
01: 11 bit
10: 9 bit
11: NA
RES
R/W
0
Reserved
MEAS_CONF[1:0]
R/W
00
Measurement configuration
00: Humidity + Temperature
01: Temperature only
10: NA
11: NA
MEAS_TRIG
R/W
0
Measurement trigger
0: no action
1: Start measurement
Self-clearing bit when measurement completed
3
2:1
0
7.6.17 Manufacturer ID Low
表 39. Manufacturer ID Low Register
7
6
5
4
3
MANUFACTURER ID[7:0]
2
1
0
表 40. Address 0xFC Manufacturer ID Low Field Descriptions
BIT
FIELD
[7:0]
TYPE
MANUFACTURER ID [7:0]
R
RESET
01001001
DESCRIPTION
Manufacturer ID LOW value
7.6.18 Manufacturer ID High
These registers contain a factory-programmable identification value that identifies this device as being
manufactured by Texas Instruments. These registers distinguish this device from other devices that are on the
same I2C bus. The manufacturer ID reads 0x4954.
表 41. Manufacturer ID High Register
7
6
5
4
3
MANUFACTURER ID[15:8]
2
1
0
表 42. Address 0xFD Manufacturer ID High Field Descriptions
BIT
[7:0]
26
FIELD
MANUFACTURER ID [15:8]
TYPE
R
RESET
01010100
DESCRIPTION
Manufacturer ID HIGH value
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HDC2010
www.ti.com.cn
ZHCSGL3C – JULY 2017 – REVISED MAY 2019
7.6.19 Device ID Low
表 43. Device ID Low Register
7
6
5
4
3
2
1
0
DEVICE ID[7:0]
表 44. Address 0xFE Device ID Low Field Descriptions
BIT
FIELD
[7:0]
TYPE
DEVICE ID [7:0]
R
RESET
11010000
DESCRIPTION
Device ID LOW value
7.6.20 Device ID High
These registers contain a factory-programmable identification value that identifies this device as a HDC2010.
These registers distinguish this device from other devices that are on the same I2C bus. The Device ID for the
HDC2010 is 0x07D0.
表 45. Device ID High Register
7
6
5
4
3
DEVICE ID[15:8]
2
1
0
表 46. Address 0xFF Device ID High Field Descriptions
BIT
[7:0]
FIELD
DEVICE ID [15:8]
版权 © 2017–2019, Texas Instruments Incorporated
TYPE
R
RESET
00000111
DESCRIPTION
Device ID HIGH value
27
HDC2010
ZHCSGL3C – JULY 2017 – REVISED MAY 2019
www.ti.com.cn
8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
An HVAC system thermostat control is based on environmental sensors and a microcontroller. The
microcontroller acquires data from humidity and temperature sensors and controls the heating and cooling
system. The collected data are then shown on a display that can be easily controlled by the microcontroller.
Based on data from the humidity and temperature sensor, the heating and cooling system then maintains the
environment at the customer-defined preferred conditions.
8.2 Typical Application
In a battery-powered HVAC system thermostat, one of the key parameters in the selection of components is the
power consumption. The HDC2010, with 550 nA of current consumption (the average consumption over 1s for
RH and Temperature measurements), in conjunction with a MSP430, represents one way an engineer can obtain
low power consumption and extend battery life. A system block diagram of a battery-powered thermostat is
shown in 图 16.
DISPLAY
TEMPERATURE: 25°C/ 77°F
Relative Humidity (RH): 25%
Red
Lithium
Ion Battery
+
TIME: XX:XX
DATE: XX:XX:XX
1.8V
1.8V
VDD
HDC2010
VDD
RH
Violet
Sensor
Temp
Violet
Sensor
ADC
Red
Orange
MUX
MUX
Registers/
Red
Logic
SCL
SDA
I2C
Red
INT
Interface
ADDR
MCU
Red
I2C Peripheral
Red
GPIOs
GPIO
GPIOs
-
GND
Calibration
Red
Coefficients
GND
KEYPAD
Button1
C
Button2
C
C
Button3
C
Button4
C
图 16. Typical Application Schematic HVAC
28
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HDC2010
www.ti.com.cn
ZHCSGL3C – JULY 2017 – REVISED MAY 2019
Typical Application (接
接下页)
8.2.1 Design Requirements
To improve measurement accuracy, TI recommends to isolate the HDC2010 from all heat sources in the form of
active circuitry, batteries, displays and resistive elements. If design space is a constraint, cutouts surrounding the
device or the inclusion of small trenches can help minimize heat transfer from PCB heat sources to the
HDC2010. To avoid self-heating the HDC2010, TI recommends to configure the device for a maximum sample
rate of 1 Hz (1sps).
8.2.2 Detailed Design Procedure
When a circuit board layout is created from the schematic shown in 图 16, a small circuit board is possible. The
accuracy of a RH and temperature measurement depends on the sensor accuracy and the setup of the sensing
system. The HDC2010 samples relative humidity and temperature in its immediate environment, it is therefore
important that the local conditions at the sensor match the monitored environment. Use one or more openings in
the physical cover of the thermostat to obtain a good airflow even in static conditions. Refer to the layout (图 18)
for a PCB layout which minimizes the thermal mass of the PCB in the region of the HDC2010, which can
improve measurement response time and accuracy.
8.2.3 Application Curve
These results were acquired at TA = 30°C using a humidity chamber that sweeps RH%. The sweep profile used
was 20% > 30% > 40% > 50% > 60% > 70% > 60% > 50% > 40% > 30% > 20%. Each RH% set point was held
for 20 minutes.
图 17. RH% Readings of Chamber and HDC2010 vs. Time
版权 © 2017–2019, Texas Instruments Incorporated
29
HDC2010
ZHCSGL3C – JULY 2017 – REVISED MAY 2019
www.ti.com.cn
9 Power Supply Recommendations
The HDC2010 requires a voltage supply within 1.62 V and 3.60 V. TI recommends a multilayer ceramic bypass
X7R capacitor of 0.1 µF between the VDD and GND pins.
10 Layout
10.1 Layout Guidelines
The HDC2010’s relative humidity-sensing element is located on the bottom side of the package.
TI recommends that the user eliminate the copper layers below the device (GND, VDD) and create slots in the
PCB around the device to enhance the thermal isolation of the HDC2010. To ensure the temperature sensor
performance, TI highly recommends that the user follow the Land Pattern, Solder Mask, and Solder Paste
examples depicted in the 图 18.
10.1.1 Guidelines for HDC2010 Storage and PCB Assembly
10.1.1.1 Storage and Handling
As with all humidity sensors, the HDC2010 must follow special guidelines regarding handling and storage that
are not common with standard semiconductor devices. Long exposure to UV and visible light, or exposure to
chemical vapors for prolonged periods, should be avoided as it may affect RH% accuracy. Additionally, the
device should be protected from out-gassed solvent vapors produced during manufacturing, transport, operation,
and package materials (that is, adhesive tapes, stickers, bubble foils). For further detailed information, see
Humidity Sensor: Storage and Handling guidelines (SNIA025)
10.1.1.2 Soldering Reflow
For PCB assembly, standard reflow soldering ovens may be used. The HDC2010 uses the standard soldering
profile IPC/JEDEC J-STD-020 with peak temperatures at 260°C. When soldering the HDC2010, it is mandatory
to use no-clean solder paste, and the paste must not be exposed to water or solvent rinses during assembly
because these contaminants may affect sensor accuracy. After reflow, it is expected that the sensor will
generally output a shift in relative humidity, which will reduce over time as the sensor is exposed to typical indoor
ambient conditions. These conditions include 30-40% RH at room temperature during a duration of several days.
Following this re-hydration procedure allows the polymer to correctly settle after reflow and return to the
calibrated RH accuracy.
10.1.1.3 Rework
TI recommends to limit the HDC2010 to a single IR reflow with no rework, but a second reflow may be possible if
the following guidelines are met:
• The no-clean solder paste is used and the process is not exposed to any liquids, such as water or solvents.
• The Peak soldering temperature does not exceed 260°C.
10.1.1.4 High Temperature and Humidity Exposure
Long exposure outside the recommended operating conditions may temporarily offset the RH output. The
recommended humidity operating range is 20 to 80% RH (non-condensing) over 0 to 60°C. Prolonged operation
beyond these ranges may shift the sensor reading with a slow recovery time.
10.1.1.5 Bake/Re-Hydration Procedure
Prolonged exposure to extreme conditions or harsh contaminants may impact sensor performance. In the case
that permanent offset is observed from contaminants, the following procedure is suggested, which may recover
or reduce the error observed in sensor performance:
1. Baking: 100°C, at less than 5%RH, for 5 to 10 hours
2. Re-hydration: Between 20°C to 30°C, 60%RH to 75%RH, for 6 to 12 hours
30
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HDC2010
www.ti.com.cn
ZHCSGL3C – JULY 2017 – REVISED MAY 2019
10.2 Layout Example
The only component next to the device is the supply bypass capacitor. The relative humidity is dependent on the
temperature, so the HDC2010 should be positioned away from hot spots present on the board, such as a battery,
display or microcontroller. Slots around the device can be used to reduce the thermal mass for a quicker
response to environmental changes. The DAP may be soldered to a floating pad on the board, but the board pad
should NOT be connected to GND
图 18. HDC2010 PCB Layout Example
版权 © 2017–2019, Texas Instruments Incorporated
31
HDC2010
ZHCSGL3C – JULY 2017 – REVISED MAY 2019
www.ti.com.cn
11 器件和文档支持
11.1 文档支持
11.1.1 相关文档
请参阅如下相关文档：
• 德州仪器 (TI)，《HDC2010EVM 用户指南》(SNAU214)
• 德州仪器 (TI)，《湿度传感器：存储和处理指南》 (SNIA025)
• 德州仪器 (TI)，《优化湿度传感器的布局和布线》应用报告 (SNAA297)
11.2 接收文档更新通知
要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.3 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
32
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HDC2010
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ZHCSGL3C – JULY 2017 – REVISED MAY 2019
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
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33
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Copyright © 2019 德州仪器半导体技术（上海）有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
HDC2010YPAR
ACTIVE
DSBGA
YPA
6
3000
RoHS & Green
SAC405 SNAGCU
Level-1-260C-UNLIM
-40 to 85
L
HDC2010YPAT
ACTIVE
DSBGA
YPA
6
250
RoHS & Green
SAC405 SNAGCU
Level-1-260C-UNLIM
-40 to 85
L
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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