HPA00025S8

PCN Number: Title: 20150929003A PCN Date: 12/07/2015 Assembly site move from Amkor K1 to Amkor P1 for Select Devices Customer Contact: PCN Manager Proposed 1st Ship Date: 03/07/2016 Change Type: Assembly Site Assembly Process Assembly Materials Mechanical Specification Packing/Shipping/Labeling Estimated Sample Availability: Design Data Sheet Part number change Test Site Test Process Dept: Quality Services Date provided at sample request Wafer Wafer Wafer Wafer Wafer Wafer Bump Site Bump Material Bump Process Fab Site Fab Materials Fab Process PCN Details Description of Change: Revision A is to announce the addition of new devices that were not included on the original PCN notification. These new devices are highlighted in the device list below under Product Affected Group 2. The expected first shipment date for these new devices will be 90 days from this notice for these newly added devices only. Assembly site move from Amkor K1 to Amkor P1 for Select Devices listed in the “Product Affected” Section. Material differences are as follows: Assembly Site Assembly Site Origin Assembly Country Code Assembly Site City Amkor K1 AMN KR Seoul Amkor P1 AKR PH Cupang, Muntinlupa City Material Differences: Group 1 Devices: Amkor K1 Amkor P1 Mount Compound 101339127 101380679 Mold Compound 101360571 101385017 Group 2 Devices: No material differences between sites. Reason for Change: Closure of the Amkor K1 assembly facility. Continuity of supply. Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative): None. Changes to product identification resulting from this PCN: Texas Instruments, Inc. PCN# 20150929003A Sample Product Shipping Label (not actual product label) Group 1: Assembly Site Amkor K1 Assembly Site Origin (22L) Amkor P1 Assembly Site Origin (22L) ASSEMBLY SITE CODES: AMN =7, ASO: AMN ASO: AKR AKR = 4 Product Affected Group 1: AFE9006RFD Product Affected Group 2: 74SSTVF16859G4RG4 ADS1158IRTCR ADS1158IRTCT ADS1258IRTCR ADS1258IRTCT BQ29312ARTHR DDC114IRTCR DDC114IRTCT DDC118IRTCR DDC118IRTCT HPA00025S8 MM9603-LQ4/NOPB MM9635-LQ3/NOPB SN74SSTV16859RGQ8 SN74SSTV16859RGQR Group 1: Qualification Report Amkor K1 to P1 transfer of AFE9006RFD Product Attributes Attributes Qual Device: AFE9006RFD Assembly Site AP1 Package Family HTFQP Wafer Fab Supplier DMOS5 Wafer Process 1833 CO5 - QBS: Qual By Similarity - Qual Device AFE9006RFD is qualified at LEVEL3-260C Qualification Results Data Displayed as: Number of lots / Total sample size / Total failed Type AC HAST HTSL LI LI PD TC Test Name / Condition Autoclave 121C Biased HAST, 130C/85%RH High Temp. Storage Bake, 170C Lead Fatigue Lead Pull to Destruction Physical Dimensions Temperature Cycle, -65/150C Texas Instruments, Inc. Duration 96 Hours 96 Hours 420 Hours Leads Leads -500 Cycles Qual Device: AFE9006RFD 3/231/0 3/231/0 3/231/0 3/66/0 3/66/0 3/30/0 3/231/0 PCN# 20150929003A WBP Bond Pull Wires 3/90/0 WBS Ball Bond Shear Wires 3/90/0 - Preconditioning was performed for Autoclave, Unbiased HAST, THB/Biased HAST, Temperature Cycle, Thermal Shock, and HTSL, as applicable - The following are equivalent HTOL options based on an activation energy of 0.7eV : 125C/1k Hours, 140C/480 Hours, 150C/300 Hours, and 155C/240 Hours - The following are equivalent HTSL options based on an activation energy of 0.7eV : 150C/1k Hours, and 170C/420 Hours - The following are equivalent Temp Cycle options per JESD47 : -55C/125C/700 Cycles and -65C/150C/500 Cycles Quality and Environmental data is available at TI's external Web site: http://www.ti.com/ Green/Pb-free Status: Qualified Pb-Free(SMT) and Green Group 2: Qualification Report QFN transfer from Amkor K1 to Amkor P1 Product Attributes Attributes Assembly Site Package Family Qual Device: ADS1158IRTC Qual Device: DDC118IRTCR Qual Device: MM9603-LQ4/NOPB Qual Device: ADC12J4000NKER / LM15851 AP1 AP1 AP1 AP1 QFN QFN QFN QFN Wafer Fab Supplier DMOS 5 TSMC-WF2 MAINEFAB UMC12A Wafer Process 50HPA07 0.50UM-TSMC C80L18M2 UMC65NM - QBS: Qual By Similarity - Qual Device ADC12J4000NKER / LM15851 is qualified at LEVEL3-260C - Qual Device ADS1158IRTC is qualified at LEVEL2-260C - Qual Device DDC118IRTCR is qualified at LEVEL3-260C - Qual Device MM9603-LQ4/NOPB is qualified at LEVEL4-260C - Device DDC118IRTCR contains multiple dies. Qualification Results Data Displayed as: Number of lots / Total sample size / Total failed Type AC DS HAST HTSL Test Name / Condition Autoclave 121C Die Shear Biased HAST, 130C/85%RH High Temp. Storage Bake, 170C Qual Device: ADS1158IRTC Qual Device: DDC118IRTCR Qual Device: MM9603LQ4/NOPB - 1/77/0 1/10/0 3/231/0 3/90/0 1/77/0 1/10/0 Qual Device: ADC12J4000 NKER / LM15851 - 96 Hours - 3/231/0 - - 420 Hours - 3/231/0 - 3/231/0 Duration 96 Hours PD Physical Dimensions (per mechanical drawing) 1/5/0 3/15/0 1/5/0 3/15/0 TC Temperature Cycle, 65/150C 500 Cycles 1/77/0 3/228/0 1/77/0 3/231/0 Wires Bonds 1/30/0 1/30/0 3/90/0 3/90/0 1/30/0 1/30/0 3/90/0 3/90/0 (top side only) 1/5/0 3/15/0 1/5/0 3/15/0 WBP WBS Bond Pull Ball Bond Shear XRAY X-ray Texas Instruments, Inc. PCN# 20150929003A - Preconditioning was performed for Autoclave, Unbiased HAST, THB/Biased HAST, Temperature Cycle, Thermal Shock, and HTSL, as applicable - The following are equivalent HTOL options based on an activation energy of 0.7eV : 125C/1k Hours, 140C/480 Hours, 150C/300 Hours, and 155C/240 Hours - The following are equivalent HTSL options based on an activation energy of 0.7eV : 150C/1k Hours, and 170C/420 Hours - The following are equivalent Temp Cycle options per JESD47 : -55C/125C/700 Cycles and -65C/150C/500 Cycles Quality and Environmental data is available at TI's external Web site: http://www.ti.com/ Green/Pb-free Status: Qualified Pb-Free(SMT) and Green For questions regarding this notice, e-mails can be sent to the regional contacts shown below or your local Field Sales Representative. Location USA Europe Asia Pacific Japan Texas Instruments, Inc. E-Mail PCNAmericasContact@list.ti.com PCNEuropeContact@list.ti.com PCNAsiaContact@list.ti.com PCNJapanContact@list.ti.com PCN# 20150929003A