User's Guide
SLVU805 – November 2012
HTFLASHEVM User’s Guide
1
2
3
4
5
Contents
Overview ..................................................................................................................... 2
Setup and Required Equipment ........................................................................................... 2
2.1
Software GUI installation .......................................................................................... 2
2.2
Connections ........................................................................................................ 7
Using the SMV28VLT32-HT GUI ......................................................................................... 7
3.1
GUI Info ............................................................................................................. 7
3.2
Main .................................................................................................................. 8
3.3
Sequence ........................................................................................................... 9
3.4
Read/Write Data Group .......................................................................................... 11
3.5
SPI/BIST ........................................................................................................... 12
Board Layout ............................................................................................................... 13
Schematic and Bill of Materials .......................................................................................... 14
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1
Overview
1
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Overview
The HTFLASHEVM is designed for verification of the SM28VLT32 in extreme environments. The EVM, as
shipped, is ready for test up to 200°C with the following exceptions. The decoupling capacitors need to be
swapped from standard temperature range to 200°C rated through-hole components. This was done to
save board cost on systems only needing room temperature protocol development. Alternate BOM data is
provided for acquiring appropriate 200°C capacitors for in oven testing. Additionally, the plastic separators
for the installed pins should be removed before exposing entire board to oven temperatures.
The EVM provides 100-mil berg type pins for access to SPI control pins (CS#,SO,SI,SCK), FLCLK, WP#,
HOLD#, and power. Additionally, a footprint for an oscillator is present on the layout to allow the
population of a standalone 12-MHz or slower oscillator.
Figure 1. HTFLASHEVM
2
Setup and Required Equipment
The EVM has a software GUI that is designed to interface to a TotalPhase Cheetah SPI hardware
adapter. The Cheetah SPI host adapter is not provided, but can be obtained from TotalPhase:
http://www.totalphase.com/products/cheetah_spi/.
Additionally, a flying lead set will also be needed (low temperature operation only). Custom flying leads will
need to be created for in oven testing. The flying lead set can also be ordered from TotalPhase:
http://www.totalphase.com/products/split_cable/.
The software GUI can be downloaded and installed from the SM28VLT32-HT product folder.
The EVM can be interface without the Cheetah or the use of the TI SM28VLT32-HT GUI. In this case,
connections can be made based on the SPI host adapter. Follow instructions provided with Cheetah host
adapter for proper installation.
2.1
Software GUI installation
Execute setup.exe and follow these instructions:
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Setup and Required Equipment
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Select default location or other if desired and press Next.
Figure 2. Destination Directory
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Setup and Required Equipment
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Select “I accept the License Agreement” and press Next to continue.
Figure 3. License Agreement
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Setup and Required Equipment
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Press Next to begin the installation.
Figure 4. Start Installation
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Setup and Required Equipment
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Press Finish.
Figure 5. Installation Complete
After restarting your computer the GUI is ready to use.
Figure 6. Restart
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Using the SMV28VLT32-HT GUI
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2.2
Connections
From the flying lead set, make the following connections:
• SCL → RST#: This is device reset.
• GND → GND
• MISO → SO: Device SPI slave output
• SCLK → SCK: SPI clock
• MOSI → SI: Device SPI slave input
• SS/SS# → CS#: Device Chip Select
With supplies disabled, make the following power connections:
• Connect 3.3-V supply to 3.3-V VCCIO power. Can be current limited to 100 mA.
• Connect 1.8-V supply to 1.8-V Vcore power. Can be current limited to 200 mA.
• Connect GND to common ground for both supplies.
• Connect 12-MHz clock to FCLK pin. Do not enable yet.
• Power VCORE, then VCCIO. VCORE and VCCIO can also be brought up simultaneously as RST is held
low through RC time constant. If VCCIO is brought up first, RST# must be held low until VCC has
exceeded 1.65 V. See datasheet for full specification of power sequence requirements.
• Enable FCLK.
Current on board should read approximately 120 mA on VCORE and 16 mA on VIO.
3
Using the SMV28VLT32-HT GUI
Each of the following sections will describe various attributes and capabilities of the GUI.
3.1
GUI Info
Figure 7. GUI Info Tab
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Put GUI in hardware mode by deselecting the Simulate Communications check box.
All other settings are correct. Note that the SPI frequency can be changed. The max frequency for SPI
clock is 10 MHz and is associated with 12-MHz FCLK. If FCLK is running slower, then SPI clock will need
to be less than or equal to 5/6th of FCLK. If FCLK is slower, refer to the datasheet section, Provisions for
Operating FCLK at Frequencies Less than 12 MHz.
3.2
Main
Figure 8. Main Tab
The Main tab has the ability to run any single command that the device supports as a single command.
Note that some of the commands above are either not supported or intended only for factory use.
Selecting the command on the left will enable the dialog boxes on the right for that particular command. In
the above case, Read Word is selected with 0000 in address. Pressing execute will return the value read
from address 0.
Supported commands:
Read Word, Read Word Auto Addressing, Write Word, Write Word Auto Addressing, Erase Segment,
Validate Segment, Write Register, Read Register, Write Command, Read SPI Configuration Register,
Write SPI Configuration Register, Read SPI Status Register, and Quick Status.
These commands are defined and explained in more detail in the device data sheet.
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3.3
Sequence
Figure 9. Sequence Tab
The Sequence tab is perhaps the most powerful part of the GUI. The GUI implements what is called a
sequence file. This file represents a pseudo command with address and data. In the screen shot above, a
sequence file is loaded that executes erase segment commands.
Most functionality of this GUI is self-explanatory. Options are defined as follows:
On Error?— Determines what functionality should be executed if an error occurs. This can be pause,
Clear and Resume, or Ignore.
Set Execution Pointer— Sets the execution pointer to any line number, so part of the sequence can be
skipped if necessary.
Wait for command complete?— Turns on a polling mechanism that will query the flash to determine if
the last command completed and if completed without error. This is valid for writes and erases.
Executing an erase with this unchecked will cause issues with some commands not being
executed. This is due to the fact that both writes and erases take time to complete. This does not
affect reads.
Pause on Fail— Halts the execution if a failure or error is detected. Pressing Execute Sequence will
resume the execution.
Single command Execute?— Executes only one line at a time at each press of the Execute Sequence
button.
Pause at line numbers— Allows the sequence to execute up to a line number and pause. Pressing
Execute Sequence will resume the sequence.
Clear Results— Resets execution pointer to 1 and will clear all the results.
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Clear Errors— Executes a sequence “1F 00 40 xx” This is a special command that will clear internal
device errors such as a command error or invalid data error. See datasheet for further description
of these two errors that require manual intervention to clear.
Reset using SCL— Asserts the SCL line active low, then back high. If this is connected to the RST line,
then is can automate resetting the flash device.
Near the bottom of the screen is a blank line with a folder browse dialog to the right. This is a file logging
option. If a file is entered here, the results will be written to a file. The Sequence File has the following
format:
CC_AAAAAA_DDDD // Comment
Where CC is the hex value of the command, AAAAAA is the address, and DDDD is the data.
In the case of a read (register or address), the DDDD represents the expected value of the read. In this
way, a test can be created to write and read data to the array or configuration registers with validation.
The RESET command is an additional command that is implemented. This single word command will
cause the GUI to assert RST (via SCL) low and then resume back high.
It is useful to note the distinction between an error and a fail. Errors are reported by the device, such as
Command Error or Invalid Data. The GUI will report fails if a read of an address or register does not match
its expected value. The Clear Errors button only impacts the first two device errors. An error does not
represent a fail in the GUI logic. A fail is a logical mismatch between an expected value for a read and the
actual read value.
The Sequence file has some practical restrictions due to the nature of hardware and software
implementation. It needs to be limited to approximately 1000 lines. Exceeding this causes progressively
slower performance. Reading and writing large portions of the array should use the Read/Write Data
Group tab.
Some example sequence files are provided for reference under the sequence_patterns directory.
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3.4
Read/Write Data Group
Figure 10. Read/Write Data Group Tab
The Read/Write Data Group tab takes advantage of building transactions for the Cheetah hardware that
can be streamed to the device. This prevents USB latency issues from dramatically impacting
performance if commands were individually framed for transfer.
The Read Group Data is very self explanatory. Pressing Read Reg Group will build the transactions for
the entire address range utilizing the read command (and the read with autoread if selected) then send
these to the device. The GUI will record the results to the file indicated.
The Write Group is similar, with one added complexity. The nature of a flash write is such that the duration
of the write is not known and varies. To accommodate this, a delay variable is entered that allows the
delay to be set between each transaction. The typical max delay at room temperature is 50 µs. In most
cases, this will be sufficient time to complete the write before the next write is submitted. If shorter
durations are used or if some addresses require longer than the delay setting, then an error will be
observed. This is post-processed information as the transactions are built and sent as a stream. The
PC/GUI cannot interact with the device quick enough on the fly. If there are errors, then you will be able to
see the cumulative count of these in the dialog boxes on the right. Note that most addresses will actually
program in about 8 µs at room temperature. Unfortunately, the GUI and hardware are not capable of
polling the device for completion at this speed. This is due to overhead associated with windows and USB
bus transactions.
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Using the SMV28VLT32-HT GUI
3.5
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SPI/BIST
Figure 11. SPI/BIST Tab
The SPI/BIST tab contains interactive views of the configuration register, the quick status results, the
status register, and BIST diagnostics.
The SM28VLT32-HT is capable of running an internal BIST engine for self test at less than full operating
temperature. The algorithm includes erase and, therefore, the max temperature of the test must be less
than 125°C to prevent over depletion of the array during erase.
Full operation of the BIST engine is not covered in the users guide. However, several sequence file
examples are available in the sequence file directory that invoke the necessary register writes to run BIST.
Note the device must be reset after a BIST run to enter normal operation mode.
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Board Layout
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4
Board Layout
Figure 12. Assembly
Figure 13. Top Layer
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Schematic and Bill of Materials
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Figure 14. Power
Figure 15. Bottom Layer
5
Schematic and Bill of Materials
The following pages contain the HTFLASHEVM schematic and bill of materials.
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Schematic and Bill of Materials
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2
C4
0.1uF
TH1
C3
C13
10uF
R1
100K
0.1uF
TH2
4
3
2
1
6
5
4
1uF
+3.3VDC
R3
8
7
6
5
3
2
1
C14
+3.3VDC
+3.3VDC
D
1
2
3
C12
+1.8VDC
D
1
4
5
6
1uF
3
1
2
3
4
C11
4
5
6
7
8
10uF
5
10K
GND
U1
GND
+3.3VDC
C1
0.1uF
GND
GND
+3.3VDC
C
1
14
VCORE
R4
HOLDn
2
13
VIO
25.2K
RSTn
3
12
CSn
WPn
4
11
SO
5
10
SI
6
9
SCK
7
8
FLCLK
VIO
+3.3VDC
R5
10K-DNI
DNI
2
B
GND
EN
GND
1
2
3
4
5
6
1uF C10
C6
1
2
3
4
5
6
GND
SM28VLT32
Assembly & Layout Notes:
C7,C9,C11,C13 have dual footprint
for HT version install: SMX43C106KAN360
for Std version install: CGA5L1X7R1E106K
C2
0.1uF TH4
Y1
1
1uF
0.1uF
+3.3VDC
C8
GND
C5
+3.3VDC
GND
VCC
OUT
C
22-03-2051
VCORE
+1.8VDC
5
1
6
2
7
3
8
4
10uF C9
10K
0.1uF
TH3
5
1
6
2
7
3
8
4
10uF C7
R2
J1
1
2
3
4
5
4
GND
3
7710026-12M00
12MHz
DNI
+1.8VDC
TH5
+3.3VDC
TH6
TH7
TH8
GND
GND
C8,C10,C12,C14 have dual footprint
for HT version install: SMX55C105KAN240
for Std version install: C3216X8R1E105K
B
A
A
TEXAS INSTRUMENTS
Title
Size
B
Date:
5
4
3
2
HT Flash EVM
Document Number
Rev
A
Wednesday, September 05, 2012
Sheet
1
of
1
1
Figure 16. HTFLASHEVM Schematic
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Schematic and Bill of Materials
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Table 1. HTFLASHEVM Bill of Materials
Item No.
Qty
Designator
Value
Manufacturer
Part No.
PCB Footprint
1
6
C1, C2, C3, C4,
C5, C6
0.1uF
Kemet
C1206H103J5GACTU
1206
2
4
C7, C9, C11,
C13
10uF
TDK
CGA5L1X7R1E106K
1206
3
4
C8, C10, C12,
C14
1uF
TDK
C3216X8R1E105K
1206
4
1
J1
22-03-2051
Samtec
HTSW-150-08-G-S
HDR_THVT_1x5_100
5
2
R1, R2
10K
Vishay
PLTT0805Z1002QGT5
0805
6
1
R3
100K
Vishay
PHT0805Y1003BGT20
0
0805
7
1
R4
25.2K
Vishay
PLTT0805Z2522QGT5
0805
8
1
R5
10K-DNI
Vishay
PLTT0805Z1002QGT5
0805
9
8
TH1, TH2, TH3,
TH4, TH5, TH6,
TH7, TH8
TP
Samtec
HTSW-150-08-G-S
HDR_THVT_1x1_100
10
1
U1
SM28VLT32
Texas Instruments
SM28VLT32
CDFP_14_320X800_40
11
1
Y1-DNI
12MHz
Frequency
Management Int.
7710026-12M00
XTAL_4_SM_283x204
Alternate HT temperature components for Dual Footprints
16
4
C7, C9, C11,
C13
10uF
AVX
SMX43C106KAN360
CAP_THVT_SMX4_440X400_100
4
C8, C10, C12,
C14
1uF
AVX
SMX55C105KAN240
CAP_THVT_SMX3_300X250_100
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EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO
BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH
ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety
programs, please visit www.ti.com/esh or contact TI.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and
therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,
software performance, or infringement of patents or services described herein.
REGULATORY COMPLIANCE INFORMATION
As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal
Communications Commission (FCC) and Industry Canada (IC) rules.
For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer
use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency
interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will
be required to take whatever measures may be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and
power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local
laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this
radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and
unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory
authorities, which is responsibility of user including its acceptable authorization.
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
For EVMs annotated as IC – INDUSTRY CANADA Compliant
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs including radio transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs including detachable antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
【Important Notice for Users of this Product in Japan】
】
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:
1.
2.
3.
Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this
product, or
Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with
respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note
that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
http://www.tij.co.jp
【ご使用にあたっての注】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
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EVALUATION BOARD/KIT/MODULE (EVM)
WARNINGS, RESTRICTIONS AND DISCLAIMERS
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished
electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in
laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks
associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end
product.
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:
1.
2.
3.
4.
You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug
Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,
affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.
You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable
regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,
contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)
between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to
minimize the risk of electrical shock hazard.
You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even
if the EVM should fail to perform as described or expected.
You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the
user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and
environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact
a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the
specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or
interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the
load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures
greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include
but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the
EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please
be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable
in electronic measurement and diagnostics normally found in development environments should use these EVMs.
Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives
harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in
connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims
arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such
as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices
which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate
Assurance and Indemnity Agreement.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
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other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
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endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
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anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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regulatory requirements in connection with such use.
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non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
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