User's Guide
SBOU055B – February 2008 – Revised May 2016
INA209 Evaluation Module
This user's guide describes the characteristics, operation, and use of the INA209 evaluation module
(EVM). It discusses the processes and procedures required to properly use this EVM board. This
document also includes the physical printed circuit board (PCB) layout, schematic diagram, and circuit
descriptions.
1
2
3
4
5
Contents
Overview ..................................................................................................................... 2
System Setup ................................................................................................................ 4
INA209EVM Hardware Setup............................................................................................. 10
INA209 Software Overview ............................................................................................... 17
Bill of Materials ............................................................................................................. 24
List of Figures
1
Hardware Included With the INA209EVM ................................................................................ 2
2
Hardware Setup for the INA209EVM...................................................................................... 4
3
Block Diagram of the INA209 Test Board ................................................................................ 5
4
INA209 Test Board Schematic ............................................................................................. 6
5
Theory of Operation For the USB Dig Platform .......................................................................... 9
6
Typical Hardware Connections ........................................................................................... 10
7
Connecting the Two EVM PCBs ......................................................................................... 11
8
Connecting Power to the EVM
9
10
11
12
13
14
15
...........................................................................................
Connecting the USB Cable ...............................................................................................
Default Jumper Settings ...................................................................................................
INA209EVM Software—Functioning Properly ..........................................................................
INA209EVM Software—No Communication With the USB Dig Platform ...........................................
INA209EVM Software—No Communication Between the USB Dig Platform and the INA209 ..................
EVM Controls Pull-Down Menu ..........................................................................................
Current Revision of Software .............................................................................................
12
13
14
18
19
20
23
23
Windows is a registered trademark of Microsoft Corporation.
I2C is a trademark of NXP Semiconductors.
X2Y is a registered trademark of X2Y Attenuators LLC.
All other trademarks are the property of their respective owners.
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Evaluation Module
1
Overview
1
www.ti.com
Overview
This document provides the information needed to set up and operate the INA209EVM evaluation module,
a test platform for the INA209 high-side current shunt monitor. For a more detailed description of the
INA209 product line, please refer to the product data sheet (SBOS403) available from the Texas
Instruments web site at http://www.ti.com. Support documents are listed in the section of this guide
entitled Related Documentation from Texas Instruments .
The INA209EVM is an evaluation module that is used to fully evaluate the INA209 current shunt monitor.
The INA209 is a mixed-signal current shunt monitor. The INA209EVM consists of two PCBs. One board
generates the digital signals (USB DIG Platform) required to communicate with the INA209
(INA209_Test_Board), and the second board contains the INA209, as well as support and configuration
circuitry.
NOTE: Much of the information contained in this document is also contained in the QuickStart
Video, which is included with the EVM kit. It is highly recommended that you watch this video
before using this EVM.
Throughout this document, the abbreviation EVM and the term evaluation module are synonymous with
the INA209EVM.
1.1
INA209EVM Hardware
Figure 1 shows the hardware included with the INA209EVM kit. Contact the factory if any component is
missing. It is highly recommended that you check the TI web sit at http://www.ti.com to verify that you
have the latest software. It is also recommended that you watch the QuickStart Video (included on the
compact disk) before using the INA209EVM.
Figure 1. Hardware Included With the INA209EVM
2
INA209 Evaluation Module
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
Overview
www.ti.com
The complete kit includes the following items:
• INA209 test PCB
• USB Dig platform PCB
• USB cable
• QuickStart Video
• Barrel plug cable assembly (part# 10-01935/ Tensility Intl Corp.) for external power supply to USB DIG
and optionally to EVM.
1.2
Related Documentation from Texas Instruments
The following document provides information regarding Texas Instruments integrated circuits used in the
assembly of the INA209EVM. This document is available from the TI web site under literature number
SBOU055. Any letter appended to the literature number corresponds to the document revision that is
current at the time of the writing of this User’s Guide. Newer revisions may be available from the TI web
site at http://www.ti.com/, or call the Texas Instruments Literature Response Center at (800) 477-8924 or
the Product Information Center at (972) 644-5580. When ordering, identify the document by both title and
literature number.
1.3
Data Sheet
Literature Number
INA209 Product Data Sheet
SBOS403
If You Need Assistance
If you have questions about the INA209 evaluation module, send an e-mail to the Linear Application Team
at precisionamps@list.ti.com. Include INA209EVM as the subject heading.
1.4
Information About Cautions and Warnings
This document contains caution statements.
CAUTION
This is an example of a caution statement. A caution statement describes a
situation that could potentially damage your software or equipment.
The information in a caution or a warning is provided for your protection. Please read each caution and
warning carefully.
1.5
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can
radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable
protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user at his own expense is required to
take whatever measures may be required to correct this interference.
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Evaluation Module
3
System Setup
2
www.ti.com
System Setup
Figure 2 shows the system setup for the INA209EVM. The PC runs software that communicates with the
USB Dig platform. The USB Dig platform generates the digital signals used to communicate with the
INA209 test board. Connectors on the INA209 test board allow for connection to the system that will be
monitored by the user.
Figure 2. Hardware Setup for the INA209EVM
Minimim PC operating requirements:
• Microsoft Windows® XP or higher
• USB port
• Works on US or European regional settings
4
INA209 Evaluation Module
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
System Setup
www.ti.com
2.1
Theory of Operation for the INA209 Test Board Hardware
Figure 3 shows the block diagram of the INA209 test board. The INA209 test board functionality is
relatively simple. It provides connections to the I2C™ interface and general-purpose inputs/outputs
(GPIOs) on the USB Dig platform. It also provides connection points for external connection of the shunt
voltage, bus voltage, and GND on the system being measured.
VDUT Supply
Switched 5.0V Power
25-Pin
Male DSUB Signals
From USB DIG Platform
Connection to
Shunt Voltage
and GND
2
2
IC
Interface
INA209
25-Pin
Female DSUB Signals
From USB DIG Platform
IC
Address
Jumpers
General-Purpose
Digital I/O
Connects to Alert, Warning, Critical,
Overlimit, GPIO, and Convert
Figure 3. Block Diagram of the INA209 Test Board
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Evaluation Module
5
System Setup
www.ti.com
Figure 4 illustrates the system setup for the INA209 test board schematic. LEDs D1 through D6 are used
as indicators for many of the digital signals (for example, Warning, Critical, GPIO, etc). Jumpers JMP1
through JMP8 allow the configuration of A0 and A1. Connector T1 allows the connection of shunt and bus
voltages.
Figure 4. INA209 Test Board Schematic
6
INA209 Evaluation Module
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
System Setup
www.ti.com
2.2
Signal Definition of J1 (25-Pin Male DSUB) on the INA209 Test Board
Table 1 shows the different signals connected to J1 on the INA209 test board. Table 1 also identifies
signals connected to pins on J1 that are not used on the INA209 test board.
Table 1. Signal Definition of J1 (25-Pin Male DSUB) on the INA209 Test Board
J1 Pin
Signal
Used On This EVM?
INA209 Pin
1
DAC A
No
—
2
DAC B
No
—
3
DAC C
No
—
4
DAC D
No
—
5
ADS1+
No
—
6
ADS1–
No
—
7
ADS2+
No
—
8
ADS2–
No
—
9
I2C_SCK
No
—
10
I2C_SDA2
No
—
11
ONE_WIRE
No
—
12
I2C_SCK_ISO
Yes
SCL
13
I2C_SDA_ISO
Yes
SDA
14
XTR_LOOP+
No
—
15
XTR_LOOP–
No
—
16
INA–
No
—
17
VDUT
Yes
VS
18
VCC
No
—
19
+15V
No
—
20
–15V
No
—
21
GND
Yes
GND
22
SPI_SCK
No
—
23
SPI_CS1
No
—
24
SPI_DOUT
No
—
25
SPI_DIN1
No
—
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Evaluation Module
7
System Setup
2.3
www.ti.com
Signal Definition of J2 (25-Pin Female DSUB) on the INA209 Test Board
Table 2 shows the different signals connected to J2 on the INA209 test board. Table 2 also identifies
signals connected to pins on J2 that are not used on the INA209 test board.
Table 2. Signal Definition of J2 (25-Pin Female DSUB) on the INA209 Test Board
8
J1 Pin
Signal
Used On This EVM?
1
NC
No
—
2
CTRL1
Yes
Convert
3
CTRL2
Yes
GPIO
4
CTRL3
No
—
5
CTRL4
No
—
6
CTRL5
No
—
7
CTRL6
No
—
8
CTRL7
No
—
9
CTRL8
No
—
10
MEAS1
Yes
Warning
11
MEAS2
Yes
GPIO
12
MEAS3
Yes
Overlimit
13
MEAS4
Yes
Critical
14
MEAS5
Yes
ALT
15
MEAS6
No
—
16
MEAS7
No
—
17
MEAS8
No
—
18
SPI_SCK
No
—
19
SPI_CS2
No
—
20
SPI_DOUT2
No
—
21
SPI_DIN2
No
—
22
VDUT
No
VS
23
VCC
No
—
24
GND
Yes
GND
25
GND
Yes
GND
INA209 Evaluation Module
INA209 Pin
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
System Setup
www.ti.com
2.4
Theory of Operation For the USB Dig Platform
Figure 5 shows the block diagram for the USB Dig platform. This platform is a general-purpose data
acquisition system that is used on several different Texas Instruments evaluation modules. The block
diagram shown in Figure 5 illustrates the general platform outline.
The core component of the USB Dig platform is the TUSB3210.
External
Power
Adjustable
Regulator
VCC
(3V to 5.5V)
Power
Switching
VDUT
(3V to 5.5V)
Switched Power
3.3V
Regulator
VSmC
3.3V
V_USB
5V
TUSB3210
8052mC
with USB Interface
and UART
USB Bus
From Computer
Reset Button
and
Power-On Reset
USB Dig EVM
2
I C, SPI
Control Bits and
Measure Bits
Buffers and
Latches
8Kx8 Byte
EEPROM
Figure 5. Theory of Operation For the USB Dig Platform
An important function of the USB DIG is to power the EVM PCB. As depicted in Figure 5, switched power
for the EVM can be derived from the PC's USB supply or alternatively from an external power source
connected to J5. TI recommends using the external supply option because the USB power supply can be
noisy. The barrel connector cable assembly included in the EVM kit can be used to connect an external
power supply to the USB DIG. Connect the black wire of the cable assembly to the low side (or ground) of
the external supply and the red wire to the high side.
NOTE:
For proper operation, the external source must provide a supply voltage between 5.8 V and
10.4 V and have a current limit greater than 100 mA.
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Evaluation Module
9
INA209EVM Hardware Setup
3
www.ti.com
INA209EVM Hardware Setup
The INA209EVM hardware setup involves connecting the two halves of the EVM together, applying power,
connecting the USB cable, and setting the jumpers. This section covers the details of this procedure.
3.1
Electrostatic Discharge Warning
Many of the components on the INA209EVM are susceptible to damage by electrostatic discharge (ESD).
Customers are advised to observe proper ESD handling precautions when unpacking and handling the
EVM, including the use of a grounded wrist strap at an approved ESD workstation.
CAUTION
Failure to observe ESD handling procedures may result in damage to EVM
components.
3.2
Typical Hardware Connections
A typical INA209EVM hardware setup connects the two EVM PCBs, then supplying power, and
connecting an external shunt and load. The external connections may be the real-world system to which
the INA209 will be connected. Figure 6 shows the typical hardware connections.
Figure 6. Typical Hardware Connections
10
INA209 Evaluation Module
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209EVM Hardware Setup
www.ti.com
3.3
Connecting the Hardware
The best way to connect the two INA209EVM PCBs together is to gently push on both sides of the D-SUB
connectors, as shown in Figure 7. Make sure that the two connectors are completely socketed together;
loose connections may cause intermittent EVM operation.
Figure 7. Connecting the Two EVM PCBs
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Evaluation Module
11
INA209EVM Hardware Setup
3.4
www.ti.com
Connecting Power
Connect the two INA209EVM PCBs prior to connecting a power source, as shown in Figure 8. Always
connect power before connecting the USB cable. If the USB cable is connected before the power is
supplied, the computer will attempt to communicate with an unpowered device, and the device will not be
able to respond.
Figure 8. Connecting Power to the EVM
12
INA209 Evaluation Module
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209EVM Hardware Setup
www.ti.com
3.5
Connecting the USB Cable to the INA209EVM
Figure 9 shows the typical response to connecting the USB Dig platform to a PC USB port for the first
time. Note that the EVM must be powered prior to connecting the USB cable. Typically, the computer will
respond with a Found New Hardware, USB Device pop-up. The pop-up typically changes to Found New
Hardware, USB Human Interface Device. This pop-up indicates that the device is ready to be used. The
USB Dig platform uses the Human Interface Device Drivers that are part of the Microsoft Windows
operating system.
In some cases, the Windows Add Hardware Wizard will pop-up. If this prompt occurs, allow the system
device manager to install the Human Interface Drivers by clicking Yes when requested to install drivers.
Figure 9. Connecting the USB Cable
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Evaluation Module
13
INA209EVM Hardware Setup
3.6
www.ti.com
INA209 Jumper Settings
Figure 10 shows the default jumper configuration for the INA209EVM. In general, the jumper settings of
the USB Dig platform do not need to be changed. However, you may want to change some of the jumpers
on the INA209 test board to match your specific device configuration (for example, to change the I2C
address).
Figure 10. Default Jumper Settings
Table 3 explains the function of the jumpers on the INA209 test board.
Table 3. INA209 Test Board Jumper Function
Jumper
14
Default
Purpose
JMP1–JMP4
JMP1
A0 address select input. These jumpers determine where the
address select pin is connected. This setting connects A0 to
GND.
JMP5–JMP8
JMP5
A1 address select input. These jumpers determine where the
address select pin is connected. This setting connects A1 to
GND.
JMP9
VDUT
INA209 Evaluation Module
This jumper determines where the INA209 gets its power supply.
In the VDUT position, the EVM provides power. In the Vs_Ext
position, the power is connected externally.
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209EVM Hardware Setup
www.ti.com
Table 4 indicates the function and default position of the USB-DIG-Platform jumpers. For most
applications, the default jumper position should be used. Table 5 and Table 6 describe the options for the
power-supply configuration. For example, the logic power supply can be changed from the default of 5V to
3V. A separate document (SBOU058) gives details regarding the operation and design of the USB Dig
platform.
Table 4. USB DIG Platform Jumper Settings
Jumper
Default
Purpose
JUMP1
EXT
This jumper selects external power or bus power. External
power is applied on J5 (on USB DIG board) or T3 (9V dc). Bus
power is 5V from the USB bus. External power is typically used
because the USB bus power is noisy.
JUMP2
EXT
This jumper selects external power or bus power. External
power is applied on J5 (on USB DIG board) or T3 (9V dc). Bus
power is 5V from the USB bus. External power is typically used
because the USB bus power is noisy.
JUMP3
EE ON
JUMP4
L
This sets the address for the USB board. The only reason to
change from the default is if multiple boards are being used.
JUMP5
L
This sets the address for the USB board. The only reason to
change from the default is if multiple boards are being used.
JUMP9
5V
JUMP10
WP ON
This write protects the firmware EEPROM.
JUMP11
WP ON
This write protects the calibration EEPROM.
JUMP13
Reg
JUMP14
9V
This jumper determines where the INA209 gets its power supply.
In the VDUT position, the EVM provides power. The default is the
VDUT position. In the Vs_Ext position, the power is connected
externally.
This selects the voltage of the device under test supply
(VDUT = 5V or 3V)
Uses the regulator output to generate the VDUT supply. The USB
bus can be used as the VDUT supply.
Uses external power (9V as apposed to the bus).
While in the BUS position, VDUT operation is normal. While in the
VRAW position, the VDUT supply is connected to an external
source. This allows for any value of VDUT between 3V and 5V.
CAUTION
JUMP17
BUS
JUMP18
VDUT
When JUMP17 is in the
VRAW position, adjusting
the VDUT voltage beyond
the 3V to 5V range will
damage the EVM.
Connects the pull-up resistor on the GPIO to the VDUT supply or
the VCC supply.
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Evaluation Module
15
INA209EVM Hardware Setup
www.ti.com
Table 5. Power-Supply Jumper Configuration #1
Mode
Jumper
Comment
External Power—5V
(default jumper settings)
JUMP17 = BUS (not used)
JUMP13 = REG
JUMP14 = 9V
JUMP1 = EXT
JUMP2 = EXT
JUMP6 = 5V
JUMP7 = REF
In this mode, all power is supplied to the EVM via J5 (on USB DIG board) or
T3. The external supply must be between 5.8V and 10.4V for proper
operation. All digital I/Os are regulated to 5V using U19 (REG101).
External Power—3V
(typical jumper settings)
JUMP17 = BUS (not used)
JUMP13 = REG
JUMP14 = 9V
JUMP1 = EXT
JUMP2 = EXT
JUMP6 = 3V
JUMP7 = REF
In this mode, all power is supplied to the EVM via J5 (on USB DIG board) or
T3. The external supply must be between 5.8V and 10.4V for proper
operation. All digital I/Os are regulated to 3V using U19 (REG101).
External Power—Variable
Supply
JUMP17 = Vraw
JUMP13 = BUS
JUMP14 = 9V (not used)
JUMP1 = EXT
JUMP2 = EXT
JUMP6 = 5V (not used)
JUMP7 = REG (ratiometric
mode)
In this mode, all the digital I/Os are referenced to the supply that is attached
to either J5 (on USB DIG board) or T3.
CAUTION
It is absolutely critical that the
supply voltage does not exceed
5.5V in this mode.
The supply is directly applied to devices with 5.5V absolute maximum ratings.
This mode of operation is useful when a device supply other then 3.0V or
5.0V is required.
Table 6. Power-Supply Jumper Configuration #2
16
Mode
Jumper
Comment
Bus Power—5V
JUMP17 = BUS
JUMP13 = BUS
JUMP14 = 9V (not used)
JUMP1 = BUS
JUMP2 = BUS
JUMP6 = 5V (not used)
JUMP7 = REG (ratiometric
mode, 5V supply)
In this mode, the USB bus completely powers the EVM. The USB bus is
regulated by the master (computer) to be 5V. This mode relies upon
external regulation. This mode is recommended only when an external
9V supply is not available. If an external 9V supply is available, use
either External Power 5V mode or External Power 3V mode.
Bus Power—3V
JUMP17 = BUS (not used)
JUMP13 = REG
JUMP14 = BUS
JUMP1 = BUS
JUMP2 = BUS
JUMP6 = 3V
JUMP7 = REG (ratiometric
mode, 5V supply)
In this mode, the USB bus completely powers the EVM. The regulator
(U19, REG101) is used to generate a 3V supply for all digital I/O.
INA209 Evaluation Module
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209EVM Hardware Setup
www.ti.com
3.7
Connecting External Power to the INA209EVM
The INA209 power supply (VS) operates over the range of 3V to 5.5V (see the INA209 product data
sheet). The default jumper position provides 5V to the INA209 from the USB-DIG-Platform. The power
from the USB-DIG-Platform can be changed to 3V using JUMP9.
Another option is to connect power to the INA209 power supply (VS) using an external power supply. In
this case, connect power to the T3 terminal block and set JMP1 to the Vs_EXT positon. The INA209
power supply (VS) operates over the range of 3V to 5.5V, so be careful to not exceed this range.
3.8
Connecting External Signals to the INA209EVM
The INA209 shunt and bus voltages are applied via terminal block T4. The T4 terminal block is a direct
connection to VIN+ and VIN– of the INA209. The bus voltage is monitored on VIN– (26V max). The shunt
voltage is the difference between VIN– and VIN+ (320mV max). Refer to the INA209 data sheet for more
details
4
INA209 Software Overview
This section explains how to install and use the INA209 software.
4.1
Operating Systems for the INA209 Software
The INA209 software has been tested on Windows XP with United States and European regional settings.
The software should also function on other Windows operating systems. Please report any compatibility
issues to precisionamps@list.ti.com.
4.2
INA209EVM Software Install
Install the INA209EVM software by following these steps:
1. Software can be downloaded from the INA209EVM web page, or from the disk included with the
INA209EVM, which contains a folder called Install_software/.
2. Find the file called setup.exe. Double-click the file to start the installation process.
3. Follow the on-screen prompts to install the software.
4. To remove the application, use the Windows Control Panel utility, Add/Remove Software.
5. The INA209 Quickstart Video (included on the CD), or available at www.ti.com, gives more details
regarding the initialization of the software.
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Evaluation Module
17
INA209 Software Overview
4.3
www.ti.com
Starting the INA209EVM Software
Use the Windows Start menu to start the INA209 software. From Start, select All Programs, then select
the INA209EVM program. Figure 11 shows the software display if the EVM is functioning properly.
Figure 11. INA209EVM Software—Functioning Properly
18
INA209 Evaluation Module
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Software Overview
www.ti.com
Figure 12 shows an error that appears if the computer cannot communicate with the EVM. If this error
occurs, check to see that the USB cable is connected. This error can also happen if the USB cable is
connected prior to connecting the USB Dig platform 9V power. Another possible reason for this error
message is a problem with the USB human interface device driver of the computer. Make sure that the
computer recognizes the device when the USB cable is plugged in. If the sound is on, you will hear the
distinctive sound that you expect when a USB device is properly connected to a PC with the Windows
operating system.
Figure 12. INA209EVM Software—No Communication With the USB Dig Platform
See Figure 13 for an error that will occur if the INA209 test board is not communicating with the USB Dig
platform. If you get this error, check the connectors between the two boards; make sure the two 25-pin Dsub connectors are completely pushed together. Another possible cause for this error is it that the INA209
test board jumpers are set in the wrong positions.
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Evaluation Module
19
INA209 Software Overview
4.4
www.ti.com
Using the INA209 Software
The INA209EVM software has 10 different tabs that allow you to access different features of the INA209.
The first seven tabs were designed for complete configuration of the device by stepping through these
tabs in order. Each of these tabs are intended to have an intuitive graphical interface that allows users to
develop a better understanding of the INA209.
Figure 13. INA209EVM Software—No Communication Between the USB Dig Platform and the INA209
4.4.1
Software Overview Tab
This tab has the following controls:
• Turn on and off the power supply
• Set the I2C address
• Set the logic value on the GPIO and Convert pins
• Read the logic values on the Alert, Critical, Overlimit, and Warning pins
20
INA209 Evaluation Module
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Software Overview
www.ti.com
4.4.2
A/D Config Tab
Controls on this tab:
• Shunt voltage attenuator range (smallest range is 40mV, largest range is 320mV).
• Shunt voltage configuration—Resolution and number averages. Note that increasing the number of
averages will decrease noise, but will slow down the conversion rate.
• Bus voltage attenuator range (16V and 32V)—Note that the maximum bus voltage for the INA209 is
26V. Therefore, the 32V range cannot be fully used.
• Bus voltage configuration—Resolution and number averages. Note that increasing the number of
averages will decrease noise but will slow down the conversion rate.
• A/D converter mode—This control determines how the converters work. The most commonly used
mode is the shunt and bus continuous conversion mode. This mode causes both converters to run
continuously.
NOTE: More details on these options are explained in the INA209 data sheet and the data sheet
sections Register Details and Data Output Registers.
4.4.3
Calibrate Tab
The calibration tab allows users to enter some information regarding a specific INA209 configuration. This
information is used to compute the Full Scale Cal Register. The Full Scale Cal Register converts shunt
voltage to current voltage. The detailed mathematics behind this calibration feature are given in the
INA209 data sheet section, Calibration Register Scaling . Also, this feature is explained in a step-by-step
manner in the QuickStart Video.
4.4.4
Warning Tab
The warning tab allows you to completely configure the warning feature on the INA209. Specifically, there
are warning limit registers for Power, Bus Overvoltage, Bus Undervoltage, Shunt Voltage Positive, and
Shunt Voltage Negative. If an INA209 reading exceeds the value in a warning limit register, the INA209
warning will trip. Other options on the warning feature are also set on this tab (for instance, the delay,
polarity, latch enable, and output enable). See the Warning/Watchdog Registers section of the INA209
data sheet.
4.4.5
Overlimit Tab
The overlimit tab allows you to completely configure the overlimit feature on the INA209. Specifically, there
are overlimit limit registers for Power, Bus Overvoltage, and Bus Undervoltage. If an INA209 reading
exceeds the value in a overlimit limit register, the INA209 overlimit will trip. Other options on the warning
feature are also set on this tab (for example, the delay, polarity, latch enable, and output enable). See the
Over-Limit/Critical Watchdog Registers section of the INA209 data sheet.
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Evaluation Module
21
INA209 Software Overview
4.4.6
www.ti.com
Critical Fault Tab
The Critical Fault tab allows complete configuration of the Critical Fault feature on the INA209. The Critical
Fault feature is an analog path that will trigger when the shunt voltage exceeds a specific level. The level
is set by the Critical DAC+ and the Critical DAC– controls. Hysteresis, polarity, latch enable, and output
enable options can also be set. See the Over-Limit/Critical Watchdog Registers section of the INA209
data sheet.
4.4.7
SMB Alert Tab
The SMB Alert tab sets the Alert mask register. This register configures the INA209 to allow some events
to cause an SMB Alert, while preventing (or masking) other events from causing an Alert. This tab allows
the Alert output to be enabled or disabled.
4.4.8
Scaling Overview Tab
This tab allows you to see how the mathematics work in the INA209. Specifically, this tab shows how the
current and power values are computed using the full-scale calibration register.
4.4.9
Graph Tab
The graph tab displays bus voltage, shunt current, and power versus time when the software is in
continuous convert mode.
4.4.10
Registers Tab
This tab allows reading and editing of all the registers in the INA209. All the previous tabs will affect the
register listing. For example, changing the A/D configuration in tab 2 will affect Register 0 in the register
list. It is also true that changing Register 0 will update the A/D configuration on tab 2. Thus, the graphical
representation and register representation affect each other.
22
INA209 Evaluation Module
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Software Overview
www.ti.com
4.5
EVM Controls Pull-Down Menu
The INA209 configuration (such as register settings) can be saved or loaded using the EVM Controls pulldown menu, as shown in Figure 14. The file that the configuration is saved into is a simple text file and
can be viewed with any text editor.
Figure 14. EVM Controls Pull-Down Menu
4.6
Help Pull-Down Menu
The About feature can be used to check the current revision. This document is based on revision 1.0.9, as
shown in Figure 15.
Figure 15. Current Revision of Software
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
INA209 Evaluation Module
23
Bill of Materials
5
www.ti.com
Bill of Materials
Table 7 shows the parts list for the INA209 test board.
Table 7. Parts List for the INA209 Test Board
Quantity
Value
6
4.02kΩ
R5–R10
Resistor, 4.02kΩ, 603
ROHM
MCR03EZPFX4021
8
10kΩ
R3, R4,
R11–R16
Resistor, 10kΩ, 603
Yageo
Corporation
RC0603FR-0710KL
2
10Ω
R1, R2
RES 10.0Ω 1/10W 1% 0603 SMD
Yageo
Corporation
RC0603FR-0710RL
1
10μF
C2
Capacitor, Tantalum, 10μF, 16V, 6032
Kemet
T491C106M016AT
2
0.1μF
C3, C4
Capacitor, Ceramic, 0.1μF, 1206, X7R
Yaego Electric
CC1206KRX7R9BB104
1
1000pF
C1
X2Y® Cap
Johanson
500X18N102MV4
6
LED
D1–D6
Diode, LED, Ultra Bright Diff, 603
Panasonic
LNJ208R8ARA
AMP/Tyco
Electronics
5747842-4
24
RefDes
Description
Vendor
Part Number
1
DSUB25M
J1
Conn D-Sub Plug R/A 25pos 30gold (with threaded
inserts and board locks)
1
DSUB25F
J2
Conn D-Sub Rcpt R/A 25pos 30gold (with threaded
inserts and board locks)
AMP/Tyco
Electronics
5747846-4
8
JUMP2 Cut to Size
JMP1–JMP8
Conn, Header, 0.100, 36pos (18 jumpers/strip)
3M/ESD
929647-09-36-I
1
JUMP3 Cut to Size
JMP9
Conn, Header, 0.100, 36pos (12 jumpers/strip)
3M/ESD
929647-09-36-I
16
TP Cut to Size
All Test Points
Conn, Header, 0.100, 36pos (36 test points/strip)
3M/ESD
929647-09-36-I
Keystone
2203
6
Standoff
None
Standoffs, Hex , 4-40 Threaded, 0.500" Length,
0.250" OD, Aluminum Iridite Finish
6
Screw
None
Screw, Machine, Phil 4-40X1/4 SS
Building
Fasteners
PMSSS 440 0025 PH
4
2-Pin Connector
T3–T6
2-Position Terminal Strip, Cage Clamp, 45°, 15A,
Dove-tailed
On-Shore
Technology Inc
ED300/2
2
3-Pin Connector
T1, T2
3-Position Terminal Strip, Cage Clamp, 45°, 15A,
Dove-tailed
On-Shore
Technology Inc
ED300/3
1
INA209
U1
IC Curr/Pwr Mon Bi-Dir 16-TSSOP
Texas
Instruments
INA209AIPWR
INA209 Evaluation Module
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
Revision History
www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from A Revision (February, 2010) to B Revision ............................................................................................ Page
•
•
•
•
•
Changed Figure 1 ......................................................................................................................... 2
Added "Barrel plug cable" to the kit items list in Section 1.1 ........................................................................ 3
Added new paragraph and NOTE to Section 2.4 ..................................................................................... 9
Added "(on USB DIG board)" to J5 in Table 4 ...................................................................................... 15
Added "(on USB DIG board)" to J5 in Table 4 ...................................................................................... 16
Revision History
Changes from Original (February, 2008) to A Revision ................................................................................................. Page
•
•
•
•
Revised Table 4 ..........................................................................................................................
Added Table 5 and Table 6 ............................................................................................................
Added Section 3.7 .......................................................................................................................
Added Section 3.8 .......................................................................................................................
SBOU055B – February 2008 – Revised May 2016
Submit Documentation Feedback
Copyright © 2008–2016, Texas Instruments Incorporated
Revision History
15
16
17
17
25
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
SPACER
SPACER
SPACER
SPACER
SPACER
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
SPACER
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
spacer
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
