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INA233AIDGSR

INA233AIDGSR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VSSOP10

  • 描述:

    INA233AIDGSR

  • 数据手册
  • 价格&库存
INA233AIDGSR 数据手册
Order Now Product Folder Support & Community Tools & Software Technical Documents INA233 SBOS790 – APRIL 2017 INA233 High-Side or Low-Side Measurement, Bidirectional Current and Power Monitor With I2C-, SMBus-, and PMBus-Compatible Interface 1 Features 3 Description • • • • The INA233 device is a current, voltage, and power monitor with an I2C-, SMBus-, and PMBus-compatible interface that is compliant with digital bus voltages from 1.8 V to 5.0 V. The device monitors and reports values for current, voltage, and power. The integrated power accumulator can be used for energy or average power calculations. Programmable calibration value, conversion times, and averaging when combined with an internal multiplier enable direct readouts of current in amperes and power in watts. 1 • • • • • • • Senses Bus Voltages From 0 V to 36 V High-Side or Low-Side Sensing Reports Current, Voltage, and Power Integrated Power Accumulator for Energy and Average Power Monitoring High Accuracy: – 0.1% Gain Error (Max) – 10-µV Offset (Max) Configurable Averaging Options Independent Alert Limits for Current, Bus Voltage, and Power 1.8-V Compliant I2C, SMBus, PMBus Interface 16 Programmable Addresses Operates From a 2.7-V to 5.5-V Power Supply 10-Pin, DGS (VSSOP) Package 2 Applications • • • • • • • The INA233 senses current on common-mode bus voltages that can vary from 0 V to 36 V, independent of the supply voltage. The device operates from a single 2.7-V to 5.5-V supply, drawing a typical supply current of 310 µA in normal operation. The device can be placed in a low-power standby mode where the typical operating current is only 2 µA. The device is specified over the operating temperature range between –40°C and +125°C and features up to 16 programmable addresses. Servers Telecom Infrastructure High-Performance Computing Power Metering Battery Chargers Power Supply Test Equipment Device Information(1) PART NUMBER INA233 PACKAGE VSSOP (10) BODY SIZE (NOM) 3.00 mm x 3.00 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. High-Side or Low-Side Sensing Application Sup ply Vo ltag e (2.7 V to 5.5 V) C BYPASS 0.1 µF Bus Voltage (0 V to 36 V) INA233 HighSide Shu nt VS VBUS u Power Register SDA SCL Power Accumulator Loa d V IN+ LowSide Shu nt Curren t Re gister ADC I2C-, SMBus-, PMBus Compatible Inte rface I IN- Voltage Register ALE RT A0 Aler t Register A1 GND Copyright © 201 7, Texas Instrumen ts Incorpor ate d 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. INA233 SBOS790 – APRIL 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics ............................................. 7.6 Register Maps ......................................................... 23 8 8.1 Application Information............................................ 41 8.2 Typical Application .................................................. 41 9 Power Supply Recommendations...................... 44 10 Layout................................................................... 44 10.1 Layout Guidelines ................................................. 44 10.2 Layout Example .................................................... 44 11 Device and Documentation Support ................. 45 11.1 11.2 11.3 11.4 11.5 11.6 11.7 Detailed Description ............................................ 11 7.1 7.2 7.3 7.4 7.5 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ Programming........................................................... Application and Implementation ........................ 41 11 11 11 13 15 Device Support .................................................... Documentation Support ........................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 45 45 45 45 45 45 45 12 Mechanical, Packaging, and Orderable Information ........................................................... 45 4 Revision History 2 DATE REVISION NOTES April 2017 * Initial release. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 5 Pin Configuration and Functions DGS Package 10-Pin VSSOP Top View A1 1 10 IN+ A0 2 9 IN± ALERT 3 8 VBUS SDA 4 7 GND SCL 5 6 VS Not to scale Pin Functions PIN NAME NO. I/O DESCRIPTION A0 2 Digital input Address pin. Connect to GND, SCL, SDA, or VS. Table 3 lists the pin settings and corresponding addresses. A1 1 Digital input Address pin. Connect to GND, SCL, SDA, or VS. Table 3 lists the pin settings and corresponding addresses. ALERT 3 Digital output GND 7 Analog IN– 9 Analog input Connect to the load side of the shunt resistor IN+ 10 Analog input Connect to the supply side of the shunt resistor SCL 5 Digital input Serial bus clock line, open-drain input SDA 4 Digital I/O VBUS 8 Analog input VS 6 Analog PMBus-compatible multifunctional alert, open-drain output. This pin alerts on independent settings for overcurrent, under- and overvoltage, and overpower conditions. Ground Serial bus data line, open-drain input/output Bus voltage input Power supply, 2.7 V to 5.5 V Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 3 INA233 SBOS790 – APRIL 2017 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN VVS MAX UNIT 6 V Supply voltage Differential (VIN+ – VIN–) Analog Inputs, IN+, IN– (2) Common-mode –40 40 –0.3 40 –0.3 40 V V V VVBUS VBUS pin voltage VSDA SDA, SCL pin voltages GND – 0.3 6 VA A0, A1 pin voltages GND – 0.3 6 V IIN Input current into any pin 5 mA IOUT Open-drain digital output current 10 mA TJ Junction temperature 150 °C Tstg Storage temperature 150 °C (1) (2) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. IN+ and IN– can have a differential voltage between –40 V and 40 V. However, the voltage at these pins must not exceed the range of –0.3 V to 40 V. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 Electrostatic discharge (1) ±2500 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX 0 36 UNIT VCM Common-mode input voltage V VVS Operating supply voltage 2.7 5.5 V TA Operating free-air temperature –40 125 °C 6.4 Thermal Information INA233 THERMAL METRIC (1) DGS (VSSOP) UNIT 10 PINS RθJA Junction-to-ambient thermal resistance 171.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 42.9 °C/W RθJB Junction-to-board thermal resistance 91.8 °C/W ψJT Junction-to-top characterization parameter 1.5 °C/W ψJB Junction-to-board characterization parameter 90.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 6.5 Electrical Characteristics at TA = 25°C, VVS = 3.3 V, VIN+ = 12 V, VSENSE = (VIN+ – VIN–) = 0 mV, and VVBUS = 12 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUT Shunt voltage input range –81.92 81.9175 Bus voltage input range (1) 0 36 CMRR Common-mode rejection ratio VOS Offset voltage, RTI (2) VOS (RTI (2)) vs temperature PSRR Power-supply rejection ratio (RTI (2)) IB Input bias current (IIN+, IIN– pins) 0 V ≤ VIN+ ≤ 36 V Shunt voltage Bus voltage Shunt voltage, –40°C ≤ TA ≤ +125°C Bus voltage, –40°C ≤ TA ≤ +125°C Shunt voltage, 2.7 V ≤ VS ≤ 5.5 V Bus voltage VBUS input impedance Input leakage (3) (IN+) + (IN–), power-down mode 126 mV V 140 dB ±2.5 ±10 µV ±1.25 ±7.5 mV 0.02 0.1 10 40 µV/°C 1 µV/V 0.5 mV/V 8 μA 830 kΩ 0.1 0.5 µA DC ACCURACY ADC native resolution 1-LSB step size 16 Shunt voltage Bus voltage Shunt voltage gain error Shunt voltage gain error vs temperature –40°C ≤ TA ≤ +125°C Bus voltage gain error DNL tCT Bus voltage gain error vs temperature –40°C ≤ TA ≤ +125°C Power gain error VBUS = 12 V, VIN+ – VIN– = –80 mV to 80 mV Power gain error vs temperature –40°C ≤ TA ≤ +125°C Differential nonlinearity ADC conversion time Bits 2.5 μV 1.25 mV 0.02% 0.1% 5 25 0.02% 0.1% 10 50 0.05% 0.2% 10 50 ±0.1 ppm/°C ppm/°C ppm/°C LSB CT bit = 000 140 154 CT bit = 001 204 224 CT bit = 010 332 365 CT bit = 011 588 646 CT bit = 100 1.1 1.21 CT bit = 101 2.116 2.328 CT bit = 110 4.156 4.572 CT bit = 111 8.244 9.068 28 35 µs ms SMBus SMBus timeout (4) (1) (2) (3) (4) ms Although the input range is 36 V, the full-scale range of the ADC scaling is 40.96 V; see the High-Accuracy Analog-to-Digital Convertor (ADC) section. Do not apply more than 36 V. RTI = Referred-to-input. Input leakage is positive (current flowing into the pin) for the conditions shown at the top of this table. Negative leakage currents can occur under different input conditions. SMBus timeout in the INA233 resets the interface whenever SCL is low for more than 28 ms. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 5 INA233 SBOS790 – APRIL 2017 www.ti.com Electrical Characteristics (continued) at TA = 25°C, VVS = 3.3 V, VIN+ = 12 V, VSENSE = (VIN+ – VIN–) = 0 mV, and VVBUS = 12 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DIGITAL INPUT/OUTPUT Input capacitance 3 Leakage input current 0 V ≤ VSCL ≤ VVS, 0 V ≤ VSDA ≤ VVS, 0 V ≤ VAlert ≤ VVS, 0 V ≤ VA0 ≤ VVS, 0 V ≤ VA1 ≤ VVS VIH High-level input voltage SDA pin VIL Low-level input voltage SDA pin VOL Low-level output voltage IOL = 3 mA, SDA and ALERT pins 0 0.5 pF 2 µA 1.4 6 V –0.3 0.4 V 0.4 V Hysteresis 500 mV POWER SUPPLY Operating supply range IQ VPOR 6 2.7 5.5 V 310 400 µA Quiescent current, power-down (shutdown) mode 2 5 µA Power-on-reset (POR) threshold voltage 2 Quiescent current Submit Documentation Feedback V Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 6.6 Typical Characteristics at TA = 25°C, VVS = 3.3 V, VIN+ = 12 V, VSENSE = (VIN+ – VIN–) = 0 mV, and VVBUS = 12 V (unless otherwise noted) 0 −10 Population Gain (dB) −20 −30 −40 −50 10 7.5 5.0 G001 2.5 100k 0.0 10k -2.5 100 1k Frequency (Hz) -5.0 10 -7.5 1 -10 −60 D002 Input Offset Voltage (PV) Figure 1. Frequency Response Figure 2. Shunt Input Offset Voltage Production Distribution 160 1 Common-Mode Rejection Ratio (dB) 0.8 0.6 Offset (PV) 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -50 -25 0 25 50 75 Temperature (qC) 100 125 140 120 100 80 -50 150 -25 0 D003 Figure 3. Shunt Input Offset Voltage vs Temperature 25 50 75 Temperature (qC) 100 125 150 D004 Figure 4. Shunt Input CMRR vs Temperature 100 80 Population Gain Error (m%) 60 40 20 0 -20 -40 -60 0.04 0.03 0.02 0.01 0 -0.01 -0.02 -0.03 -0.04 -0.05 -0.06 -80 -100 -50 -25 0 25 50 75 Temperature (qC) 100 125 D005 150 D006 Input Gain Error (%) Figure 5. Shunt Input Gain Error Production Distribution Figure 6. Shunt Input Gain Error vs Temperature Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 7 INA233 SBOS790 – APRIL 2017 www.ti.com Typical Characteristics (continued) at TA = 25°C, VVS = 3.3 V, VIN+ = 12 V, VSENSE = (VIN+ – VIN–) = 0 mV, and VVBUS = 12 V (unless otherwise noted) 100 80 40 Population Gain Error (m%) 60 20 0 -20 -40 -60 -80 4 3 2 1 0 Bus Input Offset Voltage (mV) D007 Figure 7. Shunt Input Gain Error vs Common-Mode Voltage -1 36 -2 32 -3 8 12 16 20 24 28 Common - Mode Input Voltage (V) -4 4 -5 0 -6 -100 D008 Figure 8. Bus Input Offset Voltage Production Distribution 0 -0.5 -1 Population Offset (mV) -1.5 -2 -2.5 -3 -3.5 -4 D009 0.05 0.04 0.03 0.02 150 0.01 125 0.0 100 -0.01 25 50 75 Temperature (qC) -0.02 0 -0.03 -25 -0.04 -5 -50 -0.05 -4.5 Bus Gain Error (%) Figure 9. Bus Input Offset Voltage vs Temperature D010 Figure 10. Bus Input Gain Error Production Distribution 100 80 40 20 Population Gain Error (m%) 60 0 -20 -40 -60 D011 Figure 11. Bus Input Gain Error vs Temperature 8 Power Gain Error (%) 0.15 0.12 0.09 0.06 150 0.03 125 0 100 -0.03 25 50 75 Temperature (qC) -0.06 0 -0.09 -25 -0.12 -100 -50 -0.15 -80 D012 Figure 12. Power Gain Error Production Distribution Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 Typical Characteristics (continued) at TA = 25°C, VVS = 3.3 V, VIN+ = 12 V, VSENSE = (VIN+ – VIN–) = 0 mV, and VVBUS = 12 V (unless otherwise noted) 200 150 Gain Error (m%) 100 Population 50 0 -50 -100 D013 0.4 0.32 0.24 0.16 150 0.08 125 0 100 -0.08 25 50 75 Temperature (qC) -0.16 0 -0.24 -25 -0.32 -200 -50 -0.4 -150 D023 CMR (PV/V) Figure 13. Power Gain Error vs Temperature Figure 14. Input Common-Mode Rejection Distribution 25 Population Input Bias Current (PA) 20 15 10 5 5 4 3 2 1 0 -1 -2 -3 -4 -5 0 PSR (PV/V) 0 4 D024 8 12 16 20 24 28 Common - Mode Input Voltage (V) 32 36 D016 (IN+) + (IN–) Figure 16. Input Bias Current vs Common-Mode Voltage Figure 15. Power-Supply Rejection Distribution 20 1.4 1.2 Bias Current - Shutdown (PA) Bias Current (PA) 19 18 17 16 15 14 -50 1 0.8 0.6 0.4 0.2 0 -25 0 25 50 75 Temperature (qC) 100 125 150 -0.2 -50 D017 (IN+) + (IN–) -25 0 25 50 75 Temperature (qC) 100 125 150 D018 (IN+) + (IN–) Figure 17. Input Bias Current vs Temperature Figure 18. Input Bias Shutdown Current vs Temperature Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 9 INA233 SBOS790 – APRIL 2017 www.ti.com Typical Characteristics (continued) at TA = 25°C, VVS = 3.3 V, VIN+ = 12 V, VSENSE = (VIN+ – VIN–) = 0 mV, and VVBUS = 12 V (unless otherwise noted) 420 Quiescent Current - Shutdown (PA) 6.5 Quiescent Current (PA) 390 360 330 300 270 240 -50 -25 0 25 50 75 Temperature (qC) 100 125 5.5 4.5 3.5 2.5 1.5 -50 150 Figure 19. Active IQ vs Temperature Quiescent Current - Shutdown (PA) Quiescent Current (PA) 25 50 75 Temperature (qC) 100 125 150 D020 Figure 20. Shutdown IQ vs Temperature 340 320 10k 100k Frequency (Hz) 1M 2M 60 40 20 0 1k D021 Figure 21. Active IQ vs SCL Frequency 10 0 80 360 300 1k -25 D019 Submit Documentation Feedback 10k 100k Frequency (Hz) 1M 2M D022 Figure 22. Shutdown IQ vs SCL Frequency Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 7 Detailed Description 7.1 Overview The INA233 is a digital current-sense amplifier with an I2C-, SMBus-, and PMBus-compatible interface. The device provides digital current, voltage, and power readings necessary for accurate decision-making in preciselycontrolled systems. The INA233 also has a built-in power accumulator that can be used for energy or average power measurements. Programmable out-of-range limits can be set to issue alerts when the voltage, current, or power is outside the normal range of operation. The integrated analog-to-digital converter (ADC) can be set to different averaging modes and configured for continuous-versus-triggered operation. The Register Maps section provides detailed register information for the INA233. 7.2 Functional Block Diagram Power Accumulator Power Bus Voltage Current Shunt Voltage Channel Bus Voltage Channel ADC Calibration Shunt Voltage Copyright © 2017, Texas Instruments Incorporated 7.3 Feature Description 7.3.1 High-Accuracy Analog-to-Digital Convertor (ADC) The INA233 integrates a highly accurate, 16-bit, delta-sigma (ΔΣ) ADC. This ADC is multiplexed to process both the shunt voltage and bus voltage measurements. The shunt voltage measurement is a differential measurement of the voltage developed when the load current flows through a shunt resistor as measured at the IN+ and IN– pins. The shunt voltage measurement has an maximum offset voltage of only 10 µV and a maximum gain error of only 0.1%. The low offset voltage of the shunt voltage measurement allows for increased accuracy at light load conditions for a given shunt resistor value. Another advantage of low offset is the ability to sense lower voltage drop across the sense resistor accurately, thus allowing for a lower-value shunt resistor. Lower-value shunt resistors reduce power loss in the current-sense circuit and help improve the power efficiency of the end application. The device can also measure the power-supply bus voltage by connecting this voltage to the VBUS pin. Internally, the voltage at VBUS is divided down to a voltage that can be measured by the ADC. The impedance of the VBUS pin to ground is approximately 830 kΩ. The differential shunt voltage is measured between the IN+ and IN– pins and the bus voltage is measured between the VBUS pin and GND. The device takes two measurements: shunt voltage and bus voltage. The INA233 then converts these measurements to current, based on the calibration register value, and then calculates power; see the Calibration Register and Scaling section for additional information on programming the calibration register. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 11 INA233 SBOS790 – APRIL 2017 www.ti.com Feature Description (continued) Although the device can be read at any time, and the data from the last conversion remain available, the conversion ready flag bit (MFR_ALERT_MASK, conversion ready bit) is provided to help coordinate one-shot or triggered conversions. The conversion ready bit is set after all conversions, averaging, and multiplication operations are complete. The conversion ready bit clears under these conditions: • Writing to the MFR_ADC_CONFIG register, except when configuring the MODE bits for power-down mode; or • Reading the MFR_ALERT_MASK register 7.3.2 Interleaved Power Calculation The current and shunt voltage measurements are interleaved to minimize time alignment errors in the power measurement. Figure 23 shows that power is calculated following the bus voltage measurement based on the previous current calculation and bus voltage measurement. The power calculation is performed in the background and does not add to the overall conversion times for bus voltage or current. These current and power values are considered intermediate results (unless the averaging is set to 1) and are stored in an internal accumulation register instead of the corresponding output registers. Following every measured sample, the newly-calculated values for current and power are appended to this accumulation register until all samples are measured and averaged based on the number of averages set in the MFR_ADC_CONFIG register. Bus and Power Limit Detect Following Every Bus Voltage Conversion Current Limit Detect Following Every Shunt Voltage Conversion I V I P V I P V I P V I P V I P V I P V I P V I P V I V P I P V I P V I P V I P V I P V I P V P Power Average Bus Voltage Average Shunt Voltage Average Figure 23. Power Calculation Scheme In addition to the current and power accumulating after every sample, the shunt and bus voltage measurements are also collected. After all samples are measured and the corresponding current and power calculations are made, the accumulated average for each parameter is then loaded to the corresponding output registers and can then be read. 7.3.3 Power Accumulator and Energy Measurement The INA233 has an integrated power accumulator that records the total accumulated power and the corresponding sample count and rollover counts. The accumulated power and sample count is accessible through the READ_EIN PMBus command and can be used for both energy metering and on-demand average power calculations. The READ_EIN section details how to use the power accumulator for both average power and energy calculations. 7.3.4 I2C-, SMBus-, and PMBus-Compatible Digital Interface The INA233 features an I2C-compatible, 2-wire interface with an open-drain alert output. The data transfer format is SMBus version 3.0 compliant and the device supports multiple PMBus commands that allow the device to be easily used along side PMBus version 1.3 devices. Logic levels of 0.4 V (maximum VIL) and 1.4 V (minimum VIH) allow the device to be used with digital bus voltages ranging from 1.8 V to 5.0 V (5.5-V maximum operating). The digital interface can support clock speeds as high as 400 kHz and offers packet error checking for increased communications robustness. The device supports group protocol as defined in the PMBus version 1.3.1 specification that allows the host processor to easily communicate with multiple devices on the bus. 12 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 Feature Description (continued) 7.3.5 Multiple Fault Event Reporting The INA233 open-drain ALERT pin can report if any of the following errors simultaneously occur: • Overcurrent warning • Overpower warning • Bus overvoltage warning • Bus undervoltage warning • Communication faults • ADC overflow • Conversion ready The warning thresholds for the current, power, and bus voltages are set with the IOUT_OC_WARN_LIMIT, PIN_OP_WARN_LIMIT, VIN_UV_WARN_LIMIT, and VIN_OV_WARN_LIMIT standard PMBus commands. Various bus communications faults are supported as outlined in the STATUS_CML PMBus command. The status for the conversion ready and ADC overflow bits can be monitored by the STATUS_MFR_SPECIFIC command. The conversion ready bit notifies when the device completes the previous conversion and is ready to begin a new conversion. Conversion ready can be monitored at the ALERT pin along with one of the alert functions. If an alert function and the conversion ready are both enabled to be monitored at the ALERT pin, then after the ALERT pin is asserted, the MFR_ALERT_MASK register or the PMBus status registers must be read following the alert to determine the source of the alert. If the alert function is not used, the ALERT pin can be left floating without affecting device operation. 7.4 Device Functional Modes 7.4.1 Continuous verses Triggered Operation The internal ADC has two operating modes, continuous and triggered, that determine how the ADC operates following shunt voltage and bus voltage conversions. When the device is in normal operating mode, the INA233 continuously converts a shunt voltage reading followed by a bus voltage reading. After the shunt voltage reading, the current value is calculated. This current value is then used to calculate the power result. These values are subsequently stored in an accumulator, and the measurement and calculation sequence repeats until the number of averages set in the MFR_ADC_CONFIG register is reached. Following every sequence, the present set of values measured and calculated are appended to previously collected values. After all averaging completes, the final values for the shunt voltage, bus voltage, current, and power are updated in the corresponding registers that can then be read. The MFR_ADC_CONFIG command allows for selecting modes that only convert the shunt voltage or the bus voltage to further allow the monitoring function to be configured to better fit the specific application requirements. This command also allows the device to be configured in continuous-versus-triggered operation. In triggered mode, writing any of the triggered convert modes into the MFR_ADC_CONFIG register triggers a single-shot conversion. This action produces a single set of measurements; thus, to trigger another single-shot conversion, the MFR_ADC_CONFIG register must be written to a second time, even if the mode does not change. 7.4.2 Device Shutdown In addition to the two operating modes (continuous and triggered), the internal ADC also has a power-down mode that reduces the quiescent current and turns off current into the device inputs, reducing the effect of supply drain when the device is not being used. Full recovery from power-down mode requires 40 µs. The device registers can be written to and read from when the device is in power-down mode. The device remains in powerdown mode until one of the active modes settings is selected using the MFR_ADC_CONFIG command. 7.4.3 Averaging and Conversion Time Considerations The INA233 offers programmable conversion times (tCT) for both the shunt voltage and bus voltage measurements. The conversion times for these measurements can be selected from as fast as 140 µs to as long as 8.244 ms. The conversion time settings, along with the programmable averaging mode, allow the device to be configured to optimize the available timing requirements in a given application. For example, if a system requires that data be read every 5 ms, the device can be configured with the conversion times set to 588 µs for both Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 13 INA233 SBOS790 – APRIL 2017 www.ti.com Device Functional Modes (continued) shunt and bus voltage measurements and the averaging mode set to 4. This configuration results in the data updating approximately every 4.7 ms. The device can also be configured with a different conversion time setting for the shunt and bus voltage measurements. This type of approach is common in applications where the bus voltage tends to be relatively stable. This situation can allow for the time focused on the bus voltage measurement to be reduced relative to the shunt voltage measurement. The shunt voltage conversion time can be set to 4.156 ms with the bus voltage conversion time set to 588 µs and averaging mode set to 1. This configuration also results in data updating approximately every 4.7 ms. There are trade-offs associated with the settings for conversion time and the averaging mode used. The averaging feature can significantly improve the measurement accuracy by effectively filtering the signal. This approach allows the device to reduce any noise in the measurement that may be caused by noise coupling into the signal. A greater number of averages enables the device to be more effective in reducing the noise component of the measurement. The conversion times selected can also have an effect on the measurement accuracy. Figure 24 shows multiple conversion times to illustrate the effect of noise on the measurement. In order to achieve the highest accuracy measurement possible, use a combination of the longest allowable conversion times and highest number of averages, based on the timing requirements of the system. 10mV/div Conversion Time: 140ms Conversion Time: 1.1ms Conversion Time: 8.244ms 0 200 400 600 800 1000 Number of Conversions Figure 24. Noise vs Conversion Time 7.4.4 Filtering and Input Considerations Measuring current is often noisy and such noise can be difficult to define. The INA233 offers several options for filtering by allowing the conversion times and number of averages to be selected independently in the MFR_ADC_CONFIG register. The conversion times can be set independently for the shunt voltage and bus voltage measurements to allow added flexibility when configuring the monitoring of the power-supply bus. The internal ADC is based on a delta-sigma (ΔΣ) front-end with a 500-kHz (±10% max) sampling rate. This architecture has good inherent noise rejection; however, transients that occur at or very close to the sampling rate harmonics can cause problems. These signals are at 1 MHz and higher and can be managed by incorporating filtering at the device input. The high frequency enables the use of low-value series resistors on the filter with negligible effects on measurement accuracy. In general, filtering the device input is only necessary if there are transients at exact harmonics of the 500 kHz (±10% max) sampling rate (greater than 1 MHz). Filter using the lowest possible series resistance (typically 10 Ω or less) and a ceramic capacitor. Recommended values for this capacitor are between 0.1 µF and 1 µF. Figure 25 illustrates the device with a filter added at the input. 14 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 Device Functional Modes (continued) Sup ply Vo ltag e (2,7 V to 5.5 V) BUS Voltage (0 V to 36 V) C BYPASS 0.1 µF INA233 VBUS C FILTER 0.1 µF to 1 µF Ceramic Capacitor VS SDA SCL X Power Register R FILTER 7 10 2 IN+ Curren t Re gister ADC Voltage Register IC or SMBus Compatible Inte rface ALE RT INA0 R FILTER Loa d 7 10 Aler t Register A1 GND Copyright © 201 6, Texas Instrumen ts Incorpor ate d Figure 25. Input Filtering Overload conditions are another consideration for the device inputs. The device inputs are specified to tolerate 40 V across the inputs. A large differential scenario can be a short to ground on the load side of the shunt. This type of event can result in full power-supply voltage across the shunt (as long the power supply or energy storage capacitors can support this voltage). Removing a short to ground can result in inductive kickbacks that can exceed the 40-V differential and common-mode rating of the device. Inductive kickback voltages are best controlled by Zener-type, transient-absorbing devices (commonly called transzorbs) combined with sufficient energy storage capacitance. The Current Shunt Monitor with Transient Robustness Reference Design describes a high-side, current-shunt monitor used to measure the voltage developed across a current-sensing resistor and how to better protect the current-sense device from transient overvoltage conditions. In applications that do not have large energy storage electrolytics on one or both sides of the shunt, an input overstress condition can result from an excessive dV/dt of the voltage applied to the input. A hard physical short is the most likely cause of this event, particularly in applications with no large electrolytics present. This problem occurs because an excessive dV/dt can activate the ESD protection in the device in systems where large currents are available. Testing demonstrates that the addition of 10-Ω resistors in series with each input of the device sufficiently protects the inputs against this dV/dt failure up to the 40-V rating of the device. Selecting these resistors in the range noted has minimal effect on accuracy. 7.5 Programming The device can be used without any programming only when reading a shunt voltage drop and bus voltage with the default power-on reset configuration and with continuous conversion of the shunt and bus voltages. Without setting the device register with the MFR_CALIBRATION command, the device is unable to provide either a valid current or power value because these outputs are both derived using the values loaded into the calibration register. The MFR_CALIBRATION command sets the current LSB size based on the desired full-scale range and value of the shunt resistor. 7.5.1 Default Settings The default power-up states of the registers are shown in the Register Maps section. These registers are volatile and, if programmed to a value other than the default values listed in Table 4, must be reprogrammed at every device power-up. Detailed information on programming the calibration register specifically is given in the Programming section and calculated based on Equation 1. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 15 INA233 SBOS790 – APRIL 2017 www.ti.com Programming (continued) 7.5.2 Calibration Register and Scaling An important aspect of the INA233 is that the device does not necessarily measure current or power. The device measures both the differential voltage applied between the IN+ and IN– input pins and the voltage applied to the VBUS pin. By correctly setting the calibration register scaling with the MFR_CALIBRATION command, returned values are calculated in voltage, amperes, and watts by scaling the returned value by the appropriate lest significant bit value (LSB) or by using the PMBus direct mode equation (Equation 3). Equation 1 is used to obtain the value for the MFR_CALIGRATION register. This equation includes the term Current_LSB, which is the chosen value for the LSB for the READ_IIN command. As Equation 2 shows, the highest resolution for current measurements can be obtained by using the smallest allowable Current_LSB based on the maximum expected current. Although this value yields the highest resolution, the Current_LSB value is commonly selected as the nearest full number above this value to simplify the conversion of returned values for current and power to amperes and watts, respectively. The RSHUNT term is the value of the external shunt used to develop the differential voltage across the input pins. 0.00512 CAL = Current_LSB · R SHUNT where • 0.00512 is an internal fixed value used to ensure that scaling is maintained properly Current_LSB = Maximum Expected Current 215 (1) (2) After programming the calibration register, the values returned by the read current, power, and energy commands update accordingly based on the corresponding shunt voltage and bus voltage measurements. Returned values for voltage, current, and power are calculated by multiplying the appropriate LSB value by the returned value, or can be calculated with PMBus coefficients as detailed in the Reading and Writing Telemetry Data and Warning Thresholds section. The size of the Power_LSB is internally set as 25 times the selected Current_LSB. The voltage LSB for bus voltage (READ_VIN and READ_VOUT commands) and shunt voltage (MFR_READ_VSHUNT) are fixed at 1.25 mV/bit and 2.5 µV/bit, respectively. The MFR_CALIBRATION command allows the values returned by the READ_IN and READ_PIN commands to be scaled to the most useful value for a given application. For example, set the MFR_CALIBRATION register so that the largest possible number is returned by the READ_IN and READ_PIN commands at the expected fullscale point. This approach yields the highest resolution using the previously calculated minimum Current_LSB in Equation 1. The calibration register can also be selected so that READ_IN and READ_PIN return direct decimal equivalents of the values being measured, or to yield a full LSB value for each corresponding register. 7.5.3 Reading and Writing Telemetry Data and Warning Thresholds All telemetry data are measured using a 16-bit ADC. Telemetry data and user-programmed warning thresholds are communicated in 16-bit, two's compliment, signed data. Data are read or written in 2-byte increments conforming to the DIRECT format as described in section 8.3.3 of the PMBus Power System Management Protocol Specification 1.3 Part II. Device telemetry uses all 16 bits of the internal ADC; however, the warning registers only use the upper 12 bits for out-of-range comparisons. See each individual warning command (IOUT_OC_WARN_LIMIT, VIN_OV_WARN_LIMIT, VIN_UV_WARN_LIMIT, and PIN_OP_WARN_LIMIT) for the format of the warning threshold word. 16 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 Programming (continued) 7.5.4 Reading Telemetry Data and Warning Thresholds Conversion from direct format to real-world dimensions of current, voltage, and power is accomplished by determining the appropriate coefficients as described in section 7.2.1 of the PMBus Power System Management Protocol Specification 1.3 Part II. According to this specification, the host system converts the received values using Equation 3 into a reading of volts, amperes, watts, or other such units. 1 (Y x 10-R - b) X= m where • • • • • • X = the calculated real-world value (volts, amps, watts, and so forth) m = the slope coefficient Y = a 2-byte, two's complement integer received from the device b = the offset, which is a 2-byte, two's complement integer R = the exponent, which is a 1-byte, two's complement integer R is only necessary in systems where m is required to be an integer (for example, where m can be stored in a register of an integrated circuit) and R must only be large enough to yield the desired accuracy (3) The values for m and R (listed in Table 1) must be calculated for current and power measurements based off the selected value of the Current_LSB. For example, assume a Current_LSB of 0.75 mA/bit is selected for a given application. The value for m is calculated by inverting the LSB value (for this case, m = 1 / 0.00075 = 1333.333). Moving the decimal point so the value of m is maximized and remains within the required range of –32768 to 32767 is preferable because this value of m is relatively small and contains decimal information. Moving the decimal point one place to the right results in a final m value of 13333 with an R value of –1 resulting from the shift in decimal location. Moving the decimal point to maximize the value of m is critical to minimize rounding errors. The m coefficient for power can be calculated by applying 1 / (25 × Current_LSB). For this example, the value for the m power coefficient is calculated to be 53.333. Again (to maximize accuracy), the decimal location is shifted by 2 to the right to give a final m value of 5333 with an R coefficient of –2. Care must be taken to adjust the exponent coefficient, R, such that the value of m remains within the range of –32768 to 32767. However, rounding errors resulting from the limitations on the value of m can be mitigated by carefully selecting a slightly higher current LSB size. For example, if a Current_LSB of 1 mA/bit is selected instead of 0.75 mA/bit, the calculated value for m is 1 / 0.001 or 1000; because this value is a whole number there is no rounding errors and the value for R is 0. Positive values for R signify the number of times the decimal point is shifted to the left, whereas negative values for R signify the number of decimal point shifts to the right. Table 1. Telemetry and Warning Conversion Coefficients (RS in mΩ) COMMANDS FORMAT NUMBER OF DATA BYTES m b R UNIT READ_VIN VIN_OV_WARN_LIMIT VIN_UV_WARN_LIMIT DIRECT 2 8 0 2 V READ_IIN, READ_IOUT MFR_IIN_OC_WARN_LIMIT DIRECT 2 Calculated from Current_LSB 0 Calculated A READ_PIN, READ_EIN MFR_PIN_OP_WARN_LIMIT DIRECT 2 Calculated from Current_LSB 0 Calculated W MFR_READ_VSHUNT DIRECT 2 4 0 5 V Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 17 INA233 SBOS790 – APRIL 2017 www.ti.com 7.5.4.1 Writing Telemetry Data and Warning Thresholds There are several PMBus commands that require writing telemetry data in order to be used. Use the same coefficients previously calculated for the application and apply these coefficients using Equation 4. Y = (mX + b) × 10R where • • • • • X = the real-world value (volts, amps, watts, temperature, and so forth) m = the slope coefficient, a 2-byte, two's complement integer Y = a 2-byte, two's complement integer written to the device b = the offset, which is a 2-byte, two's complement integer R = the exponent, which is a 1-byte, two's complement integer (4) 7.5.5 System-Level Calibration With MFR_CALIRATION Command The calibration register also offers possibilities for end-user, system-level calibration. After determining the exact current by using an external ammeter, the value of the MFR_CALIBRATION register can then be adjusted (as shown in Equation 5) based on the measured current result of the INA233 to cancel the total system error. Corrected _ Full _ Scale _ Cal § Cal u MeasShuntCurrent · trunc ¨ ¸ © Device _ Reported _ Current ¹ (5) 7.5.6 Bus Overview The INA233 features an I2C-compatible, 2-wire interface with an open-drain Alert output. The data transfer format is SMBus version 3.0 compliant and the device supports multiple PMBus commands that allow the device to be easily used along with PMBus version 1.3 devices. The device that initiates a data transfer is called a master, and the devices controlled by the master are slaves. The bus must be controlled by a master device that generates the serial clock (SCL), controls the bus access, and generates START and STOP conditions. To address a specific device, the master initiates a START condition by pulling the data signal line (SDA) from a high to a low logic level when SCL is high. All slaves on the bus shift in the slave address byte on the rising edge of SCL, with the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the slave being addressed responds to the master by generating an Acknowledge and pulling SDA low. Data transfer is then initiated and eight bits of data are sent, followed by an Acknowledge bit. During data transfer, SDA must remain stable when SCL is high. Any change in SDA when SCL is high is interpreted as a START or STOP condition. After all data are transferred, the master generates a STOP condition, indicated by pulling SDA from low to high when SCL is high. The device includes a 28-ms timeout on the interface to prevent bus lockup. 18 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 7.5.6.1 Serial Bus Address To communicate with the INA233, the master must first address slave devices via a slave address byte. The slave address byte consists of seven address bits and a direction bit that indicates whether the action is to be a read or write operation. The device has two address pins, A0 and A1. Table 2 lists the pin logic levels for each of the 16 possible addresses. The device samples the state of the A0 and A1 pins on every bus communication. Establish the pin states before any activity on the interface occurs. Table 2. Address Pins and Slave Addresses A1 A0 SLAVE ADDRESS GND GND 1000000 GND VS 1000001 GND SDA 1000010 GND SCL 1000011 VS GND 1000100 VS VS 1000101 VS SDA 1000110 VS SCL 1000111 SDA GND 1001000 SDA VS 1001001 SDA SDA 1001010 SDA SCL 1001011 SCL GND 1001100 SCL VS 1001101 SCL SDA 1001110 SCL SCL 1001111 7.5.6.2 Serial Interface The INA233 operates only as a slave device on both the I2C bus and the SMBus. Connections to the bus are made via the open-drain SDA and SCL lines. The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. Although the device integrates spike suppression into the digital I/O lines, proper layout techniques help minimize the amount of coupling into the communication lines. This noise introduction can occur from capacitively coupling signal edges between the two communication lines themselves or from other switching noise sources present in the system. Routing traces in parallel with ground in between layers on a printed circuit board (PCB) typically reduces the effects of coupling between the communication lines. Shielded communication lines reduce the possibility of unintended noise coupling into the digital I/O lines that can be incorrectly interpreted as START or STOP commands. All data bytes are transmitted least significant byte first. 7.5.6.3 Writing to and Reading From the INA233 Both writing and reading to the INA233 is accomplished through the use of various PMBus commands. Each PMBus command code is an address that allows read or write access to the internal registers; see the PMBus Command Support section for a complete list of supported PMBus commands and corresponding addresses. The value for the command address is the first byte transferred after the slave address byte with the R/W bit low. Every write operation to the device requires a value for the command address. Writing to the device begins with the first byte transmitted by the master. This byte is the slave address with the R/W bit low. The device then acknowledges receipt of a valid address. The next byte transmitted by the master is the PMBus command address to the register that data are written to. This command address value updates the register pointer to the desired register. The next two bytes are written to the register addressed by the PMBus command. The device acknowledges receipt of each data byte. The master can terminate data transfer by generating a START or STOP condition. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 19 INA233 SBOS790 – APRIL 2017 www.ti.com The timing structure for SEND BYTE commands is the same as WRITE WORD commands except no data packets are sent. When reading from the device, first the device is written to with the desired PMBus command that is to return the desired value. This write is accomplished by issuing a slave address byte with the R/W bit low, followed by the PMBus command code. No additional data are required. The master then generates a repeated START condition and sends the slave address byte with the R/W bit high to initiate the read command. The next byte is transmitted by the slave and is the most significant byte of the register indicated by the register pointer. This byte is followed by an Acknowledge (ACK) from the master; then the slave transmits the least significant byte. The master acknowledges receipt of the data byte. The master can terminate data transfer by generating a NotAcknowledge after receiving any data byte, or by generating a START or STOP condition. If repeated reads from the same register are desired, the register pointer bytes do not have to be continually sent; the device retains the register pointer value until the value is changed by the next write operation. The READ BYTE format has the same timing structure as the READ WORD format except a byte of data is returned instead of a word. Figure 26 shows the write operation timing diagram. Figure 27 shows the read operation timing diagram. NOTE Register bytes are sent least-significant byte first, followed by the most significant byte. 1 9 1 9 1 9 1 9 SCL SDA 1 0 0 A3 A2 A1 A0 R/W Start By Master P7 P6 P5 P4 P3 P2 P1 Frame 1 Two-Wire Slave Address Byte (1) D7 P0 ACK By Slave D6 D5 D4 D3 D2 D1 D0 (1) D15 D14 D13 D12 D11 D10 D9 D8 ACK By Slave ACK By Slave Frame 2 PMBus Command Code ACK By Slave Frame 3 Data LSByte Stop By Master Frame 4 Data MSByte The value of the slave address byte is determined by the settings of the A0 and A1 pins; see Table 2. Figure 26. Timing Diagram for Write Word Format 1 9 1 9 SCL 1 SDA 0 0 A3 A2 A1 A0 P7 R/W Start By Master P6 P5 P4 P3 P2 P1 P0 ACK By Slave Frame 1 Two-Wire Slave Address Byte 1 9 Stop ACK By Slave (1) Frame 2 PMBus Command Code 1 9 1 9 SCL SDA 1 0 0 A3 A2 A1 A0 D7 R/W ReSt art By Master D6 D5 D4 D3 D2 D1 From Slave ACK By Slave (1) D0 D15 D14 D13 D12 (2) Frame 1 Two-Wire Slave Address Byte D11 D10 D9 D8 (3) From Slave ACK By Master No ACK By Master Stop (2) Frame 2 Data LSByte Frame 3 Data MSByte (1) The value of the slave address byte is determined by the settings of the A0 and A1 pins; see Table 2. (2) Read data are from the previous PMBus command code. (3) An Acknowledge by the master can also be sent. Figure 27. Timing Diagram for Read Word Format 20 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 A block read is similar to the read word format in that first the device is written to with the desired PMBus command that is to return the desired value. This write is accomplished by issuing a slave address byte with the R/W bit low, followed by the PMBus command code. The master then generates a repeated START condition and sends the slave address byte with the R/W bit high to initiate the read command. The next byte is transmitted by the slave is the total number of bytes that are sent to the master. This byte is followed by an Acknowledge (ACK) from the master; then the slave transmits the first data byte. At the end of each byte the master sends an Acknowledge and the next byte is sent by the slave. The master can terminate data transfer by generating a Not-Acknowledge after receiving any data byte, or by generating a START or STOP condition. Figure 28 shows the block read operation timing diagram. Figure 29 shows the timing diagram for the SMBus Alert response operation. 1 9 1 9 9 1 SCL SDA 1 0 0 A3 A2 A1 A0 R/W Start By Master P7 P6 P5 P4 P3 P2 P1 Frame 1 Slave Address Byte 1 P0 ACK By Slave ACK By Slave (1) 0 9 A3 A2 A1 A0 R/W ACK By Master Frame 2 PMBus Command Code 1 0 Repeated Start By Master Frame 3 Slave Address Byte 1 1 9 9 SCL SDA D7 D6 D5 D4 D3 D2 D1 D7 D0 D6 D5 D4 D3 D2 D1 Frame 4 Number of Bytes = N A. D7 D0 D6 D5 D4 D3 D2 D1 D0 No ACK By Stop by Master Master ACK By Master ACK By Master Frame 5 Data Byte 1 Frame N+4 Data Byte N The value of the slave address byte is determined by the settings of the A0 and A1 pins; see Table 2. Figure 28. Timing Diagram for Block Read Format ALERT 1 9 1 9 SCL SDA 0 0 0 1 1 0 0 R/W Start By Master 1 0 ACK By Slave Frame 1 SMBus ALERT Response Address Byte (1) 0 A3 A2 A1 A0 0 From Slave Frame 2 Slave Address Byte NACK By Master Stop By Master (1) The value of the slave address byte is determined by the settings of the A0 and A1 pins; see Table 2. Figure 29. Timing Diagram for SMBus ALERT Response 7.5.6.3.1 Packet Error Checking The INA233 supports packet error checking as described in the SMBus version 3.0 specification. Packet error checking is a method to improve the reliably and communication robustness of the digital interface. Packet error checking is implemented by appending a packet error code (PEC) at the end of each message transfer. To maximize compatibly, devices that support packet error checking must be able to communicate with the host and other devices that do not support the error checking protocol. Therefore, packet error checking can help improve the communication robustness when desired but is optional when not supported by the master or other devices on the bus. See the SMBus version 3.0 specification for additional details on implementing packet error checking in an SMBus environment. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 21 INA233 SBOS790 – APRIL 2017 www.ti.com 7.5.6.3.2 Bus Timing Requirements When the bus is idle, both the SDA and SCL lines are pulled high by the pullup resistors. The master generates a START condition followed by a valid serial byte containing high-speed (HS) master code 00001XXX. This transmission can be made at 400-kHz data rates. Figure 30 shows a timing diagram for the bus and Table 3 lists the bus timing definitions. t(LOW) tF tR t(HDSTA) SCL t(HDSTA) t(HIGH) t(HDDAT) t(SUSTO) t(SUSTA) t(SUDAT) SDA t(BUF) P S S P Figure 30. Bus Timing Diagram Table 3. Bus Timing Definitions (1) MIN MAX UNIT f(SCL) SCL operating frequency 10 400 kHz t(BUF) Bus free time between STOP and START conditions 0.6 µs t(HDSTA) Hold time after a repeated START condition. After this period, the first clock is generated. 0.6 µs t(SUSTA) Repeated START condition setup time 0.6 µs t(SUSTO) STOP condition setup time 0.6 µs t(HDDAT) Data hold time 0 ns t(SUDAT) Data setup time 100 ns t(LOW) SCL clock low period 1.3 µs t(HIGH) SCL clock high period 0.6 50 µs tF Data fall time 300 ns tF Clock fall time 300 ns tR Clock rise time 300 ns (1) Values are based on a statistical analysis of a one-time sample of devices. Minimum and maximum values are not specified and are not production tested. 7.5.6.4 SMBus Alert Response When SMBus alerts are latched, the INA233 is designed to respond to the SMBus alert response address. The SMBus alert response provides a quick fault identification for simple slave devices. When an alert occurs, the master can broadcast the alert response slave address (0001 100) with the R/W bit set high. Following this alert response, any slave device that generates an alert is identified by acknowledging the alert response and sending its address on the bus. The alert response can activate several different slave devices simultaneously, similar to the I2C general call. If more than one slave attempts to respond, bus arbitration rules apply and the device with the lowest address wins and is serviced first. The losing devices do not generate an Acknowledge and continue to hold the alert line low until the interrupt is cleared. The winning device responds with its address and releases the SMBus alert line. Even though the INA233 releases the SMBus line, the internal error flags are not cleared until done so by the host. 22 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 7.6 Register Maps 7.6.1 PMBus Command Support The device features an SMBus interface that allows the use of PMBus commands to set warn levels, error masks, and obtain telemetry on bus voltage, current, power, and shunt voltage. Table 4 lists the supported PMBus commands. Table 4. Supported PMBus Commands R/W NUMBER OF DATA BYTES DEFAULT VALUE Clears the status registers and rearms the black box registers for updating Send byte 0 N/A Restores internal registers to the default values Send byte 0 N/A R 1 B0h Retrieves or stores the output overcurrent warn limit threshold R/W 2 7FF8h VIN_OV_WARN_LIMIT Retrieves or stores the input overvoltage warn limit threshold R/W 2 7FF8h 58h VIN_UV_WARN_LIMIT Retrieves or stores the input undervoltage warn limit threshold R/W 2 0000h 6Bh PIN_OP_WARN_LIMIT Retrieves or stores the output overpower warn limit threshold R/W 2 7FF8h 78h STATUS BYTE Retrieves information about the device operating status R 1 00h 79h STATUS_WORD Retrieves information about the device operating status R 2 1000h 7Bh STATUS_IOUT Retrieves information about the output current status R/W, CLR 1 00h 7Ch STATUS_INPUT Retrieves information about the input status R/W, CLR 1 00h Retrieves information about the communications status R/W, CLR 1 00h Retrieves information about the manufacturer specific device status R/W, CLR 1 20h Block read 6 00h, 00h, 00h, 00h, 00h, 00h CODE NAME 03h CLEAR_FAULTS 12h RESTORE_DEFAULT_ALL 19h CAPABILITY 4Ah IOUT_OC_WARN_LIMIT 57h FUNCTION Retrieves the device capability 7Eh STATUS_CML 80h STATUS_MFR_SPECIFIC 86h READ_EIN Retrieves the energy reading measurement 88h READ_VIN Retrieves the measurement for the VBUS voltage R 2 0000h Retrieves the input current measurement, supports both positive and negative currents R 2 0000h 89h READ_IN 8Bh READ_VOUT Mirrors READ_VIN R 2 0000h 8Ch READ_IOUT Mirror of READ_IN for compatibility R 2 0000h 96h READ_POUT Mirror of READ_PIN for compatibility with possible VBUS connections R 2 0000h 97h READ_PIN Retrieves the input power measurement R 2 0000h 99h MFR_ID Retrieves the manufacturer ID in ASCII characters (TI) Block read 2 54h, 49h 9Ah MFR_MODEL Retrieves the device number in ASCII characters (INA233) Block read 6 49h, 4Eh, 41h, 32h, 33h, 33h 9Bh MFR_REVISION Retrieves the device revision letter and number in ASCII (for instance, A0) R 2 41h, 30h D0h MFR_ADC_CONFIG R/W 2 4127h D1h MFR_READ_VSHUNT R 2 0000h D2h MFR_ALERT_MASK R/W 1 F0h Configures the ADC averaging modes, conversion times, and operating modes Retrieves the shunt voltage measurement Allows masking of device warnings Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 23 INA233 SBOS790 – APRIL 2017 www.ti.com Register Maps (continued) Table 4. Supported PMBus Commands (continued) CODE NAME FUNCTION R/W NUMBER OF DATA BYTES DEFAULT VALUE D4h MFR_CALIBRATION Allows the value of the current-sense resistor calibration value to be input. Must be programed at power-up. Default value is set to 1. R/W 2 0001h D5h MFR_DEVICE_CONFIG R/W 1 02h D6h CLEAR_EIN Send byte 0 N/A Allows the ALERT pin polarity to be changed Clears the energy accumulator Returns a unique word for the manufacturer ID R 2 ASCII TI, 5449h TI_MFR_MODEL Returns a unique word for the manufacturer model R 2 ASCII 33 TI_MFR_REVISION Returns a unique word for the manufacturer revision R 2 ASCII A0 E0h TI_MFR_ID E1h E2h 7.6.2 Standard PMBus Commands 7.6.2.1 CLEAR_FAULTS (03h) CLEAR_FAULTS is a standard PMBus command that resets all stored warning and fault flags and the alert signal. If a fault or warning condition still exists when the CLEAR_FAULTS command is issued, the ALERT signal clears but reasserts almost immediately. This command uses the PMBus send byte protocol. 7.6.2.2 RESTORE_DEFAULT_ALL (12h) The RESTORE_DEFAULT_ALL command restores the internal device register settings to the default values. NOTE When issued, values in the calibration register are cleared and must be reconfigured by the master. 7.6.2.3 CAPABILITY (19h) The CAPABILITY command is a standard PMBus command that returns information about the PMBus functions supported by the INA233. This command is read with the PMBus read byte protocol. Table 5. CAPABILITY Register VALUE B0h 24 MEANING DEFAULT Supports packet error check, 400 kbits/sec, supports SMBus alert response address (ARA) Submit Documentation Feedback B0h Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 7.6.2.4 IOUT_OC_WARN_LIMIT (4Ah) [default = 01111111 11111000] This command is an overcurrent warn limit. This standard PMBus command is used to set or read the threshold of the first level warning of high output currents. Use the PMBus read or write word protocol to access this command. The contents of the IOUT_OC_WARN_LIMIT register are compared to the current-sense ADC telemetry value to detect high output current. This warning threshold applies to both positive and negative currents. Enter the value in the register in amps with the same scaling and coefficients used for reading current. When this input overcurrent warning limit is exceeded, the device: • Sets the NONE OF THE ABOVE bit in the STATUS_BYTE register • Sets the IOUT bit in the STATUS_WORD register • Sets the IOUT_OC_WARNING bit in the STATUS_IOUT register • Sets the INPUT bit in the STATUS_WORD register • Sets the IIN_OC_WARNING bit in the STATUS_INPUT register • Notifies (if unmasked) the host using the ALERT pin This warning is masked with the MFR_ALERT_MASK command with the IIN_OC_WARN bit. See the Reading and Writing Telemetry Data and Warning Thresholds and Writing Telemetry Data and Warning Thresholds sections for additional information on reading and setting warning thresholds. Figure 31. IOUT_OC_WARN_LIMIT 15 — R-0 14 IO11 R/W-1 13 IO10 R/W-1 12 IO9 R/W-1 11 IO8 R/W-1 10 IO7 R/W-1 9 IO6 R/W-1 8 IO5 R/W-1 7 IO4 R/W-1 6 IO3 R/W-1 5 IO2 R/W-1 4 IO1 R/W-1 3 IO0 R/W-1 2 — R-0 1 — R-0 0 — R-0 Table 6. IOUT_OC_WARN_LIMIT Field Descriptions Bit Field Type Default Description 15 — R 0 Reserved; always 0. 14:3 IO[11:0] R/W 1 These bits control the IOUT_OC_WARN_LIMIT. The bit weightings in this register match the bit weightings in the READ_IOUT register (IO0 = II3). 2:0 — R 0 Reserved; always 0. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 25 INA233 SBOS790 – APRIL 2017 www.ti.com 7.6.2.5 VIN_OV_WARN_LIMIT (57h) [default = 01111111 11111000] VIN_OV_WARN_LIMIT is a standard PMBus command that allows configuring or reading the threshold for a VBUS overvoltage warning detection. Use the coefficients listed in Table 1 when reading and writing to this register. Use the PMBus read or write word protocol to access this command. When this input overvoltage warning limit is exceeded, the device: • Sets the NONE OF THE ABOVE bit in the STATUS_BYTE register • Sets the INPUT bit in the STATUS_WORD register • Sets the IOUT_OC_WARNING bit in the STATUS_INPUT register • Notifies (if unmasked) the host using the ALERT pin This fault is masked with the MFR_ALERT_MASK command using the VIN_OV_WARNING See the Reading and Writing Telemetry Data and Warning Thresholds and Writing Telemetry Data and Warning Thresholds sections for additional information on reading and setting warning thresholds. Full-scale range = 40.96 V (7FFFh) and LSB = 1.25 mV. Figure 32. VIN_OV_WARN_LIMIT 15 — R-0 14 V11 R/W-1 13 V10 R/W-1 12 V9 R/W-1 11 V8 R/W-1 10 V7 R/W-1 9 V6 R/W-1 8 V5 R/W-1 7 V4 R/W-1 6 V3 R/W-1 5 V2 R/W-1 4 V1 R/W-1 3 V0 R/W-1 2 — R-0 1 — R-0 0 — R-0 Table 7. VIN_OV_WARN_LIMIT Field Descriptions 26 Bit Field Type Default Description 15 — R 0 Reserved; always 0. 14:3 V[11:0] R/W 1 These bits control the VIN_OV_WARN_LIMIT. The bit weightings in this register match the bit weightings in the READ_VIN register (V0 = BV3). 2:0 — R/W 0 Reserved; always 0. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 7.6.2.6 VIN_UV_WARN_LIMIT (58h) [default = 00000000 00000000] VIN_UV_WARN_LIMIT is a standard PMBus command that allows configuring or reading the threshold for the VBUS undervoltage warning detection. Use the coefficients listed in Table 1 when reading and writing to this register. Use the PMBus read or write word protocol to access this command. When this input undervoltage warning limit is exceeded, the device: • Sets the NONE OF THE ABOVE bit in the STATUS_BYTE register • Sets the INPUT bit in the STATUS_WORD register • Sets the VIN_UV_WARNING bit in the STATUS_INPUT register • Notifies (if unmasked) the host using the ALERT pin This fault is masked with the MFR_ALERT_MASK command using the VIN_UV_WARNING bit. See the Reading and Writing Telemetry Data and Warning Thresholds and Writing Telemetry Data and Warning Thresholds sections for additional information on reading and setting warning thresholds. Full-scale range = 40.96 V (7FFFh) and LSB = 1.25 mV. Figure 33. VIN_UV_WARN_LIMIT 15 — R-0 14 V11 R/W-0 13 V10 R/W-0 12 V9 R/W-0 11 V8 R/W-0 10 V7 R/W-0 9 V6 R/W-0 8 V5 R/W-0 7 V4 R/W-0 6 V3 R/W-0 5 V2 R/W-0 4 V1 R/W-0 3 V0 R/W-0 2 — R-0 1 — R-0 0 — R-0 Table 8. VIN_UV_WARN_LIMIT Field Descriptions Bit Field Type Default Description 15 — R 0 Reserved; always 0. 14:3 V[11:0] R/W 0 These bits control the VIN_UV_WARN_LIMIT. The bit weightings in this register match the bit weightings in the READ_VIN register (V0 = BV3). 2:0 — R 0 Reserved; always 0. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 27 INA233 SBOS790 – APRIL 2017 www.ti.com 7.6.2.7 PIN_OP_WARN_LIMIT (6Bh) [default = 11111111 11110000] PIN_OP_WARN_LIMIT is a standard PMBus command that allows setting or reading the threshold for the input overpower warning. Use the PMBus read or write word protocol to access the POUT_OP_WARN_LIMIT command. The contents of this register are compared to the calculated telemetry power value. When the PIN_OP_WARN_LIMIT is exceeded, the device: • Sets the INPUT bit in the upper byte of the STATUS_WORD register • Sets the PIN_OP_WARNING bit in the STATUS_INPUT register • Notifies the host by asserting the ALERT pin This warning is masked with the MFR_ALERT_MASK command using the IIN_OP_WARNING bit. Figure 34. PIN_OP_WARN_LIMIT 15 D11 R/W-1 14 D10 R/W-1 13 D9 R/W-1 12 D8 R/W-1 11 D7 R/W-1 10 D6 R/W-1 9 D5 R/W-1 8 D4 R/W-1 7 D3 R/W-1 6 D2 R/W-1 5 D1 R/W-1 4 D0 R/W-1 3 — R-0 2 — R-0 1 — R-0 0 — R-0 Table 9. PIN_OP_WARN_LIMIT Field Descriptions Field Type Default Description 15:4 Bit D[11:0] R/W 1 These bits control the VIN_UV_WARN_LIMIT. The bit weightings in this register match the bit weightings in the READ_PIN register (D0 = P4). 3:0 — R 0 Reserved; always 0. 7.6.2.8 STATUS_BYTE (78h) STATUS_BYTE is a standard PMBus command that returns the value of a number of flags indicating the state of the INA233. Use the PMBus read byte protocol to access this command. To clear bits in this register, clear the underlying fault and issue a CLEAR_FAULTS command. Table 10 lists the definitions for this command. Table 10. STATUS_BYTE Definitions BIT NAME MEANING DEFAULT 7 BUSY Not supported 0 6 OFF Not supported 0 5 VOUT_OV Not supported 0 4 IOUT_OC Not supported 0 3 VIN_UV Not supported 0 2 TEMPERATURE Not supported 0 1 CML A communication fault has occurred 0 0 NONE OF THE ABOVE A fault or warning not listed in bits[7:1] has occurred 0 NONE OF THE ABOVE (bit 0) is set by the logical OR of the following status bits from other registers: • IOUT_OC_WARNING • VIN_OV_WARNING • VIN_UV_WARNING • IIN_OC_WARNING This bit can only be cleared by clearing all the contributing status bits. 28 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 7.6.2.9 STATUS_WORD (79h) STATUS_WORD is a standard PMBus command that returns the value of a number of flags indicating the state of the INA233. Use the PMBus read word protocol to access this command. To clear bits in this register, clear the underlying fault and issue a CLEAR_FAULTS command. The INPUT and VIN UV flags default to 1 on startup. Table 11 lists the definitions for this command. Table 11. STATUS_WORD Definitions BIT NAME MEANING DEFAULT 15 VOUT Not supported 0 14 IOUT/POUT An output current or power warning has occurred 0 13 INPUT An input voltage, current, or power warning has occurred 0 12 MFR A manufacturer-specific fault or warning has occurred 1 11 POWER_GOOD# Not supported 0 10 FANS Not supported 0 9 OTHER Not supported 0 8 UNKNOWN Not supported 0 7 BUSY Not supported 0 6 OFF Not supported 0 5 VOUT_OV Not supported 0 4 IOUT_OC Not supported 0 3 VIN_UV Not supported 0 2 TEMPERATURE Not supported 0 1 CML A communication fault has occurred 0 0 NONE OF THE ABOVE A fault or warning not listed in bits[7:1] has occurred 0 7.6.2.10 STATUS_IOUT (7Bh) STATUS_IOUT is a standard PMBus command that returns the value of the of a number of flags related to output, current, and power. Use the PMBus read byte protocol to access this command. To clear bits in this register, clear the underlying fault and issue a CLEAR_FAULTS command or write a 1 to the bit to be cleared. Table 12 lists the definitions for this command. Table 12. STATUS_IOUT Definitions BIT NAME MEANING DEFAULT 7 IOUT_OC fault Not supported 0 6 IOUT_OC fault with LV shutdown Not supported 0 5 IOUT_OC_WARN An input undercurrent warning has occurred 0 4 IOUT_UC fault Not supported 0 3 Current share fault Not supported 0 2 In power-limiting mode Not supported 0 1 POUT_OP fault Not supported 0 0 POUT_OP_WARN Not supported 0 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 29 INA233 SBOS790 – APRIL 2017 www.ti.com 7.6.2.11 STATUS_INPUT (7Ch) STATUS_INPUT is a standard PMBus command that returns the value of the of a number of flags related to input voltage, current, and power. Use the PMBus read byte protocol to access this command. To clear bits in this register, clear the underlying fault and issue a CLEAR_FAULTS command or write a 1 to the bit to be cleared. Table 13 lists the definitions for this command. Table 13. STATUS_INPUT Definitions BIT NAME MEANING DEFAULT 7 VIN_OV fault Not supported 0 6 VIN_OV_WARN An input overvoltage warning has occurred 0 5 VIN_UV_WARN An input undervoltage warning has occurred 0 4 VIN_UV fault Not supported 0 3 Insufficient voltage Not supported 0 2 IIN_OC fault Not supported 0 1 IIN_OC_WARN An input overcurrent warning has occurred 0 0 PIN_OP_WARN An input overpower warning has occurred 0 7.6.2.12 STATUS_CML (7Eh) STATUS_CML is a standard PMBus command that returns the value of a number of flags related to communication faults. Use the PMBus read byte protocol to access this command. To clear bits in this register, issue a CLEAR FAULTS command or write a 1 to the bit to be cleared. Table 14 lists the definitions for this command. Table 14. STATUS_CML Definitions 30 BIT MEANING DEFAULT 7 Invalid or unsupported command received 0 6 Not supported 0 5 Packet error check failed 0 4 Memory fault detected (trim fuse CRC failed, ECC active) 0 3 Not supported 0 2 Reserved 0 1 Not supported 0 0 Not supported 0 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 7.6.2.13 STATUS_MFR_SPECIFIC (80h) STATUS_MFR_SPECIFIC is a standard PMBus command that contains manufacturer-specific status information. Use the PMBus read byte protocol to access this command. To clear bits in this register, clear the underlying fault and issue a CLEAR_FAULTS command or write a 1 to the bit to be cleared. Table 15 lists the definitions for this command. Table 15. STATUS_MFR_SPECIFIC Definitions BIT MEANING DEFAULT 7 Conversion ready 0 6 Arithmetic overflow flag. If the bit is set to 1 then an arithmetic operation results from an overflow error. This bit indicates that either the current or power data is invalid. 0 5 Power-on-reset event detected. To detect power-on or power glitch events, this bit must be cleared after initial power up. If power is interrupted this bit is reset to the default value of 1. 1 4 Communications or memory fault (or of STATUS_CML) 0 3 Input overpower warning 0 2 Input overcurrent warning 0 1 Input overvoltage warning 0 0 Input undervoltage warning 0 7.6.2.14 READ_EIN (86h) READ_EIN is a command that returns information that the host can use to calculate energy or to average input power consumption. Use the PMBus block read protocol to access this command. Six bytes of data are returned by this command. The first two bytes are the 16-bit, unsigned output of an accumulator that continuously sums samples of the instantaneous input power. These two data bytes are formatted such that returned values can be converted to watts using the power m, b, and R coefficients. The third data byte is a count of the rollover events for the accumulator. This byte is an unsigned integer indicating the number of times that the accumulator has rolled over from the maximum positive value (FFFFh) to zero. The last three data bytes are a 24-bit unsigned integer that counts the number of samples of the instantaneous input power that are applied to the accumulator. The combination of the accumulator and the rollover count can overflow within a few seconds depending on the ADC conversion time. The host software must detect and appropriately handle this overflow. Similarly, the sample count value overflows, but this event only occurs one time every few hours using 1-ms ADC conversion times. To convert the data obtained with the READ_EIN command to average power, first convert the accumulator and rollover count to an unsigned integer. Total Accumulated Unscaled Power (Accumulator_24) = (rollover_count × 216) + Accumulator Overflow detection and handling are done on the 24 bits of accumulator data and the sample count now. As shown in Equation 6, data from the previous calculation must be saved and used in this calculation to obtain the unscaled average power. Table 16 lists the definitions for this command. Accumulator _ 24 >n@ Accumulator _ 24 >n 1@ Sample _ count >n@ Sample _ count >n 1@ where • • • • • accumulator_24 [n] = Overflow corrected, 24-bit accumulator data from this read Sample_count [n] = Sample count data from this read accumulator_24[n-1] = Overflow corrected 24-bit accumulator data from the previous read Sample_count [n-1] = Sample count data from the previous read Unscaled average power is now in the same units as the data from the READ_PIN command PMBus coefficients are used to convert the unscaled average power to watts (6) Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 31 INA233 SBOS790 – APRIL 2017 www.ti.com Table 16. READ_EIN Definitions BYTE MEANING DEFAULT 6 Sample count high byte 0 5 Sample count mid byte 0 4 Sample count low byte 0 3 Power accumulator rollover count 0 2 Power accumulator high byte 0 1 Power accumulator low byte 0 0 Number of bytes 6 When the average power is calculated over a known number of samples, energy can be calculated by taking the product of the average power and the time interval for that average. The time interval can be externally measured or calculated by multiplying the number of samples reported by the ADC conversion time inclusive of any device averaging modes. However, calculating the energy consumption using the ADC conversion time results in a 10% error in the energy reading because of variations in the internal sampling oscillator. For increased precision in the energy measurement, using a higher accuracy external time measurement method is recommended. The energy accumulator can be configured by the MFR_DEVICE_CONFIG command to automatically clear with each READ_EIN command. The ability to clear the accumulator on a read permits the device to be easily synchronised to an external timer and allows the accumulator to always start at 0, thus eliminating the need to subtract the initial accumulated values and sample counts. The READ_EIN power accumulator can also be cleared by issuing a CLEAR_EIN command or RESTORE_DEFAULTS_ALL command. Clearing the power accumulator with the RESTORE_DEFAULTS_ALL command is not recommended because this command also clears the calibration register used to scale the accumulated power. 7.6.2.15 READ_VIN (88h) READ_VIN is a standard PMBus command that returns the 16-bit measured value of the input voltage as read from the VBUS pin. Use the coefficients listed in Table 1 to read this register. Use the PMBus read word protocol to access this command. This value is also used internally for the VIN_OV_WARN and VIN_UV_WARN detection. Table 17. READ_VIN Register VALUE 0h–7FFFh MEANING Measured value for VBUS DEFAULT 0000h Full-scale range = 40.96 V (7FFFh) and LSB = 1.25 mV. 7.6.2.16 READ_IIN (89h) READ_IN is a standard PMBus command that returns the 16-bit signed value of the sensed current. Use the PMBus read word protocol to access this command. This value is also used internally for the IOUT_OC_WARN detection. Table 18. READ_IIN Register VALUE 0000h–FFFFh MEANING Measured value for IIN DEFAULT 0000h If averaging is enabled, this register displays the averaged value. The value returned by the READ_IIN command is calculated by multiplying the decimal value in the READ_VHSUNT_OUT register with the decimal value of the MFR_CALIBRATION register. 7.6.2.17 READ_VOUT (8Bh) This command is a mirror of the READ_VIN command supported for cases where VBUS is connected to the output. 32 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 7.6.2.18 READ_IOUT (8Ch, R) This command is a mirror of the READ_IOUT command for software compatibility. 7.6.2.19 READ_POUT (96h, R) READ_POUT is mirror of the READ_PIN command to support applications that connect the VBUS pin to the output. 7.6.2.20 READ_PIN (97h, R) READ_PIN is a standard PMBus command that returns the 16-bit measured unsigned absolute value of the input power when VBUS is connected to the input. Use the PMBus read word protocol to access this command. This value is also used internally for the POUT_OP_WARN detection. Table 19. READ_PIN Register VALUE MEANING DEFAULT 0h–FFFFh Measured value for PIN 0000h 7.6.2.21 MFR_ID (99h) MFR_ID is a standard PMBus command that returns the identification of the manufacturer. Use the PMBus block read protocol to read the manufacturer ID. Table 20. MFR_ID Register BYTE NAME 0 Number of bytes VALUE 02h 1 MFR ID-1 54h, ASCII (T) 2 MFR ID-2 49h, ASCII (I) 7.6.2.22 MFR_MODEL (9Ah) MFR_MODEL is a standard PMBus command that returns the part number of the device. Use the PMBus block read protocol to read the manufacturer model. Table 21. MFR_MODEL Register BYTE NAME 0 Number of bytes VALUE 06h 1 MFR MODEL-1 49h, ASCII (I) 2 MFR MODEL-2 4Eh, ASCII (N) 3 MFR MODEL-3 41h, ASCII (A) 4 MFR MODEL-4 32h, ASCII (2) 5 MFR MODEL-5 33h, ASCII (3) 6 MFR MODEL-6 33h, ASCII (3) 7.6.2.23 MFR_REVISION (9Bh) MFR_REVISION is a standard PMBus command that returns the revision level of the device. Use the PMBus block read protocol to read the manufacturer revision. Table 22. MFR_REVISION Register BYTE NAME VALUE 0 Number of bytes 02h 1 MFR REV-1 41h, ASCII (A) 2 MFR REV-2 41h, ASCII (0) Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 33 INA233 SBOS790 – APRIL 2017 www.ti.com 7.6.3 Manufacturer-Specific PMBus Commands 7.6.3.1 MFR_ADC_CONFIG (D0h) [default = 01000001 00100111] The MFR_ADC_CONFIG command settings control the operating modes for the device ADC. This command controls the conversion time settings for both the shunt and bus voltage measurements as well as the averaging mode used. The operating mode that controls what signals are selected to be measured is also set with this command. Reading with the MFR_ADC_CONFIG command can be done at any time without affecting the device settings or a conversion in progress. Writing with the MFR_ADC_CONFIG command halts any conversion in progress until the write sequence is completed, resulting in a new conversion starting based on the updated contents. This halt prevents any uncertainty in the conditions used for the next completed conversion. Figure 35. MFR_ADC_CONFIG 15 — R-0 14 — R-1 13 — R-0 12 — R-0 11 AVG2 R/W-0 10 AVG1 R/W-0 9 AVG0 R/W-0 8 VBUSCT2 R/W-1 7 VBUSCT1 R/W-0 6 VBUSCT0 R/W-0 5 VSHCT2 R/W-1 4 VSHCT1 R/W-0 3 VSHCT0 R/W-0 2 MODE3 R/W-1 1 MODE2 R/W-1 0 MODE1 R/W-1 Table 23. MFR_ADC_CONFIG Field Descriptions Bit Field Type Default Description 15 — R 0 Reserved. 14 1 13:12 0 11 AVG2 R/W 0 10 AVG1 R/W 0 9 AVG0 R/W 0 8 VBUSCT2 R/W 1 7 VBUSCT1 R/W 0 6 VBUSCT0 R/W 0 5 VSHCT2 R/W 1 4 VSHCT1 R/W 0 3 VSHCT0 R/W 0 MODE[3:1] R/W 1 2:0 Averaging mode. These bits determine the number of samples that are collected and averaged. Table 24 lists AVG bit settings and related number of averages for each bit setting. Bus voltage conversion time. These bits set the conversion time for the bus voltage measurement. Table 25 lists the VBUSCT bit options and related conversion times for each bit setting. Shunt voltage conversion time. These bits set the conversion time for the shunt voltage measurement. Table 26 lists the VSHCT bit options and related conversion times for each bit setting. Operating mode. These bits select the continuous, triggered, or power-down mode of operation. These bits default to continuous shunt and bus measurement mode. Table 27 lists the mode settings. Table 24. AGV[2:0] Bit Setting Combinations 34 AVG2 AVG1 AVG0 NUMBER OF AVERAGES 0 (default) 0 (default) 0 (default) 1 (default) 0 0 1 4 0 1 0 16 0 1 1 64 1 0 0 128 1 0 1 256 1 1 0 512 1 1 1 1024 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 Table 25. VBUSCT[2:0] Bit Setting Combinations VBUSCT2 VBUSCT1 VBUSCT0 CONVERSION TIME 0 0 0 140 µs 0 0 1 204 µs 0 1 0 332 µs 0 1 1 588 µs 1 (default) 0 (default) 0 (default) 1.1 ms (default) 1 0 1 2.116 ms 1 1 0 4.156 ms 1 1 1 8.244 ms Table 26. VSHCT[2:0] Bit Setting Combinations VSHCT2 VSHCT1 VSHCT0 CONVERSION TIME 0 0 0 140 µs 0 0 1 204 µs 0 1 0 332 µs 0 1 1 588 µs 1 (default) 0 (default) 0 (default) 1.1 ms (default) 1 0 1 2.116 ms 1 1 0 4.156 ms 1 1 1 8.244 ms Table 27. Mode[3:1] Bit Settings Combinations MODE3 MODE2 MODE1 MODE 0 0 0 Power-down (or shutdown) 0 0 1 Shunt voltage, triggered 0 1 0 Bus voltage, triggered 0 1 1 Shunt and bus, triggered 1 0 0 Power-down (or shutdown) 1 0 1 Shunt voltage, continuous 1 1 0 Bus voltage, continuous 1 (default) Shunt and bus, continuous (default) 1 (default) 1 (default) Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 35 INA233 SBOS790 – APRIL 2017 www.ti.com 7.6.3.2 MFR_READ_VSHUNT (D1h) [default = 00000000 00000000] This register stores the current shunt voltage reading, VSHUNT. Negative numbers are represented in two'scomplement format. Generate the two's complement of a negative number by complementing the absolute value binary number and adding 1. An MSB = 1 denotes a negative number. If averaging is enabled, this register displays the averaged value. Full-scale range = 81.92 mV (7FFFh) and LSB: 2.5 µV. This command only supports the PMBus direct data format. Figure 36. MFR_READ_VSHUNT 15 Sign R-0 14 SD14 R-0 13 SD13 R-0 12 SD12 R-0 11 SD11 R-0 10 SD10 R-0 9 SD9 R-0 8 SD8 R-0 7 SD7 R-0 6 SD6 R-0 5 SD5 R-0 4 SD4 R-0 3 SD3 R-0 2 SD2 R-0 1 SD1 R-0 0 SD0 R-0 Table 28. MFR_READ_VSHUNT Field Descriptions Bit Field Type Default Description 15 Sign R 0 This bit determines the sign for the returned value. 0 = Positive 1 = Negative SD[14:0] R 0 These bits set the shunt voltage data. 14:0 7.6.3.3 MFR_ALERT_MASK (D2h) [default = XXXXXXXX 11110000] The bits in this register correspond to the bits in the STATUS_MFR_SPECIFIC register. Setting a bit in this register blocks the corresponding bit in the STATUS_MFR_SPECIFIC register from having an effect on the ALERT pin. Figure 37. MFR_ALERT_MASK 7 Conversion ready R/W-1 6 ADC overflow detected R/W-1 5 POR event detected R/W-1 4 3 2 1 Communication IN_OP_WARNI IN_OC_WARNI IN_OV_WARNI s NG NG NG R/W-1 R/W-0 R/W-0 R/W-0 0 IN_UV_WARNI NG R/W-0 Table 29. MFR_ALERT_MASK Field Descriptions Bit 36 Field Type Default Description 7 Conversion ready R/W 1 Masks the conversion ready signal to the ALERT pin (masked by default). 6 ADC overflow detected R/W 1 Masks the ADC overflow detection 5 POR event detected R/W 1 Masks the detection of a power-on-reset event. 4 Communications R/W 1 Communications or memory fault (or of STATUS_CML) 3 IN_OP_WARNING R/W 0 Input overpower warning mask 2 IN_OC_WARNING R/W 0 Input overcurrent warning mask 1 IN_OV_WARNING R/W 0 Input overvoltage warning mask 0 IN_UV_WARNING R/W 0 Input undervoltage warning mask Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 7.6.3.4 MFR_CALIBRATION (D4h) [default = 00000000 00000001] This register provides the device with the value of the shunt resistor that was present to create the measured differential voltage. This register also sets the resolution of the current register. Programming this register sets the Current_LSB and the Power_LSB. This register is also suitable for use in overall system calibration. See the Calibration Register and Scaling section for additional information on programming the calibration register. The Current_LSB can be used to scale the value in the READ_IOUT register. Figure 38. MFR_CALIBRATION 15 — R/W-0 14 13 12 R/W-0 R/W-0 R/W-0 7 6 5 4 11 CAL R/W-0 10 9 8 R/W-0 R/W-0 R/W-0 3 2 1 0 R/W-0 R/W-0 R/W-0 R/W-1 CAL R/W-0 R/W-0 R/W-0 R/W-0 Table 30. MFR_CALIBRATION Field Descriptions Bit Field Type Default Description 15 — R/W 0 Reserved CAL R/W 0 Calibration register value 14:1 0 1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 37 INA233 SBOS790 – APRIL 2017 7.6.3.5 www.ti.com MFR_DEVICE_CONFIG (D5h) [default = 00000010] This register configures various behaviors of the device in regards to data communications and alerts. Figure 39. MFR_DEVICE_CONFIG 7 6 5 4 3 EIN_STATUS Reserved EIN_ACCUM I2C_FILT R/W-0 R/W-0 R/W-0 R/W-0 2 READ_EIN Autoclear R/W-0 1 0 Alert Behavior APOL R/W-1 R/W-0 Table 31. MFR_DEVICE_CONFIG Field Descriptions Bit Field Type Default Description 7 EIN_STATUS R/W 0 0 = All values added to the EIN accumulator match the setting of EIN_ACCUM 1 = The EIN accumulator encountered a value inconsistent with the selected mode of operation. For EIN_ACCUM = 01, a negative value of the sign bit of READ_IIN is detected. For EIN_ACCUM = 10, a positive value of the sign bit of READ_IIN is detected. EIN_STATUS is not set when EIN_ACCUM is 00 or 11. 6 Reserved R/W 0 Reserved EIN_ACCUM R/W 00 00, 11 = The READ_EIN accumulator sums all values of the READ_POUT register. Both negative and currents will increase the accumulator. 01 = The READ_EIN only sums positive values of the READ_POUT register based on the sign bit of the READ_IIN register; the sample count continues to increment for negative values 10 = The READ_EIN only sums negative values of the READ_POUT register based on the sign bit of the READ_IIN register; the sample count continues to increment for positive values 3 I2C_FILT R/W 0 0 = Normal operation 1 = Disables the I2C input filter 2 READ_EIN Autoclear R/W 0 0 = Does not clear the sample count and accumulator 1 = Clears the sample count and accumulator after read 1 Alert Behavior R/W 1 0 = Transparent 1 = Latched 0 APOL R/W 0 Alert polarity bit. 0 = Normal 1 = Inverted 5:4 7.6.3.6 5.1.1 CLEAR_EIN (D6h) No data are associated with this command. This register clears the READ_EIN accumulator and counters. One sample of data may be lost. 38 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 7.6.3.7 TI_MFR_ID (E0h) [value = 01010100 01001001] Figure 40. TI_MFR_ID 15 ID15 R-0 14 ID14 R-1 13 ID13 R-0 12 ID12 R-1 11 ID11 R-0 10 ID10 R-1 9 ID9 R-0 8 ID8 R-0 7 ID7 R-0 6 ID6 R-1 5 ID5 R-0 4 ID4 R-0 3 ID3 R-0 2 ID2 R-0 1 ID1 R-0 0 ID0 R-1 Table 32. TI_MFR_ID Field Descriptions Bit Field Type Value Description 15 ID15 R 0 14 ID14 R 1 This command returns the same two bytes of data as the Read MFR_ID command except in an I2C-compatible format of word read. The value that the device returns is ASCII TI (5449h). 13 ID13 R 0 12 ID12 R 1 11 ID11 R 0 10 ID10 R 1 9:7 ID[9:7] R 0 ID6 R 1 ID[5:1] R 0 ID0 R 1 6 5:1 0 7.6.3.8 TI_MFR_MODEL (E1h) [value = 00110011 00110011] Figure 41. TI_MFR_MODEL 15 MD15 R-0 14 MD14 R-0 13 MD13 R-1 12 MD12 R-1 11 MD11 R-0 10 MD10 R-0 9 MD9 R-1 8 MD8 R-1 7 MD7 R-0 6 MD6 R-0 5 MD5 R-1 4 MD4 R-1 3 MD3 R-0 2 MD2 R-0 1 MD1 R-1 0 MD0 R-1 Table 33. TI_MFR_MODEL Field Descriptions Field Type Value Description 15:14 Bit MD[15:14] R 0 13:12 MD[13:12] R 1 This command returns the two bytes of data coded to represent the manufacturer model. The value that the device returns is ASCII 33. 11:10 MD[11:10] R 0 9:8 MD[9:8] R 1 7:6 MD[7:6] R 0 5:4 MD[5:4] R 1 3:2 MD[3:2] R 0 1:0 MD[1:0] R 1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 39 INA233 SBOS790 – APRIL 2017 www.ti.com 7.6.3.9 TI_MFR_REVISION (E2h) [value = 01000001 00110000] Figure 42. TI_MFR_REVISION 15 RV15 R-0 14 RV14 R-1 13 RV13 R-0 12 RV12 R-0 11 RV11 R-0 10 RV10 R-0 9 RV9 R-0 8 RV8 R-1 7 RV7 R-0 6 RV6 R-0 5 RV5 R-1 4 RV4 R-1 3 RV3 R-0 2 RV2 R-0 1 RV1 R-0 0 RV0 R-0 Table 34. TI_MFR_REVISION Field Descriptions Bit Field Type Value Description 15 RV[15] R 0 14 RV[14] R 1 RV[13:9] R 0 This command returns the same two bytes of data as the Read MFR_REVISION command except in an I2C-compatible format of word read. The value that the device returns is ASCII A0 (4130h). 13:9 8 40 RV[8] R 1 7:6 RV[7:6] R 0 5:4 RV[5:4] R 1 3:0 RV[3:0] R 0 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Validate and test the design implementation to confirm system functionality. 8.1 Application Information The INA233 is a current shunt and power monitor with an I2C-, SMBus-, and PMBus-compatible interface. The device monitors both a shunt voltage drop and bus supply voltage. Programmable calibration value, conversion times, and averaging (combined with an internal multiplier) enable direct readouts of current in amperes and power in watts. 8.2 Typical Application 3.3-V Supply Voltage C BYPASS 0.1 µF 5 - Bus Supply Pullup Resistors INA233 VS VBUS SDA ´ SCL Power Register 2 IN+ Current Register ADC R SHUNT 2 m: IC Interface Voltage Register ALERT INA0 10-A Alert Register Load A1 GND Copyright © 2017, Texas Instruments Incorporated Figure 43. Typical High-Side Sensing Circuit Configuration, INA233 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 41 INA233 SBOS790 – APRIL 2017 www.ti.com Typical Application (continued) 8.2.1 Design Requirements The INA233 measures the voltage developed across a current-sensing resistor (RSHUNT) when current passes through it. The device also measures the bus supply voltage and can calculate power when the calibration register is properly configured. The device comes with alert capability where the ALERT pin can be programmed to respond to a user-defined event or to a conversion ready notification. This design illustrates the ability of the ALERT pin to respond to a set input overvoltage threshold and how to correctly set the calibration registers and calculate returned values. Table 35 details the requirements for this design. Table 35. Design Requirements PARAMETER DESIGN TARGET Power-supply voltage, VS 5V Nominal bus supply voltage, VBUS 5V VBUS overvoltage warning threshold 5.5 V Nominal load current 10 A Peak load current 15 A Overcurrent warning threshold 15 A RSHUNT 2 mΩ 8.2.2 Detailed Design Procedure This design example walks through the process of programming the calibration register, calculating the PMBus coefficients, setting the correct overvoltage and overcurrent warning thresholds, and how to properly scale returned values from the device. The device alert response time is also examined with 140-µs and 1.1-ms ADC conversion rates. 8.2.2.1 Programming the Calibration Register For this example, assuming a peak current of less than 15 A, the Current_LSB is calculated to be 457.7 μA/bit using Equation 2. Selecting a value for the Current_LSB of 500 μA/bit or 1 mA/bit significantly simplifies the conversion of the returned value from the READ_IN and READ_PIN commands to amperes and watts. For this example, a value of 1 mA/bit is chosen for the Current_LSB. Using this value for the Current_LSB does trade a small amount of resolution for having a simpler conversion process on the user side. Using Equation 1 in this example with a Current_LSB value of 1 mA/bit and a shunt resistor of 2 mΩ results in a MFR_CALIBRATION register value of 2560d (or A00h). 8.2.2.2 Calculating PMBus Coefficients The m, b, and R coefficients are fixed for bus voltage measurements returned by the READ_VIN and READ_VOUT and are available from Table 1. For current and power measurements, the value for the m and R coefficients must be calculated. For current measurements returned by the READ_IIN and READ_IOUT commands, the value for m is calculated by inverting the Current_LSB used to set the MFR_CALIBRATION register and shifting the decimal location if needed to minimize rounding errors. In this example, using the Current_LSB of 1 mA/bit, the value of m is calculated to be 1000. Shifting the decimal location does not obtain higher accuracy because the value for m is a whole number. The value for R in this example is 0 because the decimal location for the value of m does not need shifting. The POWER_LSB value is 25 times the value of the CURRENT_LSB, therefore, the value for m is reduced by a factor of 25. For this example, the value for the m power coefficient 1000 / 25 or 40. For this case, the R coefficient is also 0 because m is a whole number. If m is not a whole number, then shifting the decimal place is advantageous to reduce rounding errors while keeping the value between –32768 and 32767. Decimal shifts to the right result in negative values for R and shifts to the left result in positive values; the number of shifts is the absolute value of R. The value of 0 can be used for b for both current and power measurements with very little loss in accuracy because the offset for power and current measurements is very low. The m, b, and R coefficients are fixed for bus voltage measurements returned by the READ_VIN and READ_VOUT and are available from Table 1. 42 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 8.2.2.3 Programming Warning Thresholds Warning thresholds are set by converting the warning value from volts, amperes, and watts to the appropriate digital word using Equation 4 with the correct values for m, b, and R. For example, to set a bus voltage overvoltage warning at 5.5 V with the VIN_OV_WARN_LIMIT command, the correct value to write with this command is 4400d or 1130h. The least significant last three bits of the 16-bit word are hard coded to 0 because the warning thresholds only have 12 bits of effective resolution. For this example there is no change to what is written in the VIN_OV_WARN_LIMIT register because the last three bits are already zero. To set an overcurrent warning level at 15 A with the IIN_OC_WARN_LIMIT command, the correct value to write to the device is 15000d (or 3A98h). 8.2.2.4 Calculating Returned Telemetry Values When the value for the m, b, and R coefficients are known, returned values can be translated to volts, amperes, or watts by using Equation 3 with the calculated m, b, and R coefficients. Alternatively, returned values can be calculated by multiplying the returned code by the corresponding LSB size as discussed in the Calibration Register and Scaling section. 8.2.3 Application Curves LIMIT (5.5 V) LIMIT (5.5 V) Figure 44 shows the ALERT pin response to a bus overvoltage limit of 5.6 V for a conversion time (tCT) of 1.1 ms and averaging set to 1. Figure 45 shows the response for the same limit but with the conversion time reduced to 140 µs. For the scope shots shown in these figures, persistence was enabled on the ALERT channel. Figure 44 and Figure 45 show how the ALERT response time can vary depending on when the fault condition occurs relative to the internal ADC clock of the INA233. For fault conditions that are just exceeding the limit threshold, the response time for the ALERT pin can vary from one to two conversion cycles. As mentioned previously, the variation is because of the timing on when the fault event occurs relative to the start time of the internal ADC conversion cycle. For fault events that greatly exceed the limit threshold, the alert can respond in less than one conversion cycle because fewer samples are required for the average to exceed the limit threshold value. 2.2 ms (2 conversions) BUS Voltage/LIMIT (1V /div) BUS Voltage/LIMIT (1V /div) ALERT (1V /div) ALERT (1V /div) 280 Ps (2 conversions) 140 Ps (1 conversion) 1.1 ms (1 conversion) TIME (50 Ps /div) TIME (500 Ps /div) Figure 44. Alert Response (tCT = 140 µs) Figure 45. Alert Response (tCT = 1.1 ms) Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 43 INA233 SBOS790 – APRIL 2017 www.ti.com 9 Power Supply Recommendations The device input circuitry can accurately measure signals on common-mode voltages beyond the power-supply voltage, VVS. For example, the voltage applied to the VS power supply pin can be 5 V, whereas the load powersupply voltage being monitored (the common-mode voltage) can be as high as 36 V. The device can also withstand the full 0-V to 36-V range at the input pins, regardless of whether the device has power applied or not. Place the required power-supply bypass capacitors as close as possible to the supply and ground pins of the device to ensure stability. A typical value for this supply bypass capacitor is 0.1 µF. Applications with noisy or high-impedance power supplies can require additional decoupling capacitors to reject power-supply noise. 10 Layout 10.1 Layout Guidelines Connect the input pins (IN+ and IN–) to the sensing resistor using a Kelvin connection or a 4-wire connection. These connection techniques ensure that only the current-sensing resistor impedance is detected between the input pins. Poor routing of the current-sensing resistor commonly results in additional resistance present between the input pins. Given the very low ohmic value of the current-sensing resistor, any additional high-current carrying impedance causes significant measurement errors. Place the power-supply bypass capacitor as close as possible to the supply and ground pins. 10.2 Layout Example A1 A0 IN+ Sense, Shunt Resistor IN± (1) ALERT Alert Output (Can be left floating if unused) VBUS SDA GND SCL VS 2 I C, SMBus Interface Supply Bypass Capacitor Via to Ground Plane Via to Power Plane (1) Connect the VBUS pin to the power-supply rail. Figure 46. INA233 Layout Example 44 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 INA233 www.ti.com SBOS790 – APRIL 2017 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support • INA226EVM Evaluation Board and Software Tutorial 11.2 Documentation Support 11.2.1 Related Documentation For related documentation see the following: Current Shunt Monitor with Transient Robustness Reference Design 11.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: INA233 45 PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) INA233AIDGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS & no Sb/Br) NIPDAUAG Level-2-260C-1 YEAR -40 to 125 233 INA233AIDGST ACTIVE VSSOP DGS 10 250 Green (RoHS & no Sb/Br) NIPDAUAG Level-2-260C-1 YEAR -40 to 125 233 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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