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ISO15MDWR

ISO15MDWR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOIC16

  • 描述:

    RS422, RS485 Digital Isolator 2500Vrms 3 Channel 1Mbps 25kV/µs CMTI 16-SOIC (0.295", 7.50mm Width)

  • 数据手册
  • 价格&库存
ISO15MDWR 数据手册
Product Folder Sample & Buy Support & Community Tools & Software Technical Documents ISO15, ISO35, ISO15M, ISO35M SLOS580G – MAY 2008 – REVISED MARCH 2015 ISOx5 Isolated 3.3-V Half- and Full-Duplex RS-485 Transceivers 1 Features 3 Description • • • • • • • • • The ISO15 is an isolated half-duplex differential line transceiver while the ISO35 is an isolated full-duplex differential line driver and receiver for TIA/EIA 485/422 applications. The ISO15M and ISO35M have extended ambient temperature ratings of –55°C to 125°C while the ISO15 and ISO35 are specified over –40°C to 85°C. 1 Meets or Exceeds TIA/EIA RS-485 Requirements 1/8 Unit Load – Up to 256 Nodes on a Bus Signaling Rates up to 1 Mbps Thermal Shutdown Protection Low Bus Capacitance – 16 pF (Typical) 50 kV/μs Typical Transient Immunity Fail-safe Receiver for Bus Open, Short, Idle 3.3-V Inputs are 5-V Tolerant Safety and Regulatory Approvals – 4000-VPK VIOTM, 560-VPK VIORM per DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 and DIN EN 61010-1 – 2500 VRMS Isolation Rating per UL 1577 – 2500 VRMS Isolation Rating per CSA CA5A and IEC 60950-1 2 Applications • • • • • • Security Systems Chemical Production Factory Automation Motor and Motion Control HVAC and Building Automation Networks Networked Security Stations These devices are ideal for long transmission lines because the ground loop is broken to allow for a much larger common-mode voltage range. The symmetrical barrier of the device is tested to provide isolatlion of 4000 VPK per VDE and 2500 VRMS per UL and CSA between the bus-line transceiver and the logic-level interface. Any cabled I/O can be subjected to electrical noise transients from various sources. These noise transients can cause damage to the transceiver and/or nearby sensitive circuitry if they are of sufficient magnitude and duration. These isolated devices can significantly increase protection and reduce the risk of damage to expensive control circuits. Device Information(1) PART NUMBER ISO15 PACKAGE SOIC (16) ISO35 BODY SIZE (NOM) 10.30 mm × 7.50 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 4 Simplified Schematics D R RE 5 6 3 4 GALVANIC ISOLATION DE R 13 12 B 3 4 RE DE 5 A D 6 GALVANIC ISOLATIO N ISO35x ISO15x 14 13 12 A B Z 11 Y 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ISO15, ISO35, ISO15M, ISO35M SLOS580G – MAY 2008 – REVISED MARCH 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Simplified Schematics........................................... Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 1 2 4 5 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 5 5 5 6 6 6 6 7 7 7 8 Absolute Maximum Ratings ..................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Dissipation Ratings ................................................... Supply Current .......................................................... Driver Electrical Characteristics ................................ Receiver Electrical Characteristics ........................... Driver Switching Characteristics ............................... Receiver Switching Characteristics......................... Typical Characteristics ............................................ Parameter Measurement Information .................. 9 9 Detailed Description ............................................ 13 9.1 9.2 9.3 9.4 Overview ................................................................. Functional Block Diagrams ..................................... Feature Description................................................. Device Functional Modes........................................ 13 13 14 15 10 Application and Implementation........................ 18 10.1 Application Information.......................................... 18 10.2 Typical Application ............................................... 18 11 Power Supply Recommendations ..................... 20 12 Layout................................................................... 20 12.1 Layout Guidelines ................................................. 20 12.2 Layout Example .................................................... 21 13 Device and Documentation Support ................. 22 13.1 13.2 13.3 13.4 13.5 Documentation Support ........................................ Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 22 22 22 22 22 14 Mechanical, Packaging, and Orderable Information ........................................................... 22 5 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision F (January 2012) to Revision G Page • Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 • Changed VDE standard to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12. .................................................................... 1 Changes from Revision E (April 2010) to Revision F Page • Changed the FEATURES From: 4000-Vpeak 560-Vpeak VIORM per IEC....Rev 2) To: 4000-VPK VIOTM, 560-VPKVIORM, IEC 60747-5-2 (VDE 0884, Rev 2)......................................................................................................................................... 1 • Changed Description From: The symmetrical isolation......interface. To; The symmetrical isolation barrier of the device is tested to provide isolatlion of 4000 VPK per VDE and 2500 VRMS per UL and CSA between ....interface. ............. 1 • Changed CTI From: ≥175 V To: ≥400 V................................................................................................................................. 7 • Changed the Regulatory Information Table............................................................................................................................ 7 Changes from Revision D (March 2009) to Revision E Page • Added devices ISO15M and ISO35M to the data sheet ........................................................................................................ 1 • Changed Description - From: The ISO15 and ISO35 are qualified for use from –40°C to 85°C. To: The ISO15M and ISO35M have extended ambient temperature ratings of –55°C to 125°C while the ISO15 and ISO35 are specified over –40°C to 85°C................................................................................................................................................................. 1 • Added Added Ambient Temp information in the RECOMMENDED OPERATING CONDITIONS table................................ 5 • Added ISO15M and ISO35M to the Operating junction temperature in the RECOMMENDED OPERATING CONDITIONS table ................................................................................................................................................................ 5 • Changed the DRIVER ELECTRICAL table, IOZ High-impedance state output current - Test Condition VY or VZ = 12 V, VCC = 0 values From: TYP = -10 , MAX = - To: TYP = -, MAX = 90. ............................................................................... 6 • Changed the DRIVER ELECTRICAL table, IOZ High-impedance state output current - Test Condition VY or VZ = –7 2 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: ISO15 ISO35 ISO15M ISO35M ISO15, ISO35, ISO15M, ISO35M www.ti.com SLOS580G – MAY 2008 – REVISED MARCH 2015 V values From: TYP = -, MAX = 90 To: TYP = -10, MAX = - ................................................................................................ 6 • Added IA or IB limits for the ISO15M ans ISO35M devices .................................................................................................... 7 • Added tr, tf limits for the ISO15M ans ISO35M devices ......................................................................................................... 7 • Added pulse skew limits for the ISO15M ans ISO35M devices ............................................................................................. 7 • Added tr, tf for the ISO15M ans ISO35M devices................................................................................................................... 7 • Added the Driver output pins Note for Figure 3 through Figure 6 .......................................................................................... 9 • Changed the Driver output pins Note for Figure 7 through Figure 8.................................................................................... 10 Changes from Revision C (December 2008) to Revision D • Page Changed Propagation delay values From: μs To: ns in the DRIVER SWITCHING table...................................................... 7 Changes from Revision B (July 2008) to Revision C Page • Added added IEC......Approved.............................................................................................................................................. 1 • Added added CSA information column back in table............................................................................................................. 7 Changes from Revision A (June 2008) to Revision B Page • Changed From: 4000-Vpeak Isolation To: 4000-Vpeak Isolation, 560-Vpeak VIORM UL 1577, IEC 60747-5-2 (VDE 0884, Rev 2) ........................................................................................................................................................................... 1 • Changed Figure 15, Full-Duplex Common-Mode Transient Immunity Test Circuit.............................................................. 12 Changes from Original (May 2008) to Revision A Page • Changed L(101) Minimum air gap (Clearance) From 7.7mm To 8.34mm. ............................................................................ 7 • Changed From 40014131 To 40016131 ................................................................................................................................ 7 • Deleted CSA information from the Regulatory Information Table. ......................................................................................... 7 Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: ISO15 ISO35 ISO15M ISO35M Submit Documentation Feedback 3 ISO15, ISO35, ISO15M, ISO35M SLOS580G – MAY 2008 – REVISED MARCH 2015 www.ti.com 6 Pin Configuration and Functions ISO35x DW Package 16-Pin SOIC Top View VCC1 GND1 R RE DE D GND1 GND1 1 2 16 15 VCC2 GND2 3 4 5 6 7 8 14 13 12 A B Z Y GND2 11 10 9 GND2 ISO15x DW Package 16-Pin SOIC Top View VCC1 GND1 R RE DE D GND1 GND1 1 2 16 15 3 4 5 6 7 8 14 13 12 11 10 9 VCC2 GND2 NC B A NC GND2 GND2 Pin Functions PIN NAME VCC1 ISO15x NO. ISO35x NO. I/O DESCRIPTION 1 1 – Logic side power supply 2,7,8 2,7,8 – Logic side ground; internally connected R 3 3 O Receiver output RE 4 4 I Receiver logic-low enable DE 5 5 I Driver logic-high enable input D 6 6 I Driver input 9,10,15 9,10,15 – Bus side ground; internally connected 11,14 – – Not connected internally; may be left floating GND1 GND2 NC A 12 14 B 13 13 Y – Z VCC2 4 I/O I I/O ISO15x: Noninverting bus input / output ISO35x: Noninverting bus input ISO15x: Inverting bus input / output I ISO35x: Inverting bus input 11 O Noninverting bus output – 12 O Inverting bus output 16 16 – Bus side power supply Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: ISO15 ISO35 ISO15M ISO35M ISO15, ISO35, ISO15M, ISO35M www.ti.com SLOS580G – MAY 2008 – REVISED MARCH 2015 7 Specifications 7.1 Absolute Maximum Ratings (1) MAX MAX UNIT –0.3 6 V Voltage at any bus I/O terminal –9 14 V VIT Voltage input, transient pulse, A, B, Y, and Z (through 100Ω, see Figure 13) –50 50 V VI Voltage input at any D, DE or RE terminal –0.5 7 V IO Receiver output current –10 10 mA TJ Maximum junction temperature 170 °C Tstg Storage temperature 150 °C VCC Input supply voltage. VO (1) (2) (2) VCC1, VCC2 -65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values except differential I/O bus voltages are with respect to network ground terminal and are peak voltage values 7.2 ESD Ratings VALUE V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS001 (1) Bus pins and GND1 ±6000 Bus pins and GND2 ±16000 All pins ±4000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) V ±1000 Machine model ANSI/ESDS5.2-1996 (1) (2) UNIT ±200 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions VCC Supply Voltage, VCC1, VCC2 VOC Voltage at either bus I/O terminal VIH High-level input voltage VIL Low-level input voltage VID Differential input voltage RL Differential input resistance IO Output current 1/tUI Signaling rate TA Ambient temperature TJ Operating junction temperature A, B D, DE, RE A with respect to B MIN NOM MAX 3.15 3.3 3.6 V –7 12 V 2 VCC 0 0.8 –12 54 Driver Receiver 12 V Ω –60 60 –8 8 1 ISO15 and ISO35 –40 25 85 ISO15M and ISO35M –55 25 125 ISO15 and ISO35 –40 150 ISO15M and ISO35M –55 150 Product Folder Links: ISO15 ISO35 ISO15M ISO35M V 60 ISO15x and ISO35x Copyright © 2008–2015, Texas Instruments Incorporated UNIT mA Mbps Submit Documentation Feedback °C °C 5 ISO15, ISO35, ISO15M, ISO35M SLOS580G – MAY 2008 – REVISED MARCH 2015 www.ti.com 7.4 Thermal Information THERMAL METRIC ISO15, ISO35 (1) UNIT DW (SOIC) 16 PINS High-K board 79.6 RθJA Junction-to-ambient thermal resistance RθJC(top) Junction-to-case (top) thermal resistance 39.7 RθJB Junction-to-board thermal resistance 44.6 ψJT Junction-to-top characterization parameter 11.8 ψJB Junction-to-board characterization parameter 44 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a (1) Low-K board 168 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.5 Dissipation Ratings PD VCC1 = VCC2 = 3.6 V, TJ = 150°C, CL = 15 pF, Input a 0.5 MHz 50% duty cycle square wave Device Power Dissipation VALUE UNIT 220 mW 7.6 Supply Current over recommended operating condition (unless otherwise noted) PARAMETER TEST CONDITIONS MIN ICC1 Logic-side supply current ISO35x and RE at 0 V or VCC, DE at 0 V, No load (driver disabled) ISO15x RE at 0 V or VCC, DE at VCC, No Load (driver enabled) ICC2 Bus-side supply current ISO35x and RE at 0 V or VCC, DE at 0 V, No load (driver disabled) ISO15x RE at 0 V or VCC, DE at VCC, No Load (driver enabled) TYP MAX 8 15 8 19 UNIT mA mA 7.7 Driver Electrical Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP IO = 0 mA, no load 2.5 RL = 54 Ω, See Figure 3 1.5 2 2 2.3 | VOD | Differential output voltage magnitude Δ|VOD| Change in magnitude of the differential output voltage VOC(SS) Steady-state common-mode output voltage ΔVOC(SS) Change in steady-state common-mode output voltage VOC(pp) Peak-to-peak common-mode output voltage See Figure 5 II Input current RL = 100 Ω (RS-422), See Figure 3 Vtest from –7 V to +12 V, See Figure 4 See Figure 3 and Figure 4 See Figure 5 MAX V 1.5 –0.2 0 0.2 1 2.6 3 –0.1 0.1 0.5 D, DE, VI at 0 V or VCC1 UNIT VCC –10 V V V 10 μA ISO15 See receiver input current VY or VZ = 12 V IOZ High-impedance state output current ISO35 VY or VZ = 12 V, VCC = 0 VY or VZ = –7 V 90 Other input at 0 V VY or VZ = –7 V, VCC = 0 VA or VB at –7 V Short-circuit output current VA or VB at 12 V COD Differential output capacitance VI = 0.4 sin (4E6πt) + 0.5 V, DE at 0 V CMTI Common-mode transient immunity VI = VCC or 0 V, See Figure 14 and Figure 15 Submit Documentation Feedback μA -10 Other input at 0 V IOS 6 90 –10 –250 25 250 mA 16 pF 50 kV/μs Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: ISO15 ISO35 ISO15M ISO35M ISO15, ISO35, ISO15M, ISO35M www.ti.com SLOS580G – MAY 2008 – REVISED MARCH 2015 7.8 Receiver Electrical Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS VIT(+) Positive-going input threshold voltage IO = –8 mA VIT(–) Negative-going input threshold voltage IO = 8 mA Vhys Hysteresis voltage (VIT+ – VIT–) UNIT –20 mV mV 50 IO = –8 mA Output voltage VID = 200 mV, See Figure 9 IOZ High-impedance state output current VI = –7 to 12 V, Other input = 0 V -55oC ≤ TA ≤ 85oC 85oC ≤ TA ≤ 125oC Bus input current TYP MAX –200 VO IA or IB MIN -55oC ≤ TA ≤ 125oC IO = 8 mA –1 μA 1 VA or VB = 12 V, VCC = 0 VA or VB = 12 V, VCC = 0 V 0.4 VA or VB = 12 V VA or VB = 12 V mV 2.4 50 100 50 100 200 Other input at 0V μA 200 VA or VB = –7 V –100 –40 VA or VB = –7 V, VCC = 0 –100 –30 IIH High-level input current, RE VIH = 2 V –10 μA IIL Low-level input current, RE VIL = 0.8 V –10 μA RID Differential input resistance A, B CID Differential input capacitance VI = 0.4 sin (4E6πt) + 0.5V, DE at 0 V 48 kΩ 16 pF 7.9 Driver Switching Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX tPLH, tPHL Propagation delay UNIT 340 tsk(p) Pulse skew (|tPHL – tPLH|) tr, tf Differential output signal rise time, fall time tPHZ Propagation delay, high-level-to-high-impedance output tPZH Propagation delay, high-impedance-to-high-level output tPLZ Propagation delay, low-level to high-impedance output tPZL Propagation delay, standby-to-low-level output ISO15 and ISO35 6 See Figure 6 ISO15M and ISO35M 120 180 300 120 180 350 ns 205 See Figure 7 ns 530 330 See Figure 8 ns 530 7.10 Receiver Switching Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER tPLH, tPHL Propagation delay TEST CONDITIONS MIN TYP ISO15x and ISO35x Pulse skew (|tPHL – tPLH|) ISO15M and ISO35M 13 18 See Figure 10 ISO15 and ISO35 2 4 ISO15M and ISO35M 2 6 13 25 13 25 tr, tf Output signal rise and fall time tPZH, tPZL Propagation delay, high-impedance-to-high-level output Propagation delay, high-impedance-to-low-level output tPHZ, tPLZ Propagation delay, high-level-to-high-impedance output Propagation delay, low-level to high-impedance output UNIT 100 ISO15 and ISO35 tsk(p) MAX DE at 0 V, See Figure 11 and Figure 12 Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: ISO15 ISO35 ISO15M ISO35M ns ns Submit Documentation Feedback 7 ISO15, ISO35, ISO15M, ISO35M SLOS580G – MAY 2008 – REVISED MARCH 2015 www.ti.com 7.11 Typical Characteristics 25 60 20 Supply Current (mA) Supply Current (mA) 50 40 ICC1 (3.3 V) ICC2 (3.3 V) 30 20 ICC1 (3.3 V) ICC2 (3.3 V) 10 5 10 0 0 0 200 400 600 Data Rate (kbps) 800 1000 Submit Documentation Feedback 0 200 D001 D007 Figure 1. ISOx5 Supply Current vs Data Rate With Load 8 15 400 600 Data Rate (kbps) 800 1000 D002 D007 Figure 2. ISOx5 Supply Current vs Data Rate With No Load Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: ISO15 ISO35 ISO15M ISO35M ISO15, ISO35, ISO15M, ISO35M www.ti.com SLOS580G – MAY 2008 – REVISED MARCH 2015 8 Parameter Measurement Information VCC2 VCC1 IOA DE DE A 375 W A II 0 or VCC1 D VOD B GND1 D 0 or 3 V + VOD - B 60 W IOB GND2 VI 375 W GND2 VOA VOB GND1 -7 V to 12 V GND2 Figure 3. Driver VOD Test and Current Definitions Figure 4. Driver VOD With Common-Mode Loading Test Circuit VCC1 IOA DE 27 W A A VA B VB II VOD Input D VI B GND1 VOB VOC 27 W IOB GND2 VOA VOC(SS) VOC(PP) VOC GND2 GND1 Figure 5. Test Circuit and Waveform Definitions for the Driver Common-Mode Output Voltage 3V DE VCC1 A D Input Generator VI B VI VOD RL = 54 W ±1% CL = 50 pF ±20% 90% 50% 10% GND1 Generator: PRR = 500 kHz, 50% duty cycle, tr
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