Order
Now
Product
Folder
Support &
Community
Tools &
Software
Technical
Documents
Reference
Design
ISO3080, ISO3082, ISO3086, ISO3088
SLOS581I – MAY 2008 – REVISED APRIL 2017
ISO308x Isolated 5-V Full- and Half-Duplex RS-485 Transceivers
1 Features
3 Description
•
•
•
•
•
•
•
•
•
The ISO3080 and ISO3086 devices are isolated fullduplex differential line drivers and receivers while the
ISO3082 and ISO3088 devices are isolated halfduplex differential line transceivers for TIA/EIA
485/422 applications.
•
Meets or Exceeds TIA/EIA RS-485 Requirements
Signaling Rates up to 20 Mbps
1/8 Unit Load – Up to 256 Nodes on a Bus
Thermal Shutdown Protection
Low Bus Capacitance – 16 pF (Typical)
50 kV/μs Typical Transient Immunity
Fail-safe Receiver for Bus Open, Short, Idle
3.3-V Inputs are 5-V Tolerant
Bus-Pin ESD Protection
– 12-kV HBM Between Bus Pins and GND2
– 6-kV HBM Between Bus Pins and GND1
Safety-Related Certifications:
– 4000-VPK Basic Insulation, 560 VPK VIORM per
DIN V VDE V 0884-10 (VDE V 0884-10):
2006-12 and DIN EN 61010-1
– 2500 VRMS Isolation per UL 1577
– 4000 VPK Isolation per CSA Component
Acceptance Notice 5A and IEC 60950-1
These devices are ideal for long transmission lines
because the ground loop is broken to allow for a
much larger common-mode voltage range. The
symmetrical isolation barrier of the device is tested to
provide 2500 VRMS of isolation for 60 s per UL 1577
between the bus-line transceiver and the logic-level
interface.
Any cabled I/O can be subjected to electrical noise
transients from various sources. These noise
transients can cause damage to the transceiver
and/or nearby sensitive circuitry if they are of
sufficient magnitude and duration. These isolated
devices can significantly increase protection and
reduce the risk of damage to expensive control
circuits.
The ISO3080, ISO3082, ISO3086, and ISO3088
device are qualified for use from –40°C to +85°C.
2 Applications
•
•
•
•
•
•
Security Systems
Chemical Production
Factory Automation
Motor and Motion Control
HVAC and Building Automation Networks
Networked Security Stations
R
3
4
RE
DE 5
D
6
GALVANIC ISOLATIO N
ISO3080, IOS3086 Function Diagram
14
13
12
Device Information(1)
PART NUMBER
BODY SIZE (NOM)
ISO3080
ISO3082
SOIC (16)
ISO3086
10.30 mm × 7.50 mm
ISO3088
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
ISO3082, IOS3088 Function Diagram
A
DE
B
D
Z
R
RE
11
PACKAGE
5
6
3
4
GALVANIC ISOLATION
1
13
12
B
A
Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ISO3080, ISO3082, ISO3086, ISO3088
SLOS581I – MAY 2008 – REVISED APRIL 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
6.12
6.13
6.14
7
1
1
1
2
4
5
Absolute Maximum Ratings ..................................... 5
ESD Ratings.............................................................. 5
Recommended Operating Conditions....................... 5
Thermal Information .................................................. 6
Insulation Specifications............................................ 6
Safety-Related Certifications..................................... 6
Safety Limiting Values .............................................. 7
Electrical Characteristics: Driver ............................... 7
Electrical Characteristics: Receiver .......................... 8
Supply Current ........................................................ 9
Switching Characteristics: Driver ............................ 9
Switching Characteristics: Receiver........................ 9
Insulation Characteristics Curves ......................... 10
Typical Characteristics .......................................... 11
Parameter Measurement Information ................ 13
8
Detailed Description ............................................ 17
8.1
8.2
8.3
8.4
9
Overview .................................................................
Functional Block Diagrams .....................................
Feature Description.................................................
Device Functional Modes........................................
17
17
18
18
Application and Implementation ........................ 20
9.1 Application Information............................................ 20
9.2 Typical Application ................................................. 20
10 Power Supply Recommendations ..................... 22
11 Layout................................................................... 22
11.1 Layout Guidelines ................................................. 22
11.2 Layout Example .................................................... 23
12 Device and Documentation Support ................. 24
12.1
12.2
12.3
12.4
12.5
12.6
12.7
Documentation Support ........................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
24
24
24
24
24
24
25
13 Mechanical, Packaging, and Orderable
Information ........................................................... 25
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (December 2015) to Revision I
Page
•
Changed the L(I01) and L(I02) parameters to external clearance and external creepage, respectively ............................... 6
•
Changed the VPR parameter to apparent charge .................................................................................................................. 6
•
Switched the R and D pins of the master device in the Typical RS-485 Network With Full-Duplex Transceivers figure .... 20
•
Added the Receiving Notification of Documentation Updates section ................................................................................. 24
•
Changed the Electrostatic Discharge Caution statement .................................................................................................... 24
Changes from Revision G (July 2015) to Revision H
Page
•
Changed the CDM value in ESD Ratings From: ±200 To: ±1000 ......................................................................................... 5
•
Changed the MON value of L(IO1) in Insulation and Safety-Related Package Characteristics From: 8.34 To: 8 mm ........ 6
•
Changed the MON value of L(IO2) in Insulation and Safety-Related Package Characteristics From: 8.1 To: 8 mm .......... 6
•
Moved the last list item " Routing the high-speed traces..." to the second list items in Layout Guidelines section............. 22
Changes from Revision F (May 2015) to Revision G
Page
•
Deleted "Rated mains voltage ≤ 400 VRMS" from IEC 60664-1 Ratings Table ....................................................................... 6
•
Changed "Maximum case temperature" To: "Maximum safety temperature" in Safety Limiting............................................ 7
•
Changed the Layout Guidelines section .............................................................................................................................. 22
2
Submit Documentation Feedback
Copyright © 2008–2017, Texas Instruments Incorporated
Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088
ISO3080, ISO3082, ISO3086, ISO3088
www.ti.com
SLOS581I – MAY 2008 – REVISED APRIL 2017
Changes from Revision E (September 2011) to Revision F
Page
•
Added ESD Rating table, Thermal Information table, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1
•
Changed Features list item From: IEC 60747-5-2 (VDE 0884, Rev. 2) To: DIN V VDE V 0884-10 (VDE V 0884-10):
2006-12................................................................................................................................................................................... 1
•
VDE standard changed to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12....................................................................... 1
•
Changed IEC 60664-1 Ratings Table. Basic isolation group SPECIFICATION entry From: IIIa To: II ................................. 6
Changes from Revision D (January 2011) to Revision E
Page
•
Changed Features list item From: 16 kV HBM To: 12 kV HBM ............................................................................................. 1
•
Changed ESD HBM spec value from ±16 to ±12 in ESD Ratings ......................................................................................... 5
Changes from Revision C (October 2009) to Revision D
Page
•
Added TSTG row to the Absolute Maximum Ratings ............................................................................................................... 5
•
Added "Dynamic" conditions to Recommended Operating Conditions VID spec with reference to ISO3086
Recommended Minimum Differential Input Voltage vs Signaling Rate .................................................................................. 5
•
Changed for 3 V to 3.3 V in note 1 of the Recommended Operating Conditions table ......................................................... 5
•
Changed File Number from '1698195' to '220991 in Regulatory Information ....................................................................... 6
•
Changed θJA from 212 ° C/W to 168 ° C/W in conditions statement for IS spec.; and MAX current from 210 mA to
157 mA in Safety Limiting....................................................................................................................................................... 7
•
Deleted VI = VCCI or 0 V from CMTI spec. Conditions statement. Added "Figure 13" in Electrical Characteristics: Driver ... 7
•
Changed top row, UNIT column, split into 2 rows, top row µs and second row ns in Switching Characteristics: Driver....... 9
•
Changed graph for " DW-16 θJC Thermal Derating Curve per IEC 60747-5-2 " , Thermal Derating Curve......................... 10
•
Added the ISO3086 Recommended Minimum Differential Input Voltage vs Signaling Rate graph..................................... 11
•
Added note to bottom of first page of the Parameter Measurement Information ................................................................. 13
•
Added Footnotes to the Driver Function Table and Receiver Function Table ..................................................................... 18
Changes from Revision B (December 2008) to Revision C
•
Page
Changed Recommended Operating Conditions table note From: For 3-V operation, VCC1 or VCC2 is specified from
3.15 V to 3.6V. To: For 3-V operation, VCC1 is specified from 3.15 V to 3.6V........................................................................ 5
Changes from Revision A (June 2008) to Revision B
Page
•
Changed Features bullet From: 4000-VPEAK Isolation, To: 4000-VPEAK Isolation,, 560-VPEAK VIORM ...................................... 1
•
Added the CSA column to Regulatory Information................................................................................................................. 6
Changes from Original (May 2008) to Revision A
Page
•
Deleted the CSA column from Regulatory Information. ......................................................................................................... 6
•
Changed the file number in the VDE column in Regulatory Information From: 40014131 To: 40016131............................. 6
Copyright © 2008–2017, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088
3
ISO3080, ISO3082, ISO3086, ISO3088
SLOS581I – MAY 2008 – REVISED APRIL 2017
www.ti.com
5 Pin Configuration and Functions
ISO3080 and ISO3086 DW Package
16-Pin SOIC
Top View
VCC1
GND1
R
RE
DE
D
GND1
GND1
1
2
16
15
VCC2
GND2
3
4
5
6
7
8
14
13
12
A
B
Z
Y
GND2
11
10
9
ISO3082 and ISO3088 DW Package
16-Pin SOIC
Top View
VCC1
GND1
R
RE
DE
D
GND1
GND1
GND2
1
2
16
15
3
4
5
6
7
8
14
13
12
11
10
9
VCC2
GND2
NC
B
A
NC
GND2
GND2
Pin Functions
PIN
NAME
A
B
ISO3080,
ISO3086
ISO3082,
ISO3088
I/O
14
—
I
—
12
I/O
13
—
I
DESCRIPTION
Receiver noninverting input on the bus-side
Transceiver noninverting Input or output (I/O) on the bus-side
Receiver inverting Input on the bus-side
—
13
I/O
D
6
6
I
Driver input
DE
5
5
I
Enables (when high) or disables (when low or open) driver output of ISO308x
2
2
7
7
8
8
GND1
GND2
9
9
10
10
15
15
11
Transceiver inverting input or output (I/O) on the bus-side
—
Ground connection for VCC1
—
Ground connection for VCC2
—
No connect
NC
—
R
3
3
O
Receiver output
RE
4
4
I
Disables (when high or open) or enables (when low) receiver output of ISO308x
14
VCC1
1
1
—
Power supply, VCC1
VCC2
16
16
—
Power supply, VCC2
Y
11
—
O
Driver noninverting output
Z
12
—
O
Driver inverting output
4
Submit Documentation Feedback
Copyright © 2008–2017, Texas Instruments Incorporated
Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088
ISO3080, ISO3082, ISO3086, ISO3088
www.ti.com
SLOS581I – MAY 2008 – REVISED APRIL 2017
6 Specifications
6.1 Absolute Maximum Ratings
See
(1)
.
VCC
Input supply voltage (2)
VO
Voltage at any bus I/O pin
VIT
Voltage input, transient pulse (through 100 Ω, see Figure 21)
VI
Voltage input at any D, DE or RE pin
IO
Receiver output current
TJ
Maximum junction temperature
Tstg
Storage temperature
(1)
(2)
VCC1, VCC2
A, B, Y, and Z
MIN
MAX
UNIT
–0.3
6
V
–9
14
V
–50
50
V
–0.5
7
V
±10
mA
150
°C
150
°C
–65
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values except differential I/O bus voltages are with respect to network ground terminal and are peak voltage values.
6.2 ESD Ratings
VALUE
V(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
Charged device model (CDM), per JEDEC specification JESD22-C101
(1)
(2)
Bus pins and GND1
±6000
Bus pins and GND2
±12000
All pins
±4000
(2)
UNIT
V
±1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
(1)
VCC1
Logic-side supply voltage
VCC2
Bus-side supply voltage (1)
VOC
Voltage at either bus I/O pin
A, B
VIH
High-level input voltage
VIL
Low-level input voltage
VID
Differential input voltage
RL
Differential input resistance
IO
Output current
TA
Ambient temperature
(1)
TYP
3.15
MAX
UNIT
5.5
V
5.5
V
–7
12
V
D, DE, RE
2
VCC
D, DE, RE
0
0.8
–12
12
4.5
A with respect to B
Dynamic (ISO3086)
5
See Figure 10
54
Driver
Receiver
60
V
V
Ω
–60
60
–8
8
–40
85
mA
°C
For 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For 3.3-V operation, VCC1 is specified from 3.15 V to 3.6 V.
Copyright © 2008–2017, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088
5
ISO3080, ISO3082, ISO3086, ISO3088
SLOS581I – MAY 2008 – REVISED APRIL 2017
www.ti.com
6.4 Thermal Information
ISO308x
THERMAL METRIC (1)
DW (SOIC)
UNIT
16 PINS
Low-K thermal resistance (2)
168
High-K thermal resistance
79.6
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
39.7
°C/W
RθJB
Junction-to-board thermal resistance
44.7
°C/W
ψJT
Junction-to-top characterization parameter
11.8
°C/W
ψJB
Junction-to-board characterization parameter
44.0
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
°C/W
(1)
(2)
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.
6.5 Insulation Specifications
PARAMETER
TEST CONDITIONS
VALUE
UNIT
GENERAL
CLR
External clearance (1)
Shortest terminal-to-terminal distance through air
8
mm
CPG
External creepage (1)
Shortest terminal-to-terminal distance across the
package surface
8
mm
DTI
Distance through the insulation
Minimum internal gap (internal clearance)
0.008
mm
CTI
Comparative tracking index
DIN EN 60112 (VDE 0303-11)
≥400
V
Material group
II
Overvoltage category
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
VIORM
Rated mains voltage ≤ 150 VRMS
I-IV
Rated mains voltage ≤ 300 VRMS
I-III
(2)
Maximum repetitive peak isolation voltage AC voltage (bipolar)
560
VPK
4000
VPK
VIOTM
Maximum transient isolation voltage
VTEST = VIOTM, t = 60 s (qualification);
t = 1 s (100% production)
qpd
Apparent charge (3)
Method b1, VPR = VIORM × 1.5,
100% Production test with t = 1 s
≤5
pC
CIO
Barrier capacitance, input to output (4)
VI = 0.4 sin (4E6πt)
2
pF
12
Isolation resistance, input to output (4)
VIO = 500 V, TA = 25°C, all pins on each side of the
barrier tied together creating a 2-terminal device
>10
Ω
VIO = 500 V at TS = 150°C
>109
Ω
RIO
(1)
(2)
(3)
(4)
Pollution degree
2
Climatic category
40/125/21
Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care
should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on
the printed-circuit board do not reduce this distance. Creepage and clearance on a printed-circuit board become equal in certain cases.
Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.
This coupler is suitable for basic electrical insulation only within the maximum operating ratings. Compliance with the safety ratings shall
be ensured by means of suitable protective circuits.
Apparent charge is electrical discharge caused by a partial discharge (pd).
All pins on each side of the barrier tied together creating a two-terminal device
6.6 Safety-Related Certifications
VDE
CSA
UL
Certified according to DIN V VDE V 0884-10 (VDE
V 0884-10):2006-12
Approved under CSA Component
Acceptance Notice 5A and IEC 60950-1
Recognized under UL 1577
Component Recognition Program
Basic insulation,
4000 VPK Maximum transient overvoltage,
560 VPK Maximum repetitive peak isolation voltage
4000 VPK Isolation rating,
560 VPK Basic working voltage per CSA
60950-1-07 and IEC 60950-1 (2nd Ed)
Single Protection, 2500 VRMS
Certificate number: 40016131
Master contract number: 220991
File number: E181974
6
Submit Documentation Feedback
Copyright © 2008–2017, Texas Instruments Incorporated
Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088
ISO3080, ISO3082, ISO3086, ISO3088
www.ti.com
SLOS581I – MAY 2008 – REVISED APRIL 2017
6.7 Safety Limiting Values
Safety limiting (1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure
of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat
the die and damage the isolation barrier, potentially leading to secondary system failures.
PARAMETER
TEST CONDITIONS
IS
Safety input, output, or supply
current
TS
Safety temperature
(1)
MIN
TYP
RθJA = 79.6°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C,
see Figure 1
MAX
UNIT
286
mA
150
°C
The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air
thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air
thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount
packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient
temperature plus the power times the junction-to-air thermal resistance.
6.8 Electrical Characteristics: Driver
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IO = 0 mA, no load
RL = 54 Ω, See Figure 11
| VOD |
Differential output voltage
magnitude
Δ|VOD|
Change in magnitude of the
differential output voltage
See Figure 11 and Figure 12
VOC(SS)
Steady-state common-mode
output voltage
ΔVOC(SS)
RL = 100 Ω (RS-422), See Figure 11
Vtest from –7 V to +12 V, See Figure 12
MIN
TYP
MAX
VCC
3
4.3
1.5
2.3
2
2.3
V
1.5
–0.2
0
0.2
See Figure 13
1
2.6
3
Change in steady-state commonmode output voltage
See Figure 13
–0.1
VOC(pp)
Peak-to-peak common-mode
output voltage
See Figure 13
II
Input current
D, DE, VI at 0 V or VCC1
High-impedance state output
current
IOS
Short-circuit output current
CMTI
Common-mode transient
immunity
V
V
ISO3080
ISO3086
–10
10
μA
1
μA
VY or VZ = –7 V.
VCC = 0 V or 5 V,
DE = 0 V, Other input at 0 V
VA or VB at 12 V, Other input at 0 V
V
See the receiver bias input
current parameter
VY or VZ = 12 V,
VCC = 0 V or 5 V,
DE = 0 V, Other input at 0 V
VA or VB at –7 V, Other input at 0 V
–1
–200
See Figure 22 and Figure 23
Copyright © 2008–2017, Texas Instruments Incorporated
0.1
0.5
ISO3082, ISO3088
IOZ
UNIT
25
200
50
mA
kV/μs
Submit Documentation Feedback
Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088
7
ISO3080, ISO3082, ISO3086, ISO3088
SLOS581I – MAY 2008 – REVISED APRIL 2017
www.ti.com
6.9 Electrical Characteristics: Receiver
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT(+)
Positive-going input threshold
voltage
IO = –8 mA
VIT(–)
Negative-going input threshold
voltage
IO = 8 mA
Vhys
Hysteresis voltage (VIT+ – VIT–)
VOH
High-level output voltage
MIN
–200
TYP
MAX
UNIT
–85
–10
mV
–115
mV
30
mV
VCC1 –
0.4
3.1
4
4.8
VID = 200 mV, IO = –8 mA,
See Figure 17
3.3-V VCC1
3.3-V VCC1
0.15
0.4
5-V VCC1
0.15
0.4
5-V VCC1
VOL
Low-level output voltage
VID = –200 mV, IO = 8 mA,
See Figure 17
IO(Z)
High-impedance state output
current
VI = –7 to 12 V, Other input = 0 V
–1
V
1
VA or VB = 12 V, Other input at 0 V
0.04
0.1
VA or VB = 12 V, VCC = 0, Other input at 0 V
0.06
0.13
V
μA
II
Bus input current
IIH
High-level input current, RE
VIH = 2 V
–10
10
μA
IIL
Low-level input current, RE
VIL = 0.8 V
–10
10
μA
RID
Differential input resistance
A, B
CD
Differential input capacitance
Test input signal is a 1.5-MHz sine wave with
1-VPP amplitude. CD is measured across A
and B
7
pF
CI
Input capacitance to ground
VI = 0.4 sin (4E6πt)
2
pF
VA or VB = –7 V, Other input at 0 V
VA or VB = –7 V, VCC = 0, Other input at 0 V
8
Submit Documentation Feedback
–0.1
–0.04
–0.05
–0.03
48
mA
kΩ
Copyright © 2008–2017, Texas Instruments Incorporated
Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088
ISO3080, ISO3082, ISO3086, ISO3088
www.ti.com
SLOS581I – MAY 2008 – REVISED APRIL 2017
6.10 Supply Current
over recommended operating condition (unless otherwise noted)
PARAMETER
ICC1
TEST CONDITIONS
TYP
RE at 0 V or VCC, DE at 0 V
3.3-V VCC1
or VCC1
Logic-side supply current
ICC2
MIN
Bus-side supply current
MAX
UNIT
8
mA
RE at 0 V or VCC, DE at 0 V
5-V VCC1
or VCC1
10
RE at 0 V or VCC, DE at 0 V, No load
15
mA
6.11 Switching Characteristics: Driver
over recommended operating conditions (unless otherwise noted)
PARAMETER
tPLH, tPHL
Propagation delay
TYP
MAX
ISO3080/82
TEST CONDITIONS
0.7
1.3
μs
ISO3086/88
25
45
ns
20
200
3
7.5
0.9
1.5
μs
ns
PWD (1)
Pulse skew (|tPHL –
tPLH|)
ISO3080/82
Differential output
signal rise and fall
time
ISO3080/82
tr, tf
tPZH,
tPZL
Propagation delay,
high-impedance-tohigh-level output and
high-impedance-tolow-level output
See Figure 15 and
ISO3080/82 Figure 16,
DE at 0 V
tPHZ,
tPLZ
(1)
ISO3086/88
MIN
See Figure 14
0.5
ISO3086/88
7
15
50% VO
2.5
7
90% VO
1.8
ISO3086/88
Propagation delay,
ISO3080/82
high-level-to-highSee Figure 15 and Figure 16, DE at 0 V
impedance output
and low-level to high- ISO3086/88
impedance output
UNIT
ns
μs
25
55
95
225
25
55
ns
ns
Also known as pulse skew
6.12 Switching Characteristics: Receiver
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
90
125
4
12
UNIT
tPLH, tPHL
Propagation delay
PWD (1)
Pulse width distortion |tPHL – tPLH|
tr, tf
Output signal rise and fall time
tPHZ,
tPZH
Propagation delay, high-level-tohigh-impedance output and highimpedance-to-high-level output
See Figure 19, DE at 0 V
22
ns
tPZL,
tPLZ
Propagation delay, highimpedance-to-low-level output
and low-level-to-high-impedance
output
See Figure 20, DE at 0 V
22
ns
(1)
See Figure 18
1
ns
ns
Also known as pulse skew.
Copyright © 2008–2017, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088
9
ISO3080, ISO3082, ISO3086, ISO3088
SLOS581I – MAY 2008 – REVISED APRIL 2017
www.ti.com
6.13 Insulation Characteristics Curves
300
Safety Limiting Current (mA)
VCC1 = VCC2 = 5.5 V
200
100
0
0
50
100
150
Case Temperature (°C)
200
D001
Figure 1. Thermal Derating Curve for Limiting Current per VDE
10
Submit Documentation Feedback
Copyright © 2008–2017, Texas Instruments Incorporated
Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088
ISO3080, ISO3082, ISO3086, ISO3088
www.ti.com
SLOS581I – MAY 2008 – REVISED APRIL 2017
60
30
50
25
Supply Current (mA)
Supply Current (mA)
6.14 Typical Characteristics
40
ICC1 (3.3 V)
ICC2 (5 V)
30
20
10
0
0
0
50
100
Data Rate (kbps)
150
0
200
50
D002
Figure 2. ISO3080 Supply Current vs Data Rate With Load
100
Data Rate (kbps)
150
200
D003
Figure 3. ISO3080 Supply Current vs Data Rate With No
Load
50
60
ICC1 (3.3 V)
ICC2 (5 V)
50
40
40
ICC1 (3.3 V)
ICC2 (5 V)
30
20
Supply Current (mA)
Supply Current (mA)
ICC1 (3.3 V)
ICC2 (5 V)
15
5
10
30
20
10
10
0
0
0
50
100
Data Rate (kbps)
150
200
0
50
D004
Figure 4. ISO3082 Supply Current vs Data Rate With Load
80
70
70
60
60
50
ICC1 (3.3 V)
ICC2 (5 V)
40
30
20
100
Data Rate (kbps)
150
200
D005
Figure 5. ISO3082 Supply Current vs Data Rate With No
Load
Supply Current (mA)
Supply Current (mA)
20
ICC1 (3.3 V)
ICC2 (5 V)
50
40
30
20
10
10
0
0
0
5
10
Data Rate (Mbps)
15
20
D007
Figure 6. ISO3086 Supply Current vs Data Rate With Load
Copyright © 2008–2017, Texas Instruments Incorporated
0
5
10
Data Rate (Mbps)
15
20
D006
Figure 7. ISO3086 Supply Current vs Data Rate With No
Load
Submit Documentation Feedback
Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088
11
ISO3080, ISO3082, ISO3086, ISO3088
SLOS581I – MAY 2008 – REVISED APRIL 2017
www.ti.com
80
70
70
60
60
Supply Current (mA)
Supply Current (mA)
Typical Characteristics (continued)
50
ICC1 (3.3 V)
ICC2 (5 V)
40
30
20
ICC1 (3.3 V)
ICC2 (5 V)
50
40
30
20
10
10
0
0
0
5
10
Data Rate (Mbps)
15
20
0
5
D008
Figure 8. ISO3088 Supply Current vs Data Rate With Load
10
Data Rate (Mbps)
15
20
D009
Figure 9. ISO3088 Supply Current vs Data Rate With No
Load
1
VID - Differential Input Voltage - pk
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
2
4
6
8
10 12 14
Signaling Rate - Mbps
16
18
20
Figure 10. ISO3086 Recommended Minimum Differential Input Voltage vs Signaling Rate
12
Submit Documentation Feedback
Copyright © 2008–2017, Texas Instruments Incorporated
Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088
ISO3080, ISO3082, ISO3086, ISO3088
www.ti.com
SLOS581I – MAY 2008 – REVISED APRIL 2017
7 Parameter Measurement Information
VCC2
VCC1
IOA
DE
DE
A
0 or
VCC1
D
VOD
B
+
0 V or 3 V
VOD
–
B
60 W
GND 2
375 W
VOA
VOB
GND 2
GND 1
–7 V to 12 V
IOB
GND 2
GND 1
VI
375 W
A
II
Figure 11. Driver VOD Test and Current Definitions
Figure 12. Driver VOD With Common-Mode Loading
Test Circuit
NOTE
Unless otherwise stated, test circuits are shown for half-duplex devices, ISO3082 and
ISO3088. For full-duplex devices, the driver output pins are Y and Z.
VCC1
I OA
DE
27 W
A
II
Input
B
VB
27 W
I OB
GND2
VOB
VOC
VOA
VOC(SS)
VOC(p-p)
V OC
GND2
GND1
VA
VOD
B
GND1
VI
A
Input
Generator: PRR= 100 kHz, 50 % duty
cycle, t r < 6ns , t f < 6 ns , ZO = 50 W
Figure 13. Test Circuit and Waveform Definitions For The Driver Common-Mode Output Voltage
DE
VCC1
3V
A
D
Input
Generator
B
VI
50 W
GND 1
Generator: PRR = 100 kHz, 50 % duty cycle,
t r < 6ns , t f
工商网监
湘ICP备2023018690号
