ISO3086TDW

Sample & Buy Product Folder Support & Community Tools & Software Technical Documents Reference Design ISO3086T SLLSE27D – JANUARY 2011 – REVISED OCTOBER 2015 ISO3086T Isolated 5-V RS-485 Transceiver With Integrated Transformer Driver 1 Features 3 Description • • • • • The ISO3086T is an isolated differential line transceiver with integrated oscillator outputs that provide the primary voltage for an isolation transformer. The device is a full-duplex differential line transceiver for RS-485 and RS-422 applications that can easily be configured for half-duplex operation by connecting pin 11 to pin 14, and pin 12 to pin 13. 1 • • • • • • Meets or Exceeds TIA/EIA-485-A Signaling Rate up to 20 Mbps 1/8 Unit Load – Up to 256 Nodes on a Bus Thermal Shutdown Protection Typical Efficiency > 60% (ILOAD = 100 mA) - see SLUU469 Low Bus Capacitance 7 pF (Typ) 50-kV/µs Typical Transient Immunity Fail-safe Receiver for Bus Open, Short, Idle Logic Inputs are 5-V Tolerant Bus-Pin ESD Protection – 11-kV HBM Between Bus-Pins and GND2 – 6-kV HBM Between Bus-Pins and GND1 Safety and Regulatory Approvals – 4242 VPK Basic Insulation per DIN V VDE V 0884-10 and DIN EN 61010-1 – 2500 VRMS Isolation for 1 minute per UL 1577 – CSA Component Acceptance Notice 5A, IEC 60950-1 and IEC 61010-1 Standards These devices are ideal for long transmission lines since the ground loop is broken to allow for a much larger common-mode voltage range. The symmetrical isolation barrier of the device is tested to provide 4242 VPK of isolation for 1 minute per VDE between the bus-line transceiver and the logic-level interface. Any cabled I/O can be subjected to electrical noise transients from various sources. These noise transients can cause damage to the transceiver and/or near-by sensitive circuitry if they are of sufficient magnitude and duration. These isolated devices can significantly increase protection and reduce the risk of damage to expensive control circuits. The ISO3086T is specified for use from –40°C to 85°C. 2 Applications • • • • • Device Information(1) Isolated RS-485/RS-422 Interfaces Factory Automation Motor/Motion Control HVAC and Building Automation Networks Networked Security Stations PART NUMBER ISO3086T PACKAGE SOIC (16) BODY SIZE (NOM) 10.30 mm × 7.50 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Typical Application Circuit 4 X-FMR 8 7 6 3 2 LDO D1 1 C4 C5 2 C1 5 1 3 IN OUT 5 EN C6 GND NC 1 D2 1 VCC2 D1 16 C3 2 C2 Control Circuitry D2 4 V CC1 3 GND1 5 R 6 RE 7 DE 8 D A B Z Y 14 Isolated Supply to other Components 13 12 RS-485 Bus Interface 11 15 GND2 9, 10 ISO3086T 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ISO3086T SLLSE27D – JANUARY 2011 – REVISED OCTOBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 3 4 4 4 4 5 5 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Power Rating............................................................. Electrical Characteristics: Driver ............................... Electrical Characteristics: Receiver .......................... Transformer Driver Characteristics ........................... Supply Current and Common-Mode Transient Immunity..................................................................... 6.10 Switching Characteristics: Driver ............................ 6.11 Switching Characteristics: Receiver........................ 6.12 Typical Characteristics ............................................ 7 6 6 6 7 Parameter Measurement Information ................ 10 8 Detailed Description ............................................ 14 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 14 14 15 17 Application and Implementation ........................ 20 9.1 Application Information............................................ 20 9.2 Typical Application ................................................. 20 10 Power Supply Recommendations ..................... 23 11 Layout................................................................... 23 11.1 Layout Guidelines ................................................. 23 11.2 Layout Example .................................................... 24 12 Device and Documentation Support ................. 25 12.1 12.2 12.3 12.4 12.5 Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 25 25 25 25 25 13 Mechanical, Packaging, and Orderable Information ........................................................... 25 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (July 2011) to Revision D Page • Added Feature Item "Meets or Exceeds TIA/EIA-485"........................................................................................................... 1 • VDE standard changed to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 ...................................................................... 1 • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Changes from Revision B (July 2011) to Revision C Page • Added Note 1 to the TRANSFORMER DRIVER CHARACTERISTICS table ........................................................................ 5 • Changed the TRANSFORMER DRIVER CHARACTERISTICS table - fSt Test Conditions From: .VCC1 = 9V To: VCC1 = 2.4 and Changed the TYP value From: 230 To: 350 kHz ................................................................................................... 6 Changes from Revision A (March 2011) to Revision B • Page Deleted the MIN and MAX values from rows, tr_d, tf_D, and tBBM of the TRANSFORMER DRIVER CHARACTERISTICS table ..................................................................................................................................................... 6 Changes from Original (January 2011) to Revision A Page • Changed the Features and Description.................................................................................................................................. 1 • Changed the data sheet From: Preview To: Production ........................................................................................................ 1 • Added Figure 34 Typical Application Circuit........................................................................................................................... 3 2 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: ISO3086T ISO3086T www.ti.com SLLSE27D – JANUARY 2011 – REVISED OCTOBER 2015 5 Pin Configuration and Functions DW Package 16-Pin SOIC Top View D1 D2 1 16 2 15 GND1 VCC1 R RE DE D 3 4 14 13 5 12 6 11 7 10 8 9 VCC2 GND2 A B Z Y NC GND2 Pin Functions PIN NAME NO. I/O DESCRIPTION A 14 I Non-inverting Receiver Input B 13 I Inverting Receiver Input D1 1 O Transformer Driver Terminal 1, Open Drain Output D2 2 O Transformer Driver Terminal 2, Open Drain Output D 8 I Driver Input DE 7 I Driver Enable Input GND1 3 – Logic-side Ground GND2 9, 15 – Bus-side Ground. Both pins are internally connected. NC 10 – No Connect. This pin is not connected to any internal circuitry. R 5 O Receiver Output RE 6 I Receiver Enable Input. This pin has complementary logic. VCC1 4 – Logic-side Power Supply VCC2 16 – Bus-side Power Supply Y 11 O Non-inverting Driver Output Z 12 O Inverting Driver Output 6 Specifications 6.1 Absolute Maximum Ratings See (1) MIN VCC1, VCC2 Input supply voltage (2) VA,VB,VY,VZ Voltage at any bus I/O terminal (A, B, Y, Z) MAX UNIT –0.3 6 V –9 14 V 14 V V VD1,VD2 Voltage at D1, D2 V(TRANS) Voltage input, transient pulse through 100Ω, see Figure 27 (A, B,Y, Z) –50 50 VI Voltage input at D, DE or RE terminal –0.5 7 V IO Receiver output current –10 10 mA ID1, ID2 Transformer Driver Output Current 450 mA TJ Maximum junction temperature 170 °C TSTG Storage temperature 150 °C (1) (2) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values except differential I/O bus voltages are with respect to network ground terminal and are peak voltage values. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: ISO3086T 3 ISO3086T SLLSE27D – JANUARY 2011 – REVISED OCTOBER 2015 www.ti.com 6.2 ESD Ratings VALUE Human body model (HBM), per ANSI/ESDA/JEDEC JS001 (1) Electrostatic discharge V(ESD) Bus pins and GND1 ±6000 Bus pins and GND2 ±11000 All pins ±4000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) V ±1500 Machine model (MM), ANSI/ESDS5.2-1996 (1) (2) UNIT ±200 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions 3.3 V Operation VCC1 Logic-side supply voltage VCC2 Bus-side supply voltage VI or VIC Voltage at any bus terminal (separately or common-mode) VIH High-level input voltage VIL Low-level input voltage VID Differential input voltage RL Differential load resistance 5 V Operation RE D, DE MIN NOM MAX UNIT 3 3.3 3.6 4.5 5 5.5 4.5 5 5.5 V –7 12 V 2 VCC1 V V 0.7 VCC1 RE 0 0.8 D, DE V 0.3 VCC1 A with respect to B –12 Dynamic 12 V See Figure 16 54 Driver Ω 60 –60 60 –8 8 IO Output Current TA Ambient temperature –40 85 TJ Operating junction temperature –40 150 °C 1 / tUI Signaling Rate 20 Mbps Receiver mA °C 6.4 Thermal Information ISO3086T THERMAL METRIC (1) DW (SOIC) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 80.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 43.8 °C/W RθJB Junction-to-board thermal resistance 49.7 °C/W ψJT Junction-to-top characterization parameter 13.8 °C/W ψJB Junction-to-board characterization parameter 41.4 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Power Rating over operating free-air temperature range (unless otherwise noted) PARAMETER PD 4 Maximum device power dissipation TEST CONDITIONS VALUE UNIT VCC1 = VCC2 = 5.5V, TJ = 150°C, RL = 54Ω, CL = 50pF (Driver), CL = 15pF (Receiver), Input a 10 MHz 50% duty cycle square wave to Driver and Receiver 490 mW Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: ISO3086T ISO3086T www.ti.com SLLSE27D – JANUARY 2011 – REVISED OCTOBER 2015 6.6 Electrical Characteristics: Driver over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS IO = 0 mA, no load |VOD| RL = 54 Ω (RS-485), See Figure 17 Differential output voltage magnitude RL = 100 Ω (RS-422), See Figure 17 Vtest from –7 V to +12 V, SeeFigure 18 Δ|VOD| Change in magnitude of the differential output voltage VOC(SS) Steady-state common-mode output voltage Figure 19 Change in steady-state common-mode output voltage VOC(pp) Peak-to-peak common-mode output voltage See Figure 19 II Input current IOZ VY or VZ = 12 V, High-impedance state output current, Y or Z VCC2 = 0 V or 5 V, DE = 0 V pin VY or VZ = –7 V, VCC2 = 0 V or 5 V, DE = 0 V IOS (1) (1) Short-circuit output current TYP MAX VCC2 3 4.3 1.5 2.3 2 2.3 V –0.2 0 0.2 V 1 2.6 3 V 0.1 V 10 µA –0.1 0.5 D, DE, VI at 0 V or VCC1 V –10 Other bus pin at 0 V Other bus pin at 0 V –7 V ≤ VY or VZ ≤ 12 V UNIT 1.5 See Figure 17 and Figure 18 ΔVOC(SS) MIN 1 µA –1 –250 250 mA TYP MAX UNIT –85 –10 mV This device has thermal shutdown and output current limiting features to protect in short-circuit fault condition. 6.7 Electrical Characteristics: Receiver over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS VIT(+) Positive-going input threshold voltage IO = –8 mA VIT(–) Negative-going input threshold voltage IO = 8 mA Vhys Hysteresis voltage (VIT+ – VIT–) MIN –200 –115 mV 30 mV VCC1–0.4 3.1 4 4.8 VOH High-level output voltage VID = 200 mV, IO = –8 mA, See Figure 23 VCC1 = 3.3 V VOL Low-level output voltage VID = 200 mV, IO = 8 mA, See Figure 23 VCC1 = 3.3 V 0.15 0.4 VCC1 = 5 V 0.15 0.4 IO(Z) High-impedance state output current VO = 0 or VCC1, RE = VCC1 VCC1 = 5 V –1 VA or VB = 12 V IA, IB Bus input current VA or VB = 12 V, VCC2 = 0 VA or VB = –7 V V Other input at 0 V VA or VB = –7 V, VCC2 = 0 1 40 100 60 130 –100 –40 –100 –30 IIH High-level input current, RE VIH = 2. V –10 10 IIL Low-level input current, RE VIL = 0.8 V –10 10 RID Differential input resistance A, B CID Differential input capacitance VI = 0.4 sin (4E6πt) + 0.5 V 96 V µA µA µA kΩ 7 pF 6.8 Transformer Driver Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER fOSC RON Oscillator frequency Switch on resistance TEST CONDITIONS MIN TYP MAX VCC1 = 5 V ± 10%, D1 and D2 connected to transformer 350 450 610 VCC1 = 3.3 V ± 10%, D1 and D2 connected to transformer 300 400 550 1 2.5 D1 and D2 connected to 50Ω pull-up resistors kHz Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: ISO3086T UNIT Ω 5 ISO3086T SLLSE27D – JANUARY 2011 – REVISED OCTOBER 2015 www.ti.com Transformer Driver Characteristics (continued) over recommended operating conditions (unless otherwise noted) PARAMETER tr_D D1, D2 output rise time tf_D D1, D2 output fall time fSt Startup frequency tBBM (1) TEST CONDITIONS VCC1 = 5 V ± 10%, see Figure 29, MIN TYP MAX (1) VCC1 = 3.3 V ± 10%, see Figure 29, 80 (1) VCC1 = 3.3 V ± 10%, see Figure 29, 55 (1) Break before make time delay 350 (1) VCC1 = 3.3 V ± 10%, see Figure 29, ns 80 VCC1 = 2.4 V, D1 and D2 connected to transformer VCC1 = 5 V ± 10%, see Figure 29, ns 70 (1) VCC1 = 5 V ± 10%, see Figure 29, UNIT kHz 38 (1) ns 140 D1 and D2 connected to 50Ω pull-up resistors 6.9 Supply Current and Common-Mode Transient Immunity over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS TYP MAX VCC1 = 3.3 V ±10% 5 8 VCC1 = 5 V ±10% 7 12 RE = 0 V or VCC1, DE = 0 V (driver disabled), No load 10 15 RE = 0 V or VCC1, DE = VCC1 (driver enabled), D = 0 V or VCC1, No Load 10 15 ICC1 (1) Logic-side quiescent supply current DE and RE = 0 V or VCC1 (Driver and Receiver Enabled or Disabled), D = 0 V or VCC1, No load ICC2 (1) Bus-side quiescent supply current CMTI Common-mode transient immunity (1) MIN See Figure 28, VI = VCC1 or 0 V 25 50 UNIT mA mA kV/µs ICC1 and ICC2 are measured when device is connected to external power supplies, VCC1 and VCC2. In this case, D1 and D2 are open and disconnected from external transformer. 6.10 Switching Characteristics: Driver over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS tPLH, tPHL Propagation delay PWD (1) Pulse width distortion (|tPHL – tPLH|) tr, tf Differential output signal rise time and fall time tPZH, tPHZ Propagation delay, high-impedance-to-high-level output, Propagation delay, high-level-to-high-impedance output tPLZ, tPZL Propagation delay, low-level to high-impedance output, Propagation delay, high-impedance to low-level output (1) MIN TYP MAX 25 45 1 7.5 7 15 See Figure 21 DE at 0 V 25 55 ns See Figure 22, DE at 0 V 25 55 ns See Figure 20 UNIT ns Also known as pulse skew 6.11 Switching Characteristics: Receiver over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX tPLH, tPHL Propagation delay tsk(p) Pulse skew (|tPHL – tPLH|) tr, tr Output signal rise and fall time tPHZ, tPZH Propagation delay, high-level to high-impedance output Propagation delay, high-impedance to high-level output See Figure 25, DE at 0 V 11 22 tPLZ, tPZL Propagation delay, low-level to high-impedance output Propagation delay, high-impedance to low-level output See Figure 26, DE at 0 V 11 22 6 See Figure 24 103 125 3 15 UNIT ns 1 ns Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: ISO3086T ISO3086T www.ti.com SLLSE27D – JANUARY 2011 – REVISED OCTOBER 2015 6.12 Typical Characteristics 25 60 No Load TA = 25°C, 16 PRBS Data 2 - 1 ICC2 @ 5 V 50 ICC2 @ 5 V ICC - Supply Current - mA ICC - Supply Current - mA 20 15 10 ICC1 @ 5 V 5 5 30 20 10 15 Signaling Rate - Mbps 5 10 15 Signaling Rate - Mbps 20 Figure 2. Supply Current vs Signaling Rate (With Load) 30 34 VCC1 = VCC2 = 5 V, RL = 54 W, CL = 50 pF 32 Driver Propagation Delay - ns Driver Propagation Delay - ns ICC1 @ 3.3 V 0 0 20 Figure 1. Supply Current vs Signaling Rate (No Load) 28 ICC1 @ 5 V 10 ICC1 @ 3.3 V 0 0 Driver: RL = 54 W, CL = 50 pF, Receiver: CL = 15 pF, TA = 25°C, 16 PRBS Data 2 - 1 40 tPHL 26 tPLH 24 VCC1 = 3.3 V, VCC2 = 5 V, RL = 54 W, CL = 50 pF 30 tPHL 28 tPLH 26 24 22 22 20 -40 -15 10 35 60 TA - Free-Air Temperature - °C 20 -40 85 Figure 3. Driver Propagation Delay vs Free-Air Temperature 110 Reveiver Propagation Delay - ns Reveiver Propagation Delay - ns VCC1 = VCC2 = 5 V, CL = 15 pF 104 103 tPHL 101 100 99 85 Figure 4. Driver Propagation Delay vs Free-Air Temperature 105 102 -15 10 35 60 TA - Free-Air Temperature - °C tPLH 108 VCC1 = 3.3 V, VCC2 = 5 V, CL = 15 pF 106 tPHL 104 tPLH 102 98 97 -40 -15 10 35 60 TA - Free-Air Temperature - °C 85 Figure 5. Receiver Propagation Delay vs Free-Air Temperature 100 -40 -15 10 35 60 TA - Free-Air Temperature - °C 85 Figure 6. Receiver Propagation vs Free-Air Temperature Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: ISO3086T 7 ISO3086T SLLSE27D – JANUARY 2011 – REVISED OCTOBER 2015 www.ti.com Typical Characteristics (continued) 10 10 VCC1 = VCC2 = 5 V, 9.5 9 Driver Rise, Fall Time - ns Driver Rise, Fall Time - ns 9.5 RL = 54 W, CL = 50 pF 9 8.5 8 7.5 tr 7 tf 6.5 8 7 6 5 -40 85 -15 10 35 60 TA - Free-Air Temperature - °C 85 Figure 8. Driver Rise, Fall Time vs Free-Air Temperature 1200 1400 VCC1 = VCC2 = 5 V, 1300 C = 15 pF L 1100 Receiver Rise, Fall Time - ps 1200 Receiver Rise, Fall Time - ps tf 6.5 5.5 Figure 7. Driver Rise, Fall Time vs Free-Air Temperature tr 7.5 6 -15 10 35 60 TA - Free-Air Temperature - °C RL = 54 W, CL = 50 pF 8.5 5.5 5 -40 VCC1 = 3.3 V, VCC2 = 5 V, tf 1100 1000 900 800 tr 700 VCC1 = 3.3 V, VCC2 = 5 V, CL = 15 pF 1000 600 tf 900 tr 800 700 500 400 -40 -15 10 35 60 TA - Free-Air Temperature - °C 600 -40 85 Figure 9. Receiver Rise, Fall Time vs Free-Air Temperature -100 TA = 25°C TA = 25°C, VCC1 = 5 V -90 VCC2 = 5 V 3 -80 IO - Output Current - mA VOD - Differential Output Voltage - V 85 Figure 10. Receiver Rise, Fall Time vs Free-Air Temperature 3.5 2.5 VCC2 = 5.5 V 2 100 W 1.5 VCC2 = 4.5 V 1 -70 -60 -50 -40 -30 -20 0.5 0 0 50 W 10 20 30 40 50 IL - Load Current - mA -10 60 0 0 70 Figure 11. Driver Differential Output Voltage vs Load Current 8 -15 10 35 60 TA - Free-Air Temperature - °C 1 2 3 VO - Output Voltage - V 4 5 Figure 12. Receiver High-Level Output Current vs HighLevel Output Voltage Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: ISO3086T ISO3086T www.ti.com SLLSE27D – JANUARY 2011 – REVISED OCTOBER 2015 Typical Characteristics (continued) 90 60 TA = 25°C, VCC2 = 5 V TA = 25°C, 80 VCC1 = 5 V 40 II - Bus Input Current - mA IO - Output Current - mA 70 60 50 40 30 20 0 -20 20 -40 10 -60 -7 0 0 1 2 3 VO - Output Voltage - V 4 5 Figure 13. Receiver Low-Level Output Current vs Low-Level Output Voltage -4 -1 2 5 8 VI - Bus Input Voltage - V 11 Figure 14. Input Bias Current vs Bus Input Voltage 1 2.1 VCC2 = 5 V, 0.9 VID - Differential Input Voltage - pk VOD - Differential Output Voltage - V RL = 54 W 2.08 2.06 2.04 2.02 2 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 1.98 -40 -15 10 35 60 TA - Free-Air Temperature - °C 0 0 85 Figure 15. Differential Output Voltage vs Free-Air Temperature 2 4 6 8 10 12 14 Signaling Rate - Mbps 16 18 20 Figure 16. Recommended Minimum Differential Input Voltage vs Signaling Rate Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: ISO3086T 9 ISO3086T SLLSE27D – JANUARY 2011 – REVISED OCTOBER 2015 www.ti.com 7 Parameter Measurement Information VCC1 VCC2 IY DE Y RL VOD D D 0 or 3 V . Z GND1 375 W DE Y II 0 or VCC1 + VOD - Z 60 W IZ GND2 VI 375 W GND2 VY VZ GND1 VTEST = -7 V to 12 V GND2 Figure 17. Driver VOD Test and Current Definitions VCC1 IY DE 27 W ±1% Y II Input D VOD Z GND2 GND1 VI 27 W ±1% IZ VZ GND1 Figure 18. Driver VOD With Common-Mode Loading Test Circuit Y VY Z VZ VOC VOC(SS) VOC(p-p) VOC VY Input Generator: PRR= 100 kHz, 50 % duty cycle, t r < 6ns , t f