LDC0851EVM

User's Guide SNLU194A – November 2015 – Revised July 2017 LDC0851EVM The Texas Instruments LDC0851 evaluation module (EVM) helps designers evaluate the operation and performance of the LDC0851 Inductive Switch. The EVM contains one LDC0851 soldered onto the EVM PCB and options to operate with battery or USB power. A 50-kΩ trim pot is also included to change the switching distance threshold making it easy to evaluate for a wide variety of use cases. Table 1. Device and Package Configurations DEVICE IC PACKAGE U1 LDC0851 WSON-8 Figure 1. LDC0851EVM 1 2 3 4 5 6 Contents EVM Features and Connections ........................................................................................... 3 Theory of Operation ......................................................................................................... 6 Quick Start Guide .......................................................................................................... 10 EVM Design – Board Layout ............................................................................................. 14 EVM Design - Schematic .................................................................................................. 16 EVM Bill of Materials ....................................................................................................... 18 List of Figures 1 LDC0851EVM ................................................................................................................ 1 2 EVM Block Diagram ......................................................................................................... 3 3 Connector and Feature Locations (Top) .................................................................................. 4 4 Connector and Feature Locations (Bottom) .............................................................................. 4 5 EVM Break-Away Sections ................................................................................................. 5 6 Break-Away Sensor (Top) .................................................................................................. 5 7 Break-Away Sensor (Bottom) .............................................................................................. 5 8 Simplified Block Diagram for Stacked Coils .............................................................................. 6 9 Switch Distance with Offset ................................................................................................ SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated LDC0851EVM 7 1 www.ti.com 10 Adjust the Offset ............................................................................................................. 7 11 Switching Distance of 20mm Stacked Coil ............................................................................... 9 12 Stacked Coil Separation .................................................................................................... 9 13 Insert 5-V Micro-USB ...................................................................................................... 10 14 Set SUPPLY Switch (S2) to USB ........................................................................................ 10 15 Insert CR2032 Battery into BT1 .......................................................................................... 11 16 Change SUPPLY Switch (S2) to BAT ................................................................................... 11 17 Adjust the Offset ............................................................................................................ 12 18 Toggle Enable to Set New Threshold ................................................................................... 12 19 Observe Status of OUT LED 20 Bring Metal Target Close to LSENSE ................................................................................... 13 21 ESD Compliance ........................................................................................................... 14 22 Top Layer Routing 14 23 Bottom Layer Routing 15 24 25 26 27 ............................................................................................. ......................................................................................................... ..................................................................................................... Mid-Layer 1 Routing ....................................................................................................... Mid-Layer 2 Routing ....................................................................................................... Battery, LDC0851, and Sensor ........................................................................................... Optional 5-V Micro-USB to 3.0 V ......................................................................................... 13 15 15 16 17 List of Tables 1 Device and Package Configurations ...................................................................................... 1 2 EVM Connections............................................................................................................ 3 3 LED Indicator Behavior with GUI .......................................................................................... 4 4 LDC0851EVM Sensor Parameters ........................................................................................ 6 5 Resistor Values for ADJ Code ............................................................................................. 8 6 Battery Requirements...................................................................................................... 11 7 Layer Usage 8 Bill of Materials ................................................................................................................ ............................................................................................................. 14 18 Trademarks All trademarks are the property of their respective owners. 2 LDC0851EVM SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated EVM Features and Connections www.ti.com 1 EVM Features and Connections This section describes the connectors on the LDC0851EVM and how to properly connect, set up and use the LDC0851. Approaching Metal Target Breakaway Portion 2 Breakaway Portion 1 VDD 5V µUSB (J3) 5V VDD LP5951 3.0-V Out LDO 1.8V 3.0 V Coin Cell Battery CR2032 - 3.0 V (BT1) ADJ 3.0 V LREF LSENSE LDC0851 (WSON8) LR LS LC J1 LSENSE Sensor 20 mm O.D. 7 turns/layer 6 mil trace 6 mil space 2 Layer 6.2 µH LR LS LC LCOM USB J4 BAT 50-kO Trim Pot (R5) EN OUT LREF Sensor Output LED (D3) Supply Switch, SPDT (S2) VDD VDD VDD Enable Toggle Switch, SPDT (S2) Figure 2. EVM Block Diagram 1.1 Connector Description Table 2. EVM Connections CONNECTOR TYPE FUNCTIONALITY J1 6 pin, 100 mil header (not stuffed) Provides connections for LREF, LSENSE, and LCOM if sensor portion is detached. J2 2 pin, 100 mil header (not stuffed) Provides connections for GND and VDD if the power section is detached. J3 Micro-USB connector Provides 3.0-V power to the DUT when connected to 5 V. BT1 – CR2032 CR2032 Battery Holder Provides 3.0-V power to the DUT when CR2032 battery is inserted into the battery slot. J4 4 pin, 100 mil header (not stuffed) Provides optional connections for DUT Supply, Ground, OUT, and EN. S1 – EN RESET SPDT Switch Spring loaded switch (default on) to toggle EN low. This resamples the voltage on the ADJ pin. S2 SPDT Switch Toggle between 3.0-V USB Power (USB position) and 3.0-V battery power (BAT position). D3 – OUT Green LED Indicates when the output of the LDC0851 switches. Note that LED will be off in the absence of a metal target. D5 Green LED (not stuffed) Indicates 3.0 V is present at output of the 3.0-V LDO (LP5951). R5 – OFFSET ADJUST 50k Trim Pot Provides adjustable resistance to create a voltage divider between 0 V and VDD/2 on the ADJ pin. If the voltage is changed during operation, the EN pin must be toggled low then high with switch S1. Breakaway Perforation 1 Perforation The EVM can be separated at this point to use a different supply rail or to directly access VDD, GND, OUT, and EN. Breakaway Perforation 2 Perforation The EVM can be separated at this point to use different LSENSE and LREF sensors. USB Test Point Test point for 3.0-V output of LP5951. BAT Test Point Test point for 3.0-V output of Battery SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated LDC0851EVM 3 EVM Features and Connections www.ti.com Figure 3. Connector and Feature Locations (Top) Figure 4. Connector and Feature Locations (Bottom) 1.2 EVM Interface The LDC0851EVM can be powered with 5 V via the micro-USB connection (J3) on the top side of the EVM. Alternatively, a 3-V battery via the battery connection (BT1) on the backside of the EVM may be used to directly supply the LDC0851 with 3 V. Use Supply Switch (S2) to select the desired power source. The voltage on the ADJ pin of the LDC0851 at startup will determine the distance at which a metal target will be detected. The voltage can be easily controlled through the 50-kΩ trim pot (R5). Note, the ADJ value is only sampled once on startup or after EN has toggled low to high with switch S1. Table 3. LED Indicator Behavior with GUI 4 LED COLOR FUNCTIONALITY D3 Green Indicates when the output of the LDC0851 switches. LDC0851EVM SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated EVM Features and Connections www.ti.com 1.3 Break-Away Sections Figure 5. EVM Break-Away Sections The LDC0851 EVM can be broken into 3 discrete sections: a 5-V to 3-V section which includes the USB interface section, an LDC0851 section, and a sensor section which contains the LREF and LSENSE sensors. Figure 6. Break-Away Sensor (Top) Figure 7. Break-Away Sensor (Bottom) Break-Away Sensor Section: The Sensor section of the LDC0851EVM can be broken along the indicated line to separate the sensor from the LDC0851 IC. A three pin header is available on the LDC0851 section to connect to different sensors or for remote location. If the cable connection between the sensor and the LDC0851EVM is longer than 2 cm, use twisted pair or coaxial to connect back to the LDC0851 section. The EVM sensor is a 4 layer stacked coil design, with the top 2 layers used for the sensing coil, and the bottom 2 layers used for the reference coil. SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated LDC0851EVM 5 Theory of Operation www.ti.com Table 4. LDC0851EVM Sensor Parameters 2 PARAMETER LSENSE SENSOR VALUE LREF SENSOR VALUE Outer Diameter 787.4 mils (20.0 mm) 787.4 mils (20.0 mm) Inner Diameter 619.4 mils (15.7 mm) 619.4 mils (15.7 mm) Number of turns 7 7 Trace Width 6 mils (0.152 mm) 6 mils (0.152 mm) Trace Spacing 6 mils (0.152 mm) 6 mils (0.152 mm) Number of layers 2 2 Trace Thickness 1 oz-cu (35 μm) 1 oz-cu (35 μm) Inductance at 9.5 MHz 8.65 µH 8.65 µH CSENSOR (C4) 68 pF 68 pF ƒSENSOR (no target) 9.5 MHz 9.5 MHz Theory of Operation The LDC0851 is an inductance based switch for contactless and robust applications such as presence detection, event counting, and coarse position detection. The device is connected to a reference coil (LREF) and a sensing coil (LSENSE). The output of the LDC0851 switches when the inductance of LSENSE drops below LREF which is caused by an approaching metal target. The LDC0851 EVM employs a stacked coil arrangement, in which the LSENSE sensor coil is closer to the metal target than the LREF reference coil when approached from the top side (LSENSE side). The user can take advantage of the Offset Adjust feature to change the switching distance (dswitch). The offset is added to LREF so that increasing the ADJ code causes the LDC0851 to switch at a closer distance. The ADJ code is determined by the voltage level on the ADJ pin at device power on and by toggling the Enable pin low then high. LDC0851 LSENSE Switching distance set by ADJ Value LREF Approaching Metal Target ... Sense Coil Ref Coil Differential Inductive Switch LCOM ADJ =1 ADJ =15 Sensor Cap Mode Select 0: Reference switch 1 ± 15: Threshold Adjust VDD R3 53.6 k ADJ 4-bit ADC R5 50 k R4 3.56 k Figure 8. Simplified Block Diagram for Stacked Coils 6 LDC0851EVM SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated Theory of Operation www.ti.com Coil Inductance LSENSE Adjusted LREF (ADJ = 1) Y Adjusted LREF (ADJ = 15) dswitch C 0.3x(dcoil) (ADJ = 1) dswitch (ADJ = 15) Target Distance Figure 9. Switch Distance with Offset A potentiometer (R5) has been included to make adjusting the threshold easier for prototyping. Note that rotating the potentiometer clockwise towards the MIN direction decreases the ADJ value and results in a longer switching threshold. Similarly, rotating R5 counter clockwise towards the MAX position increases the ADJ value and decreases the switching distance. The Enable pin should be toggled low then high to set a new switching threshold. Figure 10. Adjust the Offset The ADJ value can be achieved by setting the combination of R4 + R5 to the values in Table 5. SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated LDC0851EVM 7 Theory of Operation www.ti.com Table 5. Resistor Values for ADJ Code ADJ Level (code) R4+R5 (kΩ) 1 3.57 2 5.54 3 7.66 4 9.93 5 12.37 6 15.01 7 17.87 8 20.97 9 24.36 10 28.08 11 32.16 12 36.67 13 41.69 14 47.29 15 53.60 The switching distance for stacked coils can be approximated with Equation 1. ADJCode · § dswitch dcoil u 0.3x ¨ 1 ¸ 16 © ¹ where • • • dswitch is the approximated switching distance for a stacked coil sensor with good separation between LSENSE coil layers and LREF coil layers. Note that for side-by-side coils, the switching distance uses a factor of 0.4. dcoil is the coil diameter ADJCode is the desired value from Table 5 (1) For example, consider a coil with a diameter of 20 mm. An ADJ code of 1 yields a switching distance of 5.6 mm, and an ADJ code of 15 yields a switching distance of 0.375 mm. This method helps approximate the switching distance, but the actual response of the coils may vary slightly which is why it is important to prototype the coil as can be seen in Figure 11 below. 8 LDC0851EVM SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated Theory of Operation www.ti.com 8 Switch ON Switch OFF Switching Distance (mm) 7 6 5 4 3 2 1 0 1 2 3 4 5 6 7 8 9 ADJ Code 10 11 12 13 14 15 D001 Figure 11. Switching Distance of 20mm Stacked Coil It should be noted that the sensing distance is determined by the diameter of the coils, inductance matching, and the spacing or PCB thickness between the LSENSE coil and LREF coil layers. To achieve the maximum sensing range for stacked coils, the spacing (h) between the LSENSE and LREF coils should be as thick as possible. Refer to Figure 12 below. Layers 1, 2 Sense Coil h Layers 3, 4 Reference Coil Figure 12. Stacked Coil Separation It is also recommended to use a target of equal or larger size to the coil diameter to get the longest sensing range. SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated LDC0851EVM 9 Quick Start Guide www.ti.com 3 Quick Start Guide 3.1 Supply Power to the LDC0851EVM Power can be supplied either through the 5-V micro-USB connection (J3) or through the 3.0-V battery slot (BT1) on the backside of the EVM. 3.1.1 5-V Micro-USB to 3-V Device Power Connect a USB cable between the 5-V source and the micro-USB connector (J3) on EVM. An onboard LDO will convert the 5-V source into 3.0 V which can be measured at the USB test point shown below. Figure 13. Insert 5-V Micro-USB Verify that SUPPLY Switch (S2) is in the USB position. Figure 14. Set SUPPLY Switch (S2) to USB 10 LDC0851EVM SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated Quick Start Guide www.ti.com 3.1.2 3-V Battery Power Alternatively, the LDC0851 may be operated from battery power. The list of battery requirements is provided below: Table 6. Battery Requirements Parameter Specification Battery Model CR2032 UL Certified Battery Voltage 3.0 V Min Capacity 225 mAh Min Discharge Rate 200 µA Manufacturer and Model Number Panasonic - BSG CR2032 (or equivalent) When the EVM is powered by the battery, it is not necessary to have a micro-USB cable connected to J3. Insert CR2032 battery in the slot (BT1) on the back of the board. A voltage of 3.0 V can be measured at the BAT test point shown below. Figure 15. Insert CR2032 Battery into BT1 Slide SUPPLY switch (S2) to the BAT position. Figure 16. Change SUPPLY Switch (S2) to BAT SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated LDC0851EVM 11 Quick Start Guide 3.2 www.ti.com Adjust the Threshold The EVM has a potentiometer (R5) which can be used to control the voltage level on the ADJ pin. Rotate the pot clockwise towards “MIN” so that ADJ value is in the minimum offset position, which has the longest sensing range. Figure 17. Adjust the Offset To set a new threshold, toggle the EN RESET switch (S1) to re-sample the ADJ pin. This must be done every time a new threshold is set. Figure 18. Toggle Enable to Set New Threshold 12 LDC0851EVM SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated Quick Start Guide www.ti.com 3.3 Detecting presence of Metal Targets With no target is present the OUTPUT LED (D3) should be off. If D3 is on or remains on, increase the offset with R5 and toggle EN with S1 as shown in the previous step. Figure 19. Observe Status of OUT LED Bring a conductive target close to the LSENSE coil. The OUT LED (D3) should turn on when the target is 1 to 8 mm above the EVM sensing coil depending on the ADJ value. Figure 20. Bring Metal Target Close to LSENSE To change the switching threshold simply adjust the value of R5, toggle EN with S1 and retest. Note that during active operation the ADJ pin draws ~10 µA of current will alter the resistance reading if using a multi meter to check the value. In order to properly set or check the ADJ resistance when using a multi meter, turn off the device, remove the battery, and set S2 to BAT. The resistance measured across R4 + R5 should be set according to Table 5 for a desired ADJ setting. This process can be repeated and fine-tuned for a variety of applications including open/close proximity switches, white goods, home security and tamper detection, e-meters, and printers. SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated LDC0851EVM 13 Quick Start Guide 3.4 www.ti.com PCB Breakoff Sections and Compliance The different sections of the EVM may be broken apart for ease of prototyping and development. Please note that breaking apart the sections voids the warranty. In addition, the stated performance and compliance specifications of the EVM cannot be guaranteed when sections have been broken apart. The LDC0851EVM has the ability to be powered by either connecting a USB cable or by a 3 V battery as mentioned in Section 3.1. Compliance was evaluated with both Battery powered and USB powered options. Note that if a USB cable is used for powering the EVM, ferrites need to be added to each end of the cable. Fair-rite, Model #0431164951 (or equivalent) are to be installed with one turn each at each end when a USB cable is used for powering the EVM. If provided, the shielded USB cable is less than 3m in length. If not, and one is to be purchased for use with this EVM, it is required to be no longer than 3m to retain the stated performance and compliance. ATTENTION STATIC SENSITIVE DEVICES HANDLE ONLY AT STATIC SAFE WORK STATIONS Figure 21. ESD Compliance CAUTION The EVM contains components that can potentially be damaged by electrostatic discharge. Always transport and store the EVM in the supplied ESD bag when not in use. Handle using an antistatic wristband. Operate on an antistatic work surface. For more information on proper handling, refer to Electrostatic Discharge (ESD)[SSYA010]. 4 EVM Design – Board Layout Table 7. Layer Usage LAYER FUNCTIONALITY Top Signals, Components, Sense coil, and ground-fill Mid-layer 1 Sense coil, and section transition routing Mid-layer 2 Reference coil, and section transition routing Bottom Signals, Components, Reference coil, and ground-fill Figure 22. Top Layer Routing 14 LDC0851EVM SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated EVM Design – Board Layout www.ti.com Figure 23. Bottom Layer Routing Figure 24. Mid-Layer 1 Routing Figure 25. Mid-Layer 2 Routing SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated LDC0851EVM 15 EVM Design - Schematic 5 www.ti.com EVM Design - Schematic Figure 26. Battery, LDC0851, and Sensor 16 LDC0851EVM SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated EVM Design - Schematic www.ti.com Figure 27. Optional 5-V Micro-USB to 3.0 V SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback LDC0851EVM Copyright © 2015–2017, Texas Instruments Incorporated 17 EVM Bill of Materials 6 www.ti.com EVM Bill of Materials Table 8. Bill of Materials ITEM # DESIGNATOR PART NUMBER MANUFACTURER DESCRIPTION 1 !PCB1 SV601198 Any Printed Circuit Board 2 BT1 BK-912 Memory Protection Devices Battery Holder for CR2032, SMT 3 C1 C1005X7R1H104K TDK CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0402 4 C2 C0603C105K4PACTU Kemet CAP, CERM, 1 µF, 16 V, +/- 10%, X5R, 0603 5 C4 C1608C0G1H680J TDK CAP, CERM, 68 pF, 50 V, +/- 5%, C0G/NP0, 0603 6 C5 EMK212BB7106MG-T Taiyo Yuden CAP, CERM, 10 µF, 16 V, +/- 20%, X7R, 0805 7 C6, C7 C0603C104J3RAC Kemet CAP, CERM, 0.1 µF, 25 V, +/- 5%, X7R, 0603 8 C8 C2012X7S1A226M125A C TDK CAP, CERM, 22 µF, 10 V, +/- 20%, X7S, 0805 9 C9 GRM188R71A225KE15 D MuRata CAP, CERM, 2.2 µF, 10 V, +/- 10%, X7R, 0603 10 D1 MMSZ4685-V Vishay-Semiconductor Diode, Zener, 3.6 V, 500 mW, SOD-123 11 D3 LG L29K-G2J1-24-Z OSRAM LED, Green, SMD 12 D4 MMSZ5232B-7-F Diodes Inc. Diode, Zener, 5.6 V, 500 mW, SOD-123 13 FID6 N/A N/A Fiducial mark. There is nothing to buy or mount. 14 J3 ZX62R-B-5P Hirose Electric Co. Ltd. Connector, Receptacle, Micro-USB Type B, SMT 15 L1 VLS201610ET-100M TDK Inductor, Shielded, Ferrite, 10 µH, 0.4 A, 1.38 ohm, SMD 16 LBL1 THT-14-423-10 Brady Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll 17 R2 CRCW0402200RFKED Vishay-Dale RES, 200, 1%, 0.063 W, 0402 18 R3 RC0603FR-0753K6L Yageo America RES, 53.6 k, 1%, 0.1 W, 0603 19 R4 CRCW06033K57FKEA Vishay-Dale RES, 3.57 k, 1%, 0.1 W, 0603 20 R5 3352T-1-503LF Bourns Trimming Potentiometer, 50K, 0.5W, TH 21 R7 CRCW060333R0JNEA Vishay-Dale RES, 33, 5%, 0.1 W, 0603 C&K Components Switch, SPDT, On-Mom, 1 Pos, 0.01A, 5 VDC, SMD Switch, Slide, SPDT, 0.2A, J Lead, SMD 22 S1 JSX08001SAQNL 23 S2 CL-SB-12A-01T Copal Electronics 24 U1 LDC0851DSGR Texas Instruments 1.8-3.3V Inductive Switch, DSG0008A Texas Instruments Micropower, 150mA Low-Dropout CMOS Voltage Regulator, 5-pin SC-70, Pb-Free 25 18 LDC0851EVM U2 LP5951MG-3.0/NOPB SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated Revision History www.ti.com Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (November 2015) to A Revision ................................................................................................ Page • • Changed to new ug layout ............................................................................................................... 3 Added PCB Breakoff Sections and Compliance section ........................................................................... 14 SNLU194A – November 2015 – Revised July 2017 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated Revision History 19 IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. 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