LDC1101EVM User Guide
User's Guide
Literature Number: SNOU137
May 2015
Contents
1
Introduction ......................................................................................................................... 5
2
EVM Features and Connections ............................................................................................. 6
2.1
2.2
2.3
3
Connector Description....................................................................................................... 6
EVM Interface ................................................................................................................ 7
Break-Away Sections........................................................................................................ 7
LDC1101EVM PC Software (GUI) .......................................................................................... 11
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
Host Platform Requirements ..............................................................................................
Software Installation .......................................................................................................
Software Launch ...........................................................................................................
Connecting the GUI to the EVM ..........................................................................................
Software Operation ........................................................................................................
Active/Sleep Mode .........................................................................................................
Sensor Configuration ......................................................................................................
RP+L Page ..................................................................................................................
LHR Page ...................................................................................................................
Datalogging Conversion Results .........................................................................................
Configuration Saving and Loading .......................................................................................
Plot Display Controls and Options .......................................................................................
3.12.1 AutoScale .........................................................................................................
3.12.2 Graph Data Export ...............................................................................................
3.12.3 Graph Update .....................................................................................................
RP Apps Calculator Page ..................................................................................................
Direct Register Access Page .............................................................................................
EVM FW Protocol ..........................................................................................................
11
12
13
13
15
16
16
17
21
24
24
25
25
25
25
25
26
28
4
EVM Design - Board Layout ................................................................................................. 30
5
EVM Design - Schematic ..................................................................................................... 31
6
EVM Bill of Materials ........................................................................................................... 36
Revision History .......................................................................................................................... 38
2
Contents
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List of Figures
1-1.
LDC1101EVM ................................................................................................................ 5
2-1.
EVM Block Diagram ......................................................................................................... 6
2-2.
Connector Locations
2-3.
EVM Break-Away Sections ................................................................................................. 7
2-4.
Break-Away Sensor
2-5.
2-6.
2-7.
2-8.
2-9.
2-10.
3-1.
3-2.
3-3.
3-4.
3-5.
3-6.
3-7.
3-8.
3-9.
3-10.
3-11.
3-12.
3-13.
3-14.
3-15.
3-16.
3-17.
3-18.
3-19.
3-20.
3-21.
3-22.
4-1.
4-2.
4-3.
4-4.
5-1.
5-2.
5-3.
5-4.
........................................................................................................
6
......................................................................................................... 7
Default Inductive Sensor Section .......................................................................................... 8
LDC1101EVM Default Sensor Resistance Variation .................................................................... 8
Sensor Configuration Options .............................................................................................. 9
Unpopulated Footprints on EVM Bottom ................................................................................. 9
Remote Sensor with Twisted Pair Connection ......................................................................... 10
MSP430 Section ............................................................................................................ 10
LDC1101EVM GUI ......................................................................................................... 11
Choose Install Location .................................................................................................... 12
Desktop Icon ................................................................................................................ 13
COM Port Selection ........................................................................................................ 13
EVM COM Port ............................................................................................................. 14
EVM Connected/Not Connected Indication ............................................................................. 14
LDC1101EVM GUI ......................................................................................................... 15
Page Selection.............................................................................................................. 16
Sleep Mode/Active Mode .................................................................................................. 16
Sensor Configuration with changed Sensor Capacitor ................................................................ 16
LDC1101EVM Control Software: RP+L Page Streaming ............................................................. 17
RP+L Status ................................................................................................................ 17
RP+L Page Measurement Configuration ................................................................................ 19
LDC1101 Control Software: LHR Page Streaming .................................................................... 21
LHR Status .................................................................................................................. 21
LDC1101EVM LHR Configuration ....................................................................................... 22
Datalogging ................................................................................................................. 24
Save Config and Load Config Buttons .................................................................................. 24
Graph Right-Click Menu ................................................................................................... 25
Apps Calculator to Configure RP Measurements ....................................................................... 26
LDC1101 Control Software: Register Map Page ....................................................................... 27
Register Read/Write Controls............................................................................................. 28
Top Layer Routing ......................................................................................................... 30
Mid-Layer 1 Routing ....................................................................................................... 30
Mid-Layer 2 Routing ....................................................................................................... 31
Bottom Layer Routing...................................................................................................... 31
LDC1101, Sensor, and Level Shifter Schematic ....................................................................... 32
Power Conditioning Schematic ........................................................................................... 33
MCU Schematic ............................................................................................................ 34
USB Connection Schematic .............................................................................................. 35
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List of Figures
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3
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List of Tables
3-1.
4
Streaming Data Structure ................................................................................................. 29
List of Tables
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Chapter 1
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Introduction
The Texas Instruments LDC1101 evaluation module (EVM) helps designers evaluate the operation and
performance of the LDC1101 Inductance to Digital Converter. The EVM contains a low cost
MSP430F5528 microcontroller which comes with pre-loaded firmware to communicate with LabVIEW™
based PC controller software.
The EVM contains one LDC1101 soldered onto the EVM PCB.
Device and Package Configurations
Device
IC
Package
U1
LDC1101
VSON-10
Figure 1-1. LDC1101EVM
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Chapter 2
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EVM Features and Connections
This section describes the connectors on the LDC1101EVM and how to properly connect, set up and use
the LDC1101. The EVM block diagram is shown below.
1.8 V
LP5951
1.8 V Out LDO
5V
USB1.1+
µUSB
2.5 V
LP5951
2.5 V Out LDO
5V
2.5 V
USB
Host
Computer
SPI(SDO)
Sensor: 14 mm O.D.
15 turns, 0.15 mm trace
width
4 Layer
7.2 µH, 390 pF
MSP430F5528
SPI
LDC1101
(WSON10)
CLKIN
SPI
Level
Shifter
12 MHz
SN74AVCH4T245
12 MHz
x
x
x
USB interface
12 MHz CLK to LDC1101
SPI connection to LDC1101
MSP430 runs at 2.5 V for
24 MHz operation
24-MHz
Xtal
Figure 2-1. EVM Block Diagram
2.1
Connector Description
EVM Connections
Connector
Type
Functionality
J1
Micro-USB connector
Provides power and control via PC USB connection
J2
Phoenix Connector 1727010 (not
installed)
Provides convenient screw-terminal adapter for connecting various
sensors
J5
100mil header (not installed)
SPY-Bi-Wire connection for Code Composer Studio support.
Break-Away
Header
7pin 100mil spaced pads
The EVM can be separated at this point for remote placement of the
LDC1101 or to use a different MCU. Provides power and control interface
for the LDC1101.
VDD
Via
LDC1101 VDD supply voltage test point
GND
Via
Ground test point
Figure 2-2. Connector Locations
6
EVM Features and Connections
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EVM Interface
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2.2
EVM Interface
The LDC1101EVM is powered via the USB connection on J1. Use a micro-USB to USB-A cable to
connect the EVM to a PC. The LDC1101EVM draws its supply current from the USB port. Do not use a
passive USB hub with the EVM.
When powered on, the LDC1101EVM performs a quick self-test; if the LDC1101EVM is working properly
and the default EVM sensor is connected, the Green LED will illuminate. If the sensor is different, then the
Red LED will illuminate. When connected to the GUI, the Red LED is used to indicate data streaming.
LED Indicator Behavior with GUI
2.3
LED
Color
Functionality
D2
Green
Indicates MCU is powered and the default sensor (or a similar sensor) is
connected.
D3
Red
Indicates LDC1101 is in streaming mode, transferring conversion results to
host when illuminated.
Break-Away Sections
Figure 2-3. EVM Break-Away Sections
The LDC1101 EVM can be broken into 3 discrete sections – a sensor section, which contains the sensor,
an LDC1101 section, and an MSP430 section which includes the USB interface section.
Figure 2-4. Break-Away Sensor
Break-Away Sensor Section
The sensor section of the LDC1101EVM can be broken along the indicated line to separate the sensor
from the LDC1101 IC. A two pin header is available for connecting the LDC1101 to alternative inductive
sensors. If the cable connection between the sensor and the LDC1101EVM is longer than 2cm, use
twisted pair or coaxial cable to connect the sensor to the LDC1101 section.
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Break-Away Sections
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Figure 2-5. Default Inductive Sensor Section
The included sensor is a 4 layer circular coil with 2 parallel inductor paths. This is done to reduce the
parasitic series resistance (RS) of the sensor for improved parallel resonant impedance (RP) measurement
range. J3, a pair of 100mil separated thru-holes, is included for remote connection of the sensor.
A 1mm diameter un-plated thru-hole in the sensor center is available for mounting or alignment to an
external assembly.
LDC1101EVM Sensor Parameters
Parameter
EVM Sensor Value
Outer Diameter
551 mils (14.0 mm)
Inner Diameter
191 mils (4.86 mm)
Number of turns
15
Trace Width
6 mils (0.152 mm)
Trace Spacing
6 mils (0.152 mm)
Number of layers
4
Trace Thickness
1 oz-cu (35 μm)
Inductance@ 3 MHz
7.2 µH
Sensor Capacitance
390 pF
fSENSOR (no target)
3.0 MHz
RS @ 3 MHz (no target)
1.8 Ω
RP @ 3 MHz (no target)
10.3 kΩ
Q@ 3 MHz
29
Approx. CPARASITIC
3 pF
SRF
33 MHz
5.0
4.5
Rs (Ω)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0 10.0
Frequency (MHz)
Figure 2-6. LDC1101EVM Default Sensor Resistance Variation
8
EVM Features and Connections
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Break-Away Sections
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LDC1101 Recommended Register Settings for EVM Sensor
Register Address
Value
0x01
0x36
0x02
0xDD
0x03
0xFD
0x04
0xCX (set lower nibble based on desired response time)
Sensor Configuration Options
Component footprints are available for a variety of configuration connections.
Figure 2-7. Sensor Configuration Options
When operating in an electrically noisy environment or with extended distances to a remote sensor, it may
be necessary to populate C4+C5 to improve the measurement ENOB. The components are left
unpopulated by default, and the footprints are located on the bottom of the PCB. For additional noise
suppression, R1 & R2 can be removed and a common-mode choke (e.g. SRF3216-222Y) can be placed
into those two footprints.
Figure 2-8. Unpopulated Footprints on EVM Bottom
In the rare case where EMI interference is caused by the LDC1101, it may be mitigated by populating
C6+C7 with capacitors that are approximately 10% of the value of CSENSOR. The components are left
unpopulated by default, and the footprints are located on the bottom of the PCB.
For some sensors, such as wire-wound inductors, it may not be easy to connect a sensor capacitor. A
second capacitor footprint – CSENSOR2 - is included for such a situation. This is left unpopulated by default,
with the footprint located on the bottom of the PCB.
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Break-Away Sections
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For remote sensor usage it is recommended to use twisted pair or coaxial cable for the connection to the
LDC1101 section of the PCB as shown in Figure 2-9. The maximum distance that a sensor can be located
is a function of the sensor frequency, sensor Q, and level of environmental interference. Refer to the
Remote Sensor Calculator tool in the LDC Tools Spreadsheet (http://www.ti.com/lit/zip/slyc137) to
evaluate maximum sensor distances.
Figure 2-9. Remote Sensor with Twisted Pair Connection
Break-Away MSP430 Section
The MSP430 section of the LDC1101EVM can be broken along the indicated line to separate the MSP430
from the LDC1101 IC. A 7 position 100mil spacing connector can be used for connecting the LDC1101 to
the MSP430, or another MCU if necessary. The interface pins on the connector are labeled for proper
functionality.
This connector can also be used to supply an external clock input to the LDC1101. If necessary, R7, a
0603 footprint for a 50Ω termination resistor, is present next to the LDC1101. R7 is not populated by
default. A ground via is also next to the CLKIN pad for connections using coaxial or twisted pair.
Figure 2-10. MSP430 Section
10
EVM Features and Connections
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Chapter 3
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LDC1101EVM PC Software (GUI)
The LDC1101EVM uses PC-based application software for device configuration and to retrieve conversion
results. The LDC1101 EVM software can be used to evaluate the performance and functionality of the
LDC1101 in a simple and flexible GUI configuration. The controls provided correspond to various register
fields of the LDC1101 or EVM features (e.g. the RPMIN field setting for the LDC1101).
Figure 3-1. LDC1101EVM GUI
3.1
Host Platform Requirements
The LDC1101EVM GUI can run on:
• Windows XP
• Windows 7 (32 & 64 Bit)
• Windows 8 (32 & 64 Bit)
Other platforms are not supported and may not properly operate.
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Software Installation
3.2
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Software Installation
Download the latest version of LDC1101EVM GUI software from http://www.ti.com/product/LDC1101. The
software must be installed before connecting the LDC1101 to your PC.
To install the LDC1101EVM software:
• Connect to http://www.ti.com/products/LDC1101, and then scroll down to the Software Section to
download the latest LDC1101 software.
• Unzip the downloaded file and run the installer file, named “Texas Instruments LDC1101 EVM GUI
Setup.exe”
The installer will run through a standard Windows program install process. By default, the installer places
the control application into C:\Program Files (x86)\Texas Instruments\LDC1101 EVM GUI. During the
install, the install location can be changed if desired, at the step shown below.
Figure 3-2. Choose Install Location
A shortcut to the application will be available in the Start Menu and on the Desktop.
After installation, connect the LDC1101EVM to the computer with a micro-USB cable. The PC will install
the communication driver the first time the board is connected to the PC.
When the Found New Hardware Wizard appears, select the “No, not this time”, as the driver is already on
the computer.
During installation, the PC may warn that the driver is not compatible. This warning can be ignored; simply
press the “Continue Anyway” button to complete the installation. This will associate a COM Port with the
EVM.
12
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Software Launch
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3.3
Software Launch
Launch the LDC1101EVM Software from either the Start Menu or the Desktop Icon:
Figure 3-3. Desktop Icon
After the GUI starts, plug in the EVM to an available USB port.
3.4
Connecting the GUI to the EVM
The LDC1101GUI uses a virtual COM port to communicate with the LDC1101EVM through USB.
At the top of the GUI, use the pull-down menu to select the appropriate COM port for communication with
the EVM. The GUI verifies the port connection before enabling the interface.
Figure 3-4. COM Port Selection
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Connecting the GUI to the EVM
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On systems which have a large number of installed COM ports, it may not be obvious which COM port is
assigned to the EVM. To determine the correct COM port, open the Windows Device Manager and find
the COM port named “EVM” under Ports (COM & LPT). In the example below, the LDC1101EVM can be
seen on port 89.
Figure 3-5. EVM COM Port
At the bottom right of the GUI is the connection status indicator – it changes from “NOT CONNECTED” to
“CONNECTED” as appropriate.
Figure 3-6. EVM Connected/Not Connected Indication
When the software starts up, it reads all the registers of the LDC1101.
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Software Operation
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3.5
Software Operation
Figure 3-7. LDC1101EVM GUI
The top left section of the GUI is used to select the operating pages, which are the primary sections of the
GUI. Simply click on the label corresponding to the desired page. The pages of the LDC1101 GUI are:
• RP+L Page – this configures and executes RP and Inductance (L) measurements
• LHR Page – this configures and executes High Resolution Inductance (LHR) measurements
• Apps Calculator – this is a tool to configure the LDC1101 RP measurement settings.
• Register Configuration Page – this provides direct reading and writing of LDC1101 registers
• About Page – provides information on the GUI Software and information on an attached
LDC1101EVM
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Active/Sleep Mode
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Figure 3-8. Page Selection
3.6
Active/Sleep Mode
The Active/Sleep Mode control changes the operating mode of the LDC1101; pressing the button toggles
between Sleep mode and Active mode. While in Sleep Mode the device can be configured with the
desired settings; it is recommended to make all device configuration changes in Sleep Mode.
In Active mode, the device is continuously converting and any enabled output plots are updated.
Figure 3-9. Sleep Mode/Active Mode
3.7
Sensor Configuration
The CLKIN Frequency should be set to 12MHz unless the frequency is changed using an external clock
source.
The default sensor comes with a sensor capacitance of 390pF; if the sensor capacitance is physically
changed then modify the Sensor Capacitor control setting to match the new capacitor value.
Figure 3-10. Sensor Configuration with changed Sensor Capacitor
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RP+L Page
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3.8
RP+L Page
The RP+L page allows for configuration of RP & Inductance measurements and plots conversion results.
The Streaming section displays the conversion results on two graphs. The left graph is the RP Data graph
and the right graph contains the Inductance graph.
Figure 3-11. LDC1101EVM Control Software: RP+L Page Streaming
Refer to Section 3.12 for information on the features and usage of the graphing areas.
Figure 3-12. RP+L Status
The LDC1101 Status Register (address 0x20) returns information on the measurement status. This status
is reported as a set of colored indicators in the Status Section, where Green indicates the condition was
not reported (the corresponding bit = 0).
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RP+L Page
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Register STATUS - Address 0x20
Bit
Bit Field Name
Description
7
NO_SENSOR_OSC
Sensor Oscillation Not Present Error
Indicates that the sensor has stopped oscillating. This error may also be produced if
the MIN_FREQ is set to too high a value.
b0: Error condition was not detected
b1: LDC1101 has not detected the sensor oscillation.
6
DRDYB
New Data Ready
b0: New conversion data is available.
b1: No new conversion data is available.
5
RP_HIN
RP_DATA High Threshold Comparator
Note this field will latch a high value.
b0: RP_DATA measurement has exceeded RP_THRESH_HI
b1: RP_DATA measurement has not exceeded RP_THRESH_HI
4
RP_HI_LON
RP_DATA Hysteresis Comparator
b0: RP_DATA measurement has gone below RP_THRESH_LO.
b1: RP_DATA measurement has gone above RP_THRESH_HI.
3
L_HIN
L_DATA High Threshold Comparator
Note this field will latch a high value.
b0: L_DATA measurement has exceeded L_THRESH_HI
b1: L_DATA measurement has not exceeded L_THRESH_HI
2
L_HI_LON
L_DATA Hysteresis Comparator
b0: L_DATA measurement has gone below L_THRESH_LO.
b1: L_DATA measurement has gone above L_THRESH_HI.
0
POR_READ
Device in Power-On-Reset
Indicates the device is in process of resetting. Note that the device cannot accept any
configuration changes until reset is complete. Wait until POR_READ = 0 before
changing any device configuration.
b0: Device is not in reset.
b1: Device is currently in reset; wait until POR_READ = 0.
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RP+L Page
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While on the Streaming view, press the “Go to Configuration” button to modify the RP+L device settings.
The page will change and appear as below. Press the “Go to Streaming” button to return to the Streaming
view.
Figure 3-13. RP+L Page Measurement Configuration
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RP+L Page
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RP+L Configuration Controls
Control
Function
Recommended
Setting for
LDC1101EVM
sensor
LDC1101 Register Field
RP Minimum
Sets the maximum current drive.
1.5 kΩ
RP_MIN
12 kΩ
RP_MAX + RPMAX_DIS
For higher loss coils, or if there is a larger amount
of conductive material in the vicinity of the sensor,
this setting may need to be decreased.
RP Maximum
Sets the minimum current drive.
For low-loss coils without a large amount of
conductive materials, it may need to be increased;
setting to “Disable” will set the LDC1101
RPMAX_DIS.
Time Constant 1 Capacitance
Sets Time Constant 1 capacitance.
6.0 pF
CINT1
Time Constant 1 Resistance
Sets Time Constant 1 resistance.
41.6kΩ
RINT1
Time Constant 2 Capacitance
Sets Time Constant 2 capacitance.
24 pF
CINT2
Time Constant 2 Resistance
Sets Time Constant 2 resistance.
49 kΩ
RINT2
Sensor Fmin
Set the Minimum Sensor Frequency. This is used
for checking if oscillation has died.
2.7 MHz
MIN_FREQ
Response Time
Adjusts the measurement resolution and
measurement time. A higher value response time
setting has higher measurement resolution and
lower sample rate
-
RESP_TIME
RP Comparator Low
The LDC1101 can compare the RP conversion
result against a high and low threshold. This
control is provided for completeness, although the
functionality is not available with the GUI.
-
RP_THRESH_LO
-
RP_THRESH_HI
The LDC1101 can compare the L conversion
result against a high and low threshold. This
control is provided for completeness, although the
functionality is not available with the GUI.
-
L_THRESH_LO
-
L_THRESH_HI
INTB Function
This control configures the INTB functionality; this
feature is not used as the LDC1101 FW
periodically polls the conversion results.
-
INTB2SDO
Single Conversion Sample
Returns a single conversion result
RP Comparator High
L Comparator Low
L Comparator High
20
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LHR Page
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3.9
LHR Page
The LHR Page allows for configuration of the High Resolution Inductance measurements and plots
conversion results. The Streaming section displays conversion result on a graph.
Figure 3-14. LDC1101 Control Software: LHR Page Streaming
Refer to Section 3.13 for information on the features and usage of the graphing area.
Figure 3-15. LHR Status
The LDC1101 LHR_Status Register (address 0x3B) returns information on LHR measurement status. The
status is reported as a set of colored indicators in the Status section, where Green indicates the condition
was not reported (the corresponding bit = 0).
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LHR Page
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Register LHR_STATUS - Address 0x3B
Bit
Bit Field Name
Description
4
ERR_ZC
Zero Count Error
Zero count errors indicate that no cycles of the sensor occurred in the programmed measurement
interval. This indicates either a sensor error or the sensor frequency is too low.
b0: No Zero Count error has occurred since the last read of the STATUS register.
b1: A Zero Count error has occurred.
3
ERR_OR
Conversion Over-range Error
Conversion over-range errors indicate that the sensor frequency exceeded the reference frequency.
b0: No Conversion Over-range error has occurred since the last read of the STATUS register.
b1: A Conversion Over-range error has occurred.
2
ERR_UR
Conversion Under-range Error
Conversion under-range errors indicate that the output code is negative; this occurs when
programmed LHR offset register value is too large.
b0: No Conversion Under-range error has occurred since the last read of the STATUS register.
b1: A Conversion Under-range error has occurred.
1
ERR_OF
Conversion Over-flow Error
Conversion over-flow errors indicate that the sensor frequency is too close to the reference
frequency.
b0: No Conversion Over-flow error has occurred since the last read of the STATUS register.
b1: A Conversion Over-flow error has occurred.
0
LHR_DRDY
b0: No unread conversion data is available.
b1: Unread conversion data is available.
Figure 3-16. LDC1101EVM LHR Configuration
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LHR Page
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The GUI controls provide the following functions:
LHR Configuration Controls
Control
Function
Recommended
LDC1101 Setting
LDC1101
Register Field
RP Minimum
Sets the maximum current drive.
4kΩ
RP_MIN
Enabled
D_CONFIG +
ALT_CONFIG
For higher loss coils, or if there is a larger amount of
conductive material in the vicinity of the sensor, this
setting may need to be decreased.
If the Optimize LHR measurement is set, then only the
RP_MIN setting is used to control sensor signal amplitude.
Optimize LHR measurement
Disables RP measurement sensor modulation. This can
improve L measurement accuracy.
Reference Count
Set the LHR mode reference count – which is the number >1000
of reference clock cycles used to measure the sensor
frequency. The higher this number, the higher the
resolution of the frequency, although the measurement will
take longer.
LHR_REF_CO
UNT
Offset
Sets the LHR mode offset count – this value is subtracted
off of the measurement.
0
LHR_OFFSET
Clock Divider
Set LHR Sensor Divider. Only necessary when fSENSOR >
fREFERENCE.
Not divided
SENSOR_DIV
Normal
SHUTDOWN
Do Not Report
DRDY
INTB_FUNC
This control is included only to provide comprehensive
configuration control, as the LDC1101EVM Reference
frequency of 12MHz is greater than the maximum sensor
frequency of 10MHz.
Reference Frequency Source
Used to bring LDC1101 out of shutdown.
This control is included only to provide comprehensive
configuration control and is not necessary for EVM
functionality.
INTB Disable
Set INTB reporting.
This control is included only to provide comprehensive
configuration control and is not necessary for EVM
functionality.
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Datalogging Conversion Results
www.ti.com
3.10 Datalogging Conversion Results
The LDC1101EVM GUI can save conversion results to a file for later evaluation with other applications. To
start saving data, simply check the “Enable Data Log” check box – a window will pop-up asking for the
location to save the file. While the default extension is an “xls” file, the save format is tab-delimitated
ASCII text. If the file is opened in Excel, Excel may issue a warning that the file is corrupt, but it will still
properly open the output file.
To stop saving, simply un-check the “Enable Data Log” check box.
Figure 3-17. Datalogging
The file data structure is formatted as columns of data, with a header at the beginning of the file which
indicates the column data. The columns are separated by tabs.
Time Stamp
RP Raw Code
RP Min
Rp Max
calculated (uH)
Fref(Hz)
C(pF)
Offset
LHR Count
RP (Ohms)
Fref(Hz)
C(pF)
L count
L
LHR calculated (uH)
11/17/2014 11:35 AM
5219578
5.507225
0
0
0
0
0
0
0
0
12000000.0
330.0
0
11/17/2014 11:35 AM
5219578
5.507225
0
0
0
0
0
0
0
0
12000000.0
330.0
0
11/17/2014 11:35 AM
4846751
6.387078
0
0
0
0
0
0
0
0
12000000.0
330.0
0
3.11 Configuration Saving and Loading
The Save Config and Load Config buttons enable saving the programmed register settings. After
configuring the register settings to the desired values (which is the same as setting the configuration
controls to the desired settings), simply press the Save Config Button. Enter a filename for the save file.
The file data is formatted as ASCII text.
To retrieve the configuration at a later time (e.g. after restarting the GUI), press the Load Config button
and select the desired configuration file.
Figure 3-18. Save Config and Load Config Buttons
24
LDC1101EVM PC Software (GUI)
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Plot Display Controls and Options
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3.12 Plot Display Controls and Options
Right-clicking on a plot opens the plot control options, as shown in Figure 3-19 below.
Figure 3-19. Graph Right-Click Menu
3.12.1 AutoScale
The graph can automatically scale the Y axis to only show range of data variation.
3.12.2 Graph Data Export
Plotted data currently shown on the Graph can be exported as an image file, as clipboard data or Excel
data. If the data is exported to Excel, then the data will be inserted into a temporary workbook. Clipboard
data is exported as ascii text. Both clipboard data and Excel data will have a header at the top, and a
maximum of 10k samples of data available.
Note that this feature is independent of the Datalogging functionality described in Section 3.10.
3.12.3 Graph Update
To the bottom right of the plot is the Graph Update rate setting. If the graph rate is updating too quickly,
change the update rate to slow down the graph. For example, selecting the 1:10 rate setting will reduce
the plotting speed by a factor of 10x.
3.13 RP Apps Calculator Page
This page is used to calculate appropriate settings for the RPMIN, RPMAX, C1, C2, R1, and R2 LDC1101
settings for a sensor. Setting these parameters are necessary for optimal RP measurements. The
LDC1101EVM does not need to be connected to determine the appropriate settings for a sensor.
Use of the Apps Calculator is simple:
1. Enter the CSENSOR, LSENSOR, and the sensor RS.
2. Select the largest value possible for C1 and C2; if the settings are not recommended, the bar
underneath the control will turn red.
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Direct Register Access Page
www.ti.com
3. The L variation is used to compensate for target interaction with the sensor. If the target movement
causes a maximum shift in inductance of 20%, then enter (1-20%), or 0.8 into the Lvariation field.
4. Adjust the RPvariation – this factor is used to compensate for eddy current losses. This factor is
generally quite small and should be 1.02 or less, as the majority of the RP shift with target position is
due to the sensor frequency shifts.
Once a setup is configured, if an LDC1101EVM is connected, press the Update Registers button to write
the appropriate values to the LDC1101 registers.
Figure 3-20. Apps Calculator to Configure RP Measurements
3.14 Direct Register Access Page
If desired, the LDC1101 registers can be viewed and directly modified on the Register Map page of the
GUI. The register names, addresses, and current values are displayed in a table format in the middle of
the window, and the Write register or Read Register allow for direct manipulation of the registers. Care
should be taken to ensure that any write commands are correct and are not writing any incorrect values
into the reserved fields.
To set a register, first select the desired register, and then fill in the desired hex value into the Write Data
field. Once the data is entered, press the “Write Register” button to update the selected register.
The current configuration can be saved by pressing the “Save Config” button to store the configuration,
and the “Load Config” button will restore a previously saved configuration. The files can be read by an
ASCII file editor.
26
LDC1101EVM PC Software (GUI)
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Direct Register Access Page
www.ti.com
Figure 3-21. LDC1101 Control Software: Register Map Page
In the Register Map table, all of the LDC1101 registers are listed, along with the address, default setting,
the Last Written value (LW column), and the Last Read value (LR column).
At the bottom left of the Register Map page, the Register Description section of the page provides
information on each field in the register.
To the right of the Register Map table are the register read and write controls. Enter a desired Hex value
to program the register value, or click on the desired fields farther to the right. Press the Write Register
button to update the LDC1101 with the new value. The LW column in the Register table for the selected
register will update to reflect the new value written.
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EVM FW Protocol
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Figure 3-22. Register Read/Write Controls
3.15 EVM FW Protocol
The EVM communicates with the PC using a Com port interface running on USB. Interfacing the
LDC1101EVM with PC based tools which can manage Com port communications is feasible. Setting a
data rate of 115200 baud, 8 data bits, 1 stop bit with no parity and no flow control are recommended com
port settings. Note that the EVM returns values in binary format and not ASCII. For example, the EVM
may return the value of 0x00, which is not printable as an ASCII character.
Example: Setting Register 0x31 to 0x6B:
First, take the set Register command, 0x02, as ASCII characters ‘0’ and ‘2’ in array positions 0 and 1.
Append the register address, 0x31, as ‘3’ and ‘1’ into positions 2 and 3, followed by the write data, 0x6B,
formatted as ‘6’ and ‘B’ into positions 4 and 5.
The resulting string “02316B”, followed by a carriage return, then a line feed.
The EVM response is an array of 8bit integers:
Position
0
1
2
3
4
5
6
7
Value
0x00
0x6B
0x00
0x00
0x00
0x00
0x00
0x00
Where [00] corresponds to a return value of 0x00 and is not a printable ASCII character. The desired
return value is in position 1 (starting count from 0), and is the byte value of 0x6B, which appears as “k”,
when displayed in an ASCII interface.
28
LDC1101EVM PC Software (GUI)
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EVM FW Protocol
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FW Protocol
Command
Command
Value (Hex)
Parameters
Return Value
SPI Byte Write
0x02
2,3: SPI Address
1: Data Byte write confirmation
4,5: SPI Data byte
SPI Byte Read
0x03
2,3: SPI Address
4: Data Byte read back
Enable BSL
0x04
none
none
Stream Convert data
0x06
2,3: SPI Address
4kbyte integer array. Refer to
Table 3-1 for structure.
SPI Address 0x20: Stream RP+L conversion
results
SPI Address 0x38: Stream LHR conversion
results
Stop Conversion Stream
0x07
Read FW Version
0x09
none
6,7,8,9: FW version
Table 3-1. Streaming Data Structure
Position
RP+L Streaming
LHR Streaming
0
Contents of Register 0x20 (RP_STATUS)
Contents of Register 0x3B (LHR_STATUS)
1
Contents of Register 0x22 (RP_DATA_MSB)
Contents of Register 0x3A (LHR_DATA_MSB)
2
Contents of Register 0x21 (RP_DATA_LSB)
Contents of Register 0x39 (LHR_DATA_MID)
3
Contents of Register 0x24 (L_DATA_MSB)
Contents of Register 0x38 (LHR_DATA_LSB)
4
Contents of Register 0x23 (L_DATA_LSB)
0x5A
5
0x5A
Sample Index
6
Sample Index
0x5A
7
0x5A
0x5A
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29
Chapter 4
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EVM Design - Board Layout
Layer Usage
Layer
Functionality
Top
Signals, Components, and ground-fill
Mid-layer 1
Ground
Mid-layer 2
Signals and section transition routing
Bottom
MSP430 Power and optional components
Figure 4-1. Top Layer Routing
Figure 4-2. Mid-Layer 1 Routing
30
EVM Design - Board Layout
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Figure 4-3. Mid-Layer 2 Routing
Figure 4-4. Bottom Layer Routing
Chapter 5
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EVM Design - Schematic
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EVM Design - Schematic
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31
EVM FW Protocol
www.ti.com
Figure 5-1. LDC1101, Sensor, and Level Shifter Schematic
32
EVM Design - Schematic
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EVM FW Protocol
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Figure 5-2. Power Conditioning Schematic
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EVM Design - Schematic
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EVM FW Protocol
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Figure 5-3. MCU Schematic
34
EVM Design - Schematic
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EVM FW Protocol
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Figure 5-4. USB Connection Schematic
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EVM Design - Schematic
Copyright © 2015, Texas Instruments Incorporated
35
Chapter 6
SNOU137 – May 2015
EVM Bill of Materials
Item #
Designator
Part Number
Manufacturer
Description
1
!PCB1
SV601159
Any
Printed Circuit Board
2
C1, C8, C10, C11,
C19, C21, C26, C27
C1005X7R1H104K050B
B
TDK
CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0402
3
C12, C14
C1005X7R1A224K050B
B
TDK Corporation
CAP, CERM, 220nF, 10V, 10%, X7R, 0402
4
C13
C0603C474K8RACTU
Kemet
CAP, CERM, 0.47uF, 10V, +/-10%, X7R, 0603
5
C15, C16
GRM1555C1H180JA01
D
MuRata
CAP, CERM, 18 pF, 50 V, +/- 5%, C0G/NP0, 0402
6
C17
C1005X7R1H222K
TDK
CAP, CERM, 2200 pF, 50 V, +/- 10%, X7R, 0402
7
C18
C2012X5R1C226K125A
C
TDK
CAP, CERM, 22uF, 16V, +/-10%, X5R, 0805
8
C2
GRM155R61A105KE15
D
MuRata
CAP, CERM, 1uF, 10V, +/-10%, X5R, 0402
9
C22, C24, C25
C0603C225K8PACTU
Kemet
CAP, CERM, 2.2uF, 10V, +/-10%, X5R, 0603
10
C3
C0603C153J3GACTU
Kemet
CAP, CERM, 0.015 µF, 25 V, +/- 5%, ,NP0 0603
11
C4, C5, C6, C7
GRM1885C2A180JA01D MuRata
CAP, CERM, 18pF, 100V, +/-5%, C0G/NP0, 0603
12
C9, C20
C1608X5R1A106M
TDK
CAP, CERM, 10uF, 10V, +/-20%, X5R, 0603, CAP,
CERM, 10 µF, 10 V, +/- 20%, X5R, 0603
13
Csensor, Csensor2
CC0603FRNPO9BN391
Yageo America
CAP, CERM, 390 pF, 50 V, +/- 1%, C0G/NP0, 0603
14
D1
MMSZ5232B-7-F
Diodes Inc.
Diode, Zener, 5.6V, 500mW, SOD-123
15
D2
LG L29K-G2J1-24-Z
OSRAM
LED, Green, SMD
16
D3
SML-LX0603SRW-TR
Lumex
LED, Super Red, SMD
17
J1
ZX62R-B-5P
Hirose Electric Co. Ltd.
Connector, Receptacle, Micro-USB Type B, SMT
18
J2
1727010
Phoenix Contact
Conn Term Block, 2POS, 3.81mm, TH
19
J3, J5
TSW-102-07-G-S
Samtec, Inc.
Header, TH, 100mil, 2x1, Gold plated, 230 mil
above insulator
20
L1
VLS201610ET-100M
TDK
Inductor, Shielded, Ferrite, 10 µH, 0.4 A, 1.38 ohm,
SMD
21
LBL1
THT-14-423-10
Brady
Thermal Transfer Printable Labels, 0.650" W x
0.200" H - 10,000 per roll
22
R1, R2
CRCW08050000Z0EA
Vishay-Dale
RES, 0 ohm, 5%, 0.125W, 0805
23
R10, R11
CRCW040210R0FKED
Vishay-Dale
RES, 10.0, 1%, 0.063 W, 0402
24
R12
ERJ-2GEJ152X
Panasonic
RES, 1.5k ohm, 5%, 0.10W, 0402
25
R13
CRCW04021M00JNED
Vishay-Dale
RES, 1.0 M, 5%, 0.063 W, 0402
26
R14
CRCW06030000Z0EA
Vishay-Dale
RES, 0 ohm, 5%, 0.1W, 0603
27
R3
CRCW06030000Z0EA
Vishay-Dale
RES, 0 ohm, 5%, 0.1W, 0603
28
R4
CRCW040233K0JNED
Vishay-Dale
RES, 33k ohm, 5%, 0.063W, 0402
29
R5, R6
CRCW04021K00JNED
Vishay-Dale
RES, 1.0k ohm, 5%, 0.063W, 0402
30
R7
RT0603BRD0749R9L
Yageo America
RES, 49.9, 0.1%, 0.1 W, 0603
31
R9
CRCW060333R0JNEA
Vishay-Dale
RES, 33 ohm, 5%, 0.1W, 0603
32
TP1
5001
Keystone
Test Point, Miniature, Black, TH
33
U1
LDC1101DRC
Texas Instruments
1.8V High Resolution Inductance to Digital
Converter, DRC0010J
34
U2
MSP430F5528IRGC
Texas Instruments
Mixed Signal MicroController, RGC0064B
36
EVM Bill of Materials
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EVM FW Protocol
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Item #
Designator
Part Number
Manufacturer
Description
36
U3
TPD2E001DRLR
Texas Instruments
Low-Capacitance + / - 15 kV ESD-Protection Array
for High-Speed Data Interfaces, 2 Channels, -40 to
+85 degC, 5-pin SOT (DRL), Green (RoHS & no
Sb/Br)
37
U4
LP5951MG-2.5/NOPB
Texas Instruments
Micropower, 150mA Low-Dropout CMOS Voltage
Regulator, 5-pin SC-70, Pb-Free
38
U5
LP5951MG-1.8/NOPB
Texas Instruments
Micropower, 150mA Low-Dropout CMOS Voltage
Regulator, 5-pin SC-70, Pb-Free
39
U7
SN74AVCH4T245RSVR
Texas Instruments
4-Bit Dual-Supply Bus Transceiver with
Configurable Voltage Translation and 3-State
Outputs, RSV0016A
40
Y1
ABM8-24.000MHZ-B2-T
Abracon Corportation
Crystal, 24.000MHz, 18pF, SMD
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EVM Bill of Materials
Copyright © 2015, Texas Instruments Incorporated
37
Revision History
www.ti.com
Revision History
38
DATE
REVISION
NOTES
May 2015
*
Initial release.
Revision History
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Copyright © 2015, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
SPACER
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
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