LDC2114 Evaluation Module for Inductive
Touch Applications
User's Guide
Literature Number: SNOU144
December 2016
Contents
1
2
3
4
Overview .............................................................................................................................
Compatible Sensor EVM .......................................................................................................
Main EVM elements ..............................................................................................................
Sensing Solutions EVM GUI ..................................................................................................
6
7
7
8
4.1
System Requirements ................................................................................................... 8
4.2
Installation Instructions .................................................................................................. 9
4.3
Starting the GUI ......................................................................................................... 16
4.4
Navigating the GUI ..................................................................................................... 17
4.5
Connecting the EVM ................................................................................................... 19
4.6
Configuring the EVM Using the Register Page .....................................................................
4.6.1
Automatically Update GUI Register Values Using Auto Read ........................................
4.6.2
Manually Update Device Register Values ...............................................................
4.6.3
Reading Register Values Without Auto Read ...........................................................
4.6.4
Saving Device Configurations .............................................................................
4.6.5
Loading Previously Saved Configurations ...............................................................
19
19
20
22
24
24
4.7
Configuring the EVM Using the Configuration Page ...............................................................
4.7.1
Changing registers through the Configuration Pane ...................................................
4.7.2
Selecting the Mode of Operation and Scan Rate .......................................................
4.7.3
Interrupt polarity .............................................................................................
4.7.4
Base-tracking Increment ...................................................................................
4.7.5
LC Resonant Frequency Divider (Pre-scaler) ...........................................................
4.7.6
Channel Settings ............................................................................................
4.7.7
Algorithm Settings...........................................................................................
4.7.8
Calculator ....................................................................................................
4.7.9
Status .........................................................................................................
25
25
26
26
26
26
27
27
27
28
4.8
Streaming Measurement Data ........................................................................................
4.8.1
Choosing Visible Channels ................................................................................
4.8.2
Logging Data to a File ......................................................................................
4.8.3
Starting and Stopping Data Streaming ...................................................................
4.8.4
Data Statistics ...............................................................................................
4.8.5
Configuring the Graph ......................................................................................
4.8.6
Navigating the Data Streaming Buffer....................................................................
28
28
29
30
31
32
34
4.9
Updating the EVM Firmware .......................................................................................... 36
5
6
LDC2114 EVM REV A Schematics and Layout........................................................................ 41
LDC2114EVM REV A Bill of Materials .................................................................................... 52
2
Table of Contents
SNOU144 – December 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
www.ti.com
List of Figures
1
LDC2114 Evaluation Module ............................................................................................... 6
2
Main EVM elements ......................................................................................................... 7
3
User Account Control Prompt .............................................................................................. 9
4
Software Installer Wizard .................................................................................................. 10
5
Software Installer License Agreement ................................................................................... 10
6
Software Installation Directory ............................................................................................ 11
7
Software Installer Ready .................................................................................................. 12
8
Software Installer in Progress
9
Device Driver Installer Wizard ............................................................................................ 13
10
Device Driver Installer in Progress ....................................................................................... 14
11
Device Driver Installer Completed
12
Software Installer Completed ............................................................................................. 15
13
Splash Screen .............................................................................................................. 16
14
Introduction Page........................................................................................................... 17
15
Mouse Hovered Over Menu Button ...................................................................................... 18
16
Menu Display After Clicking Button ...................................................................................... 18
17
EVM Connected to GUI
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
............................................................................................
.......................................................................................
...................................................................................................
Selecting Auto Read Interval on Register Page .......................................................................
Selecting a Register's Current Value for Editing on Register Page .................................................
Hovering Mouse Over Register Bit Value on Register Page ........................................................
Selecting a Register on Register Page ..................................................................................
Reading the Current Device Register Value on Register Page .....................................................
Save Register Values to File on Register Page ........................................................................
Loading Previously Saved Register Values from File on Register Page ...........................................
Global Button Settings, Channel Settings on Configuration Page ...................................................
Algorithm Settings and Calculator on Configuration Page ............................................................
Device Status ...............................................................................................................
Select the Data Graph on Data Streaming Page ......................................................................
Select Log File Button on Data Streaming Page .......................................................................
Start Button on Data Streaming Page ...................................................................................
Show Statistics Button on Data Streaming Page ......................................................................
Hide Statistics Button on Data Streaming Page .......................................................................
Show Graph Configuration Button on Data Streaming Page .........................................................
Graph Configuration Button on Data Streaming Page ................................................................
Changing Number of Samples Displayed in Data Graph ............................................................
Displaying Previous Data Samples on the Data Streaming Page ...................................................
Select TI-TXT File Button on Firmware Upload Page ................................................................
Selecting TI-TXT Firmware File for Upload to EVM ..................................................................
Upload Firmware Button on Firmware Upload Page .................................................................
Firmware Upload in Progress ............................................................................................
Firmware Upload Success ...............................................................................................
Bridge between LDC and MSP430 ......................................................................................
PU/PD for LDC inputs .....................................................................................................
Power: 1.8V LDO for LDC211x ...........................................................................................
Button press LEDs .........................................................................................................
LDC2114 ....................................................................................................................
Level shift from 1.8V LDC211x to 3.3V MSP430 ......................................................................
SNOU144 – December 2016
Submit Documentation Feedback
List of Figures
Copyright © 2016, Texas Instruments Incorporated
12
15
19
20
21
22
23
23
24
25
26
27
28
29
30
31
32
32
33
34
35
36
37
38
39
39
40
41
41
42
42
43
44
3
www.ti.com
48
Level shift for I2C ........................................................................................................... 45
49
USB connector.............................................................................................................. 46
50
Power: 3.3V LDC for MSP430 ............................................................................................ 46
51
MSP430
52
53
54
55
56
57
58
4
.....................................................................................................................
MSP430 GPIO Breakout connector and General purpose LEDs ....................................................
LDC2114 Layout Top Layer - Overview .................................................................................
LDC2114 Layout Top Layer – Signals and Components .............................................................
LDC2114 Layout MidLayer 1 – Ground Plane .........................................................................
LDC2114 Layout MidLayer 2 – Signals and Power Plane ............................................................
LDC2114 Layout Bottom Layer – Signals Plane .......................................................................
LDC2114 Bottom Layer - Overview ......................................................................................
List of Figures
47
48
49
49
50
50
51
51
SNOU144 – December 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
www.ti.com
List of Tables
1
List of Evaluation modules .................................................................................................. 6
2
Connection options
3
......................................................................................................... 7
BOM for LDC2114EVM rev A ............................................................................................ 52
SNOU144 – December 2016
Submit Documentation Feedback
List of Tables
Copyright © 2016, Texas Instruments Incorporated
5
User's Guide
SNOU144 – December 2016
LDC2114 Evaluation Module for Inductive Touch
Inductance to Digital Converter
1
Overview
The LDC2114 EVM demonstrates the use of inductive sensing technology to sense and measure the
presence or position of conductive target objects, and to detect the press of an inductive touch button. The
LDC is controlled by an MSP430, which interfaces to a host computer.
The LDC2112 is the two-channel version of the LDC2114. The LDC2112 does not have a dedicated EVM.
Instead, the four-channel LDC2114 EVM should be used to evaluate the technology and performance.
Figure 1. LDC2114 Evaluation Module
PCB perforations allow removal of the microcontroller, so that a different microcontroller can be
connected.
This user guide covers the following EVMs:
Table 1. List of Evaluation modules
6
EVM name
EVM revision
Device under test
LDC2114EVM
A
LDC2114 WCSP
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Compatible Sensor EVM
www.ti.com
2
Compatible Sensor EVM
The EVM does not include any example sensors, but can easily be connected to sensors by using either
the ZIF connector or soldering wires to the header pins on the PCB. The LDC2114 EVM is compatible
with the LDCCOILEVM, which is available on the TI estore and contains 19 different sensor designs.
Connect sensors from the LDCCOILEVM with unshielded twisted pair wires to J6 of the LDC2114 EVM.
NOTE: Schematics, Layout, and Coil characteristics of the LDCCOILEVM are described in the
LDCCOILEVM user guide.
Table 2 shows the connection options for each coil type.
Table 2. Connection options
LDCTOUCHCOMCOILEVM coil type
Connect to
A
J3 ZIF connector using flat ribbon cable
B
J3 ZIF connector using flat ribbon cable
C
J3 ZIF connector using flat ribbon cable
D
J3 ZIF connector using flat ribbon cable
E
J6 2.54mm header using unshielded twisted pair wires
NOTE: When connecting the coil board to the EVM, it is recommended to attach the assembly to a
static object using tape or screws. This will prevent the cables from moving and potentially
changing the output code reading or reporting false triggers.
3
Main EVM elements
Figure 2. Main EVM elements
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
7
Sensing Solutions EVM GUI
www.ti.com
The EVM has the following features, as shown in Figure 2:
1. Power indication LED: this LED shows that the PCB is powered through the USB cable
2. MSP430 GPIO headers: This is a multi-purpose GPIO header which facilitates connection with a
second I2C interface, JTAG, UART, and three additional GPIOs. It also contains 5V, 3.3V, and GND
rails. These pins could be used for example to connect a haptics driver or an audio amplifier. Note that
functionality pof these pins is not implemented in the default EVM firmware.
3. Sensor capacitors: These are the sensor capacitors of the LDC2114. Replace them with suitable
values if appropriate.
4. Alternative connection for UTP cables: Custom sensors can be connected to these header
connections. Unshielded twisted pair (UTP) wires are the preferred wire choice for the sensor.
5. ZIF connector for LDCTOUCHCOMCOILEVM: Sensors of this PCB can be connected easily by
connecting the supplied flat ribbon cable.
6. BSL jumper connection: If firmware upgrade is unsuccessful, put the MSP430 into bootstrap loader
mode by shorting these two pins while powering up the EVM.
7. Micro-USB connector: connect to the PC using a micro-USB cable
8. Force touch LEDs: these eight LEDs show the intensity of the button press. They default firmware
chooses the channel with the strongest button push to indicate intensity.
9. MSP430 F5528: This microcontroller is used to configure the LDC2114, facilitate data streaming to the
GUI, and to show the intensity of the button press.
10. Perforation and probing header: These pads can be used for probing any signals between the
MSP430 and the LDC2114. It can be populated with a standard 2x11 pin 2.54mm header for ease of
access. It is also possible to break the LDC along the perforation and attach a different microcontroller
to these pins. The signals of the header are: [1-2]: OUT3, [3-4]: OUT2, [5-6]: OUT1, [7-8]: OUT0, [910]: INTB, [11-12]: LPWRB, [13-14]: SDA, [15-16]: SCL, [17-18]: GND, [19-20]: +3.3V, [21-22]: GND.
Note that the signals on this header are referenced to the Microcontroller VIO voltage (3.3V).
11. Button Press LEDs: These LEDs indicate which button has been pressed. Note that the MAXWIN
function is not enabled by default, so multiple buttons can be pressed simultaneously, and therefore
multiple LEDs may light up.
12. LDC2114: The LDC2114 Inductive Touch Inductance-to-Digital Converter for Consumer and LowPower Applications
13. LDC probing pads: These probing points use the level-shifted (1.8V referenced) signals of SDA, SCL,
OUT0, OUT1, OUT2, and OUT3
4
Sensing Solutions EVM GUI
The Sensing Solutions EVM GUI provides direct device register access, user-friendly configuration, and
data streaming.
4.1
System Requirements
The host machine is required for device configuration and data streaming. The following steps are
necessary to prepare the EVM for the GUI:
• The GUI and EVM driver must be installed on a host computer.
• The EVM must be connected to a full speed USB port (USB 1.0 or above).
The Sensing Solutions EVM GUI supports the following operating systems (both 32-bit and 64-bit):
• Windows XP
• Windows 7
• Windows 8 and 8.1
• Windows 10
8
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
4.2
Installation Instructions
The Sensing Solutions GUI and EVM driver installer is packaged in a zip file. Follow these steps to install
the software:
1. Download the latest version of the Sensing Solutions EVM GUI from EVM tool page.
NOTE: The minimum Sensing Solutions GUI revision for this EVM is 1.9.1. The latest GUI can be
downloaded here.
2. Extract the downloaded ZIP file.
3. Run the included executable.
4. If prompted by the User Account Control about making changes to the computer, click Yes.
Figure 3. User Account Control Prompt
5. After the setup wizard starts, click Next.
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
9
Sensing Solutions EVM GUI
www.ti.com
Figure 4. Software Installer Wizard
6. Read the license agreement, select I accept the agreement, and click Next.
Figure 5. Software Installer License Agreement
10
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
7. Use the preselected installation directory and click Next.
Figure 6. Software Installation Directory
8. Start the installation by clicking Next.
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
11
Sensing Solutions EVM GUI
www.ti.com
Figure 7. Software Installer Ready
9. Wait for the installation to complete.
Figure 8. Software Installer in Progress
12
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
10. When the Device Driver Installation Wizard appears, click Next to install the EVM driver.
Figure 9. Device Driver Installer Wizard
11. Wait for the driver installation to complete.
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
13
Sensing Solutions EVM GUI
www.ti.com
Figure 10. Device Driver Installer in Progress
12. After the driver installation is completed, click Finish.
14
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
Figure 11. Device Driver Installer Completed
13. Click Finish to complete the installation.
Figure 12. Software Installer Completed
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
15
Sensing Solutions EVM GUI
4.3
www.ti.com
Starting the GUI
Follow these steps to start the GUI:
1. Select the Windows start menu.
2. Select All programs.
3. Select Texas Instruments.
4. Select Sensing Solutions EVM GU.
5. Click Sensing Solutions EVM GU.
6. The splash screen will appear for at least two seconds.
Figure 13. Splash Screen
7. After the splash screen is displayed the main window will open.
16
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
Figure 14. Introduction Page
4.4
Navigating the GUI
To navigate to different pages of the GUI follow these steps:
1. Click Menu in the upper left corner.
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
17
Sensing Solutions EVM GUI
www.ti.com
Figure 15. Mouse Hovered Over Menu Button
2. Select the desired page from the menu shown on the left.
Figure 16. Menu Display After Clicking Button
18
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
4.5
Connecting the EVM
Follow these steps to connect the EVM to the GUI:
1. Attach the EVM to the computer through USB.
2. The GUI always shows the connection status on the bottom left corner of the GUI.
Figure 17. EVM Connected to GUI
4.6
Configuring the EVM Using the Register Page
The register page allows users to control the device directly with the register values. The user may also
use this page to read the current register values on the device.
4.6.1
Automatically Update GUI Register Values Using Auto Read
Auto read will periodically request the register values on the device. Click the drop down box next to Auto
Read to select the update interval.
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
19
Sensing Solutions EVM GUI
www.ti.com
Figure 18. Selecting Auto Read Interval on Register Page
4.6.2
Manually Update Device Register Values
There are two methods to change register values: update the entire register value or change a single bit
within the register. The recommended update mode is always Immediate and not Deferred. To update
register values, follow these steps.
1. Double-click the current value of the register that needs to be changed. The text will turn into an
editable text box.
20
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
Figure 19. Selecting a Register's Current Value for Editing on Register Page
2. Type the new hexadecimal value into the box and click enter. The text box changes to normal text and
the GUI will send a command to the EVM to update the device register.
To change individual bit values rather that entire register values follow these steps.
1. Hover the mouse over the desired bit to change.
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
21
Sensing Solutions EVM GUI
www.ti.com
Figure 20. Hovering Mouse Over Register Bit Value on Register Page
2. Double-click the bit to toggle its value and the register’s current value will update automatically.
4.6.3
Reading Register Values Without Auto Read
To read register values follow these steps.
1. Select the register to update by clicking any column of the register row in the table.
22
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
Figure 21. Selecting a Register on Register Page
2. Click the Read Register button to update the selected register’s current value and bit values in the
table.
Figure 22. Reading the Current Device Register Value on Register Page
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
23
Sensing Solutions EVM GUI
4.6.4
www.ti.com
Saving Device Configurations
To save the current register settings of the device follow these steps.
1. Click the button immediately right to the Auto Read selection drop down.
Figure 23. Save Register Values to File on Register Page
2. Choose a name for the JSON file and the directory to save it within. Then click Save.
4.6.5
Loading Previously Saved Configurations
To load previously saved register settings from a JSON file follow these steps.
1. Click the button furthest right from the Auto Read selection drop down.
24
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
Figure 24. Loading Previously Saved Register Values from File on Register Page
2. Select the JSON file with the desired settings and click Open.
4.7
Configuring the EVM Using the Configuration Page
The Sensing Solutions GUI is capable to configure the device in a more intuitive way than through the
direct register values. The Configuration page provides an easy-to-use tool for updating the device
configuration and provides additional information about how the device will perform.
4.7.1
Changing registers through the Configuration Pane
The device configuration must only be changed while STATE_RESET=b1. This mode can be entered
while selecting the appropriate option in the Reset Mode section of the Global Buttons Settings. After
changing the configuration, the Reset Mode must be changed back to Active processing, as shown in
Figure 25.
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
25
Sensing Solutions EVM GUI
www.ti.com
Figure 25. Global Button Settings, Channel Settings on Configuration Page
4.7.2
Selecting the Mode of Operation and Scan Rate
Each channel on the LDC2114 can be configured to operate either in Normal power mode or in Low
power mode. The Global Button Settings menu contains Normal Power Mode Scan Rate and Low Power
Mode Scan Rate selections, in which the desired scan rate chan be chosen for each mode of operation.
Channels can be assigned to either the Normal Power Mode or the Low Power Mode by toggling the Low
Power button in the Channel Settings table for each channel individually.
4.7.3
Interrupt polarity
The LDC interrupt pin polarity can be chosen in the 'Interrupt Polarity' option of the 'Global Buttons
Settings' section.
4.7.4
Base-tracking Increment
The LDC incorporates a baseline tracking algorithm to automatically compensate for any slow change in
the sensor output caused by environmental variations, such as temperature drift. The baseline tracking is
configured independently for Normal Power Mode and Low Power Mode. The increment for this feature is
configured in the Base-tracking Increment option.
4.7.5
LC Resonant Frequency Divider (Pre-scaler)
The LCDIV field sets the oscillation frequency divider. This field should be set as described in section
Programmable button sampling window of the LDC2114 datasheet.
26
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
4.7.6
Channel Settings
In the Channel Settings section, each channel can be configured independently. Each channel has its own
enable bit and its own output pin with configurable polarity. The remaining parameters (Frequency, RP,
Gain, Counter Scale, Sensor Cycle Count, and Fast Tracking Factor) should be configured according to
the characteristics of the attached sensor.
4.7.7
Algorithm Settings
The LDC has four additional algorithms, which can be enabled in the Algorithms Settings section, as
shown in Figure 26.
1. The Max-Win algorithm enables the system to select the button pressed with maximum force when
multiple buttons are pressed at the same time. This feature must be enabled for each applicable
channel individually.
2. The Anti-Common Mode algorithm eliminates false detection when a user presses the panel in certain
positions, which could cause a common-mode change to two or more buttons. This feature must be
enabled for each applicable channel individually.
3. The Anti-Deform algorithm filters changes due to metal deformation in the vicinity of one or more
buttons. Such metal deformation can be accidentally caused by pressing a neighboring button that
does not have sufficient mechanical isolation. This feature must be enabled for each applicable
channel individually.
4. The Anti-twist algorithm reduces the likelihood of false detection when the case is twisted, which could
cause unintended mechanical activation of the buttons, or an opposite reaction in two adjacent buttons.
The anti-twist function can be enabled by configuring the ANTITWST setting to a value larger than 0.
4.7.8
Calculator
The Calculator does not write any registers and is used for information purposes only. It calculates the
time of the sampling window for each channel based on its configured register settings.
Figure 26. Algorithm Settings and Calculator on Configuration Page
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
27
Sensing Solutions EVM GUI
4.7.9
www.ti.com
Status
The Status section, as shown in Figure 27, reports the flags in the STATUS register of the LDC2114.
Figure 27. Device Status
4.8
Streaming Measurement Data
The Sensing Solutions GUI and EVM provide a tool to capture, display, and log measurement data. The
section describes how to use the data measurement tools from the Data Streaming page accessible from
the GUI menu.
4.8.1
Choosing Visible Channels
To select which channel measurements are displayed in the graph, check or uncheck the available
channels shown next to the graph units. Selecting or not selecting the channels only affects the graph and
not the data logged to a file. If a channel is not enabled in the Configuration page it will not appear on the
Data Streaming page. Figure 28 shows a streaming window in which channel 0 and channel 1 are
enabled, and channel 1 shows a button press.
28
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
Figure 28. Select the Data Graph on Data Streaming Page
4.8.2
Logging Data to a File
Follow these steps to log measurement data to a file.
1. Click the button in the upper right under next to Click to Select Log File.
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
29
Sensing Solutions EVM GUI
www.ti.com
Figure 29. Select Log File Button on Data Streaming Page
2. Select a file name and directory to save the data to and then click the Save button.
3. Whenever data streaming is running the data for all channels will be logged to this file. The selected
file is shown next to the button.
4.8.3
Starting and Stopping Data Streaming
To start data streaming click the Start button.
30
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
Figure 30. Start Button on Data Streaming Page
To stop data streaming click the Stop button.
4.8.4
Data Statistics
Click the Show Statistics button to view the measurement statistics. Click the Hide Statistics button to hide
the measurement statistics.
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
31
Sensing Solutions EVM GUI
www.ti.com
Figure 31. Show Statistics Button on Data Streaming Page
Figure 32. Hide Statistics Button on Data Streaming Page
4.8.5
Configuring the Graph
To configure the graph, click the Show Graph Configuration button.
32
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
Figure 33. Show Graph Configuration Button on Data Streaming Page
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
33
Sensing Solutions EVM GUI
www.ti.com
Figure 34. Graph Configuration Button on Data Streaming Page
The configuration window displays the actual frame rate of the graph, the rate at which data is added to
the graph, the vertical scaling, and the sample buffer size. The display rate is the rate at which the graph
updates on the computer display and is not configurable. It is automatically optimized by the GUI.
The New Data Sample Rate allows the user to choose when new data is added to the graph. Selecting
EVM Output Rate will display data on the graph as fast as is available from the EVM. This should not be
confused with the actual sampling rate of the device on the EVM which could be different. The Add
sample to graph every ... ms will add a new sample to the graph at the specified rate.
The Vertical Scaling allows the user to either manually set the minimum and maximum values of the y-axis
on the graph or use auto-scaling. The Autoscale & Lock button scales the graph based on the data of the
current display and then locks those vertical scaling settings.
The Sample Counts allows the user to specify the number of samples displayed on the graph and the total
number of samples stored in the buffer. Please note the buffer size does not affect data logging to a file.
To hide the configuration window, click the Hide Graph Configuration button.
4.8.6
Navigating the Data Streaming Buffer
The Sensing Solutions EVM GUI stores a buffer of data samples and then displays a subset of those
samples. The data buffer can be navigated using the horizontal slider below the graph. To show more
samples on the graph, click either the slider on the left or right side of the green bar and drag it closer or
further from the other slider. The number of samples displayed is shown between the left and right sliders
in the green bar.
34
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
Figure 35. Changing Number of Samples Displayed in Data Graph
By clicking on the green bar and dragging the mouse left or right, previous samples in the buffer can be
displayed.
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
35
Sensing Solutions EVM GUI
www.ti.com
Figure 36. Displaying Previous Data Samples on the Data Streaming Page
4.9
Updating the EVM Firmware
To upload new firmware to the EVM, navigate to the Firmware page from the GUI menu and follow these
steps. The images below show uploading the FDC2214 EVM firmware, but the steps are identical for any
LDC, FDC, or HDC EVM when using their respective firmware files.
1. Click the button to select a TI-TXT firmware file.
36
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
Figure 37. Select TI-TXT File Button on Firmware Upload Page
2. Select the firmware file and click Open.
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
37
Sensing Solutions EVM GUI
www.ti.com
Figure 38. Selecting TI-TXT Firmware File for Upload to EVM
3. Click the Upload Firmware button.
38
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
Sensing Solutions EVM GUI
www.ti.com
Figure 39. Upload Firmware Button on Firmware Upload Page
4. Wait for the firmware to upload. Do NOT disconnect the EVM from the PC at this time! Also note that
the GUI will disconnect from the EVM. The upload process should not take more than one minute. If
the upload fails or lasts longer than one minute, unplug the EVM and restart the GUI.
Figure 40. Firmware Upload in Progress
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
39
Sensing Solutions EVM GUI
www.ti.com
Figure 41. Firmware Upload Success
40
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 EVM REV A Schematics and Layout
www.ti.com
5
LDC2114 EVM REV A Schematics and Layout
Bridge between LDC and MSP430
J4
OUT3/ADDR_3.3
OUT2_3.3
OUT1_3.3
OUT0_3.3
INTB_3.3
LPWRB_3.3
SDA_3.3
SCL_3.3
GND
+3.3V
1
3
5
7
9
11
13
15
17
19
21
OUT3/ADDR_3.3
OUT2_3.3
OUT1_3.3
OUT0_3.3
INTB_3.3
LPWRB_3.3
SDA_3.3
SCL_3.3
2
4
6
8
10
12
14
16
18
20
22
GND
+3.3V
TSW-111-07-G-D
GND
GND2
GND
Layout note: Perforate PCB along this header
Layout note: Route traces between L & R header columns on inner layers
Copyright © 2016, Texas Instruments Incorporated
Figure 42. Bridge between LDC and MSP430
PU/PD for LDC inputs
+1.8V
+1.8V
R33
0
LPWRB
R34
0
R35
0
R36
0
GND
OUT3/ADDR
GND
Design note: Do not populate R34 or R36 for LDC2114
Layout note: move to bottom side
Copyright © 2016, Texas Instruments Incorporated
Figure 43. PU/PD for LDC inputs
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital Converter
Copyright © 2016, Texas Instruments Incorporated
41
LDC2114 EVM REV A Schematics and Layout
www.ti.com
Power: 1.8V LDO for LDC211x
+1.8V
TP2
+3.3V
U5 LP5951MG-1.8/NOPB
1
C16
2.2µF
3
IN
OUT
EN
NC
5
C17
2.2µF
4
2
GND
GND
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 44. Power: 1.8V LDO for LDC211x
Button press LEDs
+3.3V
4
OUT1
R30
1
1
Q1B
OUT2
MMDT3904-7-F
2
4.70k
GND
GND
Design note: 4mA
Design note: OUTPUTS must be configured as active high in device register settings
R31
Q2A
OUT3/ADDR R32
MMDT3904-7-F
4.70k
5
4.70k
Green
6
2
Green
3
6
Q1A
MMDT3904-7-F
5
4.70k
D16
Q2B
MMDT3904-7-F
2
1
R29
D15
Green
1
OUT0
R28
402
4
2
D14
3
2
D13
Green
+3.3V
R27
402
1
R26
402
1
R25
402
+3.3V
2
+3.3V
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 45. Button press LEDs
42
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 EVM REV A Schematics and Layout
www.ti.com
LDC211x
+1.8V
J7
2
1
R37
0
TSW-102-07-G-S
Sensor connectors
COM
C2
1µF
1
2
3
4
5
6
7
8
IN0
IN1
IN2
IN3
Layout note: move C1,C2,C3,C4 close to DUT
C1
0.1µF
GND
GND
C6
47pF
MP1
MP2
C5
47pF
C3
47pF
C4
47pF
J3
IN0
IN1
IN2
IN3
1
3
5
7
2
4
6
8
U1
C1
COM
+1.8V +1.8V
R38
4.7k
R39
4.7k
TP14
TP15
C9
1000pF
VDD
IN0
IN1
IN2
IN3
A3
A2
A1
B1
IN0
IN1
IN2
IN3
COM
D2
COM
SCL
SDA
D3
C3
SCL
SDA
LDC2114YFDR
D4
C4
B4
B3
OUT0
OUT1
OUT2
OUT3/ADDR
TP1
TP9
LPWR
C2
LPWRB
TP12
TP13
INT
B2
INTB
GND
GND
A4
D1
OUT0
OUT1
OUT2
OUT3
TP10
TP11
GND
J6
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 46. LDC2114
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital Converter
Copyright © 2016, Texas Instruments Incorporated
43
LDC2114 EVM REV A Schematics and Layout
www.ti.com
Level shift from 1.8V LDC211x to 3.3V MSP430
+3.3V
+1.8V
U3
C14
0.1µF
GND
3
VCCA
4
INTB_3.3
+3.3V
6
7
5
LPWRB_3.3
8
9
VCCB
C15
0.1µF
2
1
1DIR
1OE
1A1
1A2
1B1
1B2
2DIR
2OE
2A1
2A2
2B1
2B2
13
12
GND
GND
10
11
GND
15
14
INTB
16
LPWRB
SN74AVCH4T245RSVR
GND
Design note: Send INTB LDC2114->MSP430
Design note: Send LPWRB MSP430->LDC2114
Design note: DIR=Hi sends signals from A ports to B ports
+3.3V
+1.8V
U7
C20
0.1µF
+3.3V
4
GND
R16
0
3
GND
OUT0_3.3
OUT1_3.3
6
7
5
R18
0
OUT2_3.3
8
OUT3/ADDR_3.3 9
VCCA
VCCB
1DIR
1OE
1A1
1A2
1B1
1B2
2DIR
2OE
2A1
2A2
2B1
2B2
GND
GND
GND
C21
0.1µF
2
1
GND
OUT0
OUT1
15
14
R17
OUT2
0
Design note: UNPOP for LDC2112
16
13
12
OUT3/ADDR
10
11
SN74AVCH4T245RSVR
GND
Design note: PD for LDC2114, PU for LDC2112
Design note: DIR=Hi sends signals from A ports to B ports
Copyright © 2016, Texas Instruments Incorporated
Figure 47. Level shift from 1.8V LDC211x to 3.3V MSP430
44
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 EVM REV A Schematics and Layout
www.ti.com
Level shift for I2C
+3.3V +3.3V
+3.3V
R11
200k
R12
4.7k
R13
4.7k
U8
SCL
SDA
C1
D1
A2
+1.8V
B1
B2
C22
100pF
SCL1
SDA1
SCL2
SDA2
C2
D2
SCL_3.3
SDA_3.3
EN
VREF1
VREF2
GND
A1
PCA9306YZTR
GND
GND
Design note: MSP430: 3.3V, LDC211x: 1.8V
Design note: VREF2 must be 1.8V, 3.3V, or 5V if VREF1 = 1.8V
Copyright © 2016, Texas Instruments Incorporated
Figure 48. Level shift for I2C
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital Converter
Copyright © 2016, Texas Instruments Incorporated
45
LDC2114 EVM REV A Schematics and Layout
www.ti.com
11
9
7
USB connector
J1
10118193-0001LF
MSP_PUR
5
GND
R6
1.5k
4
ID
GND
D+
R9
1.00M
MSP_DM
10.0
1
VBUS
MSP_DP
10.0
R8
USB-DVBUS
2
D-
R7
USB-D+
3
10
8
6
U4
3
5
R10
33
1
GND
IO1
IO2
NC
VCC
GND
2
4
TPD2E001DRLR
C18
22µF
GND
C19
0.1µF
GND
GND
Layout note: place U4, C18, C19, and D1 next to J1
Copyright © 2016, Texas Instruments Incorporated
Figure 49. USB connector
Power: 3.3V LDO for MSP430
VBUS
L1
U2 LP5951MG-3.3/NOPB
+5V
1
VLS201610ET-100M
C11
10µF
D1
5.6V
MMSZ5232B-7-F
C12
2.2µF
3
IN
OUT
EN
NC
+3.3V
5
C13
2.2µF
4
R5
402
GND
GND
2
1
GND
D2
GND
2
GND
GND
Green
GND
GND1
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 50. Power: 3.3V LDC for MSP430
46
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 EVM REV A Schematics and Layout
www.ti.com
MSP430
U6
OUT3/ADDR_3.3 18
OUT2_3.3
19
OUT1_3.3
20
OUT0_3.3
21
+3.3V +3.3V
R20
4.7k
R21
4.7k
TP3
TP4
P1.6
INTB_3.3
22
23
24
25
SDA2
SCL2
LPWRB_3.3
Tx
Rx
34
35
36
37
38
VUSB
MSP_PUR
Silk: BSL
Layout note: place 100mil apart
S1_LED
S2_LED
Xtalin
Y1
2
4
9
10
57
58
12
13
1
3
G
G
Xtalout
ABM8-24.000MHZ-B2-T
C23
24MHz
18pF
GND
GND
Layout note: Cu cut-out under Y1, C23, C24
MSP_PUR51
55
17
VCORE
C25
0.22µF
+5V
C27
53
VUSB 54
0.47µF
C28
0.22µF
GND
GND
11
15
40
P5.0/A8/VREF+/VEREF+
P5.1/A9/VREF-/VEREFP5.2/XT2IN
P5.3/XT2OUT
P5.4/XIN
P5.5/XOUT
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
PU.0/DP
PU.1/DM
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
PUR
V18
VCORE
RST/NMI/SBWTDIO
TEST/SBWTCK
VBUS
VUSB
QFN PAD
VSSU
AVSS1
AVSS2
DVSS1
DVSS2
AVCC1
DVCC1
DVCC2
41
42
43
44
45
46
47
48
1
2
3
4
5
6
7
8
P2.0
P2.1
+3.3V +3.3V
R14
4.7k
R15
4.7k
SDA_3.3
SCL_3.3
D3
D4
D5
D6
D7
D8
D9
D10
60
61
62
63
JTAG_TDO TP5
JTAG_TDI
JTAG_TMS
JTAG_TCK
64
59
JTAG_RST
JTAG_TEST
65
49
14
56
16
39
TP6
TP7
TP8
+3.3V
R19
33k
C26
2200pF
GND
S1_LED
+3.3V
R23
402
C29
0.1µF
+3.3V
C30
10µF
C31
0.1µF
GND
+3.3V
C32
0.1µF
1
1
R24
1.0k
Super Red
GND
D11
2
D12
2
P4.0/PM_UCB1STE/PM_UCA1CLK
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.6/PM_NONE
P4.7/PM_NONE
26
27
28
29
30
31
32
33
MSP430F5528IRGCT
GND
S2_LED
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
C24
18pF
MSP_DP 50
MSP_DM 52
GND
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
GND
Green
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 51. MSP430
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital Converter
Copyright © 2016, Texas Instruments Incorporated
47
LDC2114 EVM REV A Schematics and Layout
www.ti.com
MSP430 GPIO Breakout connector and General purpose LEDs
J2
JTAG_RST 1
JTAG_TEST 3
P1.6
5
SCL2
7
SDA2
9
P2.0
11
R22
16
15
14
13
12
11
10
9
Rx
Tx
P2.1
GND
1
1
1
1
+3.3V
2
D10
Blue
2
D9
Blue
2
D8
Blue
2
D7
Blue
2
D6
Blue
2
D5
Blue
2
D4
Blue
2
D3
Blue
1
EXB-2HV681JV
680
1
TSW-106-07-G-D
1
1
2
3
4
5
6
7
8
1
D10
D9
D8
D7
D6
D5
D4
D3
+5V
2
4
6
8
10
12
GND
GND
GND
GND
GND
GND
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 52. MSP430 GPIO Breakout connector and General purpose LEDs
48
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 EVM REV A Schematics and Layout
www.ti.com
Figure 53. LDC2114 Layout Top Layer - Overview
Figure 54. LDC2114 Layout Top Layer – Signals and Components
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
49
LDC2114 EVM REV A Schematics and Layout
www.ti.com
Figure 55. LDC2114 Layout MidLayer 1 – Ground Plane
Figure 56. LDC2114 Layout MidLayer 2 – Signals and Power Plane
50
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 EVM REV A Schematics and Layout
www.ti.com
Figure 57. LDC2114 Layout Bottom Layer – Signals Plane
Figure 58. LDC2114 Bottom Layer - Overview
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
51
LDC2114EVM REV A Bill of Materials
6
www.ti.com
LDC2114EVM REV A Bill of Materials
Table 3. BOM for LDC2114EVM rev A
DESIGNATOR
52
QTY.
VALUE
DESCRIPTION
PART NUMBER
MANUFACTURER
C1, C14,
C15,
C19,
C20,
C21,
C29,
C31,
C32
9
0.1uF
CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0402
C1005X7R1H104K050BB
TDK
C2
1
1uF
CAP, CERM, 1 µF, 6.3 V, +/- 20%, X7R, 0402
GRM155R70J105MA12D
MuRata
C3, C4,
C5, C6
4
47pF
CAP, CERM, 47 pF, 50 V, +/- 1%, C0G/NP0,
0603
GRM1885C1H470FA01J
MuRata
C9
1
1000pF
CAP, CERM, 1000 pF, 50 V, +/- 1%, C0G/NP0, GRM1885C1H102FA01J
0603
MuRata
C11,
C30
2
10uF
CAP, CERM, 10 µF, 10 V, +/- 20%, X5R, 0603
C1608X5R1A106M080AC TDK
C12,
C13,
C16,
C17
4
2.2uF
CAP, CERM, 2.2 µF, 10 V, +/- 10%, X5R, 0603
C0603C225K8PACTU
Kemet
C18
1
22uF
CAP, CERM, 22 µF, 10 V, +/- 20%, X5R, 0805
CL21A226MPCLRNC
Samsung ElectroMechanics
C22
1
100pF
CAP, CERM, 100 pF, 50 V, +/- 5%, C0G/NP0,
0402
CC0402JRNPO9BN101
Yageo America
C23,
C24
2
18pF
CAP, CERM, 18 pF, 50 V, +/- 5%, C0G/NP0,
0402
GRM1555C1H180JA01D
MuRata
C25,
C28
2
0.22uF
CAP, CERM, 0.22 µF, 16 V, +/- 10%, X7R,
0402
C1005X7R1C224K050BC
TDK
C26
1
2200pF
CAP, CERM, 2200 pF, 16 V, +/- 10%, X7R,
0402
885012205027
Wurth Elektronik
C27
1
0.47uF
CAP, CERM, 0.47 µF, 10 V, +/- 10%, X7R,
0603
C0603C474K8RACTU
Kemet
D1
1
5.6V
Diode, Zener, 5.6 V, 500 mW, SOD-123
MMSZ5232B-7-F
Diodes Inc.
D2, D11,
D13,
D14,
D15,
D16
6
Green
LED, Green, SMD
LG L29K-G2J1-24-Z
OSRAM
D3,
D5,
D7,
D9,
8
Blue
LED, Blue, SMD
LB Q39G-L2N2-35-1
OSRAM
D12
1
Super
Red
LED, Super Red, SMD
SML-LX0603SRW-TR
Lumex
GND1,
GND2
2
Test Point, Miniature, SMT
5015
Keystone
H4
1
FFC 0.50 TYPE A 8 CKTS LGT 51
0151660075
Molex
J1
1
Connector, Receptacle, USB Micro B, R/A,
SMT
10118193-0001LF
FCI
J3
1
Connector, FFC, Bottom, 0.5mm, 8 Pos, SMT
52892-0833
Molex
L1
1
Inductor, Shielded, Ferrite, 10 µH, 0.4 A, 1.38
ohm, SMD
VLS201610ET-100M
TDK
LBL1
1
Thermal Transfer Printable Labels, 0.650" W x
0.200" H - 10,000 per roll
THT-14-423-10
Brady
Q1, Q2
2
Transistor, Dual NPN, 40 V, 0.2 A, SOT-363
MMDT3904-7-F
Diodes Inc.
D4,
D6,
D8,
D10
10uH
40 V
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114EVM REV A Bill of Materials
www.ti.com
Table 3. BOM for LDC2114EVM rev A (continued)
DESIGNATOR
QTY.
VALUE
DESCRIPTION
PART NUMBER
MANUFACTURER
R5, R23,
R25,
R26,
R27,
R28
6
402
RES, 402, 1%, 0.063 W, 0402
CRCW0402402RFKED
Vishay-Dale
R6
1
1.5k
RES, 1.5 k, 5%, 0.063 W, 0402
CRCW04021K50JNED
Vishay-Dale
R7, R8
2
10.0
RES, 10.0, 1%, 0.063 W, 0402
CRCW040210R0FKED
Vishay-Dale
R9
1
1.00Meg RES, 1.00 M, 1%, 0.063 W, 0402
RC0402FR-071ML
Yageo America
R10
1
33
RES, 33, 5%, 0.1 W, 0603
CRCW060333R0JNEA
Vishay-Dale
R11
1
200k
RES, 200 k, 5%, 0.063 W, 0402
CRCW0402200KJNED
Vishay-Dale
R12,
R13,
R20,
R21,
R38,
R39
6
4.7k
RES, 4.7 k, 5%, 0.063 W, 0402
CRCW04024K70JNED
Vishay-Dale
R17,
R18
2
0
RES, 0, 5%, 0.063 W, 0402
RC0402JR-070RL
Yageo America
R19
1
33k
RES, 33 k, 5%, 0.063 W, 0402
CRCW040233K0JNED
Vishay-Dale
R22
1
680
RES, 680, 5%, 0.0625 W, Resistor Array - 8x1
EXB-2HV681JV
Panasonic
R24
1
1.0k
RES, 1.0 k, 5%, 0.063 W, 0402
CRCW04021K00JNED
Vishay-Dale
R29,
R30,
R31,
R32
4
4.70k
RES, 4.70 k, 1%, 0.1 W, 0402
ERJ-2RKF4701X
Panasonic
R37
1
0
RES, 0, 5%, 0.1 W, 0603
CRCW06030000Z0EA
Vishay-Dale
U1
1
Four-channel Inductive Sensor for Touch-onMetal Application, YFD0016ALAL
LDC2114YFDR
Texas Instruments
U2
1
Micropower, 150mA Low-Dropout CMOS
Voltage Regulator, 5-pin SC-70, Pb-Free
LP5951MG-3.3/NOPB
Texas Instruments
U3, U7
2
4-Bit Dual-Supply Bus Transceiver with
Configurable Voltage Translation and 3-State
Outputs, RSV0016A
SN74AVCH4T245RSVR
Texas Instruments
U4
1
Low-Capacitance + / - 15 kV ESD-Protection
Array for High-Speed Data Interfaces, 2
Channels, -40 to +85 degC, 5-pin SOT (DRL),
Green (RoHS & no Sb/Br)
TPD2E001DRLR
Texas Instruments
U5
1
Micropower, 150mA Low-Dropout CMOS
Voltage Regulator, 5-pin SC-70, Pb-Free
LP5951MG-1.8/NOPB
Texas Instruments
U6
1
25 MHz Mixed Signal Microcontroller with 128
KB Flash, 8192 B SRAM and 47 GPIOs, -40 to
85 degC, 64-pin QFN (RGC), Green (RoHS &
no Sb/Br)
MSP430F5528IRGCT
Texas Instruments
U8
1
DUAL BIDIRECTIONAL I2C BUS AND SMBus
VOLTAGE-LEVEL TRANSLATOR,
YZT0008AABW
PCA9306YZTR
Texas Instruments
Y1
1
Crystal, 24.000MHz, 18pF, SMD
ABM8-24.000MHZ-B2-T
Abracon Corporation
FID1,
FID2,
FID3
0
Fiducial mark. There is nothing to buy or mount. N/A
N/A
H1, H2,
H3
0
ROUND STANDOFF M2 STEEL 5MM
9774050243R
Wurth Elektronik
J2
0
Header, 100mil, 6x2, Gold, TH
TSW-106-07-G-D
Samtec
J4
0
Header, 2.54 mm, 11x2, Gold, TH
TSW-111-07-G-D
Samtec
J6
0
Header, 100mil, 4x2, Gold, TH
TSW-104-07-G-D
Samtec
J7
0
Header, 100mil, 2x1, Gold, TH
TSW-102-07-G-S
Samtec
SNOU144 – December 2016
Submit Documentation Feedback
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital Converter
Copyright © 2016, Texas Instruments Incorporated
53
LDC2114EVM REV A Bill of Materials
www.ti.com
Table 3. BOM for LDC2114EVM rev A (continued)
DESIGNATOR
54
QTY.
VALUE
DESCRIPTION
PART NUMBER
MANUFACTURER
R14,
R15
0
4.7k
RES, 4.7 k, 5%, 0.063 W, 0402
CRCW04024K70JNED
Vishay-Dale
R16,
R33,
R34,
R35,
R36
0
0
RES, 0, 5%, 0.063 W, 0402
RC0402JR-070RL
Yageo America
LDC2114 Evaluation Module for Inductive Touch Inductance to Digital
Converter
Copyright © 2016, Texas Instruments Incorporated
SNOU144 – December 2016
Submit Documentation Feedback
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper sytem design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
