LM10692EVM

SNVU450 – July 2014 LM10692 Evaluation Module User's Guide The LM10692 LLP36 Evaluation Board allows the user to test all the different features of the LM10692. It is designed to interface with a Graphical User Interface (GUI) on a PC through a USB port. A microcontroller is embedded on the board to provide the USB link to I2C communication to the LM10692 and to register the different flags and switches from/to the IC. It also provides input and output voltage sensing for quick monitoring and diagnosis on the GUI. Figure 1. LM10692 Evaluation Board SNVU450 – July 2014 Submit Documentation Feedback LM10692 Evaluation Module User's Guide Copyright © 2014, Texas Instruments Incorporated 1 Quick Power-Up Procedure 1 www.ti.com Quick Power-Up Procedure • • • • • Connect jumper to JP2-JP7 on position 2-3 (between the center and the bottom of the connector) Connect USB connector (if using the GUI or communicating through I2C) Set external power supply to 3.3V, 3A. Connect the positive supply terminal to the center pin of J1. Alternatively, The F pin of any VIN B# connector (J2,J6,J12,J7,J10 or J16) can be used Connect the negative supply terminal to of the GND pin of any VIN B# connector Remark: Alternatively, the basic power-up function can be verified by connecting a jumper between pin1 and pin2 of TP1. This will feed 3.3V power from the USB port (via an LDO) into the IC. The USB connection as well as the LDO are limited in their current handling capabilities hence this is not recommended if the buck outputs of the LM10692 are to be loaded. Remark: The USB connection is not necessary to power up the LM10692 EVM. If the Graphical User Interface is not needed, the USB connector can be left disconnected. 1.1 Power Inputs to the LM10692 • • • • 1.2 Each power connector (VIN B# and BUCK#) has three pins: “F” for the positive power terminal, “GND” for the negative power terminal and “S” for the positive sense terminal in the case of a 4-wire power supply or load. If present, the negative sense terminal of the power supply connects to the “GND” connector as well. By default, all VINs are connected together with 0Ω resistors (R6,R10,R12,R15,R18, R20). If needed, these resistors can be disconnected to decouple the supply of each BUCK. IO_VIN is supplied from VIN by default through R22 (0Ω). IO_VIN can also be powered by BUCK3 output (1.8V default) by unsoldering R22 and connecting a jumper on J21. It can also be supplied through VIO pin on J5 (pin1) (R22 needs to be unsoldered also for this option). Important: Do not connect IO_VIN to more than one power rail at the same time. VIN_MODE Connector The VIN_MODE pin controls the behavior of BUCK1 (bypass mode or buck mode). By default it is left floating which results in BUCK1 in bypass mode. A jumper can be connected on JP1 which will force VIN_MODE to GND. If doing so, an inductor must be connected across the terminals of L1. By default, a 0Ω (typically 10mΩ in practice) resistor is soldered at this location. 1.3 Enables The board has connector to the EN_CPE pin and the EN_AON pin of the LM10692. EN_AON is pulled-up through a 100kΩ resistor to VIN and EN_CPE is pulled up through a 100kΩ resistor to VIN_IO. EN_CPE can also be connected to J5 or to the MCU through JP7. The GUI then provides the user with a toggle switch. 1.4 PG LEDs The board has three LED indicators which show the following signals: • LD1: PG_CPE • LD2: PG_AON • LD3: VIN (simple connection to VIN through a 511Ω resistor) 2 LM10692 Evaluation Module User's Guide Copyright © 2014, Texas Instruments Incorporated SNVU450 – July 2014 Submit Documentation Feedback GUI www.ti.com 2 GUI The following screen capture shows the main screen of the GUI. Figure 2. LM10692 Evaluation GUI main screen When the USB cable is connected, the MCU embedded on the EVM gets powered and the indicator on the bottom right turns green and reads "ready" indicating that communication is established with the MCU. The GUI includes the following features: • Ability to control each output voltage through I2C • Ability to enable and disable any BUCK through I2C Note that BUCK1 is internally tied to BUCK6 and that it will shutdown if BUCK6 is turned OFF. Similarly BUCK4 will shutdown if BUCK1 is down • Monitoring of the PFAIL, PG_AON and PG_CPE signals through sensing by MCU (on the PCB, JP5,JP6 and JP7 need to carry a jumper between pin2&3 for this function to work) • Monitoring of the individual internal PG flags of each BUCK through I2C polling (on the PCB, JP3 and JP4 need to carry a jumper between pin 2&3 for this function to work) • Monitoring of the actual output voltages through sensing by MCU • Ability to pull the EN_CPE line high or low (on the PCB, JP2 needs to carry a jumper between pin 2&3 for this function to work) • Ability to read and write data to I2C directly (on the PCB, JP3 and JP4 need to carry a jumper between pin 2&3 for this function to work) SNVU450 – July 2014 Submit Documentation Feedback LM10692 Evaluation Module User's Guide Copyright © 2014, Texas Instruments Incorporated 3 Schematics 3 www.ti.com Schematics R1 0 CONNECTOR R6 2 PG_AON 1 1 3 3 VIN R22 DNS DNP 0 VIN Q2 1 Q3 1 PG_AON DNP Q4 1 2 PG_CPE VIN_B2 0 DNP DNS J2 2 DNS 1 2 3 VIN_B6 2 VIN 0 3 VIN_B4 R20 BUCK3 VIO R16 Q1 1 VIO R11 DNS DNP 0 VCC3V3 VCC3V3 VIN 0 0 0 R7 DNS DNP 0 VCC3.3_D R14 VIN_B5 R18 LD2 Green 2 LD3 Green VIN_B6 R15 LD1 Green DNS R9 DNP 10.0k DNS PG_CPE VIN_B3 0 0 1 2 R4 511 2 R10 R12 J21 R3 511 R8 DNP 10.0k 2 3 2 1 VCC3V3 R2 511 3 0 DC IN J1 VIN_B1 1 VIN SH-J21 VIO NC2 BUCK6 VIO SH-JP2 SH-JP4 SH-JP5 SH-JP6 SCL_USB SDA_USB PFAIL_USB PG_AON_USB J5 SH-JP7 PG_CPE_USB The placement of the jumpers above reffer to the default position of jumpera on connectors JP2-JP7 AGND 2 JP2 2 JP3 2 JP4 2 JP5 2 JP6 2 JP7 NC34 NC28 PG_AON 25 BUCK2 C28 22µF C27 22µF C10 22µF R29 PGND C9 4.7µF PGND FB_B2 19 SW_B2 18 VIN_B2 23 VIN_B1 1 2 3 C13 10µF C26 22µF PGND 21 RL1 C25 22µF C14 22µF SW_B1 22 0.01 R32 FB_B1 24 0 PGND 1 2 3 PG_CPE FB_B2 32 PGND AGND VIN_B1 33 35 C40 22µF C41 22µF PGND 8 BUCK5 R30 FB_B5 C7 4.7µF 0 BUCK5 13 C8 22µF C12 22µF SW_B4 VIN_B1 VIN_B4 C43 22µF C35 22µF C36 22µF 16 C5 4.7µF VIN_B3 L3 15 SW_B3 PGND J10 1 2 3 PGND PGND J13 1 2 3 PGND C6 PGND 22µF C30 22µF BUCK3 C29 22µF IFSC0806AZER2R2M01 BUCK3 R28 FB_B3 17 FB_B3 VIN_B2 BUCK2 C37 22µF GND PGND AGND C33 22µF BUCK4 C34 22µF C11 10µF 14 FB_B1 C32 22µF PGND MAMK2520T1R0M 12 PGND C31 22µF BUCK4 0 L4 11 FB_B4 PGND PGND J9 1 2 3 R31 SW_B2 SW_B4 BUCK3 TSW-103-07-G-S SW_B5 IFSC0806AZER2R2M01 FB_B4 PGND J8 1 2 3 L5 7 VIN_B2 J7 1 2 3 VIN_B3 VIN_B5 C42 22µF BUCK5 SW_B5 EN_AON EN_CPE C39 22µF C2 10µF PGND VIN_B5 SW_B3 EN_AON EN_CPE PGND 9 VIN_B5 SW_B1 BUCK6 C38 22µF C3 22µF VIN_B6 DAP 4 VIN_B3 PGND Buck1 Feedback trace should be able to handle 2.5A as this buck has BYPASS function. J16 PG_AON BUCK6 6 DAP PGND PGND J6 1 2 3 L6 SW_B6 MAMK2520T1R0M VIN_B6 VIN_MODE NC NC 0 FB_B6 5 SW_B6 VIN_B4 BUCK4 PGND 2 3 NC FB_B6 BUCK1 BUCK1 PGND AVIN NC SCL SDA PFAIL IO_VIN FB_B5 IFSC0806AZER2R2M01 VIN_B4 J15 20 0 L2 J12 1 34 28 26 PG_CPE BUCK2 1 2 3 31 36 29 30 10 27 VIN NC36 SCL SDA EN_CPE PFAIL IO_VIN VIN_MODE PGND J3 1 2 3 R27 U1 2.2µF 1 3 1 3 1 3 1 3 1 3 1 3 EN_CPE_USB 1 2 3 4 5 6 7 8 SH-JP3 C1 LM10692_LLP36 3 2 1 R23 R24 R25 R26 R53 1.50k 1.50k 10.0k 10.0k 10.0k 0 LM10692RMY DNS - DO NOT STUFF AGND VIN_MODE J17 1 2 3 GND BUCK1 TL1 1 2 3 PGND AGND Track Link - net tie PGND GND JP1 TSW-103-07-G-S VIN VIO PGND MH1 R17 100k J20 1 2 EN_AON EN_CPE R19 LLP_SOC 100k Figure 3. Board Schematic (1/2) VCC3V3 U2 FID1 H3 H4 DNP DNP NY PMS 440 0025 PH C19 10µF VCC3.3_D VCC3.3_D 5 R35 18.0k NY PMS 440 0025 PH 4 2 OUT 1 6 IN IN ADJ GND 3 7 NC DAP C20 10µF LP38691SD-ADJ PFAIL_USB R36 10.0k EN_CPE_USB PG_AON_USB SDA_USB 21 10.0k R44 20 10.0k R45 19 10.0k 32 31 30 28 29 D+ P1.6 D- P1.7 VDD P2.0 REGIN P2.6 P2.7 11 R51 P2.5 P2.1 12 17 10.0k VIN J18 VCC5V 1 2 3 4 5 600 ohm 1 2 3 U4 4 1 5 VCC3.3_D 2 3 18 13 10.0k R48 P0.2 P1.5 R47 BUCK1 P0.3 P0.4 P0.5 P0.6 P0.7 P1.0 GND RST_C2CK 10.0k R46 BUCK4 P0.0 P1.4 P2.4 ZZ7 Assembly Note Shunt SH_JP2 on JP7 pin 3&2 10.0k R43 P1.3 P2.3 ZZ6 Assembly Note Shunt SH_JP3 on JP3 pin 1&2 ZZ10 Assembly Note Shunt SH_JP5 on JP5 pin 3&2 ZZ11 Assembly Note Shunt SH_J21 on J21pin 1&2 BUCK5 22 P3.0_C2D ZZ4 Assembly Note These assemblies must comply with workmanship standards IPC-A-610 Class 2., unless otherwise specified. 23 10.0k R42 P0.1 VBUS 6 C21 4.7µF C22 0.1µF C23 4.7µF C24 0.1µF IO1 VCC IO2 IO4 GND IO3 6 5 4 TPD4E004DRY 7 8 VCC5V 9 10.0k R41 P1.2 10 BUCK2 ZZ3 Assembly Note BUCK6 These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable. ZZ9 Assembly Note Shunt SH_JP6 on JP6 pin 3&2 P1.1 10.0k R40 ZZ2 Assembly Note These assemblies are ESD sensitive, ESD precautions shall be observed. ZZ5 Assembly Note Shunt SH_JP4 on JP4 pin 1&2 24 FB1 U3 C8051F320-GQ R38 10.0k R39 ZZ8 Assembly Note Shunt SH_JP7 on JP7 pin 3&2 27 10.0k 26 BUCK3 FID3 P2.2 NY PMS 440 0025 PH 14 NY PMS 440 0025 PH FID2 TP2 SCL_USB R37 15 DNP 25 H8 DNP 16 H7 VCC3.3_D 18.0k R49 R52 1.50k 10.0k R50 10.0k 3 2 1 PG_CPE_USB J19 PCB LOGO Texas Instruments Figure 4. Board Schematic (2/2) 4 LM10692 Evaluation Module User's Guide Copyright © 2014, Texas Instruments Incorporated SNVU450 – July 2014 Submit Documentation Feedback Bill of Materials www.ti.com 4 Bill of Materials Designator Quantity Value Description C1 1 2.2uF CAP, CERM, 2.2uF, 10V, +/- 603 10%, X6S, 0603 GRM188C81A22 MuRata 5KE34D C2, C11, C13 3 10uF CAP, CERM, 10uF, 6.3V, +/- 805 20%, X5R, 0805 GRM21BR60J10 MuRata 6ME19L C3, C6, C8, C10, C12 5 22uF CAP, CERM, 22uF, 4V, +/20%, X5R, 0603 603 GRM188R60G2 26MEA0L C5, C7, C9, C21, C23 5 4.7uF CAP, CERM, 4.7uF, 6.3V, +/-10%, X5R, 0603 603 GRM188R60J47 MuRata 5KE19D 22uF CAP, CERM, 22uF, 6.3V, +/- 805 20%, X5R, 0805 GRM21BR60J22 MuRata 6ME39L C14, C28, C32, C36, C40, C25, C29, C33, C37, C41, C26, C30, C34, C38, C42, C27, 20 C31, C35, C39, C43 Package Reference PartNumber Manufacturer MuRata C19, C20 2 10uF CAP, CERM, 10uF, 10V, +/20%, X5R, 0603 603 GRM188R61A10 MuRata 6ME69 C22, C24 2 0.1uF CAP CER 0.1UF 10V 10% X5R 0402 402 CC0402KRX5R6 YAGAO BB104 FB1 1 FERRITE BEAD 600 OHM 2.0A 080 H3, H4, H7, H8 4 screw, Round, #4-40 x 1/4, Nylon, Philips panhead J1, J2, J3, J6, J7, J8, J9, J10, J12, J13, J15, J16, J17, J19, JP1, JP2, JP3, JP4, JP5, JP6, JP7 21 J5 742792040 Wurth Screw NY PMS 440 0025 PH B and F Fastener Supply Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator 3x1 Header TSW-103-07-GS Samtec 1 Header, TH, 100mil, 8x1, Gold plated, 230 mil above insulator 8x1 Header TSW-108-07-GS Samtec, Inc. J18 1 Connector, Receptacle, Mini- USB Mini Type USB Type B, R/A, Top B Mount SMT 1734035-2 TE Connectivity J20, J21 2 Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator TSW-102-07-GS Samtec L2, L3, L5 3 Inductor, Shielded, Ferrite, 2.2uH, 1.3A, 0.236 ohm, SMD IFSC0806AZER 2R2M01 Vishay L4, L6 2 1uH Inductor, Wirewound, Ferrite, 2.5x1x2mm 1uH, 2.7A, 0.059 ohm, SMD MAMK2520T1R 0M Taiyo Yuden LD1, LD2, LD3 3 Green LED, Green, SMD LED, GREEN, 0603 SMLLX0603GW-TR Lumex MH1 1 Q1, Q2 2 25V MOSFET, N-CH, 25V, 0.68A, SOT-23 SOT-23 FDV303N Fairchild Semiconductor R1, R14, R16, R22, 10 R27, R28, R29, R30, R31, R32 0 RES, 0 ohm, 5%, 0.1W, 0603 603 MCR03EZPJ000 Rohm R2, R3, R4 3 511 RES, 511 ohm, 1%, 0.1W, 0603 603 CRCW0603511 RFKEA R6, R10, R12, R15, R18, R20 6 0 RES, 0 ohm, 5%, 0.125W, 0805 805 MCR10EZHJ000 Rohm R17, R19 2 100k RES, 100k ohm, 1%, 0.063W, 0402 402 CRCW0402100 KFKED Vishay-Dale R23, R24, R49 3 1.50k RES, 1.50k ohm, 1%, 0.1W, 0603 603 CRCW06031K5 0FKEA Vishay-Dale 2x1 Header SNVU450 – July 2014 Submit Documentation Feedback Vishay-Dale LM10692 Evaluation Module User's Guide Copyright © 2014, Texas Instruments Incorporated 5 Bill of Materials www.ti.com Designator R25, R38, R42, R46, R52, 6 R26, R39, R43, R47, R53 R36, R40, R44, R48, Quantity R37, 18 R41, R45, R50, Value Description Package Reference PartNumber Manufacturer 10.0k RES, 10.0k ohm, 1%, 0.1W, 0603 603 CRCW060310K 0FKEA Vishay-Dale R35, R51 2 18.0k RES, 18.0k ohm, 1%, 0.1W, 0603 603 RC0603FR0718KL Yageo America RL1 1 0.01 RES, 0.01 ohm, 1%, 0.25W, 0805 805 WSL0805R0100 FEA18 Vishay-Dale TP2 1 CONN HEADER VERT .100 1POS 15AU 87224-1 TE Connectivity U1 1 LM10692RMY, RMY0036A RMY0036A LM10692RMY Texas Instruments U2 1 500mA Low Dropout CMOS Linear Regulators with Adjustable Output Stable with Ceramic Output Capacitors, 6-pin LLP, PbFree SDE06A LP38691SDADJ/NOPB Texas Instruments U3 1 IC 8051 MCU 16K FLASH, 32LQFP LQFP-32 C8051F320-GQ Silicon Laboratories U4 1 4-CHANNEL ESDPROTECTION ARRAY FOR HIGH-SPEED DATA INTERFACES, DRY006A DRY0006A TPD4E004DRY Texas Instruments Q3, Q4 0 25V MOSFET, N-CH, 25V, 0.68A, SOT-23 SOT-23 FDV303N Fairchild Semiconductor R7, R11 0 0 RES, 0 ohm, 5%, 0.1W, 0603 603 MCR03EZPJ000 Rohm R8, R9 0 10.0k RES, 10.0k ohm, 1%, 0.1W, 0603 603 CRCW060310K 0FKEA LM10692 Evaluation Module User's Guide Copyright © 2014, Texas Instruments Incorporated Vishay-Dale SNVU450 – July 2014 Submit Documentation Feedback SNVU450 – July 2014 Submit Documentation Feedback LM10692 Evaluation Module User's Guide Copyright © 2014, Texas Instruments Incorporated 7 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated spacer IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated