LM1117DTX-5.0/NOPB

LM1117 SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 LM1117 800-mA, Low-Dropout Linear Regulator 1 Features 3 Description • • The LM1117 is a low dropout voltage regulator with a dropout of 1.2 V at 800 mA of load current. • • • • • • For a newer drop-in alternative, see the TLV1117 Available in 1.8 V, 2.5 V, 3.3 V, 5 V, and adjustable versions Space-saving SOT-223 and WSON packages Current limiting and thermal protection Output current: 800 mA Line regulation: 0.2% (maximum) Load regulation: 0.4% (maximum) Temperature range: – LM1117: 0°C to 125°C – LM1117I: −40°C to 125°C 2 Applications • • • • • AC drive power stage modules Merchant network and server PSU Industrial AC/DC Ultrasound scanners Servo drive control modules The LM1117 is available in an adjustable version, which can set the output voltage from 1.25 to 13.8 V with only two external resistors. In addition, it is available in five fixed voltages, 1.8 V, 2.5 V, 3.3 V, and 5 V. The LM1117 offers current limiting and thermal shutdown. Its circuit includes a Zener trimmed bandgap reference to assure output voltage accuracy to within ±1%. A minimum of 10-µF tantalum capacitor is required at the output to improve the transient response and stability. Device Information(1) PART NUMBER LM1117, LM1117I (1) PACKAGE BODY SIZE (NOM) SOT-223 (4) 6.50 mm × 3.50 mm TO-220 (3) 14.986 mm × 10.16 mm TO-252 (3) 6.58 mm × 6.10 mm WSON (8) 4.00 mm × 4.00 mm TO-263 (3) 10.18 mm × 8.41 mm For all available packages, see the orderable addendum at the end of the data sheet. Adjustable Output Regulator An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Device Comparison Table...............................................3 6 Pin Configuration and Functions...................................3 7 Specifications.................................................................. 4 7.1 Absolute Maximum Ratings........................................ 4 7.2 ESD Ratings............................................................... 4 7.3 Recommended Operating Conditions.........................4 7.4 Thermal Information....................................................4 7.5 LM1117 Electrical Characteristics............................... 5 7.6 LM1117I Electrical Characteristics.............................. 7 7.7 Typical Characteristics................................................ 9 8 Detailed Description...................................................... 11 8.1 Overview................................................................... 11 8.2 Functional Block Diagram......................................... 11 8.3 Feature Description...................................................11 8.4 Device Functional Modes..........................................13 9 Application and Implementation.................................. 14 9.1 Application Information............................................. 14 9.2 Typical Application.................................................... 14 9.3 System Examples..................................................... 16 10 Power Supply Recommendations..............................17 11 Layout........................................................................... 18 11.1 Layout Guidelines................................................... 18 11.2 Layout Example...................................................... 22 12 Device and Documentation Support..........................23 12.1 Documentation Support.......................................... 23 12.2 Receiving Notification of Documentation Updates..23 12.3 Support Resources................................................. 23 12.4 Trademarks............................................................. 23 12.5 Electrostatic Discharge Caution..............................23 12.6 Glossary..................................................................23 13 Mechanical, Packaging, and Orderable Information.................................................................... 23 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision O (June 2020) to Revision P (July 2022) Page • Updated the numbering format for tables, figures, and cross-references throughout the document..................1 Changes from Revision N (January 2016) to Revision O (June 2020) Page • Added alternative device Features bullet ...........................................................................................................1 • Changed Applications section ........................................................................................................................... 1 • Added Device Comparison Table ...................................................................................................................... 3 • Added Related Documentation section............................................................................................................ 23 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 5 Device Comparison Table IOUT PARAMETER LM1117 TLV1117 UNIT Input voltage range (max) 15 15 V Load regulation accuracy 1.6 1.6 % PSRR (120 Hz) 75 75 dB Recommended operating temperature 0 – 125 -40 – 125 °C SOT-223 TJA 61.6 104.3 °C/W TO-220 TJA 23.8 30.1 °C/W TO-252 TJA 45.1 50.9 °C/W TO-263 TJA 41.3 27.5 °C/W WSON-8 TJA 39.3 38.3 °C/W 800 mA 6 Pin Configuration and Functions Figure 6-1. 4-Pin SOT DCY Package (Top View) Figure 6-3. 3-Pin TO-263 KTT Package (Top View) ADJ/GND 1 VIN 2 Figure 6-2. 3-Pin TO-220 NDE Package (Top View) Figure 6-4. 3-Pin TO-252 NDP Package (Top View) 8 NOT CONNECTED 7 VOUT VOUT VIN 3 6 VOUT VIN 4 5 VOUT When using the WSON package pins 2, 3, and 4 must be connected together and pins 5, 6, and 7 must be connected together. Figure 6-5. 8-Pin WSON NGN Package (Top View) Table 6-1. Pin Functions PIN NAME I/O DESCRIPTION TO-252 WSON SOT-223 TO-263 TO-220 ADJ/GND 1 1 1 1 1 — VIN 3 2, 3, 4 3 3 3 I Input voltage pin for the regulator 2 , TAB 5, 6, 7, TAB 2, 4 2, TAB 2, TAB O Output voltage pin for the regulator VOUT Adjust pin for adjustable output option. Ground pin for fixed output option. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 3 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN Maximum input voltage (VIN to GND) Power dissipation(2) Storage temperature, Tstg (2) UNIT 20 V Internally Limited Junction temperature (TJ)(2) (1) MAX –65 150 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB. 7.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) VALUE UNIT ±2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000 V may actually have higher performance. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX 15 V LM1117 0 125 °C LM1117I −40 125 Input voltage (VIN to GND) Junction temperature (TJ)(1) (1) UNIT The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB. 7.4 Thermal Information LM1117, LM1117I THERMAL METRIC(1) NDE (TO-220) NDP (TO-252) NGN (WSON) KTT (TO-263) UNIT 4 PINS 3 PINS 3 PINS 8 PINS 3 PINS RθJA Junction-to-ambient thermal resistance 61.6 23.8 45.1 39.3 41.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 42.5 16.6 52.1 31.4 44.1 °C/W RθJB Junction-to-board thermal resistance 10.4 5.3 29.8 16.5 24.2 °C/W ψJT Junction-to-top characterization parameter 2.9 3.1 4.5 0.3 10.9 °C/W ψJB Junction-to-board characterization parameter 10.3 5.3 29.4 16.7 23.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — 1.5 1.3 5.6 1.3 °C/W (1) 4 DCY (SOT-223) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 7.5 LM1117 Electrical Characteristics unless otherwise specified, TJ = 25°C PARAMETER TEST CONDITIONS LM1117-ADJ IOUT = 10 mA, VIN – VOUT = 2 V, TJ = 25°C VREF Reference voltage LM1117-ADJ 10 mA ≤ IOUT ≤ 800 mA, 1.4 V ≤ VIN – VOUT ≤ 10 V over the junction temperature range 0°C to 125°C VOUT Output voltage over the junction temperature range 0°C to 125°C over the junction temperature range 0°C to 125°C ΔVOUT Line regulation(3) over the junction temperature range 0°C to 125°C LM1117-ADJ IOUT = 10mA, 1.5V ≤ VIN-VOUT ≤ 13.75V TJ = 25°C over the junction temperature range 0°C to 125°C TJ = 25°C Load regulation(3) LM1117-2.5 VIN = 3.9 V, 0 ≤ IOUT ≤ 800 mA LM1117-3.3 VIN = 4.75 V, 0 ≤ IOUT ≤ 800 mA LM1117-5.0 VIN = 6.5 V, 0 ≤ IOUT ≤ 800 mA 1.782 TJ = 25°C 1.8 1.746 2.5 2.45 3.3 3.235 over the junction temperature range 0°C to 125°C 3.333 V 3.365 5 5.05 5 4.9 V 5.1 0.035% 0.2% 1 6 mV 1 6 mV 1 6 mV 1 10 mV 0.2% 0.4% 1 10 mV 1 10 mV 1 over the junction temperature range 0°C to 125°C TJ = 25°C V 3.3 over the junction temperature range 0°C to 125°C TJ = 25°C 2.525 2.55 over the junction temperature range 0°C to 125°C TJ = 25°C V 2.5 over the junction temperature range 0°C to 125°C TJ = 25°C 1.818 1.854 over the junction temperature range 0°C to 125°C TJ = 25°C V 1.8 2.475 UNIT 1.27 over the junction temperature range 0°C to 125°C TJ = 25°C LM1117-ADJ VIN – VOUT = 3 V, 10 ≤ IOUT ≤ 800 over the junction temperature range mA 0°C to 125°C ΔVOUT 1.225 over the junction temperature range 0°C to 125°C TJ = 25°C LM1117-3.3 IOUT = 0 mA, 4.75 V ≤ VIN ≤ 15 V over the junction temperature range 0°C to 125°C LM1117-1.8 VIN = 3.2 V, 0 ≤ IOUT ≤ 800 mA 1.25 4.95 TJ = 25°C LM1117-5.0 IOUT = 0 mA, 6.5 V ≤ VIN ≤ 15 V 1.262 TJ = 25°C LM1117-5.0 0 ≤ IOUT ≤ 800 mA, 6.5 V ≤ VIN ≤ 12 V LM1117-2.5 IOUT = 0 mA, 3.9 V ≤ VIN ≤ 10 V 1.25 3.267 LM1117-5.0 IOUT = 10 mA, VIN = 7 V, TJ = 25°C LM1117-1.8 IOUT = 0 mA, 3.2 V ≤ VIN ≤ 10 V 1.238 TJ = 25°C LM1117-3.3 IOUT = 10 mA, VIN = 5 V TJ = 25°C LM1117-3.3 0 ≤ IOUT ≤ 800 mA, 4.75 V ≤ VIN ≤ 10 V MAX(1) TJ = 25°C LM1117-2.5 IOUT = 10 mA, VIN = 4.5 V, TJ = 25°C LM1117-2.5 0 ≤ IOUT ≤ 800 mA, 3.9 V ≤ VIN ≤ 10 V TYP(2) TJ = 25°C LM1117-1.8 IOUT = 10 mA, VIN = 3.8 V, TJ = 25°C LM1117-1.8 0 ≤ IOUT ≤ 800 mA, 3.2 V ≤ VIN ≤ 10 V MIN(1) 10 mV 1 15 mV Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 5 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 unless otherwise specified, TJ = 25°C PARAMETER TEST CONDITIONS MIN(1) TJ = 25°C IOUT = 100 mA VIN – V OUT IOUT = 500 mA 1.2 1.25 TJ = 25°C ILIMIT Current limit Minimum load current(5) 800 10 10 TJ = 25°C 10 TJ = 25°C 10 TA = 25°C, 30-ms pulse 0.01 Adjust pin current change TJ = 25°C (5) 6 mA mA %/W dB 60 120 μA 0.2 over the junction temperature range 0°C to 125°C Temperature stability (1) (2) (3) (4) 0.1 60 TJ = 25°C mA 75 over the junction temperature range 0°C to 125°C 10 ≤ IOUT ≤ 80 0mA, 1.4 V ≤ VIN – VOUT ≤ 10 V mA 5 over the junction temperature range 0°C to 125°C TJ = 25°C Adjust pin current mA 5 over the junction temperature range 0°C to 125°C fRIPPLE = 1 20 Hz, VIN – VOUT = 3 over the junction temperature range V VRIPPLE = 1 VPP 0°C to 125°C mA 5 over the junction temperature range 0°C to 125°C LM1117-5.0 VIN ≤ 15 V V 5 TJ = 25°C LM1117-3.3 VIN ≤ 15 V 1500 5 over the junction temperature range 0°C to 125°C Quiescent current V 1.7 TJ = 25°C LM1117-2.5 VIN ≤ 15 V Ripple regulation 1200 over the junction temperature range 0°C to 125°C LM1117-1.8 VIN ≤ 15 V Thermal regulation 1.3 TJ = 25°C LM1117-ADJ VIN = 15 V V 1.2 over the junction temperature range 0°C to 125°C VIN – VOUT = 5 V, TJ = 25°C UNIT 1.15 over the junction temperature range 0°C to 125°C IOUT = 800 mA MAX(1) 1.1 over the junction temperature range 0°C to 125°C TJ = 25°C Dropout voltage(4) TYP(2) 5 µA 0.5% Long term stability TA = 125°C, 1000 hours RMS output noise (% of VOUT), 10 Hz ≤ f ≤ 10 kHz 0.3% 0.003% All limits are ensured by testing or statistical analysis. Typical Values represent the most likely parametric normal. Load and line regulation are measured at constant junction room temperature. The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V. The minimum output current required to maintain regulation. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 7.6 LM1117I Electrical Characteristics unless otherwise specified, TJ = 25°C TEST CONDITIONS MIN(1) TYP(2) MAX(1) LM1117I-ADJ IOUT = 10 mA, VIN – VOUT = 2 V, TJ = 25°C 1.238 1.25 1.262 PARAMETER VREF Reference voltage LM1117I-ADJ 10 mA ≤ IOUT ≤ 800 mA, 1.4 V ≤ VIN – VOUT ≤ 10 V TJ = 25°C over the junction temperature range – 40°C to 125°C LM1117I-3.3 IOUT = 10 mA, VIN = 5 V, TJ = 25°C VOUT Output voltage LM1117I-5.0 IOUT = 10 mA, VIN = 7 V, TJ = 25°C LM1117I-ADJ IOUT = 10 mA, 1.5 V ≤ VIN – VOUT ≤ 13.75 V TJ = 25°C ΔVOUT Line regulation(3) LM1117I-ADJ VIN – VOUT = 3 V, 10 ≤ IOUT ≤ 800 mA ΔVOUT Load LM1117I-3.3 VIN = 4.75 V, 0 ≤ IOUT ≤ 800 mA 4.8 5.05 V 5.2 0.035% 0.3% 1 10 mV 1 15 mV 0.2% 0.5% 1 over the junction temperature range – 40°C to 125°C over the junction temperature range – 40°C to 125°C V 5 over the junction temperature range – 40°C to 125°C TJ = 25°C LM1117I-5.0 VIN = 6.5 V, 0 ≤ IOUT ≤ 800 mA 5 over the junction temperature range – 40°C to 125°C TJ = 25°C 3.333 3.432 over the junction temperature range – 40°C to 125°C TJ = 25°C regulation(3) 3.3 over the junction temperature range – 40°C to 125°C TJ = 25°C LM1117I-5.0 IOUT = 0 mA, 6.5 V ≤ VIN ≤ 15 V 1.29 3.168 TJ = 25°C over the junction temperature range – 40°C to 125°C V 3.3 4.95 TJ = 25°C LM1117I-3.3 IOUT = 0 mA, 4.75 V ≤ VIN ≤ 15 V 1.2 3.267 TJ = 25°C LM1117I-3.3 0 ≤ IOUT ≤ 800 mA, 4.75 V ≤ VIN ≤ 10 over the junction temperature range – V 40°C to 125°C LM1117I-5.0 0 ≤ IOUT ≤ 800 mA, 6.5 V ≤ VIN ≤ 12 V 1.25 UNIT 15 mV 1 20 mV Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 7 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 unless otherwise specified, TJ = 25°C PARAMETER TEST CONDITIONS MIN(1) TJ = 25°C 1.3 TJ = 25°C VIN-V OUT Dropout 1.35 TJ = 25°C ILIMIT Current limit VIN – VOUT = 5 V, TJ = 25°C Minimum load current(5) LM1117I-ADJ VIN = 15 V 1.4 800 TJ = 25°C 15 TA = 25°C, 30-ms pulse Ripple regulation fRIPPLE = 120 Hz, VIN – VOUT = 3 V VRIPPLE = 1 VPP 15 0.01 TJ = 25°C over the junction temperature range – 40°C to 125°C TJ = 25°C 10 ≤ IOUT ≤ 800 mA, 1.4 V ≤ VIN – VOUT ≤ 10 V (5) 8 mA mA mA %/W 75 dB 60 over the junction temperature range –40°C to 125°C 120 μA 0.2 over the junction temperature range – 40°C to 125°C Temperature stability (1) (2) (3) (4) 0.1 60 TJ = 25°C Adjust pin current change mA 5 over the junction temperature range – 40°C to 125°C Thermal regulation V 5 TJ = 25°C LM1117I-5.0 VIN ≤ 15 V 1500 5 over the junction temperature range – 40°C to 125°C Quiescent current V 1.7 TJ = 25°C Adjust pin current 1200 over the junction temperature range – 40°C to 125°C LM1117I-3.3 VIN ≤ 15 V V 1.2 over the junction temperature range – 40°C to 125°C IOUT = 800 mA UNIT 1.15 over the junction temperature range – 40°C to 125°C IOUT = 500 mA MAX(1) 1.1 over the junction temperature range – 40°C to 125°C IOUT = 100 mA voltage(4) TYP(2) 10 µA 0.5% Long term stability TA = 125°C, 1000 hours RMS output noise (% of VOUT), 10 Hz ≤ f ≤ 10 kHz 0.3% 0.003% All limits are ensured by testing or statistical analysis. Typical Values represent the most likely parametric normal. Load and line regulation are measured at constant junction room temperature. The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V. The minimum output current required to maintain regulation. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 7.7 Typical Characteristics Figure 7-1. Dropout Voltage (VIN – VOUT) Figure 7-2. Short-Circuit Current Figure 7-3. Load Regulation Figure 7-4. LM1117-ADJ Ripple Rejection Figure 7-5. LM1117-ADJ Ripple Rejection vs Current Figure 7-6. Temperature Stability Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 9 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 Figure 7-7. Adjust Pin Current Figure 7-8. LM1117-5.0 Load Transient Response Figure 7-9. LM1117-5.0 Line Transient Response 10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 8 Detailed Description 8.1 Overview The LM1117 adjustable version develops a 1.25-V reference voltage, VREF, between the output and the adjust pin. As shown in Figure 8-1, this voltage is applied across resistor R1 to generate a constant current I1. The current IADJ from the adjust pin can introduce error to the output, but since it is very small (60 µA) compared to the I1 and very constant with line and load changes, the error can be ignored. The constant current I1 then flows through the output set resistor R2 and sets the output voltage to the desired level. For fixed voltage devices, R1 and R2 are integrated inside the devices. Figure 8-1. Basic Adjustable Regulator 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Load Regulation The LM1117 regulates the voltage that appears between its output and ground pins, or between its output and adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the best load regulation, a few precautions are needed. Figure 8-2 shows a typical application using a fixed output regulator. The Rt1 and Rt2 are the line resistances. It is obvious that the VLOAD is less than the VOUT by the sum of the voltage drops along the line resistances. In this case, the load regulation seen at the RLOAD would be degraded from the data sheet specification. To improve this, the load should be tied directly to the output terminal on the positive side and directly tied to the ground terminal on the negative side. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 11 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 Figure 8-2. Typical Application Using Fixed Output Regulator When the adjustable regulator is used (Figure 8-3), the best performance is obtained with the positive side of the resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with 0.05Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05Ω x IL. If R1 (=125Ω) is connected near the load, the effective line resistance will be 0.05Ω (1+R2/R1) or in this case, it is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to provide remote ground sensing and improve load regulation. Figure 8-3. Best Load Regulation Using Adjustable Output Regulator 12 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 8.4 Device Functional Modes 8.4.1 Protection Diodes Under normal operation, the LM1117 regulators do not need any protection diode. With the adjustable device, the internal resistance between the adjust and output terminals limits the current. No diode is needed to divert the current around the regulator even with capacitor on the adjust terminal. The adjust pin can take a transient signal of ±25V with respect to the output voltage without damaging the device. When a output capacitor is connected to a regulator and the input is shorted to ground, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage of the regulator, and rate of decrease of VIN. In the LM1117 regulators, the internal diode between the output and input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large output capacitor (≥1000 µF), and with input instantaneously shorted to ground, the regulator could be damaged. In this case, an external diode is recommended between the output and input pins to protect the regulator, as shown in Figure 8-4. Figure 8-4. Regulator With Protection Diode Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 13 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 9 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 9.1 Application Information The LM1117 is a versatile and high performance linear regulator with a wide temperature range and tight line/ load regulation operation. An output capacitor is required to further improve transient response and stability. For the adjustable option, the ADJ pin can also be bypassed to achieve very high ripple-rejection ratios. The LM1117 is versatile in its applications, including its uses as a post regulator for DC/DC converters, battery chargers, and microprocessor supplies. 9.2 Typical Application Figure 9-1. 1.25-V to 10-V Adjustable Regulator With Improved Ripple Rejection 9.2.1 Design Requirements The device component count is very minimal, employing two resistors as part of a voltage divider circuit and an output capacitor for load regulation. A 10-μF tantalum on the input is a suitable input capacitor for almost all applications. An optional bypass capacitor across R2 can also be used to improve PSRR. See Section 7.3 for more information. 9.2.2 Detailed Design Procedure The output voltage is set based on the selection of the two resistors, R1 and R2, as shown in Figure 9-1. For details on capacitor selection, refer to Section 9.2.2.1. 9.2.2.1 External Capacitors 9.2.2.1.1 Input Bypass Capacitor An input capacitor is recommended. A 10-µF tantalum on the input is a suitable input capacitor for almost all applications. 9.2.2.1.2 Adjust Terminal Bypass Capacitor The adjust terminal can be bypassed to ground with a bypass capacitor (CADJ) to improve ripple rejection. This bypass capacitor prevents ripple from being amplified as the output voltage is increased. At any ripple frequency, the impedance of the CADJ should be less than R1 to prevent the ripple from being amplified: 14 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 1/(2π × fRIPPLE × CADJ) < R1 (1) The R1 is the resistor between the output and the adjust pin. Its value is normally in the range of 100-200Ω. For example, with R1 = 124Ω and fRIPPLE = 120Hz, the CADJ should be > 11µF. 9.2.2.1.3 Output Capacitor The output capacitor is critical in maintaining regulator stability, and must meet the required conditions for both minimum amount of capacitance and equivalent series resistance (ESR). The minimum output capacitance required by the LM1117 is 10 µF, if a tantalum capacitor is used. Any increase of the output capacitance will merely improve the loop stability and transient response. The ESR of the output capacitor should range between 0.3 Ω to 22 Ω. In the case of the adjustable regulator, when the CADJ is used, a larger output capacitance (22-µF tantalum) is required. 9.2.3 Application Curve As shown in Figure 9-2, the dropout voltage will vary with output current and temperature. Care should be taken during design to ensure the dropout voltage requirement is met across the entire operating temperature and output current range. Figure 9-2. Dropout Voltage (VIN – VOUT) Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 15 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 9.3 System Examples Several circuits can be realized with the LM1117. The circuit diagrams in this section demonstrate multiple system examples that can be utilized in many applications. Figure 9-3. Fixed Output Regulator Figure 9-4. Adjusting Output of Fixed Regulators Figure 9-5. Regulator With Reference Figure 9-6. 5-V Logic Regulator With Electronic Shutdown* Figure 9-7. Battery Backed-Up Regulated Supply Figure 9-8. Low Dropout Negative Supply 16 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 10 Power Supply Recommendations The input supply to the LM1117 must be kept at a voltage level such that its maximum rating is not exceeded. The minimum dropout voltage must also be met with extra headroom when possible to keep the LM1117 in regulation. An input capacitor is recommended. For more information regarding capacitor selection, refer to Section 9.2.2.1. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 17 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 11 Layout 11.1 Layout Guidelines Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise. Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the feedback loop from VOUT to ADJ must be kept as short as possible. To improve PSRR, a bypass capacitor can be placed at the ADJ pin and must be located as close as possible to the IC. In cases when VIN shorts to ground, an external diode must be placed from VOUT to VIN to divert the surge current from the output capacitor and protect the IC. The diode must be placed close to the corresponding IC pins to increase their effectiveness. 11.1.1 Heatsink Requirements When an integrated circuit operates with an appreciable current, its junction temperature is elevated. It is important to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is determined by summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the operating environment. A one-dimensional steady-state model of conduction heat transfer is demonstrated in Figure 11-1. The heat generated at the device junction flows through the die to the die attach pad, through the lead frame to the surrounding case material, to the printed circuit board, and eventually to the ambient environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a heatsink. Table 11-1. Component and Application Variables RθJC (COMPONENT VARIABLES) RθJA (APPLICATION VARIABLES) Leadframe Size and Material Mounting Pad Size, Material, and Location No. of Conduction Pins Placement of Mounting Pad Die Size PCB Size and Material Die Attach Material Traces Length and Width Molding Compound Size and Material Adjacent Heat Sources Volume of Air Ambient Temperatue Shape of Mounting Pad The case temperature is measured at the point where the leads contact with the mounting pad surface Figure 11-1. Cross-Sectional View of Integrated Circuit Mounted on a Printed Circuit Board 18 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 The LM1117 regulators have internal thermal shutdown to protect the device from over-heating. Under all possible operating conditions, the junction temperature of the LM1117 must be within the range of 0°C to 125°C. A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. To determine if a heatsink is needed, the power dissipated by the regulator, PD , must be calculated: IIN = IL + IG (2) PD = (VIN-VOUT)I L + VINIG (3) Figure 11-2 shows the voltages and currents which are present in the circuit. Figure 11-2. Power Dissipation Diagram The next parameter which must be calculated is the maximum allowable temperature rise, TR(max):  TR(max) = TJ(max)-TA(max) (4) where • • TJ(max) is the maximum allowable junction temperature (125°C) which will be encountered in the application TA(max) is the maximum ambient temperature which will be encountered in the application Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient thermal resistance (RθJA) can be calculated: RθJA = TR(max)/PD (5) For the maximum allowable value for θJA, refer to the Section 7.4 table. As a design aid, Table 11-2 shows the value of the θJA of SOT-223 and TO-252 for different heatsink area. Figure 11-3 and Figure 11-4 reflects the same test results as what are in the Table 11-2 Figure 11-5 and Figure 11-6 shows the maximum allowable power dissipation vs. ambient temperature for the SOT-223 and TO-252 device. Figure 11-7 and Figure 11-8 shows the maximum allowable power dissipation vs. copper area (in2) for the SOT-223 and TO-252 devices. Please see AN1028 for power enhancement techniques to be used with SOT-223 and TO-252 packages. The AN-1187 Leadless Leadframe Package (LLP) application note discusses improved thermal performance and power dissipation for the WSON. Table 11-2. RθJA Different Heatsink Area LAYOUT COPPER AREA Top Side (in2)(1) THERMAL RESISTANCE Bottom Side (in2) (θJA,°C/W) SOT-223 (θJA,°C/W) TO-252 1 0.0123 0 136 103 2 0.066 0 123 87 3 0.3 0 84 60 4 0.53 0 75 54 5 0.76 0 69 52 6 1 0 66 47 7 0 0.2 115 84 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 19 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 Table 11-2. RθJA Different Heatsink Area (continued) LAYOUT (1) COPPER AREA THERMAL RESISTANCE 8 0 0.4 98 70 9 0 0.6 89 63 10 0 0.8 82 57 11 0 1 79 57 12 0.066 0.066 125 89 13 0.175 0.175 93 72 14 0.284 0.284 83 61 15 0.392 0.392 75 55 16 0.5 0.5 70 53 Tab of device attached to topside copper Figure 11-3. RθJA vs 1-oz Copper Area for SOT-223 Figure 11-4. RθJA vs 2-oz Copper Area for TO-252 Figure 11-5. Maximum Allowable Power Dissipation vs Ambient Temperature for SOT-223 Figure 11-6. Maximum Allowable Power Dissipation vs Ambient Temperature for TO-252 20 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 Figure 11-7. Maximum Allowable Power Dissipation vs 1-oz Copper Area for SOT-223 Figure 11-8. Maximum Allowable Power Dissipation vs 2-oz Copper Area for TO-252 Figure 11-9. Top View of the Thermal Test Pattern in Actual Scale Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 21 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 Figure 11-10. Bottom View of the Thermal Test Pattern in Actual Scale 11.2 Layout Example Figure 11-11. Layout Example (SOT-223) 22 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 LM1117 www.ti.com SNOS412P – FEBRUARY 2000 – REVISED JULY 2022 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation see the following: Texas Instruments, AN-1187 Leadless Leadframe Package (LLP) application note 12.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM1117 23 PACKAGE OPTION ADDENDUM www.ti.com 13-Jul-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) LM1117DT-1.8/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-1.8 Samples LM1117DT-2.5/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-2.5 Samples LM1117DT-3.3/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-3.3 Samples LM1117DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-5.0 Samples LM1117DT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-ADJ Samples LM1117DTX-1.8/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-1.8 Samples LM1117DTX-2.5/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-2.5 Samples LM1117DTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-3.3 Samples LM1117DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-5.0 Samples LM1117DTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-ADJ Samples LM1117IDT-3.3/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-3.3 Samples LM1117IDT-5.0/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-5.0 Samples LM1117IDT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-ADJ Samples LM1117IDTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-3.3 Samples LM1117IDTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-5.0 Samples LM1117IDTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-ADJ Samples LM1117ILD-ADJ/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1117IAD Samples Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 13-Jul-2022 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) LM1117IMP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N05B Samples LM1117IMP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N06B Samples LM1117IMP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N03B Samples LM1117IMPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N05B Samples LM1117IMPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N06B Samples LM1117IMPX-ADJ/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N03B Samples LM1117LD-1.8/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-18 Samples LM1117LD-2.5/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-25 Samples LM1117LD-3.3/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-33 Samples LM1117LD-ADJ/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117ADJ Samples LM1117LDX-1.8/NOPB ACTIVE WSON NGN 8 4500 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-18 Samples LM1117LDX-ADJ/NOPB ACTIVE WSON NGN 8 4500 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117ADJ Samples LM1117MP-1.8/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N12A Samples LM1117MP-2.5/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N13A Samples LM1117MP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N05A Samples LM1117MP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N06A Samples LM1117MP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N03A Samples LM1117MPX-1.8/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N12A Samples LM1117MPX-2.5/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N13A Samples LM1117MPX-3.3 ACTIVE SOT-223 DCY 4 2000 Non-RoHS & Green Call TI Level-1-260C-UNLIM N05A Samples LM1117MPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM N05A Samples Addendum-Page 2 0 to 125 PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 13-Jul-2022 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) LM1117MPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N06A Samples LM1117MPX-ADJ/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N03A Samples LM1117S-ADJ/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 RoHS-Exempt & Green SN Level-3-245C-168 HR 0 to 125 LM1117S ADJ Samples LM1117SX-3.3/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 RoHS-Exempt & Green SN Level-3-245C-168 HR 0 to 125 LM1117S 3.3 Samples LM1117SX-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 RoHS-Exempt & Green SN Level-3-245C-168 HR 0 to 125 LM1117S 5.0 Samples LM1117SX-ADJ/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 RoHS-Exempt & Green SN Level-3-245C-168 HR 0 to 125 LM1117S ADJ Samples LM1117T-2.5/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM1117T 2.5 Samples LM1117T-3.3/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM1117T 3.3 Samples LM1117T-5.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM1117T 5.0 Samples LM1117T-ADJ/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM1117T ADJ Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of