LM140K-5.0/NOPB

LM140K www.ti.com SNVS994 – JULY 2013 LM140K 3-Terminal Positive Regulator Check for Samples: LM140K FEATURES DESCRIPTION • • • • • • The LM140K monolithic 3-terminal positive voltage regulator employs internal current-limiting, thermal shutdown and safe-area compensation, making them essentially indestructible. If adequate heat sinking is provided, they can deliver over 1.0A output current. They are intended as fixed voltage regulators in a wide range of applications including local (on-card) regulation for elimination of noise and distribution problems associated with single-point regulation. In addition to use as fixed voltage regulators, these devices can be used with external components to obtain adjustable output voltages and currents. 1 2 Complete Specifications at 1A Load Output Voltage Tolerances of ±4% at Tj = 25°C Internal Thermal Overload Protection Internal Short-circuit Current Limit Output Transistor Safe Area Protection P+ Product Enhancement Tested Considerable effort was expended to make the entire series of regulators easy to use and minimize the number of external components. It is not necessary to bypass the output, although this does improve transient response. Input bypassing is needed only if the regulator is located far from the filter capacitor of the power supply. The LM140K is available in 5V, 12V and 15V options in the steel TO-3 power package. Typical Applications *Required if the regulator is located far from the power supply filter. **Although no output capacitor is needed for stability, it does help transient response. (If needed, use 0.1 μF, ceramic disc). VOUT = 5V + (5V/R1 + IQ) R2 5V/R1 > 3 IQ, load regulation (Lr) ≈ [(R1 + R2)/R1] (Lr of LM140K-5.0). Figure 2. Adjustable Output Regulator Figure 1. Fixed Output Regulator ΔIQ = 1.3 mA over line and load changes. Figure 3. Current Regulator 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated LM140K SNVS994 – JULY 2013 www.ti.com Connection Diagrams Figure 4. TO-3 Metal Can (Bottom View) These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) DC Input Voltage 35V Internal Power Dissipation (4) Internally Limited Maximum Junction Temperature 150°C −65°C to +150°C Storage Temperature Range Lead Temperature (Soldering, 10 sec.) TO-3 Package (NDS) ESD Susceptibility (5) (1) (2) (3) (4) (5) 300°C 2 kV Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical Characteristics. Specifications and availability for military grade LM140H/883 and LM140K/883 can be found in the LM140QML datasheet (SNVS382). Specifications and availability for military and space grade LM140H/JAN and LM140K/JAN can be found in the LM140JAN datasheet (SNVS399). If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation (TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above TJMAX and the electrical specifications do not apply. If the die temperature rises above 150°C, the device will go into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal resistance (θJA) is 39°C/W. When using a heatsink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3 package and the case-to-ambient thermal resistance of the heatsink. ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ. Operating Conditions (1) Temperature Range (TA) (2) (1) (2) 2 LM140 −55°C to +125°C Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical Characteristics. The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation (TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above TJMAX and the electrical specifications do not apply. If the die temperature rises above 150°C, the device will go into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal resistance (θJA) is 39°C/W. When using a heatsink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3 package and the case-to-ambient thermal resistance of the heatsink. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: LM140K LM140K www.ti.com SNVS994 – JULY 2013 LM140 Electrical Characteristics 55°C ≤ TJ ≤ + 150°C unless otherwise specified (1) Output Voltage Symbol Input Voltage (unless otherwise noted) Parameter VO 5V Output Voltage Conditions 10V Line Regulation 19V Units Max Min Typ Max Min Typ Max TJ = 25°C, 5 mA ≤ IO ≤ 1A 4.9 5 5.1 11.75 12 12.25 14.7 15 15.3 V PD ≤ 15W, 5 mA ≤ IO ≤ 1A 4.8 5.2 11.5 12.5 14.4 15.6 V (7.5 ≤ VIN ≤ 20) IO = 500 mA TJ = 25°C, ΔVIN, −55°C ≤ TJ ≤ +150°C (7.5 ≤ VIN ≤ 20) 3 10 4 5 mA ≤ IO ≤ 1.5A 10 250 mA ≤ IO ≤ 750 mA Over Temperature, V 4 mV (16 ≤ VIN ≤ 22) 25 12 22 (17.5 ≤ VIN ≤ 30) 30 (8 ≤ VIN ≤ 12) mV (17.9 ≤ VIN ≤ 30) 9 12 ΔVIN V 22 18 (14.5 ≤ VIN ≤ 27) 4 Over Temperature (17.9 ≤ VIN ≤ 30) 18 (14.8 ≤ VIN ≤ 27) (7.5 ≤ VIN ≤ 20) TJ = 25°C TJ = 25°C (14.8 ≤ VIN ≤ 27) 10 ΔVIN, −55°C ≤ TJ ≤ +150°C Load Regulation 23V Typ TJ = 25°C ΔVO 15V Min VMIN ≤ VIN ≤ VMAX ΔVO 12V V 10 mV 30 mV (20 ≤ VIN ≤ 26) V 12 35 mV 32 15 19 21 mV 25 60 75 mV 5 mA ≤ IO ≤ 1A IQ ΔIQ Quiescent Current TJ = 25°C Quiescent Current Change 5 mA ≤ IO ≤ 1A Over Temperature 6 6 mA 6.5 6.5 mA 0.5 TJ = 25°C, IO = 1A 0.5 0.5 0.8 VMIN ≤ VIN ≤ VMAX (7.5 ≤ VIN ≤ 20) IO = 500 mA 0.8 (14.8 ≤ VIN ≤ 27) 0.8 VMIN ≤ VIN ≤ VMAX VN 6 6.5 TA = 25°C, 10 Hz ≤ f ≤ 100 kHz Ripple Rejection TJ = 25°C, f = 120 Hz, IO = 1A 68 or f = 120 Hz, IO = 500 mA, 68 (15 ≤ VIN ≤ 30) 40 80 0.8 72 mA (17.9 ≤ VIN ≤ 30) V 90 μV 70 dB 60 61 V 0.8 75 61 mA (17.9 ≤ VIN ≤ 30) 0.8 (8 ≤ VIN ≤ 25) Output Noise Voltage mA 60 dB Over Temperature, VMIN ≤ VIN ≤ VMAX RO VIN (1) (18.5 ≤ VIN ≤ 28.5) V 2.0 2.0 2.0 V f = 1 kHz 8 18 19 mΩ Short-Circuit Current TJ = 25°C 2.1 1.5 1.2 A Peak Output Current TJ = 25°C 2.4 2.4 2.4 A Average TC of VO Min, TJ = 0°C, IO = 5 mA −0.6 −1.5 −1.8 mV/°C Dropout Voltage TJ = 25°C, IO = 1A Output Resistance Input Voltage TJ = 25°C Required to Maintain Line Regulation (8 ≤ VIN ≤ 18) 7.5 (15 ≤ VIN ≤ 25) 14.5 17.5 V All characteristics are measured with a 0.22 μF capacitor from input to ground and a 0.1 μF capacitor from output to ground. All characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tw ≤ 10 ms, duty cycle ≤ 5%). Output voltage changes due to changes in internal temperature must be taken into account separately. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: LM140K 3 LM140K SNVS994 – JULY 2013 www.ti.com Typical Performance Characteristics 4 Maximum Average Power Dissipation Output Voltage (Normalized to 1V at TJ = 25°C) Figure 5. Figure 6. Ripple Rejection Ripple Rejection Figure 7. Figure 8. Output Impedance Dropout Characteristics Figure 9. Figure 10. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: LM140K LM140K www.ti.com SNVS994 – JULY 2013 Typical Performance Characteristics (continued) Quiescent Current Peak Output Current Figure 11. Figure 12. Dropout Voltage Quiescent Current Figure 13. Figure 14. Line Regulation 140K, IOUT = 1A, TA = 25°C Line Regulation 140K, VIN = 10V, TA = 25°C Figure 15. Figure 16. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: LM140K 5 LM140K SNVS994 – JULY 2013 www.ti.com Equivalent Schematic 6 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: LM140K LM140K www.ti.com SNVS994 – JULY 2013 APPLICATION HINTS The LM140K is designed with thermal protection, output short-circuit protection and output transistor safe area protection. However, as with any IC regulator, it becomes necessary to take precautions to assure that the regulator is not inadvertently damaged. The following describes possible misapplications and methods to prevent damage to the regulator. SHORTING THE REGULATOR INPUT When using large capacitors at the output of these regulators, a protection diode connected input to output (Figure 17) may be required if the input is shorted to ground. Without the protection diode, an input short will cause the input to rapidly approach ground potential, while the output remains near the initial VOUTbecause of the stored charge in the large output capacitor. The capacitor will then discharge through a large internal input to output diode and parasitic transistors. If the energy released by the capacitor is large enough, this diode, low current metal and the regulator will be destroyed. The fast diode in Figure 17 will shunt most of the capacitors discharge current around the regulator. Generally no protection diode is required for values of output capacitance ≤ 10 μF. RAISING THE OUTPUT VOLTAGE ABOVE THE INPUT VOLTAGE Since the output of the device does not sink current, forcing the output high can cause damage to internal low current paths in a manner similar to that just described in the “Shorting the Regulator Input” section. REGULATOR FLOATING GROUND (Figure 18) When the ground pin alone becomes disconnected, the output approaches the unregulated input, causing possible damage to other circuits connected to VOUT. If ground is reconnected with power “ON”, damage may also occur to the regulator. This fault is most likely to occur when plugging in regulators or modules with on card regulators into powered up sockets. Power should be turned off first, thermal limit ceases operating, or ground should be connected first if power must be left on. TRANSIENT VOLTAGES If transients exceed the maximum rated input voltage of the device, or reach more than 0.8V below ground and have sufficient energy, they will damage the regulator. The solution is to use a large input capacitor, a series input breakdown diode, a choke, a transient suppressor or a combination of these. Figure 17. Input Short Figure 18. Regulator Floating Ground Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: LM140K 7 LM140K SNVS994 – JULY 2013 www.ti.com Figure 19. Transients When a value for θ(H–A) is found using the equation shown, a heatsink must be selected that has a value that is less than or equal to this number. θ(H–A) is specified numerically by the heatsink manufacturer in this catalog, or shown in a curve that plots temperature rise vs power dissipation for the heatsink. Typical Applications INPUT OUTPUT VI VO + + 0.22 PF 0.1 PF GND Bypass capacitors are recommended for optimum stability and transient response, and should be located as close as possible to the regulator. Figure 20. Fixed Output Regulator INPUT OUTPUT VI VO 0.22 PF 8 GND Submit Documentation Feedback 0.1 PF (NOTE 1) Copyright © 2013, Texas Instruments Incorporated Product Folder Links: LM140K LM140K www.ti.com SNVS994 – JULY 2013 INPUT VI OUTPUT VO GND 0.22 PF 0.1 PF Figure 21. High Input Voltage Circuits Q1 2N6133 IQ1 VI R1 3.0: IREG OUTPUT IO MAX VO INPUT 0.22 PF 0.1 PF GND Figure 22. High Current Voltage Regulator RSC Q1 2N6132 IN Q2 2N6124 INPUT OUT R1 3.0: OUTPUT 0.22 PF GND 0.1 PF Figure 23. High Output Current, Short Circuit Protected Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: LM140K 9 LM140K SNVS994 – JULY 2013 www.ti.com INPUT OUTPUT + + OUT + 0.1 PF GND INPUT OUTPUT + + GND 0.1 PF - OUT Figure 24. Positive and Negative Regulator 10 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: LM140K PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM140K-12 ACTIVE TO-3 NDS 2 50 Non-RoHS & Non-Green Call TI Call TI -55 to 125 LM140K 12P+ LM140K-12/NOPB ACTIVE TO-3 NDS 2 50 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 LM140K 12P+ LM140K-15 ACTIVE TO-3 NDS 2 50 Non-RoHS & Non-Green Call TI Call TI -55 to 125 LM140K 15P+ LM140K-15/NOPB ACTIVE TO-3 NDS 2 50 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 LM140K 15P+ LM140K-5.0 ACTIVE TO-3 NDS 2 50 Non-RoHS & Non-Green Call TI Call TI -55 to 125 LM140K 5.0P+ LM140K-5.0/NOPB ACTIVE TO-3 NDS 2 50 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 LM140K 5.0P+ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of