User's Guide
SNOA406B – July 2001 – Revised April 2013
AN–1207 LM2593HV Evaluation Board
1
Specifications of the Board
The board is designed for a nominal DC input of 48 V, but can safely withstand up to 60 V. The regulated
DC output is 12 V at a maximum load current of 2A. It uses the adjustable version of the LM2593HV in 7
lead Surface Mount Package (TO263). Relying on careful layout, it eliminates the need for a snubber
across the diode and uses a minimum number of components. It has shutdown capability and error flag
output available on the board. It incorporates soft-start and delayed output error signaling and has an
overall efficiency higher than 85%.
The board uses no external heatsinks, or through-hole parts and is suitable for a fully automatic
production process. It requires only 1.7 x 2.0 x 0.7 cu. inches of space. The printed circuit board (PCB) is
standard 1.6 mm thick (62 mils) ‘1/2 oz' double-sided FR4 laminate, with additional cooper plating, totaling
a little over 1 oz of copper (“1 oz” is 1.4 mils/35 µm thick). The traces have been left unmasked to allow
solder to deposit on the traces during reflow, so as to aid thermal dissipation. The converter is designed
for continuous operation at rated load under natural convection up to a maximum ambient of 40°C.
2
Component Selection
We set:
VIN = 48 V
VO = 12 V
IO = 2A
2.1
Inductor
‘D' is defined as the duty cycle and ‘r' is defined as the ripple current ratio ΔI/IO. For more details on the
terms and equations used in this document, see AN-1197 Selecting Inductors for Buck Converters
(SNVA038).
r was chosen to be 0.3 in this document as per the design procedure inductor nomographs in the
LM2593HV Simple SWITCHERPower Converter 150 kHz 2A Step-Down Voltage Regulator, With
Features Data Sheet (SNVS082) as well as the guidelines in the referAN-1197 Selecting Inductors for
Buck Converters (SNVA038). ‘r' is related to the inductance through Equation 1:
where
•
•
•
'Et' is the applied Voltµsecs
IDC is the maximum rated load in Amps
L is the inductance in µH
(1)
All trademarks are the property of their respective owners.
SNOA406B – July 2001 – Revised April 2013
Submit Documentation Feedback
AN–1207 LM2593HV Evaluation Board
Copyright © 2001–2013, Texas Instruments Incorporated
1
Component Selection
www.ti.com
The duty cycle is:
where
•
•
VD is the diode forward voltage drop (≅0.5 V)
VSW is the drop across the switch when it is ON, plus any parasitics (≅1.5 V).
(2)
The switch ON-time is:
•
tON = 1.77 µs
(3)
So the Voltµseconds ‘Et' is:
Et = (VIN − VSW − VO) × tON = (48−1.5−12) × 1.77 Vµs
where
•
Et = 61.1 Vµs
(4)
Estimated inductance is:
where
•
L = 101.8 µH
(5)
The first pass selection of the inductor is usually on the basis of the inductance calculated above and the
max load current. But, if the input voltage exceeds 40 V, as it does here, evaluate the inductor further to
ensure that the converter withstands damage if the outputs are overloaded/shorted. A 100 µH/1.8A drum
core type (large inherent air gap) was chosen from Coilcraft, which saturates above 3A. It is designed for
a 40°C rise in temperature at a maximum ambient of 85°C. Its use is accepted at a load current slightly
higher than its continuous rating since the maximum ambient temperature for the demo-board is only 40°C
not 85°C, and since we also know it does not saturate at the maximum load current.
2.2
Input Capacitor
The voltage rating of the input capacitor must be higher than the DC Input. Tantalum capacitors were not
considered suitable here due to their 50 V maximum rating, and their inherent surge current limitations
(which are always of concern especially at high input voltages). A 63 V aluminum electrolytic SMT
capacitor was chosen from Panasonic, sized to handle the RMS current as calculated in Equation 6:
(6)
The capacitor that was chosen is 100 µF with an RMS current rating of 1.02A at 100 kHz.
2
AN–1207 LM2593HV Evaluation Board
Copyright © 2001–2013, Texas Instruments Incorporated
SNOA406B – July 2001 – Revised April 2013
Submit Documentation Feedback
Schematic
www.ti.com
2.3
Output Capacitor
A capacitor type was chosen similar to the input capacitor mainly for logistic reasons. It was initially sized
simply to handle the RMS current as calculated in Equation 7 , and with a voltage rating just higher than
the output voltage. Subsequently, a Bode plot for the feedback loop confirmed that the phase margin was
acceptable at around 40°. This validated the initial selection. The required RMS rating of the output
capacitor is:
(7)
The capacitor that was chosen is 47 µF/16 V with an RMS current rating of 0.24A at 100 kHz and an ESR
of 0.36 Ω.
2.4
Catch Diode
The voltage rating must be higher than the input voltage. A 60 V Schottky diode was chosen here. The
average current in the catch diode is:
IAVG_D = IO • (1−D)
IAVG_D = 2 • (1−0.27) = 1.47A
(8)
Usually the average current would be a starting point for the diode selection. But 60 V Schottky diodes
have a higher forward voltage drop than low voltage Schottkys, unless they are ‘over-sized' in terms of
their current rating. So to force good efficiency, a diode with a ‘hot-drop' (the forward drop with the diode
hot) was considered of no greater than 0.5 V (at an instantaneous forward current of about 2A). This
meant using a 3A/60V Schottky diode from International Rectifier.
3
Schematic
The board schematic is presented in Figure 1. The key layout suggestions are also indicated on the
schematic. Shutdown capacity is available and the pinout marked ‘SD' on the board can be taken low to
cause the output of the converter to fall to 0 V. The ‘Flag' pin output is also available and it goes high
(pulled up by R3 to the 12 V rail) to indicate that the output is well-regulated. When the output is ‘not OK',
this pin is pulled down internally by the IC and in this condition it sinks 12 V/21K = 0.6 mA. The maximum
voltage on the Flag pin should not exceed 45 V and the current into it should not be higher than 3 mA.
Therefore, in this case it cannot be connected directly to the input voltage rail. The resistors R1 and R2
from a simple voltage divider designed to give 1.23 V at the feedback pin when the output is at 12 V.
A
Traces shown in BOLD need to be short (not wide) as they pass high frequency current pulses. Wide copper planes
with switching current/voltage can radiate excessively.
B
Trace to Feedback Pin (Pin 6) should not pass directly under L1 (to avoid pickup). b)
Figure 1. Layout Suggestions
SNOA406B – July 2001 – Revised April 2013
Submit Documentation Feedback
AN–1207 LM2593HV Evaluation Board
Copyright © 2001–2013, Texas Instruments Incorporated
3
Layout and Bill of Material (BOM)
4
www.ti.com
Layout and Bill of Material (BOM)
The two sides of the board are presented in Figure 2 Figure 3. The Bill of Material is presented in Table 1.
Table 1. Bill of Material
Designator
Description
Manufacturer
Part Number
Quantity
U1
LM2593
Texas Instruments
LM2593
1
D1
3A/60V Schottky
International Rectifier
MBRS360TR
1
L1
100 µH/1.8A
Coilcraft
DO5022-104
1
C1
100 µF/63 V
Panasonic
EEVFC1J101Q
1
C2, C3, C4
0.1 µF/100 V
Vishay-Vitramon
VJ1206Y104KXBA
3
C5
47 µF/16 V
Panasonic
EEVFK1C470P
1
R1
2.37K/1%
Vishay
CRCW12062371F
1
R2, R3
21K/1%
Vishay
CRCW12062102F
2
Figure 2. Top Side (Component Side) of PCB
4
AN–1207 LM2593HV Evaluation Board
Copyright © 2001–2013, Texas Instruments Incorporated
SNOA406B – July 2001 – Revised April 2013
Submit Documentation Feedback
References
www.ti.com
Figure 3. Bottom Side of PCB Viewed From Top
5
References
•
•
AN-1197 Selecting Inductors for Buck Converters (SNVA038)
LM2593HV Simple SWITCHERPower Converter 150 kHz 2A Step-Down Voltage Regulator, With
Features Data Sheet (SNVS082)
SNOA406B – July 2001 – Revised April 2013
Submit Documentation Feedback
AN–1207 LM2593HV Evaluation Board
Copyright © 2001–2013, Texas Instruments Incorporated
5
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated