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LM2611EVAL

LM2611EVAL

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    BOARD EVALUATION LM2611

  • 数据手册
  • 价格&库存
LM2611EVAL 数据手册
User's Guide SNVA041B – August 2001 – Revised April 2013 AN–1203 LM2611 Demo Board 1 Introduction The LM2611 demo board is a working demonstration of a typical LM2611 Cuk converter layout. This document contains information about the board. For more information on the LM2611 and Cuk topology, see the device-specific data sheet. 2 General Description The LM2611 is typically used in inverting Cuk converter applications. The Cuk converter offers the advantages of low input and output ripple current and the ability to step up or step down the magnitude of the input voltage. The NFB pin allows for simple feedback of the negative output voltage. The demo board is assembled to show a small yet practical layout. The board will operate under the following conditions: 4.5 V ≤ VIN ≤ 5.5 V VOUT = −5 V 0 ≤ IOUT ≤ 300 mA Note: The input capacitor is rated for 6.3 V. Do not apply greater than 5.5 V without first replacing the input capacitor with one of higher voltage rating (VIN(MAX) = 14 V). The input voltage may be as low as 2.7 V, however the maximum load will be lower than 300 mA. All trademarks are the property of their respective owners. SNVA041B – August 2001 – Revised April 2013 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated AN–1203 LM2611 Demo Board 1 General Description www.ti.com Table 1. Bill of Materials Component Value Description Model Number CBYP 0.1 µF Bypass Capacitor VJ0805Y104KXAAT (Vishay) CCUK 2.2 µF Cuk Capacitor EMK316BJ225ML (Taiyo Yuden) CFF 1 nF Feedforward Capacitor VJ0805Y102KXAAT (Vishay) CIN 22 µF/6.3 V Input Capacitor LMK325BJ226MM (Taiyo Yuden) COUT 22 µF/6.3 V Output Capacitor LMK325BJ226MM (Taiyo Yuden) Scottky Diode MBRM120LT3 (Motorola) D L1 22 µH Input Inductor CR32-220 (Sumida) L2 22 µH Output Inductor CR32-220 (Sumida) RFB1 29.4 kΩ Feedback Resistor CRCW08052492FRT1 (Vishay) RFB2 10.0 kΩ Feedback Resistor CRCW08051002FRT1 (Vishay) Figure 1. LM2611 Demo Board Top Layer Layout Figure 2. LM2611 Demo Board Bottom Layer Layout 2 AN–1203 LM2611 Demo Board SNVA041B – August 2001 – Revised April 2013 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. 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With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated
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