User's Guide
SNVA041B – August 2001 – Revised April 2013
AN–1203 LM2611 Demo Board
1
Introduction
The LM2611 demo board is a working demonstration of a typical LM2611 Cuk converter layout. This
document contains information about the board. For more information on the LM2611 and Cuk topology,
see the device-specific data sheet.
2
General Description
The LM2611 is typically used in inverting Cuk converter applications. The Cuk converter offers the
advantages of low input and output ripple current and the ability to step up or step down the magnitude of
the input voltage. The NFB pin allows for simple feedback of the negative output voltage. The demo board
is assembled to show a small yet practical layout. The board will operate under the following conditions:
4.5 V ≤ VIN ≤ 5.5 V
VOUT = −5 V
0 ≤ IOUT ≤ 300 mA
Note: The input capacitor is rated for 6.3 V. Do not apply greater than 5.5 V without first replacing the
input capacitor with one of higher voltage rating (VIN(MAX) = 14 V). The input voltage may be as low as 2.7
V, however the maximum load will be lower than 300 mA.
All trademarks are the property of their respective owners.
SNVA041B – August 2001 – Revised April 2013
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
AN–1203 LM2611 Demo Board
1
General Description
www.ti.com
Table 1. Bill of Materials
Component
Value
Description
Model Number
CBYP
0.1 µF
Bypass Capacitor
VJ0805Y104KXAAT (Vishay)
CCUK
2.2 µF
Cuk Capacitor
EMK316BJ225ML (Taiyo Yuden)
CFF
1 nF
Feedforward Capacitor
VJ0805Y102KXAAT (Vishay)
CIN
22 µF/6.3 V
Input Capacitor
LMK325BJ226MM (Taiyo Yuden)
COUT
22 µF/6.3 V
Output Capacitor
LMK325BJ226MM (Taiyo Yuden)
Scottky Diode
MBRM120LT3 (Motorola)
D
L1
22 µH
Input Inductor
CR32-220 (Sumida)
L2
22 µH
Output Inductor
CR32-220 (Sumida)
RFB1
29.4 kΩ
Feedback Resistor
CRCW08052492FRT1 (Vishay)
RFB2
10.0 kΩ
Feedback Resistor
CRCW08051002FRT1 (Vishay)
Figure 1. LM2611 Demo Board Top Layer Layout
Figure 2. LM2611 Demo Board Bottom Layer Layout
2
AN–1203 LM2611 Demo Board
SNVA041B – August 2001 – Revised April 2013
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
很抱歉,暂时无法提供与“LM2611EVAL”相匹配的价格&库存,您可以联系我们找货
免费人工找货