LM2930SX-8.0/NOPB

LM2930 www.ti.com SNVS745D – APRIL 1998 – REVISED APRIL 2013 LM2930 3-Terminal Positive Regulator Check for Samples: LM2930 FEATURES DESCRIPTION • • • • • • • • The LM2930 3-terminal positive regulator features an ability to source 150 mA of output current with an input-output differential of 0.6V or less. Efficient use of low input voltages obtained, for example, from an automotive battery during cold crank conditions, allows 5V circuitry to be properly powered with supply voltages as low as 5.6V. Familiar regulator features such as current limit and thermal overload protection are also provided. 1 2 Input-Output Differential Less Than 0.6V Output Current in Excess of 150 mA Reverse Battery Protection 40V Load Dump Protection Internal Short Circuit Current Limit Internal Thermal Overload Protection Mirror-Image Insertion Protection P+ Product Enhancement Tested VOLTAGE RANGE • • • • LM2930T-5.0: 5V LM2930T-8.0: 8V LM2930S-5.0: 5V LM2930S-8.0: 8V Designed originally for automotive applications, the LM2930 and all regulated circuitry are protected from reverse battery installations or 2 battery jumps. During line transients, such as a load dump (40V) when the input voltage to the regulator can momentarily exceed the specified maximum operating voltage, the regulator will automatically shut down to protect both internal circuits and the load. The LM2930 cannot be harmed by temporary mirrorimage insertion. Fixed outputs of 5V and 8V are available in the plastic TO-220 and SFM power packages. Connection Diagrams TO-220 Plastic Package Figure 1. Front View See Package Number NDE SFM Plastic Surface-Mount Package Figure 2. Top View See Package Number KTT Figure 3. Side View See Package Number KTT 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated LM2930 SNVS745D – APRIL 1998 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Input Voltage Operating Range 26V Overvoltage Protection 40V −12V Reverse Voltage (100 ms) −6V Reverse Voltage (DC) Internal Power Dissipation (3) Internally Limited −40°C to +85°C Operating Temperature Range Maximum Junction Temperature 125°C −65°C to +150°C Storage Temperature Range Lead Temp. (Soldering, 10 seconds) (1) (2) (3) 230°C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication of device performance. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Thermal resistance without a heat sink for junction to case temperature is 3°C/W and for case to ambient temperature is 50°C/W for the TO-220, 73°C/W for the SFM. If the SFM package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package. Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. Electrical Characteristics (1) LM2930-5.0 VIN=14V, IO=150 mA, Tj=25°C Parameter (2) , C2=10 μF, unless otherwise specified Conditions Output Voltage Typ Tested Limit (3) 5 5.3 VMAX 4.7 VMIN 6V≤VIN≤26V, 5 mA≤IO≤150 mA −40°C≤TJ≤125°C Line Regulation Design Limit (4) 5.5 4.5 Unit VMAX VMIN 9V≤VIN≤16V, IO=5 mA 7 25 mVMAX 6V≤VIN≤26V, IO=5 mA 30 80 mVMAX Load Regulation 5 mA≤IO≤150 mA 14 50 mVMAX Output Impedance 100 mADC & 10 mArms, 100 Hz−10 kHz 200 Quiescent Current IO=10 mA 4 7 mAMAX IO=150 mA 18 40 mAMAX 10 Hz−100 kHz 140 μVrms 20 mV/1000 hr Output Noise Voltage Long Term Stability Ripple Rejection fO=120 Hz 56 Current Limit 400 Dropout Voltage IO=150 mA Output Voltage Under −12V≤VIN≤40V, RL=100Ω 0.32 Transient Conditions (1) (2) (3) (4) 2 mΩ dB 700 mAMAX 150 mAMIN 0.6 VMAX 5.5 VMAX −0.3 VMIN All characteristics are measured with a capacitor across the input of 0.1 μF and a capacitor across the output of 10 μF. All characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tW≤10 ms, duty cycle≤5%). Output voltage changes due to changes in internal temperature must be taken into account separately. To ensure constant junction temperature, low duty cycle pulse testing is used. Ensured and 100% production tested. Ensured (but not 100% production tested) over the operating temperature and input current ranges. These limits are not used to calculate outgoing quality levels. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM2930 LM2930 www.ti.com SNVS745D – APRIL 1998 – REVISED APRIL 2013 Electrical Characteristics (1) (2) , C2=10 μF, unless otherwise specified) LM2930-8.0 (VIN=14V, IO=150 mA, Tj=25°C Parameter Conditions Output Voltage Typ Tested Limit (3) 8 8.5 Design Limit (4) Unit VMAX 7.5 VMIN 9.4V≤VIN≤26V, 5 mA≤IO≤150 mA, −40°C≤TJ≤125°C Line Regulation 8.8 VMAX 7.2 VMIN 9.4V≤VIN≤16V, IO=5 mA 12 50 mVMAX 9.4V≤VIN≤26V, IO=5 mA 50 100 mVMAX 50 mVMAX Load Regulation 5 mA≤IO≤150 mA 25 Output Impedance 100 mADC & 10 mArms, 100 Hz−10 kHz 300 Quiescent Current IO=10 mA 4 7 mAMAX IO=150 mA 18 40 mAMAX 10 Hz−100 kHz 170 μVrms 30 mV/1000 hr 52 dB Output Noise Voltage Long Term Stability Ripple Rejection fO=120 Hz Current Limit 400 Dropout Voltage IO=150 mA 0.32 Output Voltage Under −12V≤VIN≤40V, RL=100Ω Transient Conditions (1) (2) (3) (4) mΩ 700 mAMAX 150 mAMIN 0.6 VMAX 8.8 VMAX −0.3 VMIN All characteristics are measured with a capacitor across the input of 0.1 μF and a capacitor across the output of 10 μF. All characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tW≤10 ms, duty cycle≤5%). Output voltage changes due to changes in internal temperature must be taken into account separately. To ensure constant junction temperature, low duty cycle pulse testing is used. Ensured and 100% production tested. Ensured (but not 100% production tested) over the operating temperature and input current ranges. These limits are not used to calculate outgoing quality levels. Typical Application *Required if regulator is located far from power supply filter. **COUT must be at least 10 μF to maintain stability. May be increased without bound to maintain regulation during transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating temperature range as the regulator. The equivalent series resistance (ESR) of this capacitor should be less than 1Ω over the expected operating temperature range. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM2930 3 LM2930 SNVS745D – APRIL 1998 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics 4 Output Impedance Overvoltage Supply Current Figure 4. Figure 5. Reverse Supply Current Output at Reverse Supply Figure 6. Figure 7. Output at Overvoltage Output Voltage (Normalized to 1V at Tj=25°C) Figure 8. Figure 9. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM2930 LM2930 www.ti.com SNVS745D – APRIL 1998 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Dropout Voltage Dropout Voltage Figure 10. Figure 11. Low Voltage Behavior High Voltage Behavior Figure 12. Figure 13. Line Transient Response Load Transient Response Figure 14. Figure 15. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM2930 5 LM2930 SNVS745D – APRIL 1998 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 6 Peak Output Current Quiescent Current Figure 16. Figure 17. Quiescent Current Quiescent Current Figure 18. Figure 19. Ripple Rejection Ripple Rejection Figure 20. Figure 21. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM2930 LM2930 www.ti.com SNVS745D – APRIL 1998 – REVISED APRIL 2013 Definition of Terms Dropout Voltage: The input-output voltage differential at which the circuit ceases to regulate against further reduction in input voltage. Measured when the output voltage has dropped 100 mV from the nominal value obtained at 14V input, dropout voltage is dependent upon load current and junction temperature. Input Voltage: The DC voltage applied to the input terminals with respect to ground. Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated output voltage for which the regulator will operate. Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation: The change in output voltage for a change in load current at constant chip temperature. Long Term Stability: Output voltage stability under accelerated life-test conditions after 1000 hours with maximum rated voltage and junction temperature. Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured over a specified frequency range. Quiescent Current: That part of the positive input current that does not contribute to the positive load current. The regulator ground lead current. Ripple Rejection: The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage. Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room temperature to either temperature extreme. Maximum Power Dissipation (TO-220) (1) Maximum Power Dissipation (SFM) (1) Thermal resistance without a heat sink for junction to case temperature is 3°C/W and for case to ambient temperature is 50°C/W for the TO-220, 73°C/W for the SFM. If the SFM package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package. Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM2930 7 LM2930 SNVS745D – APRIL 1998 – REVISED APRIL 2013 www.ti.com Schematic Diagram 8 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM2930 LM2930 www.ti.com SNVS745D – APRIL 1998 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision C (April 2013) to Revision D • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 8 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM2930 9 PACKAGE OPTION ADDENDUM www.ti.com 1-Oct-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking TBD Call TI Call TI -40 to 85 LM2930T -5.0 P+ Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 85 LM2930T -5.0 P+ (4/5) LM2930T-5.0 OBSOLETE TO-220 NDE 3 LM2930T-5.0/NOPB ACTIVE TO-220 NDE 3 LM2930T-8.0 OBSOLETE TO-220 NDE 3 TBD Call TI Call TI -40 to 85 LM2930T 8.0 P+ LM2930T-8.0/NOPB OBSOLETE TO-220 NDE 3 TBD Call TI Call TI -40 to 85 LM2930T 8.0 P+ 45 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Oct-2016 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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