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LM2940-N, LM2940C
SNVS769J – MARCH 2000 – REVISED DECEMBER 2014
LM2940x 1-A Low Dropout Regulator
1 Features
3 Description
•
•
•
•
•
•
•
•
The LM2940-N and LM2940C positive voltage
regulators feature the ability to source 1 A of output
current with a dropout voltage of typically 0.5 V and a
maximum of 1 V over the entire temperature range.
Furthermore, a quiescent current reduction circuit has
been included which reduces the ground current
when the differential between the input voltage and
the output voltage exceeds approximately 3 V. The
quiescent current with 1 A of output current and an
input-output differential of 5 V is therefore only 30
mA. Higher quiescent currents only exist when the
regulator is in the dropout mode (VIN − VOUT ≤ 3 V).
1
Input Voltage Range = 6 V to 26 V
Dropout Voltage Typically 0.5 V at IOUT = 1 A
Output Current in Excess of 1 A
Output Voltage Trimmed Before Assembly
Reverse Battery Protection
Internal Short Circuit Current Limit
Mirror Image Insertion Protection
P+ Product Enhancement Tested
2 Applications
•
•
•
Post Regulator for Switching Supplies
Logic Power Supplies
Industrial Instrumentation
space
space
space
Designed also for vehicular applications, the LM2940N and LM2940C and all regulated circuitry are
protected from reverse battery installations or 2battery jumps. During line transients, such as load
dump when the input voltage can momentarily
exceed the specified maximum operating voltage, the
regulator will automatically shut down to protect both
the internal circuits and the load. The LM2940-N and
LM2940C cannot be harmed by temporary mirrorimage insertion. Familiar regulator features such as
short circuit and thermal overload protection are also
provided.
Device Information(1)
PART NUMBER
LM2940-N
LM2940C
PACKAGE
BODY SIZE (NOM)
SOT-223 (4)
6.50 mm x 3.50 mm
WSON (8)
4.00 mm x 4.00 mm
TO-263 (3)
10.18 mm x 8.41 mm
TO-220 (3)
14.986 mm x 10.16 mm
TO-263 (3)
10.18 mm x 8.41 mm
TO-220 (3)
14.986 mm x 10.16 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
VIN
Unregulated Input
C1*
0.47 µF
IN
LM2940
OUT
VOUT
Regulated Output
+ COUT**
22 µF
IQ
*Required if regulator is located far from power supply filter.
**COUT must be at least 22 μF to maintain stability. May be increased without bound to maintain regulation during
transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating
temperature range as the regulator and the ESR is critical; see curve.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2940-N, LM2940C
SNVS769J – MARCH 2000 – REVISED DECEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
4
4
4
5
5
6
7
8
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics (5 V and 8 V) ....................
Electrical Characteristics (9 V and 10 V) ..................
Electrical Characteristics (12 V and 15 V) ................
Typical Characteristics ..............................................
Detailed Description ............................................ 13
7.1 Overview ................................................................. 13
7.2 Functional Block Diagram ....................................... 13
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 14
8
Application and Implementation ........................ 15
8.1 Application Information............................................ 15
8.2 Typical Application .................................................. 15
9 Power Supply Recommendations...................... 17
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Examples................................................... 17
10.3 Heatsinking ........................................................... 18
11 Device and Documentation Support ................. 20
11.1
11.2
11.3
11.4
11.5
Documentation Support ........................................
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
20
20
20
20
20
12 Mechanical, Packaging, and Orderable
Information ........................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (April 2013) to Revision J
Page
•
Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
•
Deleted information re: obsolete CDIP and CLGA package options ; Change pin names from Vin, Vout to IN, OUT;
delete Heatsinking sections re: packages apart from TO-220 ............................................................................................... 1
•
Changed symbols for Thermal Information ......................................................................................................................... 19
Changes from Revision H (April 2013) to Revision I
2
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SNVS769J – MARCH 2000 – REVISED DECEMBER 2014
5 Pin Configuration and Functions
DDPAK/TO-263 (KTT) Package
3 Pins
Top View
DDPAK/TO-263 ( KTT) Package
Side View
WSON (NGN) Package
8 Pins
Top View
TO-220 (NDE) Package
4 Pins
Front View
N/C
1
GND
2
8
N/C
7
GND
GND
SOT-223 (DCY) Package
3 Pins
Front View
IN
3
6
OUT
N/C
4
5
OUT
Pin 2 and pin 7 are fused to center DAP
Pin 5 and 6 need to be tied together on
PCB board
Pin Functions
PIN
NAME
I/O
DESCRIPTION
NDE
KTT
DCY
NGN
IN
1
1
1
3
I
GND
2
2
2
2
—
Ground
OUT
3
3
3
5, 6
O
Regulated output voltage. This pin requires an output capacitor to
maintain stability. See Detailed Design Procedure for output
capacitor details.
Unregulated input voltage.
GND
4
4
4
7
—
Ground
N/C
—
—
—
1, 4, 8
—
No connection
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SNVS769J – MARCH 2000 – REVISED DECEMBER 2014
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6 Specifications
6.1 Absolute Maximum Ratings (1) (2)
MIN
MAX
LM2940-N KTT, NDE, DCY ≤ 100 ms
60
LM2940C KTT, NDE ≤ 1 ms
45
Internal power dissipation (3)
Internally
Limited
Maximum junction temperature
Soldering
temperature (4)
260
DDPAK/TO-263 (KTT) (30 s)
235
SOT-223 (DCY) (30 s)
260
WSON-8 (NGN) (30 s)
(2)
(3)
(4)
V
150
TO-220 (NDE), Wave (10 s)
°C
235
−65
Storage temperature, Tstg
(1)
UNIT
150
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are
conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions
see the Electrical Characteristics (5 V and 8 V).
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
The maximum allowable power dissipation is a function of the maximum junction temperature, TJ, the junction-to-ambient thermal
resistance, RθJA, and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die
temperature, and the regulator will go into thermal shutdown. The value of R θJA (for devices in still air with no heatsink) is 23.3°C/W for
the TO-220 package, 40.9°C/W for the DDPAK/TO-263 package, and 59.3°C/W for the SOT-223 package. The effective value of RθJA
can be reduced by using a heatsink (see Heatsinking for specific information on heatsinking). The value of RθJA for the WSON package
is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance
and power dissipation for the WSON package, refer to Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401). It is
recommended that 6 vias be placed under the center pad to improve thermal performance.
Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the
temperature and time are for Sn-Pb (STD) only.
6.2 ESD Ratings
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
VALUE
UNIT
±2000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
Input voltage
LM2940-N NDE, LM2940-N KTT
Temperature
4
LM2940C NDE, LM2940C KTT
MAX
UNIT
V
6
26
−40
125
0
125
LM2940-N DCY
−40
85
LM2940-N NGN
−40
125
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°C
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6.4 Thermal Information
LM2940-N, LM2940C
THERMAL METRIC
(1)
LM2940-N
TO-220
(NDE)
DDPAK/TO-263
(KTT)
SOT-223
(DCY)
WSON
(NGN)
3 PINS
3 PINS
4 PINS
8 PINS
(2)
23.3
40.9
59.3
40.5
RθJC(top) Junction-to-case (top) thermal resistance
16.1
43.5
38.9
26.2
RθJB
Junction-to-board thermal resistance
4.8
23.5
8.1
17.0
ψJT
Junction-to-top characterization parameter
2.7
10.3
1.7
0.2
ψJB
Junction-to-board characterization parameter
4.8
22.5
8.0
17.2
RθJC(bot) Junction-to-case (bottom) thermal resistance
1.1
0.8
n/a
3.2
RθJA
(1)
(2)
Junction-to-ambient thermal resistance
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Thermal information for the TO-220 package is for a package vertically mounted with a heat sink in the middle of a PCB which is
compliant to the JEDEC HIGH-K 2s2p (JESD51-7). The heatsink-to-ambient thermal resistance, RƟSA, is 21.7°C/W. See Heatsinking
TO-220 Package Parts for more information.
6.5 Electrical Characteristics (5 V and 8 V)
Unless otherwise specified: VIN = VOUT + 5 V, IOUT = 1 A and COUT = 22 µF. MIN (minimum) and MAX (maximum) limits apply
over the recommended operating temperature range, unless otherwise noted; typical limits apply for TA = TJ = 25°C.
PARAMETER
Input voltage
Output voltage
Line regulation
Load regulation
Output
impedance
5V
TEST CONDITIONS
MIN
8V
TYP
MAX
MIN
TYP
MAX
5 mA ≤ IOUT ≤ 1 A
6.25
26
9.4
5 mA ≤ IOUT ≤ 1A
4.75
5
5.25
7.6
8
8.4
5 mA ≤ IOUT ≤ 1A, TJ = 25°C
4.85
7.76
8
8.24
26
5
5.15
VOUT + 2 V ≤ VIN ≤ 26 V, IOUT = 5 mA
TJ = 25°C
20
50
20
80
50 mA ≤ IOUT ≤ 1 A
LM2940-N
35
80
55
130
50 mA ≤ IOUT ≤ 1 A
TJ = 25°C
LM2940-N
35
50
55
80
LM2940C
35
50
55
80
100 mADC, 20 mArms, ƒOUT = 120 Hz
35
VOUT + 2 V ≤ VIN ≤ 26 V,
IOUT = 5 mA
LM2940-N
10
20
10
20
VOUT + 2 V ≤ VIN ≤ 26 V,
IOUT = 5 mA
Quiescent current TJ = 25°C
LM2940-N
10
15
10
15
LM2940C
10
15
VIN = VOUT + 5 V, IOUT = 1 A
30
60
30
60
VIN = VOUT + 5 V, IOUT = 1 A
TJ = 25°C
30
45
30
45
Output noise
voltage
Ripple rejection
10 Hz to 100 kHz, IOUT = 5 mA
Dropout voltage
mV
mΩ
240
LM2940-N
54
72
48
66
ƒOUT = 120 Hz, 1 Vrms, IOUT =
100 mA
TJ = 25°C
LM2940-N
60
72
54
66
LM2940C
60
72
54
66
20
µVrms
dB
mV/1000
Hr
32
IOUT = 1A
0.5
1
0.5
1
IOUT = 1A, TJ = 25°C
0.5
0.8
0.5
0.8
IOUT = 100 mA
110
200
110
200
IOUT = 100 mA, TJ = 25°C
110
150
110
150
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mA
150
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V
55
ƒOUT = 120 Hz, 1 Vrms, IOUT =
100 mA
Long-term
stability
UNIT
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V
mV
5
LM2940-N, LM2940C
SNVS769J – MARCH 2000 – REVISED DECEMBER 2014
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Electrical Characteristics (5 V and 8 V) (continued)
Unless otherwise specified: VIN = VOUT + 5 V, IOUT = 1 A and COUT = 22 µF. MIN (minimum) and MAX (maximum) limits apply
over the recommended operating temperature range, unless otherwise noted; typical limits apply for TA = TJ = 25°C.
PARAMETER
Short-circuit
current
Maximum line
transient
Reverse polarity
DC input voltage
Reverse polarity
Transient Input
Voltage
(1)
5V
TEST CONDITIONS
See (1), TJ = 25°C
8V
MIN
TYP
1.6
MAX
MIN
TYP
1.9
1.6
1.9
ROUT = 100Ω, T ≤ 100 ms
LM2940-N
60
75
60
75
ROUT = 100Ω, T ≤ 1 ms
TJ = 25°C
LM2940C
45
55
45
555
ROUT = 100 Ω
LM2940-N
–15
–30
–15
–30
ROUT = 100 Ω
TJ = 25°C
LM2940C
–15
–30
–15
–30
ROUT = 100 Ω, T ≤ 100 ms
LM2940-N
–50
–75
ROUT = 100 Ω, T ≤ 1 ms
LM2940C
–45
–55
–50
MAX
UNIT
A
V
V
–75
V
Output current will decrease with increasing temperature but will not drop below 1 A at the maximum specified temperature.
6.6 Electrical Characteristics (9 V and 10 V)
Unless otherwise specified: VIN = VOUT + 5 V, IOUT = 1 A and COUT = 22 µF. MIN (minimum) and MAX (maximum) limits apply
over the recommended operating temperature range, unless otherwise noted; typical limits apply for TA = TJ = 25°C.
PARAMETER
Input voltage
Output voltage
Line regulation
9V
TEST CONDITIONS
MIN
10 V
TYP
MAX
MIN
TYP
MAX
5 mA ≤ IOUT ≤ 1 A
10.5
26
11.5
5 mA ≤ IOUT ≤ 1A
8.55
9
9.45
9.5
10
10.5
5 mA ≤ IOUT ≤ 1A, TJ = 25°C
8.73
9
9.27
9.7
10
10.3
VOUT + 2 V ≤ VIN ≤ 26 V, IOUT = 5 mA
TJ = 25°C
20
90
20
100
26
50 mA ≤ IOUT ≤ 1 A
LM2940-N
60
150
65
165
Load regulation
50 mA ≤ IOUT ≤ 1 A
TJ = 25°C
LM2940-N
60
90
65
100
LM2940C
60
90
Output
impedance
100 mADC, 20 mArms, ƒOUT = 120 Hz
60
VOUT + 2 V ≤ VIN ≤ 26 V,
IOUT = 5 mA
LM2940-N
10
20
VOUT + 2 V ≤ VIN ≤ 26 V,
IOUT = 5 mA
Quiescent current TJ = 25°C
LM2940-N
10
15
LM2940C
10
15
VIN = VOUT + 5 V, IOUT = 1 A
30
60
30
60
VIN = VOUT + 5 V, IOUT = 1 A
TJ = 25°C
30
45
30
45
Output noise
voltage
10 Hz to 100 kHz, IOUT = 5 mA
ƒOUT = 120 Hz, 1 Vrms
IOUT = 100 mA
Ripple rejection
ƒOUT = 120 Hz, 1 Vrms
IOUT = 100 mA
TJ = 25°C
Long-term
stability
Dropout voltage
6
65
10
V
mV
mV
mΩ
20
15
mA
270
300
µVrms
LM2940-N
46
64
45
63
LM2940-N
52
64
51
63
dB
LM2940C
52
64
36
mV/1000
Hr
34
IOUT = 1A
0.5
1
0.5
1
IOUT = 1A, TJ = 25°C
0.5
0.8
0.5
0.8
IOUT = 100 mA
110
200
110
200
IOUT = 100 mA, TJ = 25°C
110
150
110
150
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UNIT
V
mV
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Electrical Characteristics (9 V and 10 V) (continued)
Unless otherwise specified: VIN = VOUT + 5 V, IOUT = 1 A and COUT = 22 µF. MIN (minimum) and MAX (maximum) limits apply
over the recommended operating temperature range, unless otherwise noted; typical limits apply for TA = TJ = 25°C.
PARAMETER
Short-circuit
current
Maximum line
transient
Reverse polarity
DC input voltage
Reverse polarity
Transient Input
Voltage
(1)
9V
TEST CONDITIONS
See (1), TJ = 25°C
MIN
TYP
1.6
MIN
TYP
1.9
1.6
1.9
60
75
ROUT = 100Ω, T ≤ 100 ms
LM2940-N
60
75
ROUT = 100Ω, T ≤ 100 ms
TJ = 25°C
LM2940C
45
55
ROUT = 100 Ω
LM2940-N
–15
–30
–15
–30
LM2940-N
–50
–75
LM2940C
–45
–55
ROUT = 100 Ω
TJ = 25°C
LM2940C
ROUT = 100 Ω, T ≤ 100 ms
10 V
MAX
MAX
UNIT
A
V
–15
–30
V
–50
–75
V
Output current will decrease with increasing temperature but will not drop below 1 A at the maximum specified temperature.
6.7 Electrical Characteristics (12 V and 15 V)
Unless otherwise specified: VIN = VOUT + 5 V, IOUT = 1 A and COUT = 22 µF. MIN (minimum) and MAX (maximum) limits apply
over the recommended operating temperature range, unless otherwise noted; typical limits apply for TA = TJ = 25°C.
PARAMETER
Input voltage
Output voltage
Line regulation
12 V
TEST CONDITIONS
MIN
15 V
TYP
MAX
MIN
TYP
MAX
5 mA ≤ IOUT ≤ 1 A
13.6
26
16.75
5 mA ≤ IOUT ≤ 1A
11.40
12
12.6
14.25
15
15.75
5 mA ≤ IOUT ≤ 1A, TJ = 25°C
11.64
12
12.36
14.55
15
15.45
VOUT + 2 V ≤ VIN ≤ 26 V, IOUT = 5 mA
TJ = 25°C
20
120
20
150
26
50 mA ≤ IOUT ≤ 1 A
LM2940-N
55
200
Load regulation
50 mA ≤ IOUT ≤ 1 A
TJ = 25°C
LM2940-N
55
120
LM2940C
55
120
Output
impedance
100 mADC, 20 mArms, ƒOUT = 120 Hz
80
VOUT + 2 V ≤ VIN ≤ 26 V,
IOUT = 5 mA
LM2940-N
10
20
VOUT + 2 V ≤ VIN ≤ 26 V,
IOUT = 5 mA
Quiescent current TJ = 25°C
LM2940-N
10
15
LM2940C
10
15
10
15
VIN = VOUT + 5 V, IOUT = 1 A
30
60
30
60
VIN = VOUT + 5 V, IOUT = 1 A
TJ = 25°C
30
45
30
45
Output noise
voltage
Ripple rejection
10 Hz to 100 kHz, IOUT = 5 mA
LM2940-N
48
66
ƒOUT = 120 Hz, 1 Vrms, IOUT =
100 mA
TJ = 25°C
LM2940-N
54
66
LM2940C
54
66
Long-term
stability
Dropout voltage
70
150
mΩ
450
mA
µVrms
dB
52
64
mV/1000
Hr
60
IOUT = 1A
0.5
1
0.5
1
IOUT = 1A, TJ = 25°C
0.5
0.8
0.5
0.8
IOUT = 100 mA
110
200
110
200
IOUT = 100 mA, TJ = 25°C
110
150
110
150
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100
48
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V
mV
360
ƒOUT = 120 Hz, 1 Vrms, IOUT =
100 mA
UNIT
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V
mV
7
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Electrical Characteristics (12 V and 15 V) (continued)
Unless otherwise specified: VIN = VOUT + 5 V, IOUT = 1 A and COUT = 22 µF. MIN (minimum) and MAX (maximum) limits apply
over the recommended operating temperature range, unless otherwise noted; typical limits apply for TA = TJ = 25°C.
PARAMETER
Short-circuit
current
See (1), TJ = 25°C
Maximum line
transient
Reverse polarity
DC input voltage
Reverse polarity
transient input
voltage
(1)
12 V
TEST CONDITIONS
15 V
MIN
TYP
1.6
1.9
ROUT = 100Ω, T ≤ 100 ms
LM2940-N
60
75
ROUT = 100Ω, T ≤ 100 ms
TJ = 25°C
LM2940C
45
55
ROUT = 100 Ω
LM2940-N
–15
–30
ROUT = 100 Ω
TJ = 25°C
LM2940C
–15
–30
ROUT = 100 Ω, T ≤ 100 ms
LM2940-N
–50
–75
LM2940C
–45
–55
ROUT = 100 Ω, T ≤ 1 ms
MAX
MIN
TYP
1.6
1.9
45
55
–15
–30
–45
–55
MAX
UNIT
A
V
V
V
Output current will decrease with increasing temperature but will not drop below 1 A at the maximum specified temperature.
6.8 Typical Characteristics
8
Figure 1. Dropout Voltage
Figure 2. Dropout Voltage vs. Temperature
Figure 3. Output Voltage vs. Temperature
Figure 4. Quiescent Current vs. Temperature
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Typical Characteristics (continued)
Figure 5. Quiescent Current
Figure 6. Quiescent Current
Figure 7. Line Transient Response
Figure 8. Load Transient Response
Figure 9. Ripple Rejection
Figure 10. Low Voltage Behavior
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Typical Characteristics (continued)
10
Figure 11. Low Voltage Behavior
Figure 12. Low Voltage Behavior
Figure 13. Low Voltage Behavior
Figure 14. Low Voltage Behavior
Figure 15. Output at Voltage Extremes
Figure 16. Output at Voltage Extremes
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Typical Characteristics (continued)
Figure 17. Output at Voltage Extremes
Figure 18. Output at Voltage Extremes
Figure 19. Output at Voltage Extremes
Figure 20. Output Capacitor ESR
Figure 21. Peak Output Current
Figure 22. Output Impedance
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Typical Characteristics (continued)
Figure 23. Maximum Power Dissipation (TO-220)
Figure 24. Maximum Power Dissipation (SOT-223)
Figure 25. Maximum Power Dissipation (DDPAK/TO-263)
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7 Detailed Description
7.1 Overview
The LM2940 positive voltage regulator features the ability to source 1 A of output current with a dropout voltage
of typically 0.5 V and a maximum of 1 V over the entire temperature range. Furthermore, a quiescent current
reduction circuit has been included which reduces the ground current when the differential between the input
voltage and the output voltage exceeds approximately 3 V. The quiescent current with 1 A of output current and
an input-output differential of 5 V is therefore only 30 mA. Higher quiescent currents only exist when the regulator
is in the dropout mode (VIN – VOUT ≤ 3 V).
7.2 Functional Block Diagram
IN
OUT
PNP
OVSD
(§30 V)
Current
Limit
Thermal
Shutdown
+
Bandgap
Reference
GND
7.3 Feature Description
7.3.1 Short-Circuit Current Limit
The internal current limit circuit is used to protect the LDO against high-load current faults or shorting events. The
LDO is not designed to operate in a steady-state current limit. During a current-limit event, the LDO sources
constant current. Therefore, the output voltage falls when load impedance decreases. Note, also, that if a current
limit occurs and the resulting output voltage is low, excessive power may be dissipated across the LDO, resulting
a thermal shutdown of the output.
7.3.2 Overvoltage Shutdown (OVSD)
Input voltage greater than typically 30 V will cause the LM2940 output to be disabled. When operating with the
input voltage greater than the maximum recommended input voltage of 26 V, the device performance is not
ensured. Continuous operation with the input voltage greater than the maximum recommended input voltage is
discouraged.
7.3.3 Thermal Shutdown (TSD)
The LM2940 contains the thermal shutdown circuitry to turn off the output when excessive heat is dissipated in
the LDO. The internal protection circuitry of the LM2940 is designed to protect against thermal overload
conditions. The TSD circuitry is not intended to replace proper heat sinking. Continuously running the device into
thermal shutdown degrades its reliability as the junction temperature will be exceeding the absolute maximum
junction temperature rating.
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7.4 Device Functional Modes
7.4.1 Operation with Enable Control
The LM2940 design does not include any undervoltage lockout (UVLO), or enable functions. Generally, the
output voltage will track the input voltage until the input voltage is greater than VOUT + 1V. When the input
voltage is greater than VOUT + 1 V, the LM2940 will be in linear operation, and the output voltage will be
regulated. However, the device will be sensitive to any small perturbation of the input voltage. Device dynamic
performance is improved when the input voltage is at least 2 V greater than the output voltage.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM2940-N and LM2940C positive voltage regulators feature the ability to source 1 A of output current with a
dropout voltage of typically 0.5 V and a maximum of 1 V over the entire temperature range. The output capacitor,
COUT, must have a capacitance value of at least 22 µF with an ESR of at least 100 mΩ, but no more than 1 Ω.
The minimum capacitance value and the ESR requirements apply across the entire expected operating ambient
temperature range.
8.2 Typical Application
VIN
Unregulated Input
LM2940
IN
VOUT
Regulated Output
OUT
+ COUT**
C1*
0.47 µF
22 µF
IQ
*Required if regulator is located far from power supply filter.
**COUT must be at least 22 μF to maintain stability. May be increased without bound to maintain regulation during
transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating
temperature range as the regulator and the ESR is critical; see curve.
Figure 26. Typical Application
8.2.1 Design Requirements
Table 1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input voltage range
6 V to 26 V
Output voltage range
8V
Output current range
5 mA to 1 A
Input capacitor value
0.47 µF
Output capacitor value
22 µF minimum
Output capacitor ESR range
100 mΩ to 1 Ω
8.2.2 Detailed Design Procedure
8.2.2.1 External Capacitors
The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both
equivalent series resistance (ESR) and minimum amount of capacitance.
8.2.2.1.1 Minimum Capacitance
The minimum output capacitance required to maintain stability is 22 μF (this value may be increased without
limit). Larger values of output capacitance will give improved transient response.
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8.2.2.1.2 ESR Limits
The ESR of the output capacitor will cause loop instability if it is too high or too low. The acceptable range of
ESR plotted versus load current is shown in the graph below. It is essential that the output capacitor meet these
requirements, or oscillations can result.
Figure 27. Output Capacitor ESR Limits
It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer
must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the
design.
For aluminum electrolytic capacitors, ESR will increase by about 30X as the temperature is reduced from 25°C to
−40°C. This type of capacitor is not well-suited for low temperature operation.
Solid tantalum capacitors have a more stable ESR over temperature, but are more expensive than aluminum
electrolytics. A cost-effective approach sometimes used is to parallel an aluminum electrolytic with a solid
tantalum, with the total capacitance split about 75/25% with the aluminum being the larger value.
If two capacitors are paralleled, the effective ESR is the parallel of the two individual values. The flatter ESR of
the tantalum will keep the effective ESR from rising as quickly at low temperatures.
8.2.3 Application Curves
Figure 28. Low Voltage Behavior
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Figure 29. Output at Voltage Extremes
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9 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between VOUT + 1 V up to a maximum of
26 V. This input supply must be well regulated and free of spurious noise. To ensure that the LM2940 output
voltage is well regulated, the input supply should be at least VOUT + 2 V.
10 Layout
10.1 Layout Guidelines
The dynamic performance of the LM2940 is dependent on the layout of the PCB. PCB layout practices that are
adequate for typical LDOs may degrade the PSRR, noise, or transient performance of the LM2940. Best
performance is achieved by placing CIN and COUT on the same side of the PCB as the LM2940, and as close as
is practical to the package. The ground connections for CIN and COUT should be back to the LM2940 ground pin
using as wide and short of a copper trace as is practical.
10.2 Layout Examples
Ground
5
1
6
2
CIN
COUT
GND
VIN
3
7
4
8
VOUT
Figure 30. LM2940 WSON Layout
4
3
2
COUT
1
CIN
VIN
VOUT
Ground
Figure 31. LM2940 SOT-223 Layout
4
CIN
VIN
COUT
1
2
3
VOUT
Ground
Figure 32. TO-263 Layout
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10.3 Heatsinking
A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of
the application. Under all possible operating conditions, the junction temperature must be within the range
specified under Absolute Maximum Ratings (1) (2).
To determine if a heatsink is required, the power dissipated by the regulator, PD, must be calculated.
Figure 33 shows the voltages and currents which are present in the circuit, as well as the formula for calculating
the power dissipated in the regulator:
IIN = IL + IG
PD = (VIN − VOUT) IL + (VIN) IG
Figure 33. Power Dissipation Diagram
The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX). This is
calculated by using the formula:
TR(MAX) = TJ(MAX) − TA(MAX)
where
•
•
TJ(MAX) is the maximum allowable junction temperature, which is 125°C for commercial grade parts.
TA(MAX)is the maximum ambient temperature which will be encountered in the application.
(1)
Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal
resistance, RθJA, can now be found:
RθJA = TR(MAX) / PD
(2)
NOTE
If the maximum allowable value for RθJA is found to be ≥ 23.3°C/W for the TO-220
package (with a heatsink of 21.7°C/W RθSA), ≥ 40.9°C/W for the DDPAK/TO-263 package,
or ≥ 59.3°C/W for the SOT-223 package, no heatsink is needed since the package alone
will dissipate enough heat to satisfy these requirements.
If the calculated value for RθJA falls below these limits, a heatsink is required.
(1)
(2)
18
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are
conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions
see the Electrical Characteristics (5 V and 8 V).
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
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Heatsinking (continued)
10.3.1 Heatsinking TO-220 Package Parts
The TO-220 can be attached to a typical heatsink, or secured to a copper plane on a PC board.
If a manufactured heatsink is to be selected, the value of heatsink-to-ambient thermal resistance, RθSA, must first
be calculated:
RθSA = RθJA − RθCS − RθJC
where
•
•
RθJC is defined as the thermal resistance from the junction to the surface of the case. A value of 3°C/W can be
assumed for RθJC for this calculation.
RθCS is defined as the thermal resistance between the case and the surface of the heatsink. The value of RθCS
will vary from about 0.5°C/W to about 2.5°C/W (depending on method of attachment, insulator, etc.). If the
exact value is unknown, 2°C/W should be assumed for RθCS.
(3)
When a value for RθSA is found using Equation 3, a heatsink must be selected that has a value that is less than
or equal to this number.
RθSA is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots
temperature rise vs power dissipation for the heatsink.
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
• Application Note AN-1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036).
• Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401).
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LM2940-N
Click here
Click here
Click here
Click here
Click here
LM2940C
Click here
Click here
Click here
Click here
Click here
11.3 Trademarks
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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30-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LM2940CS-12
NRND
DDPAK/
TO-263
KTT
3
45
Non-RoHS
& Green
Call TI
Level-3-235C-168 HR
0 to 125
LM2940CS
-12 P+
LM2940CS-12/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
0 to 125
LM2940CS
-12 P+
LM2940CS-15
NRND
DDPAK/
TO-263
KTT
3
45
Non-RoHS
& Green
Call TI
Level-3-235C-168 HR
0 to 125
LM2940CS
-15 P+
LM2940CS-15/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
0 to 125
LM2940CS
-15 P+
LM2940CS-5.0
NRND
DDPAK/
TO-263
KTT
3
45
Non-RoHS
& Green
Call TI
Level-3-235C-168 HR
0 to 125
LM2940CS
-5.0 P+
LM2940CS-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
0 to 125
LM2940CS
-5.0 P+
LM2940CS-9.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
0 to 125
LM2940CS
-9.0 P+
LM2940CSX-12
NRND
DDPAK/
TO-263
KTT
3
500
Non-RoHS
& Green
Call TI
Level-3-235C-168 HR
0 to 125
LM2940CS
-12 P+
LM2940CSX-12/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
0 to 125
LM2940CS
-12 P+
LM2940CSX-15/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
0 to 125
LM2940CS
-15 P+
LM2940CSX-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
0 to 125
LM2940CS
-5.0 P+
LM2940CSX-9.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
0 to 125
LM2940CS
-9.0 P+
LM2940CT-12
NRND
TO-220
NDE
3
45
Non-RoHS
& Green
Call TI
Level-1-NA-UNLIM
0 to 125
LM2940CT
-12 P+
LM2940CT-12/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
0 to 125
LM2940CT
-12 P+
LM2940CT-15
NRND
TO-220
NDE
3
45
Non-RoHS
& Green
Call TI
Level-1-NA-UNLIM
0 to 125
LM2940CT
-15 P+
LM2940CT-15/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
0 to 125
LM2940CT
-15 P+
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Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LM2940CT-5.0
NRND
TO-220
NDE
3
45
Non-RoHS
& Green
Call TI
Level-1-NA-UNLIM
LM2940CT-5.0/LF01
ACTIVE
TO-220
NDG
3
45
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
LM2940CT-5.0/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
0 to 125
LM2940CT
-5.0 P+
LM2940CT-9.0/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
0 to 125
LM2940CT
-9.0 P+
LM2940IMP-10/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
L55B
LM2940IMP-12/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
L56B
LM2940IMP-15
NRND
SOT-223
DCY
4
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 85
L70B
LM2940IMP-15/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
L70B
LM2940IMP-5.0
NRND
SOT-223
DCY
4
1000
Non-RoHS
& Green
Call TI
Level-1-260C-UNLIM
-40 to 85
L53B
LM2940IMP-5.0/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
L53B
LM2940IMP-9.0/NOPB
ACTIVE
SOT-223
DCY
4
1000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
L0EB
LM2940IMPX-10/NOPB
ACTIVE
SOT-223
DCY
4
2000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
L55B
LM2940IMPX-12/NOPB
ACTIVE
SOT-223
DCY
4
2000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
L56B
LM2940IMPX-5.0/NOPB
ACTIVE
SOT-223
DCY
4
2000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
L53B
LM2940IMPX-8.0/NOPB
ACTIVE
SOT-223
DCY
4
2000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
L54B
LM2940LD-12
NRND
WSON
NGN
8
1000
Non-RoHS
& Green
Call TI
Level-1-235C-UNLIM
-40 to 125
L00018B
LM2940LD-12/NOPB
ACTIVE
WSON
NGN
8
1000
RoHS & Green
SN
Level-3-260C-168 HR
-40 to 125
L00018B
LM2940LD-5.0/NOPB
ACTIVE
WSON
NGN
8
1000
RoHS & Green
SN
Level-3-260C-168 HR
-40 to 125
L00014B
LM2940S-10
NRND
DDPAK/
TO-263
KTT
3
45
Non-RoHS
& Green
Call TI
Level-3-235C-168 HR
-40 to 125
LM2940S
-10 P+
Addendum-Page 2
0 to 125
LM2940CT
-5.0 P+
LM2940CT
-5.0 P+
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Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LM2940S-10/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
-40 to 125
LM2940S
-10 P+
LM2940S-12
NRND
DDPAK/
TO-263
KTT
3
45
Non-RoHS
& Green
Call TI
Level-3-235C-168 HR
-40 to 125
LM2940S
-12 P+
LM2940S-12/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
-40 to 125
LM2940S
-12 P+
LM2940S-5.0
NRND
DDPAK/
TO-263
KTT
3
45
Non-RoHS
& Green
Call TI
Level-3-235C-168 HR
-40 to 125
LM2940S
-5.0 P+
LM2940S-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
-40 to 125
LM2940S
-5.0 P+
LM2940S-8.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
-40 to 125
LM2940S
-8.0 P+
LM2940S-9.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
-40 to 125
LM2940S
-9.0 P+
LM2940SX-10
NRND
DDPAK/
TO-263
KTT
3
500
Non-RoHS
& Green
Call TI
Level-3-235C-168 HR
-40 to 125
LM2940S
-10 P+
LM2940SX-10/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
-40 to 125
LM2940S
-10 P+
LM2940SX-12
NRND
DDPAK/
TO-263
KTT
3
500
Non-RoHS
& Green
Call TI
Level-3-235C-168 HR
-40 to 125
LM2940S
-12 P+
LM2940SX-12/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
-40 to 125
LM2940S
-12 P+
LM2940SX-5.0
NRND
DDPAK/
TO-263
KTT
3
500
Non-RoHS
& Green
Call TI
Level-3-235C-168 HR
-40 to 125
LM2940S
-5.0 P+
LM2940SX-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
-40 to 125
LM2940S
-5.0 P+
LM2940SX-8.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
-40 to 125
LM2940S
-8.0 P+
LM2940SX-9.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
-40 to 125
LM2940S
-9.0 P+
LM2940T-10.0
NRND
TO-220
NDE
3
45
Non-RoHS
& Green
Call TI
Level-1-NA-UNLIM
-40 to 125
LM2940T
10.0 P+
LM2940T-10.0/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
-40 to 125
LM2940T
10.0 P+
Addendum-Page 3
Samples
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30-Sep-2021
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LM2940T-12.0
NRND
TO-220
NDE
3
45
Non-RoHS
& Green
Call TI
Level-1-NA-UNLIM
-40 to 125
LM2940T
12.0 P+
LM2940T-12.0/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
-40 to 125
LM2940T
12.0 P+
LM2940T-5.0
NRND
TO-220
NDE
3
45
Non-RoHS
& Green
Call TI
Level-1-NA-UNLIM
-40 to 125
LM2940T
-5.0 P+
LM2940T-5.0/LF08
ACTIVE
TO-220
NEB
3
45
RoHS & Green
SN
Level-3-245C-168 HR
LM2940T-5.0/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
-40 to 125
LM2940T
-5.0 P+
LM2940T-8.0
NRND
TO-220
NDE
3
45
Non-RoHS
& Green
Call TI
Level-1-NA-UNLIM
-40 to 125
LM2940T
-8.0 P+
LM2940T-8.0/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
-40 to 125
LM2940T
-8.0 P+
LM2940T-9.0
NRND
TO-220
NDE
3
45
Non-RoHS
& Green
Call TI
Level-1-NA-UNLIM
-40 to 125
LM2940T
-9.0 P+
LM2940T-9.0/NOPB
ACTIVE
TO-220
NDE
3
45
RoHS & Green
SN
Level-1-NA-UNLIM
-40 to 125
LM2940T
-9.0 P+
LM2940T
-5.0 P+
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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