LM3152-3.3DEMO

National Semiconductor RD-164 Maurice Eaglin October 2008 1.0 Design Specifications Inputs Output #1 VinMin=6V Vout1=3.3V VinMax=24V Iout1=10A 2.0 Design Description The LM3152-3.3 demonstration board is part of the PowerWise® family of SIMPLE SWITCHER® Controllers. It has been designed to balance solution size and performance. The Constant-On-Time (COT) Emulated Ripple Mode (ERM) Control allows for the use of low ESR output capacitors and therefore decreases the output voltage ripple while maintaining a fast transient response. There is no loop compensation required for the COT architecture, as there is in voltage-mode and current mode control architectures, which helps to facilitate the ease of design and fast transient response. The demo board uses a 2-layer, 2 ounce copper PCB with all of the components mounted on the top side. The LM3152-3.3 IC has a fixed output voltage of 3.3V and will operate over the input voltage range of 6V to 24V at 10A load current. The components within the dashed line of the board photo in Figure 3, represent the total design solution. The aluminum electrolytic input capacitor Cin1 is used for input filter damping when using long leads, which contributes to parasitic induc- tance in the lab while using the demo board. Cin1 along with the input/output posts and EN test point connector may not be needed when the final circuit is integrated in the system design. 3.0 Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Easy To Use with Webench and Offline Design Tools No Loop Compensation Required Low Solution Component Count Ultra-Fast Transient Response Low Output Voltage Ripple (32mVpp) 3.3V Fixed Output Voltage Optimized for 10A Average Load Current 95% Peak Efficiency Constant-On-Time with Emulated Ripple Mode Control 500kHz Switching Frequency LM3152-3.3 Demonstration Board LM3152-3.3 Demonstration Board RD-164 © 2008 National Semiconductor Corporation www.national.com D C B GND Cin1 100uF 2 PGND SGND 1 Cin2 10uF PGND Cin3 10uF Cen Cbyp 0.1uF SGND Css 68n EN SGND Css 6 EN 3 Vin 2 SS EN VIN U1 LM3152MH-3.3 HG VCC BOOT SW LG FB SGND 11 1 12 10 13 4 SW Cvcc 4.7uF 4 4 Cbst PGND 0.47uF LG BST Vcc HG PGND M2 SW M1 3 1.65uH L1 2 3 Vo Co1 150uF PGND Vo GND Co2 150uF 4 schematic6 Cf 4 Designed for: Public Release Mod. Date: 8/14/2008 Project: LM3152-3.3 Demo Boards Sheet Title: Sheet: 1 of 1 Size: Letter Schematic: 870 600103 Rev: C Assembly Variant: Variant name is not interpreted until output File: LM3152-3p3 SO8.SchDoc CADC: http://www.national.com Contact: http://www.national.com/support/ © Copyright, National Semiconductor, 2007 FIGURE 1. LM3152-3.3 Demo Board Schematic PGND 2 National Semiconductor and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. National and/or its licensors do not warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. National and/or its licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application. EP Vin PGND 14 SGND SGND SGND SGND 5 7 8 9 5, 6, 7, 8 1, 2, 3 5, 6, 7, 8 www.national.com 1, 2, 3 A 1 D C B A RD-164 4.0 Schematic FIGURE 2. Bill of Materials Designator Manufacturer Part Number Value U1 National Semiconductor LM3152MH-3.3 Cbst TDK C2012X7R1C474K 0.47uF Cbyp TDK C2012X7R1H104K 0.1uF Cen TDK C1005X7R1H102K 1000pF Cf Cin1 Panasonic EEV-FK1J101P 100uF Cin2, Cin3 Taiyo Yuden GMK325BJ106KN-T 10uF Co1, Co2 Panasonic EEF-UE0J151R 150uF Css AVX 0603YC683KAT2A 0.068uF Cvcc MuRata GRM21BR71C475KA73L 4.7uF L1 Coilcraft Inc. HA3778-AL 1.65uH M1, M2 Renesas RJK0305DB 30V Parameters Simple Controller Ceramic, 0805, X7R, 16V, 10% Ceramic, 0805, X7R, 50V, 10% Ceramic, 0402, X7R, 50V, 10% Not Fitted AL, EEV-FK, 63V, 20% Ceramic, 1210, X5R, 35V, 10% Polymer AL, UE, 6.3V, 20% Ceramic, 0603, X7R, 16V, 10% Ceramic, 0805, X7R, 16V, 10% Shielded Drum Core, 17A, 2.53mΩ LFPAK, 30Vds, N-MOSFET bom3 RD-164 5.0 Bill of Materials 3 www.national.com RD-164 6.0 Other Operating Values Operating Values Description Parameter Value Unit Switching Frequency Frequency 500 KHz Max Average Load Current Iout 10 A Max Steady State Efficiency Efficiency 95 % Control Scheme Control Scheme COT Peak-to-Peak Output Ripple Voltage Voutp-p 32 mV Minimum Input Voltage Vinmin 6 V Maximum Input Voltage Vinmax 24 V 7.0 Board Photos boardphoto4 FIGURE 3. LM3152-3.3 Demo Board Photo www.national.com 4 CONNECTOR POSTS DESCRIPTIONS Vin: This post is used to connect to the input voltage supply rail. Input voltage ranges between 6V and 24V and the max nominal input current is 6A. Appropriate leads should be connected to this terminal that can handle this amount of input current plus fault conditions which could have input currents as high 10A peak. Therefore, it is recommended to use 16 gauge wire as a minimum for the input leads. GND: There are two GND posts which are connected to the ground of the IC. One should be used for the input voltage supply and the other should be used for the output voltage. The GND post closest to the input supply post Vin should be used for the input supply ground, and likewise the GND post closest to the output post Vo should be used for the Vo ground. For the Vin ground connector lead it is recommended to use 16 gauge wire or larger. Whereas the output ground connector lead is recommended to use 15 gauge wire or larger. Vo: This post connects to the output voltage of the LM3152-3.3 Simple Controller. When connecting the load to this post, it is recommended to use 15 gauge wire or larger. The max average load current is designed for 10A with a cur- MEASURING RIPPLE To get an accurate measurement of the output ripple voltage it is necessary to eliminate the long pig-tale from the scope probe and use a short ground connector or just the shaft of the barrel to connect to ground. This will minimize parasitic inductance from the scope probe and allow for a more accurate measurement. The output voltage ripple measurement should be taken directly across the output capacitors. As a matter of convenience, the measurement can also be taken across the output terminals if a ceramic 1µF capacitor is mounted on Cf (1206 footprint) to minimize parasitic inductance from the terminals to the output capacitors. COMPONENT TEMPERATURE RISE The temperature rise of each device was measured on the case of each device in still air at room temperature. 9.0 Layouts layout7 FIGURE 4. Top Layer layout8 FIGURE 5. Bottom Layer 5 www.national.com RD-164 rent limit of 15A using the Rdson of the low side FET to set the current limit trip point. EN: This post is connected to the enable pin of the LM3152-3.3 IC. When left floating a 1MΩ pull-up resistor to Vin will enable the device. 8.0 Quick Start RD-164 layout9 FIGURE 6. Bottom Silkscreen 10.0 Waveforms waveform1 FIGURE 7. Component Temp Rise vs Load Vin = 6V waveform2 FIGURE 8. Component Temp Rise vs Load Vin = 12V www.national.com 6 RD-164 waveform3 FIGURE 9. Component Temp Rise vs Load Vin = 18V waveform4 FIGURE 10. Component Temp Rise vs Load Vin = 24V waveform7 FIGURE 11. Load Transient 0A to 8A 7 www.national.com RD-164 waveform8 FIGURE 12. Load Transient 3.6A to 8A waveform9 FIGURE 13. Efficiency vs. Load Current www.national.com 8 RD-164 Notes 9 www.national.com LM3152-3.3 Demonstration Board Notes National Semiconductor's design tools attempt to recreate the performance of a substantially equivalent physical implementation of the design. Reference designs are created using National's published specifications as well as the published specifications of other device manufacturers. While National does update this information periodically, this information may not be current at the time the reference design is built. National and/or its licensors do not warrant the accuracy or completeness of the specifications or any information contained therein. National and/or its licensors do not warrant that any designs or recommended parts will meet the specifications you entered, will be suitable for your application or fit for any particular purpose, or will operate as shown in the simulation in a physical implementation. National and/or its licensors do not warrant that the designs are production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application. National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, 2. 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