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LM3200TLEV

LM3200TLEV

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    BOARD EVALUATION LM3200TL

  • 数据手册
  • 价格&库存
LM3200TLEV 数据手册
User's Guide SNVA110B – March 2005 – Revised April 2013 AN-1373 LM3200 Evaluation Board 1 Introduction The LM3200 evaluation board is a working demonstration of a buck converter. This document contains information about the board. For further information on buck converter topology and component selection please see the data sheet. 2 General Description The LM3200 converts high input voltages to lower output voltages with high efficiency. It does this through a inductor based switching topology, applying the input voltage to the inductor for a certain portion of the cycle. The duty cycle in PWM mode will be VOUT/VIN, which can be seen on the SW pin. There are three modes of operation: Fixed Frequency PWM (Pulse Width Modulation), Forced Bypass, and Shutdown mode. Setting the BYP pin low (≤0.4V) or leaving floating places the device in PWM mode. Setting the BYP pin high (≥1.2V) places the device in Forced Bypass mode. Setting the EN pin low (≤0.4V) places the device in Shutdown mode. Setting the EN pin high (≥1.2V) enables normal operation. At the PWM mode, the output voltage is setting by the voltage of the VCON pin, as in the following formula: VOUT = 3 x VCON 3 (1) Operating Conditions The board will operate under the following conditions: 2.7V ≤ VIN ≤ 5.5V 0.267V ≤ VCON ≤ 1.2V 0 mA ≤ IOUT ≤ 300 mA 4 Schematic VIN C4 0.1 F C1 PVIN 10 F VDD BYPOUT EN BYP VCON VCON L1 2.2 H VOUT SW LM3200 FB PGND SGND C2 4.7 F 0.267V to 1.20V Figure 1. Typical Operating Circuit All trademarks are the property of their respective owners. SNVA110B – March 2005 – Revised April 2013 Submit Documentation Feedback AN-1373 LM3200 Evaluation Board Copyright © 2005–2013, Texas Instruments Incorporated 1 Board Layout 5 www.ti.com Board Layout 2.2uH 4.7uF 10uF 0.1uF Vcon BYP EN Figure 2. Top Layer xxxxxxxxx-001 rev A LM3200 R7 R6 C3 R1 C5 R3 R2 Figure 3. Bottom Layer 2 AN-1373 LM3200 Evaluation Board SNVA110B – March 2005 – Revised April 2013 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Connection Diagrams www.ti.com 6 Connection Diagrams SGND A2 A3 BYPOUT VDD A1 B3 PVIN VCON B1 C3 SW FB C1 D3 PGND BYP D1 D2 EN Figure 4. Top View SGND A2 A1 VDD BYPOUT A3 B1 VCON PVIN B3 C1 FB SW C3 D1 BYP PGND D3 D2 EN A 10–Bump Thin DSBGA Package, Large Bump Figure 5. Bottom View Table 1. Pin Description Pin # Name Description A1 VDD Analog Supply Input. A 0.1 µF ceramic capacitor is recommended to be placed as close to this pin as possible. B1 VCON Voltage Control Analog input. VCON controls VOUT in PWM mode. Set: VOUT = 3 x VCON. Do not leave floating. C1 FB D1 BYP Bypass. Use this digital input to command operation in Bypass mode. Set the BYP pin high (> 1.2V ) for Bypass mode. Set BYP low (< 0.4V ) for normal operation. D2 EN Enable Input. Set this digital input high (> 1.2V) after Vin > 2.7V for normal operation. For shutdown, set low (< 0.4V). D3 PGND C3 SW Switching Node connection to the internal PFET switch and NFET synchronous rectifier. Connect to an inductor with a saturation current rating that exceeds the maximum Switch Peak Current Limit specification of the LM3200. B3 PVIN Power Supply Voltage Input to the internal PFET switch and Bypass FET. A3 BYPOUT Bypass FET Drain. Connect to the output capacitor. Do not leave floating. A2 SGND Feedback Analog Input. Connect to the output at the output filter capacitor. Power Ground Analog and Control Ground SNVA110B – March 2005 – Revised April 2013 Submit Documentation Feedback AN-1373 LM3200 Evaluation Board Copyright © 2005–2013, Texas Instruments Incorporated 3 BOM 7 www.ti.com BOM Manufacture Manufacture # Description C1 (input C) TDK C3216JB1A106K 10 µF,10V,20%,1206(3216) C2 (output C) TDK C2012JB0J475K 4.7µF,6.3V,20%,0805(2012) Coilcraft DO3314-222 2.2 µH inductor,1.6A Isat,0.2Ωmax. VIN banana jack - red Johnson Components 108-0902-001 conn banana jack insul nylong red VOUT banana jack - yellow Johnson Components 108-0907-001 conn banana jack insul nylong yellow GND banana jack - black Johnson Components 108-0903-001 conn banana jack insul nylong black C4 (input C) L1 (inductor) 0.1µF,10V,20%,0402(1005) COMMON TO ALL 4 AN-1373 LM3200 Evaluation Board SNVA110B – March 2005 – Revised April 2013 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. 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Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated
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