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LM3290TME/NOPB

LM3290TME/NOPB

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    DSBGA30

  • 描述:

    MUDULATOR RF

  • 数据手册
  • 价格&库存
LM3290TME/NOPB 数据手册
Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LM3290 SNVSA11A – AUGUST 2013 – REVISED JUNE 2014 LM3290 Product Brief 1 Features 2 Description • The LM3290, with its companion IC LM3291, is an RF envelope supply modulator (EM) with integrated DC-DC boost converter optimized for Envelope Tracking (ET) RF power amplifiers (PAs). The device enables maximum transmit output power independent of the input battery voltage (battery as low as 2.5 V) and is controlled by the MIPI® RFFE 1.1. 1 • • • • VOUT_RANGE – VOUT_ET = 0.6 V to 4.5 V – VOUT_APT = 0.4 V to 3.81 V (or VIN – 200 mV) DC Boost For ET Operation: – Boost Input Voltage Range: 2.5 V to 5 V – High-Efficiency (90% typical) with Internal Synchronous Rectification – Boost Bypass Function with Low Resistance (150 mΩ typ.) – 2.7-MHz PWM Switching Frequency Buck DC-DC for APT and ET Operation: – High Operating Frequency for Small External Inductor and Capacitors – VOUT_RANGE = 0.4 V to 3.81 V (or VIN – 200 mV) – High-Efficiency (95% typical) with Internal Synchronous Rectification – Low-Power PFM Mode LM3291 Control: – Automatic Control of LM3291 in ET Mode RFFE Control Interface: – 1.8-V MIPI® RFFE 1.1-Compatible Digital Control Interface – 26-MHz Write Capability – 13-MHz Read Capability MIPI eTrak 2.5 V - 5 V Active Mode 1: For low TX output power, LM3290 may operate in Average Power Tracking (APT) mode, providing a static, but programmable, output voltage to supply the PA. At light load and in APT mode, the LM3290 enters into Pulse Frequency Mode (PFM) operation automatically and operates with reduced switching frequency. In PFM mode, the quiescent current is reduced, which extends the battery life. Active Mode 2: In ET mode, the LM3290 with LM3291 efficiently provides a dynamic, highbandwidth supply voltage for the PA to maximize total EM + PA efficiency. The envelope modulator follows the envelope reference input signal delivered by the RFIC to the LM3291 via a differential analog input. The output is a single-ended power supply signal to the PA. The LM3290 and LM3291 support 3G, as well as LTE operation up to 20-MHz signal bandwidth. The LM3290 controls the LM3291 companion-IC through direct control signals, and no additional controls are needed from the system. Shutdown, standby, and idle modes turn the EM off and reduce battery current consumption. BATTERY MIPI RFFE RFIC or BBIC The LM3290 operates in two active modes: For the full datasheet, samples, or the EVM hardware and software please contact a TI representative at ET@list.ti.com. LM3291 LM3290 Device Information L PART NUMBER C LM3290 PACKAGE DSBGA (30) (1) BODY SIZE (NOM) 2.432 mm x 2.808 mm 3G/4G 3G/4G SB PA 3G/4G MBMM PA (1) For all available packages, see the orderable addendum at the end of the datasheet. space space space space 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM3290 SNVSA11A – AUGUST 2013 – REVISED JUNE 2014 www.ti.com 3 Revision History Changes from Original (August 2013) to Revision A • 2 Page Changed First page layout; added Device Information table; Device and Documentation Support page ............................ 1 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: LM3290 LM3290 www.ti.com SNVSA11A – AUGUST 2013 – REVISED JUNE 2014 4 Device and Documentation Support 4.1 Trademarks MIPI is a registered trademark of Mobile Industry Processor Interface Alliance. All other trademarks are the property of their respective owners. 4.2 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms and definitions. 5 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: LM3290 3 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM3290TME/NOPB NRND DSBGA YFQ 30 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -30 to 85 3290 LM3290TMX/NOPB NRND DSBGA YFQ 30 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -30 to 85 3290 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
LM3290TME/NOPB 价格&库存

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LM3290TME/NOPB
  •  国内价格 香港价格
  • 1+28.198521+3.42057
  • 10+25.3558310+3.07574
  • 25+23.9686325+2.90747
  • 100+20.77370100+2.51992

库存:0