LM3291TME/NOPB

LM3291 www.ti.com SNVSA12 – SEPTEMBER 2013 LM3291 Product Brief FEATURES DESCRIPTION • The LM3291 is a high-speed linear amplifier that, with its companion IC LM3290, constitutes an RF Envelope Modulator (EM) for supplying 3G/4G Power Amplifiers (PA) in envelope tracking systems. The amplifier provides extremely low output impedance and low output noise over a wide bandwidth. 1 23 • • • • • • • Highly Programmable High-Current Linear Amplifier > 75 MHz Typical Small Signal Bandwidth Extremely Low Output Impedance High Linearity Differential Analog Input Compatible with eTrak 1.0 Standard Low Output Noise When paired with the LM3290 provides a complete Envelope Modulator solution for 3G/4G Envelope Tracking Power Amplifiers. Automatically controlled through LM3290 in an envelope modulation solution using MIPI® RFFE 1.1-compatible interface. APPLICATIONS • • • 3G/LTE Handsets 3G//LTE Tablets 3G/LTE Data Cards and Wireless Modems MIPI eTrak 2.5V - 5V BATTERY MIPI RFFE RFIC or BBIC LM3291 LM3290 L C In conjunction with an Envelope Tracking (ET) capable RFIC and PA, the LM3291 and LM3290 greatly improve PA efficiency for 3G and LTE operation. In ET mode, the LM3291 and LM3290 provide envelope tracking supply voltage for the PA maximizing total EM + PA efficiency. The envelope modulator follows the differential envelope reference input signal delivered by the RFIC to the LM3291. The output is a single-ended dynamic power supply voltage to the PA. The LM3291 supports 3G and LTE operation up to 20 MHz signal bandwidth. The LM3291’s programmable parameters are controlled by LM3290 via a direct serial interface between the two devices. No additional controls are needed in the system. This interface provides flexible control and adjustment options to optimize LM3291 efficiency and noise performance for various frequency bands and power levels. 3G/4G 3G/4G SB PA 3G/4G MBMM PA At high TX output power, the EM can be operated in ET mode where LM3290 and LM3291 together modulate the supply of the PA with the envelope signal to improve overall system efficiency. At low TX output power, the EM can be transitioned to Average Power Tracking (APT) mode where LM3291 is placed into shutdown mode to improve system efficiency. The LM3291 is available in a 12-pin lead-free DSBGA package. For the full datasheet, samples, or the EVM hardware and software please contact a TI representative at ET@list.ti.com. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. MIPI is a registered trademark of Mobile Industry Processor Interface Alliance. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM3291TME/NOPB NRND DSBGA YFQ 12 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -30 to 85 AE LM3291TMX/NOPB NRND DSBGA YFQ 12 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -30 to 85 AE (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of