User's Guide
SNVA220C – May 2007 – Revised April 2013
AN-1585 LM3402 and LM3404 High Power SO PowerPAD-8
Evaluation Board
1
Introduction
The LM3402/02HV and LM3404/04HV are buck-regulator derived, controlled current sources designed to
drive a series string of high power, high brightness LEDs (HBLEDs) such as the Luxeon™ K2 Emitter at
forward currents of up to 0.5A (LM3402/02HV) or 1.0A (LM3404/04HV). This evaluation board
demonstrates the enhanced thermal performance of the SO PowerPAD-8 package option of any of those
four ICs. The LM3404 was chosen for the example circuit because the combination of high output current,
high input voltage, and high duty cycle create the greatest demand for low junction-to-ambient thermal
resistance (θJA). Note that the LM3404/04HV in SO-8 can also be used with this evaluation board, with
reduced thermal performance.
LED drivers are often placed in small, closed spaces with no air flow and high ambient temperature due to
the dissipation of the LEDs. When properly soldered the SO PowerPAD-8 package offers a θJA that is as
little as one-half that of the standard SO-8 package, and as little as one-third that of the MSOP-8 package.
2
Circuit Performance with LM3404
This evaluation board uses the LM3404 to provide a constant forward current of 1.0A ±10% to a string of
ten series-connected HBLEDs with a forward voltage of approximately 3.7V each from an input of 48V
±5%. The LED ripple current, ΔiF, will not exceed 80 mAP-P, and the switching frequency is 550 kHz ± 10%.
The circuit can operate over an extended input voltage range of 40V to 60V, however output current may
exceed the ±10% specification.
CB
10 nF
VIN = 48V ±5%
L1
VIN
CIN1
CIN2
2.2 PF
2.2 PF
BOOT
SW
RON
47 PH
Vo/LED+
D1
536 k:
CO
RON
0.47 PF
LM3404HV
CS/LED-
CS
OFF
RSNS
DIM
DIM
GND
0.2:
VCC
CF
0.1 PF
Figure 1. Standard Schematic
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SNVA220C – May 2007 – Revised April 2013
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AN-1585 LM3402 and LM3404 High Power SO PowerPAD-8 Evaluation
Board
Copyright © 2007–2013, Texas Instruments Incorporated
1
Thermal Performance
3
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Thermal Performance
The SO PowerPAD-8 package is pin-for-pin compatible with the SO-8 package with the exception of the
thermal pad, or exposed die attach paddle (DAP). The DAP is electrically connected to system ground.
When the DAP is properly soldered to an area of copper on the top layer, bottom layer, internal planes, or
combinations of various layers, the θJA of the LM3404/04HV can be significantly lower than that of the SO8 package or VSSOP-8 package in the case of the LM3402/02HV. The SO PowerPAD-8 evaluation board
is two layers of 1oz copper each, and measures 1.25" by 1.95". The DAP is soldered to approximately one
square inch of top and two square inches of bottom layer copper. Five thermal vias connect the DAP to
the bottom layer of the PCB, and the recommended DAP/via layout is shown in Figure 2.
90 mil
10 mil
10 mil
90 mil
35 mil
35 mil
Figure 2. Thermal Pad and Via Layout
Calibrated testing was performed on the SO PowerPAD-8 evaluation board to compare the performance
of the SO PowerPAD-8 with the DAP soldered and the standard SO-8 package. The example circuit
dissipation is approximately 1.1W. (see the LM3404/04HV datasheet for detailed thermal calculations.) For
dissipation ranging from 0.5W to 1.5W the θJA of the SO PowerPAD-8 package is 50°C/W ±10%. The θJA
of the SO-8 package is 100°C/W ±10%.
4
Connecting to LED Array
The LM3404/04HV Evaluation Board includes a female 6-pin SIP, J1, connector as well as two standard
94mil turret connectors for the cathode and anode connections of the LED array. Figure 3 shows the
pinout of J1. Solid 18 or 20 gauge wire with about 1 cm of insulation stripped away makes a convenient,
solderless connection to J1.
P6
Cathode of
Last LED
C535676
Connector
P1
Anode of
First LED
Figure 3. LED Connector
5
Setting the LED Current
The default forward current IF delivered to the LED array is 1.0A, typical of many 3W LEDs. To adjust this
value the current setting resistor RSNS can be changed according to the following equation:
2
AN-1585 LM3402 and LM3404 High Power SO PowerPAD-8 Evaluation
Board
Copyright © 2007–2013, Texas Instruments Incorporated
SNVA220C – May 2007 – Revised April 2013
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PWM Dimming
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0.2 x L
RSNS =
IF x L + VO x tSNS -
VIN - VO
x tON
2
(1)
(2)
tSNS = 220 ns
This resistor should be rated to handle the power dissipation of the LED current. For this example, the
closest 5% tolerance resistor to set an LED current of 1.0A is 0.2 Ω. In steady state this resistor will
dissipate (1.0 x 0.2) = 200 mW, indicating that a resistor with a 1/4W power rating is appropriate.
6
PWM Dimming
The DIM terminal on the PCB provides an input for a pulse width modulation signal for dimming of the
LED array. In order to fully enable and disable the LM3404/04HV the PWM signal should have a
maximum logic low level of 0.8V and a minimum logic high level of 2.2V. The maximum PWM dimming
frequency, minimum PWM duty cycle and maximum duty cycle are illustrated in Figure 4. PWM frequency
should be at least one order of magnitude below the LM3404/04HV switching frequency. The interval tD
represents the delay from a logic high at the DIM pin to the onset of the output current. The quantities tSU
and tSD represent the time needed for the output current to slew up to steady state and slew down to zero,
respectively. Typical response time is shown in Typical Performance Characteristics.
T
T
T
DIM
D
tD
DMIN
tSD
tSU
tD
DMAX
tSU
tSD
tD
tSU
tSD
IF
T=
1
fPWM
DMIN =
T - tSD
tD + tSU
T
DMAX =
T
Figure 4. PWM Dimming Limits
The logic of DIM is direct, hence the LM3404 will deliver regulated output current when the voltage at DIM
is high, and the current output is disabled when the voltage at DIM is low. Connecting a constant logic low
will disable the output, and the LM3404/04HV is enabled if the DIM pin is open-circuited. The DIM function
disables only the power MOSFET, leaving all other circuit blocks functioning to minimize the converter
response time.
SNVA220C – May 2007 – Revised April 2013
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AN-1585 LM3402 and LM3404 High Power SO PowerPAD-8 Evaluation
Board
Copyright © 2007–2013, Texas Instruments Incorporated
3
Low Power Shutdown
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Low Power Shutdown
The LM3404 can be placed into a low power shutdown (IQ typically 90 µA) by grounding the OFF*
terminal. During normal operation this terminal should be left open-circuit.
8
Bill of Materials
Table 1. Bill of Materials
4
ID
Part Number
Type
Size
Parameters
Qty
Vendor
U1
LM3404
LED Driver
SO
PowerPAD-8
75V, 1.0A
1
NSC
L1
SLF10145T- 470M1R4
Inductor
10.1 x 10.1 x
4.5mm
47µH, 1.4A, 0.1Ω
1
TDK
D1
CMSH2-60M
Schottky Diode
SMA
60V, 2A
1
Central Semi
Cf
VJ0603Y104KXXAT
Capacitor
0603
100nF 10%
1
Vishay
Cb
VJ0603Y103KXXAT
Capacitor
0603
10nF 10%
1
Vishay
Cin1, Cin2
C4532X7R2A225M
Capacitor
1812
2.2µF, 100V
2
TDK
Co
C3216X7R2A474M
Capacitor
1206
0.47µF, 100V
1
TDK
Rsns
ERJ8BQFR20V
Resistor
1206
0.2Ω 1%
1
Panasonic
Ron
CRCW06035363F
Resistor
0603
536kΩ 1%
1
Vishay
DIM1, OFF*
160-1512
Terminal
0.062”
2
Cambion
GND, VIN,
Vo/LED+,
CS/LED-
160-1026
Terminal
0.094”
5
Cambion
J1
535676-5
Connector
Custom
1
Tyco/AMP
AN-1585 LM3402 and LM3404 High Power SO PowerPAD-8 Evaluation
Board
Copyright © 2007–2013, Texas Instruments Incorporated
6 Pins
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Typical Performance Characteristics
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9
Typical Performance Characteristics
DIM Pin Enable
DIM
DIM Pin Disable
DIM
5V/Div
5V/Div
200 mA/Div
200 mA/Div
IF
IF
2 Ps/DIV
4 Ps/DIV
Switching Waveforms
Output Ripple Current
200 mA/Div
20 mA/Div
IF
IF
SW
10V/Div
1 Ps/DIV
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1 Ps/DIV
AN-1585 LM3402 and LM3404 High Power SO PowerPAD-8 Evaluation
Board
Copyright © 2007–2013, Texas Instruments Incorporated
5
Layout
10
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Layout
Figure 5. Top Layer and Top Overlay
Figure 6. Bottom Layer and Bottom Overlay
6
AN-1585 LM3402 and LM3404 High Power SO PowerPAD-8 Evaluation
Board
Copyright © 2007–2013, Texas Instruments Incorporated
SNVA220C – May 2007 – Revised April 2013
Submit Documentation Feedback
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