LM3414HVMRX/NOPB

Sample & Buy Product Folder Support & Community Tools & Software Technical Documents Reference Design LM3414, LM3414HV SNVS678F – JUNE 2010 – REVISED NOVEMBER 2015 LM3414/HV 1-A, 60-W Common Anode-Capable Constant Current Buck LED Driver Requires No External Current Sensing Resistor 1 Features • 1 • • • • • • • • • • • 3 Description (1) Supports LED Power up to 60 W : 18x 3-W HBLEDs Requires No External Current Sensing Resistor ±3% LED Current Accuracy Up to 96% Efficiency High Contrast Ratio (Minimum Dimming Current Pulse Width 0. D1 LM3414 / LM3414HV CVCC VCC R1 PGND IADJ GND GND Q1 Analog temperature sensor GND VIN U1 GND CIN GND LX PWM dimming signal DIM FS * DAP connect to GND R2 L1 High power LED Array Vin VCC RFS GND RIADJ GND Figure 19. Application Circuit of LM3414/HV With Temperature Fold-Back Circuitry and PWM Dimming 14 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: LM3414 LM3414HV LM3414, LM3414HV www.ti.com SNVS678F – JUNE 2010 – REVISED NOVEMBER 2015 Feature Description (continued) 7.3.6 Internal VCC Regulator The LM3414/HV features a 5.4-V internal voltage regulator that connects between the VIN and VCC pins for powering internal circuitry and provide biases to external components. The VCC pin must be bypassed to the GND pin with a 1-µF ceramic capacitor, CVCC that connected to the pins as close as possible. When the input voltage falls to less than 6 V, the VCC voltage will drop to less than 5.4 V and decrease proportionally as Vin decreases. The device will shutdown as the VCC voltage falls to less than 3.9 V. When the internal regulator is used to provide bias to external circuitry, it is essential to ensure the current sinks from VCC pin does not exceed 2 mA to maintain correct voltage regulation. 7.4 Device Functional Modes There are no additional functional modes for this device. Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: LM3414 LM3414HV Submit Documentation Feedback 15 LM3414, LM3414HV SNVS678F – JUNE 2010 – REVISED NOVEMBER 2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information 8.1.1 Setting the Switching Frequency Both the LM3414 and LM3414HV are PWM LED drivers that contain a clock generator to generate constant switching frequency for the device. The switching frequency is determined by the resistance of an external resistor RFS in the range of 250 kHz to 1 MHz. Lower resistance of RFS results in higher switching frequency. The switching frequency of the LM3414/HV is governed using Equation 5. fSW = 20 x 106 kHz RFS (5) 1000 ƒSW (kHz) 800 600 400 200 20 40 RFS (kΩ) 60 80 Figure 20. Switching Frequency vs RFS Table 1. Examples for fSW Settings fSW (kHz) RFS (kΩ) 250 80 500 40 1000 20 To ensure accurate current regulation, the LM3414/HV should be operated in continuous conduction mode (CCM) and the ON time should not be shorter than 400 ns under all operation condition. 8.1.2 Setting LED Current The LM3414/HV requires no external current sensing resistor for LED current regulation. The average output current of the LM3414/HV is adjustable by varying the resistance of the resistor, RIADJ that connects across the IADJ and GND pins. The IADJ pin is internally biased to 1.255 V. The LED current is then governed by Equation 6. ILED = 3125 x 103 mA RIADJ where • 16 350 mA < ILED < 1A Submit Documentation Feedback (6) Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: LM3414 LM3414HV LM3414, LM3414HV www.ti.com SNVS678F – JUNE 2010 – REVISED NOVEMBER 2015 1.4 1.2 ILED(A) 1.0 0.8 0.6 0.4 0.2 0.0 0 1 2 3 4 5 6 RIADJ(k ) 7 8 9 Figure 21. LED Current vs RIADJ Table 2. Examples for IOUT Settings IOUT (mA) RIADJ (kΩ) 350 8.93 500 6.25 700 4.46 1000 3.13 The LED current can be set to any level in the range from 350 mA to 1A. To provide accurate LED current, RIADJ should be a resistor with no more than 0.5% tolerance. If the IADJ pin is accidentally shorted to GND (RIADJ = 0), the output current is limited to avoid damaging the circuit. When the overcurrent protection is activated, current regulation cannot be maintained until the overcurrent condition is cleared. 8.1.3 Inductor Selection To ensure proper output current regulation, the LM3414/HV must operate in Continuous Conduction Mode (CCM). With the incorporation of PLM, the peak-to-peak inductor current ripple can be set as high as ±60% of the defined average output current. The minimum inductance of the inductor is decided by the defined average LED current and allowable inductor current ripple. The minimum inductance can be found by the equations shown in Equation 7 through Equation 8. Because: 'IL = VIN - VLED xDxT L (7) Thus: LMIN = VIN -VLED VLED 1 x x 1.2 x ILED VIN fSW (8) The LM3414/HV can maintain LED current regulation without output filter capacitor. This is because the inductor of the floating buck structure provides continuous current to the LED throughout the entire switching cycle. When LEDs are driven without filter capacitor, the LED peak current must not set exceeding the rated current of the LED. The peak LED current is governed by Equation 9. 'IL = (VIN -VLED) VLED + ILED(AVG) 2L x VIN x fSW (9) Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: LM3414 LM3414HV Submit Documentation Feedback 17 LM3414, LM3414HV SNVS678F – JUNE 2010 – REVISED NOVEMBER 2015 www.ti.com 8.2 Typical Applications 8.2.1 LM3414/HV Design Example Vin High power LED Array D1 LM3414/14HV CVCC VCC VIN PGND 4.5V ± 42 VDC (LM3414) Iout = 1A CIN 4.5V ± 65 VDC (LM3414HV) GND L1 LX IADJ DIM GND FS PWM dimming signal GND RIADJ * DAP connect to GND RFS GND GND Figure 22. LM3414/HV Design Example Schematic 8.2.1.1 Design Requirements • Input Voltage: VIN • LED String Voltage: VLED • LED Current: ILED • Switching Frequency: fSW • Maximum LED Current Ripple: ΔiL-PP • Maximum Input Voltage Ripple: ΔVIN 8.2.1.2 Detailed Design Procedure 8.2.1.2.1 Calculate Operating Parameters To calculate component values the operating duty cycle (D) must be calculated using Equation 10. D= VLED VIN (10) 8.2.1.2.2 Calculate RIADJ To get the desired LED current calculate the value for RIADJ using Equation 11. RIADJ = 3125 ILED (11) 8.2.1.2.3 Calculate RFS Calculate the value of RFS for the desired switching frequency using Equation 12. RFS = 18 20 × 109 fSW Submit Documentation Feedback (12) Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: LM3414 LM3414HV LM3414, LM3414HV www.ti.com SNVS678F – JUNE 2010 – REVISED NOVEMBER 2015 Typical Applications (continued) 8.2.1.2.4 Calculate LMIN Calculate the minimum inductor value required for the desired LED current ripple using Equation 13. LMIN = :VIN - VLED; × VLED fSW × VIN × ¨iL-PP (13) 8.2.1.2.5 Calculate CIN-MIN Calculate the minimum input capacitor value for the desired input voltage ripple using Equation 14. CIN-MIN = D × :1 -D; × ILED fSW × ¨VIN (14) 8.2.2 LM3414/HV Design Example (IOUT = 1 A) Vin Iout = 1000 mA (nom.) 100V 2.2 PF CIN CVCC 16V 1 PF LM3414 / LM3414HV VCC VIN PGND IADJ 100V 2A LED x 6 D1 24V ± 42 VDC (LM3414) 24V - 65 VDC (LM3414HV) GND L1 47 PH LX U1 GND DIM FS GND RIADJ 3.24k * DAP connect to GND GND RFS 40.2k GND Figure 23. LM3414/HV Design Example (IOUT = 1 A) Schematic 8.2.2.1 Design Requirements • Input Voltage: VIN = 48 V ±10% • LED String Voltage: VLED = 35 V • LED Current: ILED = 1 A • Switching Frequency: fSW = 500 kHz • Maximum LED Current Ripple: ΔiL-PP ≤ 500 mA • Maximum Input Voltage Ripple: ΔVIN ≤ 200 mV 8.2.2.2 Detailed Design Procedure 8.2.2.2.1 Calculate Operating Parameters To calculate component values the operating duty cycle (D) for this application can be calculated be calculated using Equation 15. D= VLED 35V = = 0.73 48V VIN (15) 8.2.2.2.2 Calculate RIADJ For 1A LED current calculate the value for RIADJ using Equation 16. Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: LM3414 LM3414HV Submit Documentation Feedback 19 LM3414, LM3414HV SNVS678F – JUNE 2010 – REVISED NOVEMBER 2015 www.ti.com Typical Applications (continued) RIADJ = 3125 3125 = = 3.125k ILED 1A (16) Choose a standard value of RIADJ = 3.24kΩ. 8.2.2.2.3 Calculate RFS Calculate the value of RFS for 500-kHz switching frequency using Equation 17. RFS 20 × 109 20 × 109 = = = 40k fSW 500kHz (17) Choose a standard value of RFS = 40.2kΩ. 8.2.2.2.4 Calculate LMIN Calculate the minimum inductor value required for 500 mA or less peak-to-peak LED current ripple using Equation 18. LMIN = :VIN - VLED; × VLED :48V - 35V; × 35V = 500kHz × 35V × 500mA fSW × VIN × ¨iL-PP H (18) Choose a higher standard value of L = 47µH. 8.2.2.2.5 Calculate CIN-MIN Calculate the minimum input capacitor value for 200 mV or less input voltage ripple using Equation 19. CIN-MIN = D × :1 -D; × ILED 0.73 × :1 - 0.73; × 1A = fSW × ¨VIN 500kHz × 200mV F (19) Choose a higher standard value of CIN = 2.2µF. Table 3. Bill of Materials DESIGNATION 20 DESCRIPTION PACKAGE MANUFACTURE PART NO. VENDOR U1 LED Driver IC LM3414 / LM3414HV SOIC-8 LM3414 / LM3414HV TI L1 Inductor 47 µH 8 × 8 × 4.9 (mm) MMD-08EZ-470M-SI Mag.Layers D1 Schottky Diode 100 V, 2 A SMP SS2PH10-M3 Vishay CIN Cap MLCC 100V 2.2 µF X7R 1210 GRM32ER72A225KA35L Murata CVCC Cap MLCC 16V 1 µF X5R 603 GRM39X5R105K16D52K Murata RIADJ Chip Resistor 3.24 kΩ 1% 603 CRCW06033241F Vishay RFS Chip Resistor 40.2 kΩ 1% 603 CRCW06034022F Vishay Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: LM3414 LM3414HV LM3414, LM3414HV www.ti.com SNVS678F – JUNE 2010 – REVISED NOVEMBER 2015 8.2.2.3 Application Curve Figure 24. PWM Dimming Top = DIM. Bottom = LED Current. Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: LM3414 LM3414HV Submit Documentation Feedback 21 LM3414, LM3414HV SNVS678F – JUNE 2010 – REVISED NOVEMBER 2015 www.ti.com 9 Power Supply Recommendations Use any DC output power supply with a maximum voltage high enough for the application. The power supply should have a minimum current limit of at least 1 A. 10 Layout 10.1 Layout Guidelines Discontinuous currents are the most likely to generate EMI; therefore, take care when routing these paths. The main path for discontinuous current in the LM3414/HV buck converter contains the input capacitor (CIN), the recirculating diode (D1), and the switch node (LX). This loop should be kept as small as possible and the connections between all three components should be short and thick to minimize parasitic inductance. In particular, the switch node (where L1, D1 and LX connect) should be just large enough to connect the components without excessive heating from the current it carries. The IADJ, FS, and DIM pins are all high-impedance control inputs which couple external noise easily, therefore the loops containing these high impedance nodes should be minimized. The frequency setting resistor (RFS) and current setting resistor (RIADJ) should be placed close to the FS and IADJ pins as possible. 10.2 Layout Example + GND VIN/LED+ CIN VCC VIN D1 CVCC LED- RIADJ LX IADJ DIM GND FS L1 - PGND RFS THERMAL/POWER VIA Figure 25. Layout Recommendation 22 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: LM3414 LM3414HV LM3414, LM3414HV www.ti.com SNVS678F – JUNE 2010 – REVISED NOVEMBER 2015 11 Device and Documentation Support 11.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 4. Related Links PARTS PRODUCT FOLDER SAMPLE AND BUY TECHNICAL DOCUMENTS TOOLS AND SOFTWARE SUPPORT AND COMMUNITY LM3414 Click here Click here Click here Click here Click here LM3414HV Click here Click here Click here Click here Click here 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: LM3414 LM3414HV Submit Documentation Feedback 23 PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM3414HVMR/NOPB ACTIVE SO PowerPAD DDA 8 95 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L3414 HVMR LM3414HVMRX/NOPB ACTIVE SO PowerPAD DDA 8 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L3414 HVMR LM3414HVSD/NOPB ACTIVE WSON NGQ 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L249B LM3414HVSDX/NOPB ACTIVE WSON NGQ 8 4500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L249B LM3414MR/NOPB ACTIVE SO PowerPAD DDA 8 95 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L3414 MR LM3414MRX/NOPB ACTIVE SO PowerPAD DDA 8 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L3414 MR LM3414SD/NOPB ACTIVE WSON NGQ 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L248B LM3414SDX/NOPB ACTIVE WSON NGQ 8 4500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L248B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 20-Jan-2017 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jun-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM3414HVMRX/NOPB SO Power PAD DDA 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM3414HVSD/NOPB WSON NGQ 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 LM3414HVSDX/NOPB WSON NGQ 8 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 LM3414MRX/NOPB SO Power PAD DDA 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM3414SD/NOPB WSON NGQ 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 LM3414SDX/NOPB WSON NGQ 8 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jun-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM3414HVMRX/NOPB LM3414HVSD/NOPB SO PowerPAD DDA 8 2500 367.0 367.0 35.0 WSON NGQ 8 1000 210.0 185.0 35.0 LM3414HVSDX/NOPB WSON NGQ 8 4500 367.0 367.0 35.0 LM3414MRX/NOPB SO PowerPAD DDA 8 2500 367.0 367.0 35.0 LM3414SD/NOPB WSON NGQ 8 1000 210.0 185.0 35.0 LM3414SDX/NOPB WSON NGQ 8 4500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE DDA0008A PowerPAD TM SOIC - 1.7 mm max height SCALE 2.400 PLASTIC SMALL OUTLINE C 6.2 TYP 5.8 SEATING PLANE PIN 1 ID AREA A 0.1 C 6X 1.27 8 1 2X 3.81 5.0 4.8 NOTE 3 4 5 B 8X 4.0 3.8 NOTE 4 0.51 0.31 0.25 1.7 MAX C A B 0.25 TYP 0.10 SEE DETAIL A 5 4 EXPOSED THERMAL PAD 0.25 GAGE PLANE 2.34 2.24 8 1 0 -8 0.15 0.00 1.27 0.40 DETAIL A 2.34 2.24 TYPICAL 4218825/A 05/2016 PowerPAD is a trademark of Texas Instruments. NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MS-012. www.ti.com EXAMPLE BOARD LAYOUT DDA0008A PowerPAD TM SOIC - 1.7 mm max height PLASTIC SMALL OUTLINE (2.95) NOTE 9 SOLDER MASK DEFINED PAD (2.34) SOLDER MASK OPENING 8X (1.55) SEE DETAILS 1 8 8X (0.6) SYMM (1.3) TYP (2.34) SOLDER MASK OPENING (4.9) NOTE 9 6X (1.27) 5 4 (R0.05) TYP METAL COVERED BY SOLDER MASK SYMM ( 0.2) TYP VIA (1.3) TYP (5.4) LAND PATTERN EXAMPLE SCALE:10X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4218825/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004). 9. Size of metal pad may vary due to creepage requirement. 10. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN DDA0008A PowerPAD TM SOIC - 1.7 mm max height PLASTIC SMALL OUTLINE (2.34) BASED ON 0.125 THICK STENCIL 8X (1.55) (R0.05) TYP 1 8 8X (0.6) (2.34) BASED ON 0.125 THICK STENCIL SYMM 6X (1.27) 5 4 METAL COVERED BY SOLDER MASK SYMM (5.4) SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES SOLDER PASTE EXAMPLE EXPOSED PAD 100% PRINTED SOLDER COVERAGE BY AREA SCALE:10X STENCIL THICKNESS SOLDER STENCIL OPENING 0.1 0.125 0.150 0.175 2.62 X 2.62 2.34 X 2.34 (SHOWN) 2.14 X 2.14 1.98 X 1.98 4218825/A 05/2016 NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE NGQ0008A WSON - 0.8 mm max height SCALE 4.000 PLASTIC SMALL OUTLINE - NO LEAD 3.1 2.9 B A PIN 1 INDEX AREA 3.1 2.9 C 0.8 0.7 SEATING PLANE 0.08 C 1.6 0.1 (0.1) TYP SYMM EXPOSED THERMAL PAD 0.05 0.00 4 5 SYMM 9 2X 1.5 2 0.1 8 1 6X 0.5 8X PIN 1 ID 8X 0.5 0.3 0.3 0.2 0.1 0.05 C A B C 4214922/A 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT NGQ0008A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD (1.6) SYMM 8X (0.6) 1 8 (0.75) 8X (0.25) 9 SYMM (2) 6X (0.5) 5 4 (R0.05) TYP ( 0.2) VIA TYP (2.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:20X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND EXPOSED METAL EXPOSED METAL SOLDER MASK OPENING METAL METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK OPENING SOLDER MASK DEFINED SOLDER MASK DETAILS 4214922/A 03/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN NGQ0008A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 8X (0.6) SYMM 9 METAL TYP 8 1 8X (0.25) SYMM (1.79) 6X (0.5) 5 4 (R0.05) TYP (1.47) (2.8) SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL EXPOSED PAD 9: 82% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X 4214922/A 03/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. 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