LM3464AMHX/NOPB

LM3464, LM3464A www.ti.com SNVS652F – APRIL 2010 – REVISED MAY 2013 LED Driver with Dynamic Headroom Control and Thermal Control Interfaces Check for Samples: LM3464, LM3464A FEATURES DESCRIPTION • The LM3464/64A is a 4-channel high voltage current regulator that provides a simple solution for LED lighting applications. The LM3464/64A provides four individual current regulator channels and works in conjunction with external N-channel MOSFETs and sense resistors to give accurate driving current for every LED string. Additionally, the Dynamic Headroom Control (DHC) output can be interfaced to the external power supply to adjust the LED supply voltage to the lowest level that is adequate to maintain all the string currents in regulation, yielding the optimal overall efficiency. 1 2 • • • • • • • • • • • Wide Input Voltage Range – 12V-80V (LM3464) – 12V-95V (LM3464A) Dynamic Headroom Control Ensures Maximum Efficiency 4 Output Channels With Individual Current Regulation High Channel to Channel Accuracy Digital PWM/Analog Dimming Control Interface Resistor Programmable Dimming Frequency and Minimum Duty Cycle (Analog Dimming Mode) Direct Interface to Thermal Sensor Fault Detection Over Temperature Protection Thermal Shutdown Under Voltage Lockout Thermal Enhanced TSSOP-28 Package Digital PWM or analog voltage signals can be used to control the duty cycle of the all the channels. When analog control is used, the dimming frequency can be programmed via an external capacitor. A minimum duty cycle control is provided in the conditions that the analog dimming is configured as thermal feedback. Protection features include VIN under-voltage lockout, LED open/short circuit and over-temperature fault signaling to the system controller. APPLICATIONS • • Streetlights Solid State Lighting Solutions Typical Application High Power LED Arrays VRAIL NTC thermistor couple to LED arrays RFB1 Voltage output B EN OutP VLedFB CDHC Voltage feedback pin RFB2 CDHC VIN DR1 DR2 DR3 DR4 FAULT_CAP CFLT PGND VDHC FAULTb Q2 GD2 SE2 AGND External voltage headroom control Q3 GD3 SE3 VDHC Fault acknowledgement output Faultb DIM Q4 GD4 SE4 RISNS1 RTHM1 PWM dimming input RISNS2 RISNS3 RISNS4 Thermal 5V 0V Q1 GD1 SE1 VCC DIM To thermal sensor terminals LM3464/64A RDHC Primary power supply A PGND RDMIN1 RTHM2 A To NTC thermal sensor RDMIN2 B PGND PGND PGND DMIN CVCC Thermal_Cap SYNC AGND PGND AGND PGND CTHM 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2013, Texas Instruments Incorporated LM3464, LM3464A SNVS652F – APRIL 2010 – REVISED MAY 2013 www.ti.com Connection Diagram Figure 1. Top View 28-Lead TSSOP-28 Package Number PWP PIN DESCRIPTIONS 2 Pin Name Description Application Information 1 SYNC Synchronization signal output for cascade operation (Master-Slave configuration) Connect this pin to the DIM pin of other LM3464/64A to enable cascade operation (multiple device). This pin should leave open for single device operation. 2 DIM PWM dimming control Apply logic level PWM signal to this pin controls the average brightness of the LED string. ( 80V/95V (LM3464/64A) APPLICATIONS WITH HIGH RAIL VOLTAGE The normal operation voltage of the LM3464 and LM3464A are rated to 80V and 95V respectively, applying voltage over the operation voltage limit to the LM3464/64A can damage the device permanently. In applications that the rail voltage is higher than the operation voltage limited of the device (80V for LM3464, 95V for LM3464A), voltage clamping circuits must be added externally to ensure the voltage limits of all the pins of the LM3464/64A are not violated. Figure 26 shows a typical application circuit with 150V peak rail voltage. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM3464 LM3464A 21 LM3464, LM3464A SNVS652F – APRIL 2010 – REVISED MAY 2013 www.ti.com In Figure 26, Z1, Z2, Z3, Z4 and ZIN are zener diodes for clamping the DRx pin voltage and input voltage (VIN pin) of the LM3464/64A. The reverse voltage of the zener diodes must be below 80V for LM3464 and 95V for LM3464A. The resistors RDR1, RDR2, RDR3, RDR4 and RIN are resistors for absorbing the voltage difference between the clamping voltage of the zener diodes and the rail voltage. Calculating the Values of Zx and RDRx: The resistance of the RDRx must be properly selected according to the reverse current of the zener diode and input current of the DRx pins of the LM3464/64A to secure the allowable pin voltages are not violated. For instant, the DRx pins are required to clamp at 75V and a 500mW/75V zener diode CMHZ5267B from Central Semiconductor is used. The reverse current of the CMHZ5267B is specified 1.7mA at 75V zener voltage. The maximum allowable reverse current is 6.67mA as the power rating of the CMHZ5276B is 500mW. Given that the input current of the DRx pins of the LM3464/64A at 100V is 63uA maximum, if the DRx pin voltage is below 100V the current flows into the DRx pin (IDRx) is below 63uA. In order to reserve operation margin for component variations, IDRx is assumed equal to 63uA in the following calculations. Because VRAIL(peak) is the possible highest voltage at the DRx pins, the maximum resistance of RDRx can be obtained following this equation: (22) Where VZ and IZ are the reverse voltage and current of the zener diode Zx respectively. For VRAIL(peak) = 150V, the maximum value of RDRx is: (23) And the minimum value of RDRx is: (24) Thus, the value of RDRx must be selected in the range: (25) To minimize power dissipation on the zener diodes, a standard 42.2kΩ resistor can be used for the RDRx. Because the resistors, RDRx are used to absorb the power being introduced by the voltage difference between VRAIL and VZx, the maximum power dissipation on every RDRx equals to: (26) Thus, a standard 42.2kΩ resistor with 0.25W power rating (1206 package) and 1% tolerance can be used. Calculating the Values of ZIN and RIN: Similar to the requirements of selecting the Zx and RDRx, the voltage at the VIN pin of the LM3464/64A is clamped to 75V by a voltage clamping circuit consists of ZIN and RIN. Because the maximum operating and shutdown current (VEN < 2.1V) are 3mA and 700uA respectively, in order to ensure the voltage of the VIN pin is clamped close to 75V even when the LM3464/64A is disabled, a 1.5W/75V zener diode CMZ5946B from Central Semiconductor is used to ensure adequate conduction current for ZIN. The reverse current of the CMZ5946B is specified 5mA at 75V, so the allowable current flows through ZIN is in between 5mA to 20mA. 22 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM3464 LM3464A LM3464, LM3464A www.ti.com SNVS652F – APRIL 2010 – REVISED MAY 2013 The value of RIN is governed by the following equations: (27) Maximum value of RIN: (28) Minimum value of RIN: (29) So the value of RIN must be in the range: (30) To minimize power dissipations on both the ZIN and RIN, a standard 9.31kΩ resistor can be selected for the RIN. Then the maximum power dissipation on RIN is: (31) Thus, a standard 9.38kΩ resistor with 2512 package (1W) and 1% tolerance can be used. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM3464 LM3464A 23 LM3464, LM3464A SNVS652F – APRIL 2010 – REVISED MAY 2013 www.ti.com Additional Application Circuit Figure 27. Cascade Operation with Thermal Foldback Control 24 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM3464 LM3464A LM3464, LM3464A www.ti.com SNVS652F – APRIL 2010 – REVISED MAY 2013 REVISION HISTORY Changes from Revision E (May 2013) to Revision F • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 24 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM3464 LM3464A 25 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM3464AMH/NOPB ACTIVE HTSSOP PWP 28 48 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM3464AMH LM3464AMHX/NOPB ACTIVE HTSSOP PWP 28 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM3464AMH LM3464MH/NOPB ACTIVE HTSSOP PWP 28 48 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM3464MH LM3464MHX/NOPB ACTIVE HTSSOP PWP 28 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM3464MH (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of