User's Guide
SNVA224A – June 2007 – Revised April 2013
AN-1594 LM3509 Evaluation Board
1
Introduction
The LM3509 is an asynchronous boost converter with two separate outputs. The first output (MAIN) is a
constant current source for driving up to five series white LED's. The second output (SUB) is configurable
as a constant current source for driving up to 5 series white LED's, or as a feedback input to set a
constant supply voltage for OLED panel power. The maximum LED current per output is set via a single
external low power resistor. An I2C compatible interface allows for independent adjustment of the LED
current in either output from 0 to max current in 32 exponential steps. When configured as a white LED +
OLED bias supply, the LM3509 can independently and simultaneously drive a string of up to 5 white
LED’s and deliver a constant output voltage of up to 21V for OLED panels.
The evaluation board is set-up to drive 2 strings of 5 white LEDs (OSRAM, LW_M67C, VF = 3.6V at
20mA). These are set-up with 5 LED's in the MAIN string and 5 LED's in the SUB string. Alternatively,
resistors can be installed in the R1 and R2 pads to make the device a voltage output boost converter for
OLED display powering (see Output Voltage Setting (OLED Mode).
VIO
2
SDA
1
MAIN
SUB/FB
1
2
4
R4
4/3/2_S
D5S
D3S
D4S
D2S
D1S
S_OPEN
R_SCL
R_SDA
VIN/VUSB
1
2
4
3
4/3/2_M
D5M
R5
1
3
SCL
3
D2M
D3M
D4M
D1M
M_OPEN
2
2
1
1
2
3
MAIN
SCL
SUB/FB
SDA
10
9
LM3509
SET
IN
VIO
OVP
8
CIN
16
15
USBL
R_GPIO
4
R_SET
7
15
16
USBR
5 RESET/
GPIO
R2
GND
SW
6
R1
D1
L1
COUT
GND
RESET/GPIO
GND
OUT
SW
IN
Figure 1. LM3509 Evaluation Board Schematic
TI is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
SNVA224A – June 2007 – Revised April 2013
Submit Documentation Feedback
AN-1594 LM3509 Evaluation Board
Copyright © 2007–2013, Texas Instruments Incorporated
1
Bill of Materials
2
www.ti.com
Bill of Materials
Table 1. Bill of Materials
Designator
Component
Manufacturer
LM3509, 10-Pin WSON (DSC0010A)
L1
TDK
CIN
1 µF, 10V Ceramic C1608JB1A105M
TDK
COUT
1 µF, 25V Ceramic C1608JB1E105M
TDK
D1M–D5M, D1S-D5S
White LED, LW_M67C
Osram
R4, R5
0Ω Resistor, CRCW0603
Vishay
R_SET
12.1kΩ, CRCW06031212F
Vishay
R_SDA, R_SCL, R_GPIO
D1
R1, R2
3
Texas Instruments
10 µH, VLF3012AT-100MR49
10kΩ, CRCW06031002F
Vishay
Schottky, 30V, 0.5A, B0530WS
Diodes Inc.
Unpopulated (used for Constant Voltage Ouptut)
Board Layout
Figure 2. LM3509 Evaluation Board Layout (Top Side)
2
AN-1594 LM3509 Evaluation Board
SNVA224A – June 2007 – Revised April 2013
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
Board Operation
www.ti.com
Figure 3. LM3509 Evaluation Board Layout (Bottom Side)
4
Board Operation
To operate the LM3509 Evaluation Board, connect a 2.7V to 5.5V supply between the IN header and GND
and attach an I2C interface using one of the methods described in Section 5.
5
External Control Interface
There are two methods for controlling the LM3509 Evaluation Board. The first option is via a TI™ USB
interface board. The second option is by using the SDA and SCL headers available on the upper right
corner of the board. When option 1 is used, the USBL and USBR connectors plug directly into the USB
interface board. The connectors are keyed so they will only fit one way.
On the LM3509 evaluation board the VIN/VUSB jumper allows for power to come from IN or from the USB
interface board. The USB interface board has its own regulator that supplies 3.3V. When power from the
USB interface board is desired connect a jumper across VIN/VUSB, if power is supplied from the IN
header leave VIN/VUSB open. DO NOT jumper VIN/VUSB while an external source is connected to IN as
this will make a conflict between the USB interface board and the external power supply. This can
permanently damage the TI USB interface board. The USB interface board interfaces directly with the
LM3509.exe graphical interface via the PC (see Section 7).
If the TI USB interface board is not used then control of the LM3509 evaluation board is done by
connecting an external I2C compatible interface directly to the SCL and SDA headers. Both the SDA and
SCL lines have 10kΩ pull-ups installed on the back side of the board.
6
Board Description
The following section describes the jumper settings on the LM3509 evaluation board.
SNVA224A – June 2007 – Revised April 2013
Submit Documentation Feedback
AN-1594 LM3509 Evaluation Board
Copyright © 2007–2013, Texas Instruments Incorporated
3
I2C Compatible Interface
www.ti.com
M_OPEN and S_OPEN are two position jumpers placed between the LM3509's OUT terminal and the top
side of the LED strings. Short M_OPEN to connect OUT to the MAIN LED string and remove the jumper to
open the MAIN string. The same applys to the S_OPEN jumper and the SUB string. These are useful for
testing OVP and/or inserting a current meter in series with the LEDs.
Both 4/3/2_M and 4/3/2_S are 4 position jumpers that allow for different combinations of series LEDs in
either the MAIN or SUB LED strings. Both 4/3/2_S and 4/3/2_M have their center pin (pin 2 in Figure 1)
connected to the bottom of the LED string. Referring to 4/3/2_S, connecting pin 2 to pin 1 will short D5S
making the SUB string a 4 LED configuration. Connect pin 2 to pin 4 to short D4S and D5S resulting in a 3
LED configuration. Connect pin 2 to pin 3 for a 2 LED configuration (D3S – D5S shorted). Leave 4/3/2_S
open for a 5 LED configuration. The operation for 4/3/2_M is the same as 4/3/2_S only it applies to the
MAIN LED string.
VIO is a 3-pin, 3-position jumper. The left pin (pin 1 in Figure 1) connects to the 3.3V supply from the USB
board connector (USBL). The right pin (pin 3) connects to IN of the LM3509. The middle pin (pin 2)
connects to VIO of the LM3509 and the top side of the pull-up resistors (R_SDA, R_SCL, and R_GPIO).
When operating the device with the TI USB interface board the jumper can be connected from pin 1 to pin
2 to supply VIO with 3.3V independent of VIN.
Resistors R4 and R5 have 0Ω’s across them. The 0Ω resistors can be replaced with current sense
resistors for measuring LED current.
7
I2C Compatible Interface
The LM3509 is controlled via an I2C compatible interface. START and STOP conditions classify the
beginning and the end of the I2C session. A START condition is defined as SDA transitioning from HIGH
to LOW while SCL is HIGH. A STOP condition is defined as SDA transitioning from LOW to HIGH while
SCL is HIGH. The I2C master always generates START and STOP conditions. The I2C bus is considered
busy after a START condition and free after a STOP condition. During data transmission the I2C master
can generate repeated START conditions. A START and a repeated START conditions are equivalent
function-wise. The data on SDA must be stable during the HIGH period of the clock signal (SCL). In other
words, the state of SDA can only be changed when SCL is LOW.
Figure 4. Start and Stop Sequences
8
I2C Compatible Address
The chip address for the LM3509 is 0110110 (36h). After the START condition, the I2C master sends the
7-bit chip address followed by a read or write bit (R/W). R/W= 0 indicates a WRITE and R/W = 1 indicates
a READ. The second byte following the chip address selects the register address to which the data will be
written. The third byte contains the data for the selected register.
Figure 5. Chip Address
4
AN-1594 LM3509 Evaluation Board
SNVA224A – June 2007 – Revised April 2013
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
Transferring Data
www.ti.com
9
Transferring Data
Every byte on the SDA line must be eight bits long, with the most significant bit (MSB) transferred first.
Each byte of data must be followed by an acknowledge bit (ACK). The acknowledge related clock pulse
(9th clock pulse) is generated by the master. The master releases SDA (HIGH) during the 9th clock pulse.
The LM3509 pulls down SDA during the 9th clock pulse, signifying an acknowledge. An acknowledge is
generated after each byte has been received. Figure 6 is an example of a write sequence to the General
Purpose register of the LM3509.
Figure 6. Write Sequence to the LM3509
10
Register Descriptions
There are 4, 8 bit registers within the LM3509 as detailed in Table 2.
Table 2. LM3509 Register Descriptions
Register Name
11
Hex Address
Power -On-Value
General Purpose (GP)
10
0xC0
Brightness Main (BMAIN)
A0
0xE0
Brightness Sub (BSUB)
B0
0xE0
General Purpose
I/O (GPIO)
80
0XF8
General Purpose Register (GP)
The General Purpose register has four functions. It controls the on/off state of MAIN and SUB/FB, it
selects between Unison or Non-Unison mode, provides for control over the rate of change of the LED
current (see Brightness Rate of Change Description), and selects between White LED and OLED mode.
Figure 7 and Table 3 describes each bit available within the General Purpose Register.
Figure 7. General Purpose Register Description
Table 3. General Purpose Register Bit Function
Bit
Name
0
ENM
Enable MAIN. Writing a 1 to this bit enables the main current sink (MAIN).
Writing a 0 to this bit disables the main current sink and forces MAIN high
impedance.
Function
0
1
ENS
Enable SUB/FB. Writing a 1 to this bit enables the secondary current sink
(SUB/FB). Writing a 0 to this bit disables the secondary current sink and forces
SUB/FB high impedance.
0
2
UNI
Unison Mode Select. Writing a 1 to this bit disables the BSUB register and
causes the contents of BMAIN to set the current in both the MAIN and SUB/FB
current sinks. Writing a 0 to this bit allows the current into MAIN and SUB/FB to
be independently controlled via the BMAIN and BSUB registers respectively.
0
SNVA224A – June 2007 – Revised April 2013
Submit Documentation Feedback
Power-On-Value
AN-1594 LM3509 Evaluation Board
Copyright © 2007–2013, Texas Instruments Incorporated
5
Brightness Registers (BMAIN and BSUB)
www.ti.com
Table 3. General Purpose Register Bit Function (continued)
3
RMP0
4
RMP1
5
OLED
6
Don’t Care
Brightness Rate of Change. Bits RMP0 and RMP1 set the rate of change of the
LED current into MAIN and SUB/FB in response to changes in the contents of
registers BMAIN and BSUB (see brightness rate of change description).
0
OLED = 0 places the LM3509 in White LED mode. In this mode both the MAIN
and SUB/FB current sinks are active. The boost converter ensures there is at
least 500mV at VMAIN and VSUB/FB. OLED = 1 places the LM3509 in OLED
mode. In this mode the boost converter regulates VSUB/FB to 1.21V. VMAIN is
unregulated and must be > 300mV for the MAIN current sink to maintain
current regulation.
0
These are non-functional read only bits. They will always read back as a 1.
1
0
7
Table 4. Operational Truth Table
UNI
OLED
ENM
ENS
X
0
0
0
LM3509 Disabled
Result
1
0
1
X
MAIN and SUB/FB current sinks enabled. Current levels set by
contents of BMAIN.
1
0
0
X
MAIN and SUB/FB Disabled
0
0
0
1
SUB/FB current sink enabled. Current level set by BSUB.
0
0
1
0
MAIN current sink enabled. Current level set by BMAIN.
0
0
1
1
MAIN and SUB/FB current sinks enabled. Current levels set by
contents of BMAIN and BSUB respectively.
X
1
1
X
SUB/FB current sink disabled (SUB/FB configured as a feedback
pin). MAIN current sink enabled current level set by BMAIN.
X
1
0
X
SUB/FB current sink disabled (SUB/FB configured as a feedback
pin). MAIN current sink disabled.
* ENM ,ENS, or OLED high enables analog circuitry.
12
Brightness Registers (BMAIN and BSUB)
With the UNI bit (General Purpose register) set to 0 (Non-Unison mode) both brightness registers (BMAIN
and BSUB) independently control the LED currents IMAIN and ISUB/FB respectively. BMAIN and BSUB are
both 8 bit, but with only the five LSB’s controlling the current. The three MSB’s are don’t cares. The LED
current control is designed to approximate an exponentially increasing response of the LED current vs
increasing code in either BMAIN or BSUB (see Figure 10). Program ILED_MAX by connecting a resistor (RSET)
from SET to GND, where:
(1)
With the UNI bit (General Purpose register) set to 1 (Unison mode), BSUB is disabled and BMAIN sets
both IMAIN and ISUB/FB. This prevents the independent control of IMAIN and ISUB/FB, however matching between
current sinks goes from typically 1%(with UNI = 0) to typically 0.15% (with UNI = 1). Figure 8 and Figure 9
show the register descriptions for the Brightness MAIN and Brightness SUB registers. Table 4 and
Figure 10 show IMAIN and/or ISUB/FB vs. brightness data as a percentage of ILED_MAX.
Figure 8. Brightness MAIN Register Description
6
AN-1594 LM3509 Evaluation Board
SNVA224A – June 2007 – Revised April 2013
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
Brightness Registers (BMAIN and BSUB)
www.ti.com
Figure 9. Brightness SUB Register Description
Table 5. ILED vs. Brightness Register Data
BMAIN or BSUB Brightness
Data
% of ILED_MAX
BMAIN or BSUB Brightness Data
% of ILED_MAX
00000
0.000%
10000
8.750%
00001
0.125%
10001
10.000%
00010
0.625%
10010
12.500%
00011
1.000%
10011
15.000%
00100
1.125%
10100
16.875%
00101
1.313%
10101
18.750%
00110
1.688%
10110
22.500%
00111
2.063%
10111
26.250%
01000
2.438%
11000
31.250%
01001
2.813%
11001
37.500%
01010
3.125%
11010
43.750%
01011
3.750%
11011
52.500%
01100
4.375%
11100
61.250%
01101
5.250%
11101
70.000%
01110
6.250%
11110
87.500%
01111
7.500%
11111
100.000%
Figure 10. IMAIN or ISUB vs BMAIN or BSUB Data
SNVA224A – June 2007 – Revised April 2013
Submit Documentation Feedback
AN-1594 LM3509 Evaluation Board
Copyright © 2007–2013, Texas Instruments Incorporated
7
Brightness Rate of Change Description
13
www.ti.com
Brightness Rate of Change Description
RMP0 and RMP1 control the rate of change of the LED current IMAIN and ISUB/FB in response to changes in
BMAIN and /or BSUB. There are four user programmable LED current rates of change settings for the
LM3509 (see Table 6).
Table 6. Rate of Change Bits
RMP0
RMP1
Change Rate (tSTEP)
0
0
51µs/step
0
1
13ms/step
1
0
26ms/step
1
1
52ms/step
The total time to transition from one brightness code to another is:
(2)
Where tSTEP is given in Table 5.
14
General Purpose I/O (GPIO)
RESET/GPIO has three functions; an active low reset input, a logic input, and an open drain logic output.
The default setting is as an active low reset input. Write a '1' to bit 0 of the GPIO register (address 0x80)
to configure RESET/GPIO as a general purpose I/O (GPIO). In this mode, bit 1 of the GPIO register
controls the input/output state of RESET/GPIO. With bit 1 = '0', RESET/GPIO is configured as a logic input
and the data is read back via bit 2 of the GPIO register. With bit 1 = '1', RESET/GPIO is configured as a
logic output. In this mode bit 2 of the GPIO register becomes the output data. Write a '1' to bit 2 to force
RESET/GPIO to a logic one. Write a '0' to bit 2 to force RESET/GPIO to a logic zero. (see Table 7 and
Figure 11) .
Table 7. GPIO Register Function
Bits 7 – 3
Data (Bit 2)
Mode (Bit 1)
Enable GPIO (Bit 0)
X
X
X
0
RESET/GPIO is configured as an active low reset
input. This is the default power on state.
Function
X
Logic Input
0
1
RESET/GPIO is configured as a logic input. The logic
state applied to RESET/GPIO can be read via bit 2 of
the GPIO register.
X
Logic Output
1
1
RESET/GPIO is configured as a logic output. A 0 in
bit 2 forces RESET/GPIO low. A 1 in bit 2 forces
RESET/GPIO high impedance.
Figure 11. GPIO Register Description
15
LM3509 I2C Compatible Interface Program
In order to fully evaluate the LM3509 with the TI USB interface board, TI has created an I2C compatible
program (LM3509 .exe) . To begin with, plug the LM3509 evaluation board iinto the USB docking board
via the USBL and USBR connectors and plug theTI USB Interface Board into a PC via a standard USB
cable. The USB docking board will provide all of the control signals for the simple interface as well as
power to the LM3509 evaluation board.
8
AN-1594 LM3509 Evaluation Board
SNVA224A – June 2007 – Revised April 2013
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
LM3509 I2C Compatible Interface Program
www.ti.com
A jumper on the LM3509 evaluation board labeled VIN/VUSB allows the user to either connect an external
power supply to the IN header on the LM3509 evaluation board, or draw power from the docking board. If
the jumper is installed the USB docking board supplies power to the LM3509 Evaluation board. Removal
of the jumper disconnects the 3.3V supply from the USB interface board. Once removed, an external
supply is required at the IN header. For proper operation, the USB docking board must be plugged into
the PC before the interface program is opened.
Once connected, and the program is executed, a basic interface window will open. (see Figure 12). At the
top of the interface, the user can read or write to any of the data registers on the LM3509 using the two
pull down menus for the slave I.D. and the desired data address.
The data field to the right of the Address pull-down menu accepts hex data while the read and write
buttons directly below the Address pull-down menu execute the Read or Write command. Just below the
Write and Read buttons are 5 enable buttons. Two dedicated enable bits (ENM and ENS) will enable the
two LED banks (MAIN and SUB). A dedicated bit (UNI) enables the unity function of the two LED banks,
and another bit (OLED) puts the part in OLED mode. The Enable All button simultaneously enables both
ENS and ENM.
Below the enable buttons are two sliding bars and data fields that allow all 32 levels of brightness for the
MAIN and SUB banks. Just below the two brightness level slider bars are six convenient action buttons:
three set buttons and three reset buttons.
SetM sets the MAIN brightness level to full-scale and enables the MAIN bank.
ResetM resets the MAIN brightness level to zero and disables the MAIN bank.
SetS sets the SUB brightness level to full-scale and enables the SUB bank.
ResetS resets the SUB brightness level to zero and disables the SUB bank.
Set sets the MAIN and the SUB brightness levels to full scale and enables the MAIN and SUB banks.
ResetM resets the MAIN and SUB brightness levels to zero and disables the MAIN and SUB banks.
To the right of the two brightness level slider bars are two pull-down menus which control the ramp rate of
the brightness levels and the delay between turning on the LM3509's boost converter and the enabling of
the current sources. To the left of the two brightness level slider bars are convenient controls for the
Hardware RESET /GPIO pin. NOTE: If the part is enabled to any brightness level and the program is
closed, the LM3509 will remain in the last programmed state.
Figure 12. LM3509.exe
SNVA224A – June 2007 – Revised April 2013
Submit Documentation Feedback
AN-1594 LM3509 Evaluation Board
Copyright © 2007–2013, Texas Instruments Incorporated
9
Applications Information
16
www.ti.com
Applications Information
16.1 LED Current Setting/Maximum LED Current
Resistor RSET connected from SET to GND sets the maximum LED current. The board is shipped with a
12.1kΩ for RSET giving a maximum LED current of 20mA/string. For higher or lower maximum LED
currents the 12.1kΩ can be removed and replaced with another value for RSET. In this case the RSET to
ILED_MAX relationship is:
(3)
where SET provides the constant 1.244V output. Typically the MAIN and SUB current sinks can provide
up to 30mA.
16.2 Output Voltage Setting (OLED Mode)
For applications that require a constant output voltage + a single LED string (such as OLED panel
powering) the LM3509 features an OLED mode (OLED bit = '1'). In OLED mode connect feedback
resistors from the converters output to SUB/FB to GND to set the output voltage (see R1 and R2 in
Figure 1. First select R2 < 100kΩ then calculate R1 such that:
(4)
In OLED mode the MAIN current sink continues to regulate the current through MAIN, however, VMAIN is no
longer regulated. To avoid dropout and ensure proper current regulation the application must ensure that
VMAIN > 0.3V.
10
AN-1594 LM3509 Evaluation Board
SNVA224A – June 2007 – Revised April 2013
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated