LM3509SDX/NOPB

LM3509 www.ti.com SNVS495D – FEBRUARY 2007 – REVISED MAY 2013 LM3509 High Efficiency Boost for White LED's and/or OLED Displays with Dual Current Sinks and I2C Compatible Brightness Control Check for Samples: LM3509 FEATURES APPLICATIONS • • 1 2 • • • • • • • • • • • • • Integrated OLED Display Power Supply and LED Driver Drives up to 10 LED’s at 30mA Drives up to 5 LED’s at 20mA and Delivers up to 21V at 40mA Over 90% Efficient 32 Exponential Dimming Steps 0.15% Accurate Current Matching Between Strings Internal Soft-Start Limits Inrush Current True Shutdown Isolation for LED’s Wide 2.7V to 5.5V Input Voltage Range 21V Over-Voltage Protection 1.27MHz Fixed Frequency Operation Low Profile 10-Pin WSON Package (3mm x 3mm x 0.8mm) General Purpose I/O Active Low Hardware Reset • • Dual Display LCD Backlighting for Portable Applications Large Format LCD Backlighting OLED Panel Power Supply DESCRIPTION The LM3509 current mode boost converter offers two separate outputs. The first output (MAIN) is a constant current sink for driving series white LED’s. The second output (SUB/FB) is configurable as a constant current sink for series white LED bias, or as a feedback pin to set a constant output voltage for powering OLED panels. Typical Application Circuits 10 PH 30 mA per string 2.7V to 5.5V CIN IN 1 PF SW OVP LM3509 COUT 1 PF VIO 10 k: 10 k: SCL SDA MAIN SUB/FB RESET/GPIO SET GND RSET 8 k: Dual White LED Bias Supply 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007–2013, Texas Instruments Incorporated LM3509 SNVS495D – FEBRUARY 2007 – REVISED MAY 2013 www.ti.com DESCRIPTION (CONTINUED) When configured as a dual output white LED bias supply, the LM3509 adaptively regulates the supply voltage of the LED strings to maximize efficiency and insure the current sinks remain in regulation. The maximum current per output is set via a single external low power resistor. An I2C compatible interface allows for independent adjustment of the LED current in either output from 0 to max current in 32 exponential steps. When configured as a white LED + OLED bias supply the LM3509 can independently and simultaneously drive a string of up to 5 white LED’s and deliver a constant output voltage of up to 21V for OLED panels. Output over-voltage protection shuts down the device if VOUT rises above 21V allowing for the use of small sized low voltage output capacitors. The LM3509 is offered in a small 10-pin thermally- enhanced WSON package and operates over the -40°C to +85°C temperature range. 2 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LM3509 LM3509 www.ti.com SNVS495D – FEBRUARY 2007 – REVISED MAY 2013 10 PH 2.7V to 5.5V CIN VOLED = 18V SW IN 1 PF OVP COUT 2.2 PF LM3509 R1 140 k: 20 mA 40 mA VIO 10 k: OLED Display 10 k: SCL SDA MAIN SUB/FB RESET/GPIO SET R2 10 k: RSET 12 k: GND OLED Panel Power Supply Connection Diagram Top View BOTTOM VIEW TOP VIEW 1 10 10 1 2 9 9 2 8 8 4 7 7 4 5 6 6 5 3 DAP DAP 3 Figure 1. 10-Pin WSON (3mm × 3mm × 0.8mm) PIN DESCRIPTIONS Pin Name 1 MAIN Function 2 SUB/FB 3 SET LED Current Setting Connection. Connect a resistor from SET to GND to set the maximum LED current into MAIN or SUB/FB (when in LED mode), where ILED_MAX = 192×1.244V/RSET. 4 VIO Logic Voltage Level Input 5 RESET/GPIO 6 SW Drain Connection for Internal NMOS Switch 7 OVP Over-Voltage Protection Sense Connection. Connect OVP to the positive terminal of the output capacitor. 8 IN Main Current Sink Input. Secondary Current Sink Input or 1.25V Feedback Connection for Constant Voltage Output. Active Low Hardware Reset and Programmable General Purpose I/O. Input Voltage Connection. Connect IN to the input supply, and bypass to GND with a 1µF ceramic capacitor. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LM3509 3 LM3509 SNVS495D – FEBRUARY 2007 – REVISED MAY 2013 www.ti.com PIN DESCRIPTIONS (continued) Pin Name 9 SDA Serial Data Input/Output Function 10 SCL Serial Clock Input DAP GND Ground These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) −0.3V to 6V VIN VSW, VOVP, −0.3V to 25V VSUB/FB, VMAIN −0.3V to 23V −0.3V to 6V VSCL, VSDA, VRESET\GPIO, VIO , VSET Continuous Power Dissipation Internally Limited Junction Temperature (TJ-MAX) +150ºC Storage Temperature Range -65ºC to +150º C Maximum Lead Temperature (Soldering, 10s) (4) +300°C ESD Rating (5) Human Body Model (1) (2) (3) (4) (5) 2.5kV Absolute maximum ratings are limits beyond which damages to the device may occur. Operating Ratings are conditions for which the device is intended to be functional, but device parameter specifications may not be ensured. For ensured specifications and test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instrument Sales Office/ Distributors for availability and specifications. All voltages are with respect to the potential at the GND pin. For detailed soldering specifications and information, please refer to Application Note 1187: Leadless Lead frame Package (AN-1187) (Literature Number SNOA401). The human body model is a 100pF capacitor discharged through 1.5kΩ resistor into each pin. (MIL-STD-883 3015.7). Operating Ratings (1) (2) VIN 2.7V to 5.5V VSW, VOVP, 0V to 23V VSUB/FB, VMAIN 0V to 21V (3) -40ºC to +110ºC Ambient Temperature Range (TA) (4) -40ºC to +85ºC Junction Temperature Range (TJ) (1) (2) (3) (4) Absolute maximum ratings are limits beyond which damages to the device may occur. Operating Ratings are conditions for which the device is intended to be functional, but device parameter specifications may not be ensured. For ensured specifications and test conditions, see the Electrical Characteristics. All voltages are with respect to the potential at the GND pin. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150ºC (typ.) and disengages at TJ=140ºC (typ.). In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = +105ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). Thermal Properties Junction to Ambient Thermal Resistance (θJA) (1) (1) 4 54°C/W Junction-to-ambient thermal resistance (θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 114mm x 76mm x 1.6mm with a 2x1 array of thermal vias. The ground plane on the board is 113mm x 75mm. Thickness of copper layers are 71.5µm/35µm/35µm/71.5µm (2oz/1oz/1oz/2oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W. The value of θJA of this product in the WSON package could fall in a range as wide as 50ºC/W to 150ºC/W (if not wider), depending on board material, layout, and environmental conditions. In applications where high maximum power dissipation exists special care must be paid to thermal dissipation issues. For more information on these topics, please refer to Application Note 1187: Leadless Leadframe Package (LLP) (Literature Number SNOA401). Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LM3509 LM3509 www.ti.com SNVS495D – FEBRUARY 2007 – REVISED MAY 2013 Electrical Characteristics Specifications in standard type face are for TA = 25°C and those in boldface type apply over the Operating Temperature Range of TA = −40°C to +85°C. Unless otherwise specified VIN = 3.6V, VIO = 1.8V, VRESET/GPIO = VIN, VSUB/FB = VMAIN = 0.5V, R = 12.0kΩ, OLED = ‘0’, ENM = ENS = ‘1’, BSUB = BMAIN = Full Scale. (1) (2) SET Symbol ILED Parameter Conditions Output Current Regulation MAIN or SUB/FB Enabled UNI = ‘0’, or ‘1’ Maximum Current Per Current Sink RSET = 8.0kΩ Min 18.6 Typ Max 20 21.8 30 Units mA (3) ILED-MATCH IMAIN to ISUB/FB Current Matching UNI = ‘1’ VSET SET Pin Voltage 3.0V < VIN < 5V ILED/ISET ILED Current to ISET Current Ratio 192 VREG_CS Regulated Current Sink Headroom Voltage 500 VREG_OLED VSUB/FB Regulation Voltage in 3.0V < VIN < 5.5V, OLED = OLED Mode ‘1’ VHR Current Sink Minimum Headroom Voltage RDSON NMOS Switch On Resistance ISW = 100mA ICL NMOS Switch Current Limit VIN = 3.0V 650 VOVP Output Over-Voltage Protection ON Threshold OFF Threshold 0.15 1 % 1.244 1.172 ILED = 95% of nominal 1.21 V mV 1.239 300 V mV Ω 0.58 770 875 21.2 22 22.9 19.7 20.6 21.2 1.0 1.27 1.4 mA V fSW Switching Frequency DMAX Maximum Duty Cycle 90 % DMIN Minimum Duty Cycle 10 % IQ Quiescent Current, Device Not Switching ISHDN Shutdown Current MHz VMAIN and VSUB/FB > VREG_CS, BSUB = BMAIN = 0x00 400 VSUB/FB > VREG_OLED, OLED=’1’, ENM=ENS=’0’ 250 305 ENM = ENS = OLED = '0' 3.6 5 µA 0.5 V 440 µA RESET/GPIO Pin Voltage Specifications VIL Input Logic Low 2.7V < VIN 0.3V. Input Capacitor Selection Choosing the correct size and type of input capacitor helps minimize the input voltage ripple caused by the switching of the LM3509’s boost converter. For continuous inductor current operation the input voltage ripple is composed of 2 primary components, the capacitor discharge (delta VQ) and the capacitor’s equivalent series resistance (delta VESR). These ripple components are found by: 'VQ = 'I L x D 2 x f SW x C IN and 'VESR = 2 x 'I L x R ESR where 'I L = VIN x (VOUT - VIN ) 2 x f SW x L x VOUT (6) In the typical application circuit a 1µF ceramic input capacitor works well. Since the ESR in ceramic capacitors is typically less than 5mΩ and the capacitance value is usually small, the input voltage ripple is primarily due to the capacitive discharge. With larger value capacitors such as tantalum or aluminum electrolytic the ESR can be greater than 0.5Ω. In this case the input ripple will primarily be due to the ESR. Output Capacitor Selection The LM3509’s output capacitor supplies the LED current during the boost converters on time. When the switch turns off the inductor energy is discharged through the diode supplying power to the LED’s and restoring charge to the output capacitor. This causes a sag in the output voltage during the on time and a rise in the output voltage during the off time. The output capacitor is therefore chosen to limit the output ripple to an acceptable level depending on LED or OLED panel current requirements and input/output voltage differentials. For proper operation ceramic output capacitors ranging from 1µF to 2.2µF are required. As with the input capacitor, the output voltage ripple is composed of two parts, the ripple due to capacitor discharge (delta VQ) and the ripple due to the capacitors ESR (delta VESR). For continuous conduction mode, the ripple components are found by: Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LM3509 21 LM3509 SNVS495D – FEBRUARY 2007 – REVISED MAY 2013 'VQ = ILED u (VOUT VIN) and fSW u VOUT u COUT 'VESR = RESR u where www.ti.com § ILED u VOUT · + 'IL¸ ¨ VIN © ¹ 'IL = VIN u (VOUT VIN) 2 u fSW u L u VOUT (7) Table 7 lists different manufacturers for various capacitors and their case sizes that are suitable for use with the LM3509. When configured as a dual output LED driver a 1µF output capacitor is adequate. In OLED mode for output voltages above 12V a 2.2µF output capacitor is required. Table 7. Recommended Output Capacitors Manufacturer Part Number Value Case Size Voltage Rating TDK C1608X5R1E105M 1µF 0603 25V Murata GRM39X5R105K25D539 1µF 0603 25V TDK C2012X5R1E225M 2.2µF 0805 25V Murata GRM219R61E225KA12 2.2µF 0805 25V Inductor Selection The LM3509 is designed for use with a 10µH inductor, however 22µH are suitable providing the output capacitor is increased 2×'s. When selecting the inductor ensure that the saturation current rating (ISAT) for the chosen inductor is high enough and the inductor is large enough such that at the maximum LED current the peak inductor current is less than the LM3509’s peak switch current limit. This is done by choosing: ISAT > 'IL = I LED VOUT + 'I L × K VIN VIN x (VOUT - VIN ) 2 x f SW x L x VOUT where , and VIN x (VOUT - VIN) L> § 2 x f SW x VOUT x ¨ ¨I PEAK - I LED _ MAX x VOUT · © K x VIN ¸¸ ¹ (8) Values for IPEAK can be found in the plot of peak current limit vs. VIN in the Typical Performance Characteristics graphs. Table 8 shows possible inductors, as well as their corresponding case size and their saturation current ratings. Table 8. Recommended Inductors 22 Manufacturer Part Number Value Dimensions ISAT DC Resistance TDK VLF3012AT100MR49 10µH 2.6mm×2.8mm×1m m 490mA 0.36Ω TDK VLF4012AT100MR79 10µH 3.5mm×3.7mm×1.2 mm 800mA 0.3Ω TOKO A997AS-100M 10µH 3.8mm×3.8mm×1.8 mm 580mA 0.18Ω Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LM3509 LM3509 www.ti.com SNVS495D – FEBRUARY 2007 – REVISED MAY 2013 Diode Selection The output diode must have a reverse breakdown voltage greater than the maximum output voltage. The diodes average current rating should be high enough to handle the LM3509’s output current. Additionally, the diodes peak current rating must be high enough to handle the peak inductor current. Schottky diodes are recommended due to their lower forward voltage drop (0.3V to 0.5V) compared to (0.6V to 0.8V) for PN junction diodes. If a PN junction diode is used, ensure it is the ultra-fast type (trr < 50ns) to prevent excessive loss in the rectifier. For Schottky diodes the B05030WS (or equivalent) work well for most designs. See Table 9 for a list of other Schottky Diodes with similar performance. Table 9. Recommended Schottky Diodes Manufacturer Part Number Package Reverse Breakdown Voltage Average Current Rating Diodes Inc. B05030WS SOD-323 30V 0.5A Philips BAT760 SOD-323 23V 1A ON Semiconductor NSR0320MW2T SOD-323 30V 1A Output Current Range (OLED Mode) The maximum output current the LM3509 can deliver in OLED mode is limited by 4 factors (assuming continuous conduction); the peak current limit of 770mA (typical), the inductor value, the input voltage, and the output voltage. Calculate the maximum output current (IOUT_MAX) using the following equation: (IPEAK IOUT_MAX = where 'IL = 'IL) u K u VIN VOUT VIN u (VOUT VIN) 2 u fSW u L u VOUT (9) For the typical application circuit with VOUT = 18V and assuming 70% efficiency, the maximum output current at VIN = 2.7V will be approximately 70mA. At 4.2V due to the shorter on times and lower average input currents the maximum output current (at 70% efficiency) jumps to approximately 105mA. Figure 47 shows a plot of IOUT_MAX vs. VIN using the above equation, assuming 80% efficiency. In reality factors such as current limit and efficiency will vary over VIN, temperature, and component selection. This can cause the actual IOUT_MAX to be higher or lower. Figure 47. Typical Maximum Output Current in OLED Mode Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LM3509 23 LM3509 SNVS495D – FEBRUARY 2007 – REVISED MAY 2013 www.ti.com Output Voltage Range (OLED Mode) The LM3509's output voltage is constrained by 2 factors. On the low end it is limited by the minimum duty cycle of 10% (assuming continuous conduction) and on the high end it is limited by the over voltage protection threshold (VOVP) of 22V (typical). In order to maintain stability when operating at different output voltages the output capacitor and inductor must be changed. Refer to Table 10 for different VOUT, COUT, and L combinations. Table 10. Component Values for Output Voltage Selection VOUT COUT L VIN Range 18V 2.2µF 10µH 2.7V to 5.5V 15V 2.2µF 10µH 2.7V to 5.5V 12V 4.7µF 10µH 2.7V to 5.5V 9V 10µF 10µH 2.7V to 5.5V 7V 10µF 4.7µH 2.7V to 5.5V 5V 22µF 4.7µH 2.7V to 4.5V Layout Considerations The WSON is a leadless package with very good thermal properties. This package has an exposed DAP (die attach pad) at the underside center of the package measuring 1.6mm x 2.0mm. The main advantage of this exposed DAP is to offer low thermal resistance when soldered to the thermal ground pad on the PCB. For good PCB layout a 1:1 ratio between the package and the PCB thermal land is recommended. To further enhance thermal conductivity, the PCB thermal ground pad may include vias to a 2nd layer ground plane. For more detailed instructions on mounting WSON packages, please refer to Texas Instrument Application Note AN-1187 (Literature Number SNOA401). The high switching frequencies and large peak currents make the PCB layout a critical part of the design. The proceeding steps must be followed to ensure stable operation and proper current source regulation. 1. Divide ground into two planes, one for the return terminals of COUT, CIN and the I2C Bus, the other for the return terminals of RSET and the feedback network. Connect both planes to the exposed PAD, but nowhere else. 2. Connect the inductor and the anode of D1 as close together as possible and place this connection as close as possible to the SW pin. This reduces the inductance and resistance of the switching node which minimizes ringing and excess voltage drops. This will improve efficiency and decrease noise that can get injected into the current sources. 3. Connect the return terminals of the input capacitor and the output capacitor as close as possible to the exposed PAD and through low impedance traces. 4. Bypass IN with at least a 1µF ceramic capacitor. Connect the positive terminal of this capacitor as close as possible to IN. 5. Connect COUT as close as possible to the cathode of D1. This reduces the inductance and resistance of the output bypass node which minimizes ringing and the excess voltage drops. This will improving efficiency and decrease noise that can get injected into the current sources. 6. Route the traces for RSET and the feedback divider away from the SW node to minimize noise injection. 7. Do not connect any external capacitance to the SET pin. 24 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LM3509 LM3509 www.ti.com SNVS495D – FEBRUARY 2007 – REVISED MAY 2013 REVISION HISTORY Changes from Revision C (May 2013) to Revision D • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 24 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LM3509 25 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM3509SD/NOPB ACTIVE WSON DSC 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 85 L3509 LM3509SDE/NOPB ACTIVE WSON DSC 10 250 RoHS & Green SN Level-3-260C-168 HR -40 to 85 L3509 LM3509SDX/NOPB ACTIVE WSON DSC 10 4500 RoHS & Green SN Level-3-260C-168 HR -40 to 85 L3509 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of