Using the LM3632A Evaluation Module
User's Guide
Literature Number: SNVU460
March 2015
Contents
1
2
3
4
5
2
Introduction ......................................................................................................................... 4
Setup .................................................................................................................................. 4
2.1
Input/Output Connector Description ................................................................................... 4
2.2
Setup ....................................................................................................................... 6
Board Layout ....................................................................................................................... 7
Schematic ........................................................................................................................... 9
USB Interface Board and I2C-Compatible Interface Program .................................................... 12
5.1
Establishing I2C Communication ...................................................................................... 13
5.2
I2C Communication Block .............................................................................................. 13
5.3
SWR RESET Button
5.4
Backlight Operation..................................................................................................... 13
5.5
Flash/Torch Operation ................................................................................................. 13
5.6
VPOS/VNEG Operation ................................................................................................ 14
5.7
Flag Registers ........................................................................................................... 14
5.8
General Register Read/Write
5.9
GPIO Controls........................................................................................................... 15
...................................................................................................
.........................................................................................
Table of Contents
13
14
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List of Figures
1
Backlight LED Configuration Example .................................................................................... 5
2
LM3632EVM Recommended Jumper Placement ....................................................................... 7
3
Top Assembly Layer......................................................................................................... 7
4
Bottom Assembly Layer ..................................................................................................... 7
5
Top Layer Routing ........................................................................................................... 8
6
Middle Layer 1 Routing
7
Middle Layer 2 Routing
8
9
10
11
12
13
14
15
..................................................................................................... 8
..................................................................................................... 8
Bottom Routing ............................................................................................................... 8
LM3632EVM Schematic .................................................................................................... 9
LM3632A General User Interface ........................................................................................ 12
I2C Communication Fields ................................................................................................. 13
Display Bias Configuration Register Fields ............................................................................. 14
Flags Read Register ....................................................................................................... 14
General Register Fields ................................................................................................... 14
GPIO Controls .............................................................................................................. 15
List of Tables
1
Device and Package Configurations ...................................................................................... 4
2
Bill of Materials
.............................................................................................................
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List of Figures
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10
3
User's Guide
SNVU460 – March 2015
LM3632EVM User's Guide
1
Introduction
The Texas Instruments LM3632EVM evaluation module (EVM) helps designers evaluate the operation
and performance of the LM3632A Backlight + Bias Power + Flash Driver. The device offers configurability
via I2C-compatible interface. All three blocks can be enabled via the I2C interface. In addition, the Flash
Driver and LCM Bias can be enabled externally using the STROBE and LCM_EN pins. The module
utilizes two strings of 8 backlight LEDs connected in series and a flash LED mounted on the EVM.
The EVM contains one LM3632A device (see Table 1).
Table 1. Device and Package Configurations
2
BACKLIGHT + FLASH + LCM BIAS DRIVER
IC
PACKAGE
U1
LM3632A
0.4 mm-pitch, 30-pin DSBGA
Setup
This section describes the jumpers and connectors on the EVM as well as how to properly connect, set up
and use the LM3632EVM.
2.1
2.1.1
Input/Output Connector Description
Input / GND
There are three input terminals and one ground for the EVM, providing a power (VIN) and ground (GND)
connection to allow the user to attach the EVM to a cable harness. The three input terminals allow the
user to split the input to the three boost drivers so that the input power to each block can be measured
independently. All three input terminals can be shorted together by jumpers J8, J9, and J10 or by 0-Ω
resistors R4, R5, and R6 (not assembled).
2.1.2
EN (J14)
This is the jumper used to enable the LED driver (HWEN pin). The driver will be enabled when the HWEN
pin is high (VIO) and disabled when it is low (GND).
2.1.3
VIO (J21)
This pin provides power for the I2C lines (Clock and Data) and for the HWEN pin. It is recommended that
this pin is connected to the VIN pin. If desired, it can be connected to the 3.3-V line provided by the USB
interface connector. In this configuration, communication via the I2C interface may not be possible if the
supply voltage to the LED driver is below approximately 3 V.
2.1.4
LCM1EN (J15) & LCM2EN (J16)
These jumpers can be used to externally enable the VPOS and VNEG outputs of the LCM Bias block. The
outputs will be enabled when the pins are high (VIO) and disabled when left floating. There are 300-kΩ
pull-down resistors to GND on both of these pins. The LCMEN1 & LCMEN2 pins can also be controlled
externally by applying a signal directly to the pins.
4
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Setup
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2.1.5
Backlight LED Connector (JBD)
This jumper connects the backlight LED strings to the outputs of the backlight boost output pin, BL_OUT.
Place jumper between BLOUT & DBL pins.
2.1.6
Backlight LED Configuration Connectors
The user can use these connectors to configure each string’s number of LEDs. The default configuration
is 8 LEDs in series (no jumpers). To achieve a configuration of 2 LEDs in series place a jumper on
location “2”, 3 LEDs on location “3” and so on. For example, placing the jumpers as shown on Figure 1,
will configure string 2 with 6 LEDs and string 1 with 7 LEDs.
Figure 1. Backlight LED Configuration Example
2.1.7
JFD Jumper
The JFD is used to connect the on-board flash LED to the LED output of the flash driver.
2.1.8
PWM (J18)
This pin is the PWM input signal for backlight LED current adjustment. It can be driven externally or if
connected to pin PWM0 via a jumper it can be driven by a using the General User Interface (GUI)
software provided.
2.1.9
STROBE (J17)
This pin provides an external method for initiating a flash event. The STROBE pin is connected to ground
via a 300-kΩ resistor internal to the LM3632. To externally drive this pin, either connect a control signal
directly to the STROBE pin of the connector or place a jumper between connector pins STROBE and
PWM1. The PWM1 pin can be configured as ON, OFF, time-adjustable voltage pulse or continuous
voltage pulses of adjustable frequency and duty cycle via the GUI software provided.
2.1.10
TX (J19)
This pin is used to initiate a TX-interrupt event. The TX pin is connected to ground via a 300-kΩ resistor
internal to the LM3632. To externally drive this pin, either connect a control signal directly to the TX pin of
the connector or place a jumper between connector pins TX and PWM2. The PWM2 pin can be
configured as ON, OFF, time-adjustable voltage pulse, or continuous voltage pulses of adjustable
frequency and duty cycle via the GUI software provided.
2.1.11
SDA / SCL (J20)
These connections allow the user to externally control the I2C lines. For independent control of the I2C
lines, do not connect the VIO jumper to either the 3.3 V or the VIN pin.
2.1.12
FOUT, FLED (J25)
These provide access to the regulated outputs of the flash driver and the flash LED current source. The
user can measure VOUT with reference to GND, VLED with reference to GND and current source
headroom directly between VOUT and VLED.
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Setup
2.1.13
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LCMOUT, VPOS (J26)
These provide access to the regulated output of the LCM bias boost and the VPOS output. The user can
measure LCMOUT and VPOS with reference to GND.
2.1.14
VNEG, CF-, CF+ (J24)
These provide access to the regulated inverting charge pump output (VNEG) and to the charge pump
positive and negative flying cap connections. The user can measure VNEG with reference to GND and can
monitor the voltage waveforms at the flying cap terminals.
2.1.15
BLSW (J13), FSW (J12), LCMSW (J11)
These connectors can be used to monitor the voltage waveforms at the switch pin of each boost circuit.
VINBL/VIN (J8), VINLCM/VIN (J10), VINF/VIN (J9)
The user can monitor the inductor current and input current waveforms for each of the three boost blocks
by omitting these jumpers and using separate wires from the power supply to the inductors and VIN. This
will remove the input capacitors from the inductors and eliminate their filtering effect to the inductor
current.
2.1.16
JFS – Flash LED Current Measurement
The LM3632EVM provides a way to accurately measure the LED current through the LED on board.
Resistor RFS (0.1 Ω) is placed between the cathode of flash LED (DF) and Ground. The user can first
measure the resistor value accurately, by applying a known current through connector DFHF and ground
and measuring the voltage between DFHS and DFLS. Then, during normal flash or torch operation, the
voltage measured across the resistor divided by the resistor value will equal the current through the
resistor (and the LED).
2.1.17
JB1S & JB2S – Backlight String Current Measurements
The LM3632EVM provides a way to accurately measure the current through the backlight LED strings on
board. Resistors RB1S & RB2S (10 Ω) are placed between the LED strings and the current sink inputs of
the LM3632. The user can measure the voltage across the resistor(s) and calculate the current(s) through
the resistor(s) by dividing the voltage by 10 Ω.
2.2
Setup
The input voltage range for the LM3632A is 2.7 V to 5 V. The on-board backlight and flash LEDs should
be connected, and the jumpers should be properly configured for proper operation. This is the
recommended setting, using shorting blocks:
• VIO to VIN (J21), Except for silicon A0
• EN to VIO (J14)
• Flash LED (JFD) shorted
• Backlight LEDs (JBD) shorted
• J8 shorted or R4 = 0 Ω
• J9 shorted or R5 = 0 Ω
• J10 shorted or R6 = 0 Ω
• PWM to PWM0 (J18) or external signal
• STROBE to PWM1 (J17) or external signal
• TX to PWM2 (J19) or external signal
In this configuration, the device will power up when power is applied and all outputs can be enabled. Refer
to Figure 2 for recommended jumper placement.
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Board Layout
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Figure 2. LM3632EVM Recommended Jumper Placement
3
Board Layout
Figure 3, Figure 4, Figure 5, Figure 6, Figure 7 and Figure 8 show the board layout for the LM3632EVM.
The EVM offers resistors, capacitors, and jumpers to enable the device and to configure it as desired.
The LM3632A will dissipate power, especially during high currents and long duration flash events. Power
will also be dissipated on the flash and backlight LEDs. The EVM layout is designed to minimize
temperature rise during operation. It is recommended that in order to prevent overheating, repeated flash
events in very short time intervals is avoided.
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Board Layout
8
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Figure 3. Top Assembly Layer
Figure 4. Bottom Assembly Layer
Figure 5. Top Layer Routing
Figure 6. Middle Layer 1 Routing
Figure 7. Middle Layer 2 Routing
Figure 8. Bottom Routing
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Schematic
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4
Schematic
Figure 9. LM3632EVM Schematic
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Table 2. Bill of Materials
ITEM
DESIGNATOR
1
PCB
2
CB
3
CBATT
4
CD
5
6
10
DESCRIPTION
MANUFACTURER
PART NUMBER
Printed Circuit Board
Any
SV601119
CAP, CERM, 1uF, 50V, +/-10%, X7R, 0805
TDK
C2012X7R1H105K125AB
CAP, CERM, 100uF, 6.3V, +/-20%, X5R, 1206
MuRata
GRM31CR60J107ME39L
CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603
TDK
C1608X5R0J106M
CF
CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603
TDK
C1608X5R0J106M
CFLY
CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603
TDK
C1608X5R0J106M
7
CIN
CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603
TDK
C1608X5R0J106M
8
CVNEG
CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603
TDK
C1608X5R0J106M
9
CVPOS
CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603
TDK
C1608X5R0J106M
10
D101
LED, White, SMD
Rohm
SML312WBCW1
11
D102
LED, White, SMD
Rohm
SML312WBCW1
12
D103
LED, White, SMD
Rohm
SML312WBCW1
13
D104
LED, White, SMD
Rohm
SML312WBCW1
14
D105
LED, White, SMD
Rohm
SML312WBCW1
15
D106
LED, White, SMD
Rohm
SML312WBCW1
16
D107
LED, White, SMD
Rohm
SML312WBCW1
17
D108
LED, White, SMD
Rohm
SML312WBCW1
18
D201
LED, White, SMD
Rohm
SML312WBCW1
19
D202
LED, White, SMD
Rohm
SML312WBCW1
20
D203
LED, White, SMD
Rohm
SML312WBCW1
21
D204
LED, White, SMD
Rohm
SML312WBCW1
22
D205
LED, White, SMD
Rohm
SML312WBCW1
23
D206
LED, White, SMD
Rohm
SML312WBCW1
24
D207
LED, White, SMD
Rohm
SML312WBCW1
25
D208
LED, White, SMD
Rohm
SML312WBCW1
26
DF
Philips Lumileds
LXCL-EYW4
LED, Cool White, SMD
27
DSH
Diode, Schottky, 30V, 0.5A, SOD-923
ON Semiconductor
NSR0530P2T5G
28
FID1
Fiducial mark. There is nothing to buy or mount.
N/A
N/A
29
FID2
Fiducial mark. There is nothing to buy or mount.
N/A
N/A
30
FID3
Fiducial mark. There is nothing to buy or mount.
N/A
N/A
31
GND
Standard Banana Jack, Insulated, Black
Keystone
6092
32
GNDS
33
J1A
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
34
J1B
35
J1C
36
Test Point, Compact, Black, TH
Keystone
5006
Samtec, Inc.
TSW-102-07-G-S
Header, TH, 100mil, 4x1, Gold plated, 230 mil above insulator
Samtec
TSW-104-07-G-S
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
J2A
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
37
J2B
Header, TH, 100mil, 4x1, Gold plated, 230 mil above insulator
Samtec
TSW-104-07-G-S
38
J2C
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
39
J5
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
40
J6
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
41
J7
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
42
J8
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
43
J9
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
44
J10
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
45
J11
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
46
J12
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
47
J13
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
48
J14
Header, 100mil, 2x1, Gold, TH
Samtec
TSW-102-07-G-S
49
J15
Header, 100mil, 2x1, Gold, TH
Samtec
TSW-102-07-G-S
50
J16
Header, 100mil, 2x1, Gold, TH
Samtec
TSW-102-07-G-S
51
J17
Header, 100mil, 2x1, Gold, TH
Samtec
TSW-102-07-G-S
52
J18
Header, 100mil, 2x1, Gold, TH
Samtec
TSW-102-07-G-S
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Table 2. Bill of Materials (continued)
ITEM
DESIGNATOR
53
J19
Header, 100mil, 2x1, Gold, TH
DESCRIPTION
MANUFACTURER
PART NUMBER
Samtec
TSW-102-07-G-S
54
J20
55
J21
Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-103-07-G-S
Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator
Samtec, Inc.
56
TSW-103-07-G-S
J22
Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-103-07-G-S
57
J23
Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-103-07-G-S
58
J24
Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-103-07-G-S
59
J25
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
60
J26
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
61
J101
Header (shrouded), 100mil, 5x2, High-Temperature, Gold, TH
3M
N2510-6002-RB
62
JB1S
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
63
JB2S
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
64
JBD
Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-103-07-G-S
65
JFD
Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-102-07-G-S
66
JFS
Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator
Samtec, Inc.
TSW-103-07-G-S
67
LB
Inductor, Shielded, Ferrite, 10uH, 1A, 0.23 ohm, SMD
TDK
VLF403212MT- 100M
68
LBL1
Thermal Transfer Printable Labels, 0.650" W x 0.200" H 10,000 per roll
Brady
THT-14-423-10
69
LD
Inductor, Shielded, Ferrite, 2.2uH, 1.05A, 0.195 ohm, SMD
TDK
VLS201612ET-2R2M
70
LF
Inductor, Shielded, Metal Composite, 1uH, 2.6A, 0.058 ohm,
SMD
Toko
DFE201610P-1R0M
71
R4
RES, 0 ohm, 5%, 0.25W, 1206
Yageo America
RC1206JR-070RL
72
R5
RES, 0 ohm, 5%, 0.25W, 1206
Yageo America
RC1206JR-070RL
73
R6
RES, 0 ohm, 5%, 0.25W, 1206
Yageo America
RC1206JR-070RL
74
RB1S
RES, 10.0 ohm, 0.1%, 0.1W, 0805
Bourns
CRT0805-BY-10R0ELF
75
RB2S
RES, 10.0 ohm, 0.1%, 0.1W, 0805
Bourns
CRT0805-BY-10R0ELF
76
RFS
RES, 0.1 ohm, 5%, 0.125W, 0805
Panasonic
ERJ-6RSJR10V
77
RSCL
RES, 1.0k ohm, 5%, 0.1W, 0603
Vishay-Dale
CRCW06031K00JNEA
78
RSDA
RES, 1.0k ohm, 5%, 0.1W, 0603
Vishay-Dale
CRCW06031K00JNEA
79
SH-BD
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
80
SH-EN
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
81
SH-FD
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
82
SH-LCM1
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
83
SH-LCM2
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
84
SH-PWM
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
85
SH-STROBE
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
86
SH-TX
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
87
SH-VIO
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
88
U1
LED Driver, YFQ0030ACAC
Texas Instruments
LM3632A
89
VIN
Test Point, TH, Compact, Red
90
VINBL
BANANA JACK, 15A, Insulated, Nylon,Yellow
Keystone
5005
Emerson Network Power
108-0907-001
91
VINF
Standard Banana Jack, Insulated, Red
Keystone
6091
92
VINLCM
Standard Banana Jack, Insulated, Red
Keystone
6091
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USB Interface Board and I2C-Compatible Interface Program
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USB Interface Board and I2C-Compatible Interface Program
Texas Instruments has created an I2C-compatible program and USB docking board that helps exercise the
part in a simple way. This section describes how to use the USB docking board and interface software.
The LM3632EVM has the means to “plug into” the USB docking board. The USB docking board provides
all the control signals for the simple interface. Power to the part must be provided externally. A USB cable
(provided) must be connected to the board from a PC.
The I2C-compatible interface program provides all of the control that the LM3632A device requires. For
proper operation, the USB docking board should be plugged into the PC before the interface program is
opened. Once connected, and the program is executed, a basic interface window will open. Figure 10
shows the default settings.
All GUI user activities result in immediate action. The only exception is the Enable Register 0x0A; in order
to update the register contents to the displayed settings, the “WRITE” button needs to be selected. This is
done in order to allow the user to turn on/off both the backlight and flash blocks simultaneously.
The GUI is configured in register blocks. Please refer to the LM3632A datasheet (SNVSA63) Register
Maps section for register configuration details.
Figure 10. LM3632A General User Interface
12
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5.1
Establishing I2C Communication
1. Verify that the Firmware version on the upper left side of the GUI shows 2.6.5.3, and a serial number is
displayed. If not, plug and unplug the USB cable on the USB2ANY box.
2. Perform a “Read” of register 0x01. The return values should be VENDOR = 01 and REV = 02. If it
returns nothing it means communication is not established properly. Vary the VIO supply voltage until
the proper values are read.
3. Once I2C communication has been established, select boxes “BLED1” or “BLED1/2” and “BL” (they
should display “ON”) and then select “WRITE” on “Reg. 0x0A ENABLE REGISTER”. The field STATUS
on the top left of the GUI should say “No error” or “Success” if the write command was properly
received and the backlight LEDs should glow. Note: The default backlight OVP setting for the
LM3632A is 22 V, so under default conditions the backlight boost circuit will operate in OVP mode, and
the light will be dim. Refer to Section 5.4 section for details.
4. If the backlight LEDs don’t glow, and there are no error messages in the “STATUS” window, close the
GUI, recycle power to the LM3632A, unplug, then plug the USB2ANY cable from the USB2ANY box
and try again.
5.2
I2C Communication Block
The GUI provides fields that allow for general I2C interaction. Simply populate the fields with the desired
internal register address and data (for write operation) and perform a read or write action. The general I2C
communication interface allows for burst “write” and “read” operations. As an example, populating the
internal address field with “03”, the “# of bytes to “READ/WRITE” field with “5” and the “DATA” field with
“02 a5 80 13 2f”, then selecting “WRITE” would attempt to write data “0x02” to register 0x03, data 0xa5 to
register 0x04, data 0x80 to register 0x05, data 0x13 to register 0x06 and data 0x0f to register 0x07. Field
“STATUS” displays communication error messages.
Figure 11. I2C Communication Fields
5.3
SWR RESET Button
Selecting the “RESET” button in register 0x0A sets bit[7] of register 0x0A to “1” which causes the
LM3632A to configure all registers to their default values. The GUI fields are updated to reflect the register
contents. Upon completion of its register updates, the LM3632A resets bit[7] to “0” (no further action by
the user is required).
5.4
Backlight Operation
1. Configure the number of backlight LEDs for both strings as desired (refer to Section 2.1)
2. Select the desired BL OVP voltage level in register 0x02, based on the number of LEDs used.
3. Turn on one or both backlight strings by selecting box “BLED1” or “BLED1/2” and box “BL”, then
selecting “WRITE” in register 0x0A.
5.5
Flash/Torch Operation
1. I2C Mode: Select TORCH or FLASH mode by selecting field “MODE” accordingly, select field “FLASH”
then select “WRITE” in register 0x0A.
2. STROBE Mode: Enable STROBE in register 0x09, follow instructions in step 1, then provide a voltage
pulse on the STROBE pin.
SNVU460 – March 2015
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Copyright © 2015, Texas Instruments Incorporated
13
USB Interface Board and I2C-Compatible Interface Program
5.6
www.ti.com
VPOS/VNEG Operation
1. I2C Mode: VPOS & VNEG can be enabled in I2C mode by the corresponding field in register 0x0C.
Field “EXT ENABLE” must be disabled in order to turn VPOS and/or VNEG on in I2C mode.
2. External Node: Enable “EXT ENABLE” in register 0x0C, then pull pins LCMEN1 and LCMEN2 high to
enable VPOS and VNEG, respectively.
Figure 12. Display Bias Configuration Register Fields
5.7
Flag Registers
Registers 0x0B and 0x10 (right side of GUI) contain the fault and flag bits of the LM3632A. Some bits are
report only while others are fault bits (see LM3632A datasheet (SNVSA63) for fault/flag definitions and
options). Faults inhibit subsequent enabling of the affected block, while flags do not. Select “READ” to
read the fault/flag status of both registers and clear the registers.
Figure 13. Flags Read Register
5.8
General Register Read/Write
The LM3632EVM GUI includes a block that allows for a quick register “read” or “write” action. Selecting
the “READ” button performs a read of all registers and updates the corresponding fields of the GUI.
Populating the register fields with the desired data and performing a “WRITE” writes the data to all
registers and updates the corresponding GUI fields.
Figure 14. General Register Fields
14
LM3632EVM User's Guide
SNVU460 – March 2015
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5.9
USB Interface Board and I2C-Compatible Interface Program
GPIO Controls
The LM3632EVM provides the user with the capability to control the STROBE, PWM and TX inputs of the
LM3632A without the need of an external supply. In order for the signals to be applied to the
corresponding LM3632A input pin(s) the appropriate jumpers need to be placed (see Section 2.1 for
STROBE, PWM, and TX jumper placement).
To force a pulse on the STROBE pin the user can select a pulse width from the dropdown menu then
select the “STROBE PULSE” button. Selecting “ON” or “OFF” on the dropdown menu sets the STROBE
pin high or low, respectively.
The user can choose among a few frequencies and duty cycle increment combinations of continuous
pulses for the backlight PWM and flash TX input pins. A duty cycle of 0% sets the voltage(s) low and a
duty cycle of 100% sets the voltage(s) high.
Figure 15. GPIO Controls
SNVU460 – March 2015
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LM3632EVM User's Guide
Copyright © 2015, Texas Instruments Incorporated
15
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
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