LM3646EVM

LM3646EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    Module

  • 描述:

    EVAL BOARD LED DRIVER LM3646

  • 数据手册
  • 价格&库存
LM3646EVM 数据手册
Using the LM3646 Evaluation Module User's Guide Literature Number: SNVU276A DECEMBER 2013 – Revised July 2014 All trademarks are the property of their respective owners. Contents 1 2 3 4 5 Introduction ......................................................................................................................... 5 Setup .................................................................................................................................. 5 2.1 Input/Output Connector Description ................................................................................... 5 2.2 Setup ....................................................................................................................... 7 2.3 Operation .................................................................................................................. 7 Board Layout ....................................................................................................................... 7 Schematic ......................................................................................................................... 11 USB Interface Board and I2C-Compatible Interface Program .................................................... 14 ................................................................................................ 15 5.2 Temp and Torch Ramp Register (0x03) ............................................................................. 16 5.3 Flash Timing Register (0x04) ......................................................................................... 16 5.4 LED1 Flash Current Control Register (0x06) ....................................................................... 16 5.5 LED1 Torch Current Control Register (0x07) ....................................................................... 17 5.6 Max Current Control Register (0x05) ................................................................................ 17 Revision History .......................................................................................................................... 19 5.1 2 Enable Register (0x01) Table of Contents SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated www.ti.com List of Figures 1 Enable Jumper Settings..................................................................................................... 5 2 VIO Jumper Settings ........................................................................................................ 5 3 STROBE Jumper Settings .................................................................................................. 6 4 TORCH Jumper Settings 5 TX Jumper Settings 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 ................................................................................................... 6 ......................................................................................................... 6 Top Assembly Layer......................................................................................................... 8 Bottom Assembly Layer ..................................................................................................... 8 Top Layer Routing ........................................................................................................... 9 Middle Layer 1 Routing ..................................................................................................... 9 Middle Layer 2 Routing .................................................................................................... 10 Bottom Layer Routing...................................................................................................... 10 LM3646EVM Schematic ................................................................................................... 11 LM3646 General User Interface .......................................................................................... 14 I2C interface Fields ......................................................................................................... 15 Immediate Action Fields ................................................................................................... 15 Device ID Field ............................................................................................................. 15 Enable Register............................................................................................................. 15 IVFM Mode Register ....................................................................................................... 16 NTC and Torch Ramp Register .......................................................................................... 16 Flash Timing Register ..................................................................................................... 16 LED1 Flash Current Control Register ................................................................................... 16 LED1 Torch Current Control Register ................................................................................... 17 Max Current Control Register............................................................................................. 17 NTC Log Register .......................................................................................................... 17 Flags ......................................................................................................................... 18 I/O Pin Controls ............................................................................................................. 18 SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated List of Figures 3 www.ti.com List of Tables 1 4 Device and Package Configurations ...................................................................................... 5 List of Tables SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated User's Guide SNVU276A – DECEMBER 2013 – Revised July 2014 LM3646EVM User's Guide 1 Introduction The Texas Instrument LM3646EVM evaluation module (EVM) helps designers evaluate the operation and performance of the LM3646 4MHz High-Current LED driver. The device offers configurability via I2Ccompatible interface. It can be enabled in Flash or Torch mode via the I2C interface or externally using the STROBE and TORCH pins. The module utilizes two LEDs (D1 & D2) mounted on the EVM. The EVM contains one Synchronous Boost LED Flash Driver (See Table 1). Table 1. Device and Package Configurations 2 FLASH LED DRIVER IC PACKAGE U1 LM3646 0.4 mm-pitch, 20-Bump DSBGA Setup This section describes the jumpers and connectors on the EVM as well as how to properly connect, set up, and use the LM3646EVM. 2.1 Input/Output Connector Description Input / GND - These are the power input terminals for the driver. The terminal block provides a power (VIN) and ground (GND) connection to allow the user to attach the EVM to a cable harness. EN (J16) - This is the jumper used to enable the LED driver. The driver will be enabled when the EN pin is high (VIO) and disabled when it is low (GND). Figure 1. Enable Jumper Settings VIO (J15) - This pin provides power for the I2C lines (Clock & Data) and for the EN pin. It is recommended that this pin is connected to the VIN pin. If desired, it can be connected to the 3.3V line provided by the USB interface connector. In this configuration, communication via the I2C interface may not be possible if the supply voltage to the LED driver is below approximately 3V. Figure 2. VIO Jumper Settings SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated LM3646EVM User's Guide 5 Setup www.ti.com D1-CON (J18) and D2-CON (J19) are the jumpers used to connect the on-board flash LEDs to the LED output of the driver. STROBE (J13) - This pin provides an external method for initiating a flash or torch event. The STROBE pin is connected to ground via a 300-KΩ resistor internal to the LM3646. To externally drive this pin, either connect a control signal directly to the STROBE pin of the connector or place a jumper between connector pins STROBE and PWM0. Pin PWM0 can be configured as ON, OFF, time-adjustable voltage pulse, or continuous voltage pulses of adjustable frequency and duty cycle via the General User Interface (GUI) software provided. Figure 3. STROBE Jumper Settings TORCH (J12) - This pin provides an external method for initiating a torch event. The TORCH pin is connected to ground via a 300-KΩ resistor internal to the LM3646. To externally drive this pin, either connect a control signal directly to the TORCH pin of the connector or place a jumper between connector pins TORCH and PWM1. Pin PWM1 can be configured as ON, OFF, time-adjustable voltage pulse, or continuous voltage pulses of adjustable frequency and duty cycle via the GUI software provided. Figure 4. TORCH Jumper Settings TX (J14) - This pin is used to initiate a TX-interrupt event. The TX pin is connected to ground via a 300KΩ resistor internal to the LM3646. To externally drive this pin, either connect a control signal directly to the TX pin of the connector or place a jumper between connector pins TX and PWM2. Pin PWM2 can be configured as ON, OFF, time-adjustable voltage pulse or continuous voltage pulses of adjustable frequency and duty cycle via the GUI software provided. Figure 5. TX Jumper Settings SDA / SCL (J17) - These connections allow the user to externally control the I2C lines. For independent control of the I2C lines, do not connect the VIO jumper to either the 3.3V or the VIN pin. OUT, LED1, LED2, TEMP (J10, J11, J6) - These provide access to the regulated output of the driver, the outputs of the LED current sources, and the TEMP pin. The user can measure VOUT with reference to GND, VLED with reference to GND, current source headroom directly between VOUT and VLED, and can monitor or control TEMP input. 6 LM3646EVM User's Guide SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Setup www.ti.com VINL/VIN (J4) - The user can monitor the Inductor Current and Input Current waveforms by omitting this jumper and using separate wires from the power supply to the VINL and VIN pins. This will remove the Input Capacitors from the Inductor and eliminate their filtering effect to the Inductor Current. J7 and J8: LED Current measurements -The LM3646 EVM provides a way to accurately measure the LED current through both LEDs on board. Resistors R1 & R2 (0.1 Ω) are placed between the cathode of LED1 & LED2, respectively, and Ground. The user can first measure the resistor values accurately, by applying a known current through connector DXHF and Ground and measuring the voltage between DXHS and DXLS. Then, during normal flash or torch operation, the voltage measured across the resistor divided by the resistor value will equal the current through the resistor (and the LED). 2.2 Setup The input voltage range for the flash driver is 2.7 volts to 5.5 volts. The on-board LEDs or an LED module should be connected for proper operation. 2.3 Operation For proper operation of the LM3646EVM, the jumpers should be properly configured. The recommended setting, using shorting blocks is: VIO to VIN EN to VIO STROBE to PWM0 or external signal TORCH to PWM1 or external signal TX to PWM2 or external signal LEDs (J18 and J19) shorted In this configuration, the device will power up when power is applied. 3 Board Layout Figure 6, Figure 7, Figure 8, Figure 9, Figure 10 and Figure 11 show the board layout for the LM3646EVM. The EVM offers resistors, capacitors, and jumpers to enable the device and to configure it as desired. The LM3646 will dissipate power, especially during high current and long duration flash events. Power will also be dissipated on the flash LEDs. The EVM layout is designed to minimize temperature rise during operation. It is recommended that in order to prevent overheating, repeated flash events in very short time intervals is avoided. SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated LM3646EVM User's Guide 7 Board Layout www.ti.com Figure 6. Top Assembly Layer Figure 7. Bottom Assembly Layer 8 LM3646EVM User's Guide SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Board Layout www.ti.com Figure 8. Top Layer Routing Figure 9. Middle Layer 1 Routing SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated LM3646EVM User's Guide 9 Board Layout www.ti.com Figure 10. Middle Layer 2 Routing Figure 11. Bottom Layer Routing 10 LM3646EVM User's Guide SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Schematic www.ti.com 4 Schematic FID1 GND 1 2 3 VINL 1 2 PWM0 J1 3.3V PWM2 SCL GND 1 3 5 7 9 2 4 6 8 10 PWM1 2 1 L1 1uH 1 2 SDA PCB LOGO J4 R3 0 TORCH SH-TORCH VIN B2 A1 B1 C1 SW1 IN C1 10 uF TORCH C2 10 uF C2 GND1 C9 100µF CBATT STROBE STROBE SH-STROBE STROBE GND E3 AGND U1 OUT A3 C3 10 uF C4 10 uF J10 B3 C3 OUT1 OUT2 B4 GND D3 LED1B SDA 1 2 3 D2 R5 SH-EN 1 .0k R6 1.0k E2 D4 LED2A LED2B T EMP EN J15 1 2 3 E1 TH1 100k ohm t° C4 R4 49.9k SH-VIO VIO 3.3V 2 1 J19 SCL SH-D2 SH-D1 J17 GND D1 D2 J7 1 2 3 4 VIO J8 3 2 1 R1 0.1 ZZ7 Assembly Note Place shun t SH-D1 on J19 GND VIN LED2 ZZ6 Assembly Note Place shun t SH-D2 on J18 J16 VIO LED1A ZZ5 Assembly Note Shunt SH-EN on J16 pins 1&2 TX EN EN 2 1 J11 2 1 SH-TX SCL LED1 A4 E4 OUT3 GND J18 TX LM3646YFQR ZZ3 Assembly Note Shunt SH-TX on J14 p ins 1&2 ZZ4 Assembly Note Shunt SH-VIO on J15 pins 1 &2 PWM2 J14 1 2 3 TX 2 1 ZZ2 Assembly Note Shunt SH-STROBE on J13 pins 1&2 PWM1 J13 1 2 3 GND GND2 ZZ1 Assembly Note Shunt SH-TORCH on J12 pins 1&2 PWM GND D1 SW2 Texas Instrumen ts PWM0 J12 1 2 3 VIN J9 A2 FID3 PCB Number: SV 600910 PCB Rev: A GND 30310 -6002 HB SW FID2 J20 J3 J21 1 2 3 J5 J2 GND 3 2 1 SDA I2C R2 0.1 GND T EMP J6 1 2 GND GND TEMP Figure 12. LM3646EVM Schematic SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback LM3646EVM User's Guide Copyright © 2013–2014, Texas Instruments Incorporated 11 Schematic www.ti.com Bill of Materials Item Designator 1 PCB Any SV600910 2 C1 CAP, CERM, 10 µF, 6.3V, X5R 20%, 0402 Murata GRM155R60J106ME44D 3 C2 CAP, CERM, 10 µF, 6.3V, X5R 20%, 0402 Murata GRM155R60J106ME44D 4 C3 CAP, CERM, 10 µF, 6.3V, X5R 20%, 0402 Murata GRM155R60J106ME44D 5 C4 CAP, CERM, 10 µF, 6.3V, X5R 20%, 0402 Murata GRM155R60J106ME44D 6 C9 CAP, CERM, 100µ F, 6.3V,±20%, X5R, 1206 Murata GRM31CR60J107ME39L 7 D1 LUMILEDS - LXCL-EYW4 - LED, LUXEON, C, COOL WHITE, MIN CRI 75 LUMILEDS LXCL-EYW4 8 D2 LUMILEDS - LXCL-EYW4 - LED, LUXEON, C, COOL WHITE, MIN CRI 75 LUMILEDS LXCL-EYW4 9 FID1 Fiducial mark. There is nothing to buy or mount. N/A N/A 10 FID2 Fiducial mark. There is nothing to buy or mount. N/A N/A 11 FID3 Fiducial mark. There is nothing to buy or mount. 12 J1 Standard Banana Jack, Insulated, Red 13 J2 Standard Banana Jack, Insulated, Black Keystone 6092 14 J3 Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-102-07-G-S 15 J4 Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-102-07-G-S 16 J5 Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-103-07-G-S 17 J6 Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-102-07-G-S 18 J7 Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-103-07-G-S 19 J8 Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-103-07-G-S 20 J9 Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-102-07-G-S 21 J10 Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-102-07-G-S 22 J11 Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-102-07-G-S 23 J12 Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-103-07-G-S 24 J13 Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-103-07-G-S 25 J14 Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-103-07-G-S 26 J15 Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-103-07-G-S 27 J16 Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-103-07-G-S 28 J17 Header, TH, 100mil, 4x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-104-07-G-S 29 J18 Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-102-07-G-S 30 J19 Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator Samtec, Inc. TSW-102-07-G-S 31 J20 CONN HEADER 10POS DL STR GOLD 32 J21 Header, TH, 100mil, 3x1, Gold plated, 230 mil above insulator 33 L1 Inductor, Metal Alloy, 1uH, 3.1A, 0.063ohm, SMT 34 R1 RES, 0.1 Ω, 5%, 0.125W, 0805 12 Description Printed Circuit Board LM3646EVM User's Guide Manufacturer Part Number N/A N/A Keystone 6091 3M 30310-6002HB Samtec, Inc. TSW-103-07-G-S TOKO 1286AS-H-1R0N Panasonic ERJ-6RSJR10V SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Schematic www.ti.com Bill of Materials (continued) 35 R2 RES, 0.1 Ω,, 5%, 0.125W, 0805 36 R3 RES, 0 Ω,, 5%, 0.25W, 1206 37 R4 38 R5 39 R6 40 SH-D1 41 42 43 Panasonic ERJ-6RSJR10V Yageo America RC1206JR-070RL RES, 49.9 kΩ,, 1%, 0.063W, 0402 Vishay-Dale CRCW040249K9FKED RES, 1.0 kΩ,, 5%, 0.1W, 0603 Vishay-Dale CRCW06031K00JNEA RES, 1.0 kΩ,, 5%, 0.1W, 0603 Vishay-Dale CRCW06031K00JNEA Shunt, 100mil, Gold plated, Black 3M 969102-0000-DA SH-D2 Shunt, 100mil, Gold plated, Black 3M 969102-0000-DA SH-EN Shunt, 100mil, Gold plated, Black 3M 969102-0000-DA SH-STROBE Shunt, 100mil, Gold plated, Black 3M 969102-0000-DA 44 SH-TORCH Shunt, 100mil, Gold plated, Black 3M 969102-0000-DA 45 SH-TX Shunt, 100mil, Gold plated, Black 3M 969102-0000-DA 46 SH-VIO Shunt, 100mil, Gold plated, Black 3M 969102-0000-DA 47 TH1 48 U1 Flash IC LM3646 49 VIN Test Point, TH, Compact, Red Thermistor NTC, 100 kΩ, 5%, 0402 MuRata NCP15WL104J03RC Texas Instruments LM3646YFQR Keystone 5005 SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback LM3646EVM User's Guide Copyright © 2013–2014, Texas Instruments Incorporated 13 USB Interface Board and I2C-Compatible Interface Program 5 www.ti.com USB Interface Board and I2C-Compatible Interface Program Texas Instruments has created an I2C-compatible program and USB docking board that can help exercise the part in a simple way. Contained in this document is a description of how to use the USB docking board and interface software. The LM3646EVM has the means to “plug into” the USB docking board. The USB docking board provides all the control signals for the simple interface. Power to the part must be provided externally. A USB cable (provided) must be connected to the board from a PC. The I2C-compatible interface program provides all of the control that the LM3646 part requires. For proper operation, the USB docking board should be plugged into the PC before the interface program is opened. Once connected, and the program is executed, a basic interface window will open. The image below shows the default settings. Figure 13. LM3646 General User Interface 14 LM3646EVM User's Guide SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated USB Interface Board and I2C-Compatible Interface Program www.ti.com The “I2C Interface” fields may be used to write or read any LM3646 register. Selecting the "Set Default Settings" button resets all registers to their default values and updates all GUI fields. Figure 14. I2C interface Fields Use the "Flash, "Torch", and "Standby" buttons to enable and disable the LED outputs. Figure 15. Immediate Action Fields Use the "Flash, "Torch", and "Standby" buttons to enable and disable the LED outputs. Figure 16. Device ID Field 5.1 Enable Register (0x01) Use the dropdown menus to select the desired settings. Refer to the LM3646 datasheet's "Register Descriptions" section for details on register settings. Figure 17. Enable Register IVFM Mode Register (0x02) Use the dropdown menus to select the desirable settings. Refer to the LM3646 datasheet's "Register Descriptions" section for details on register settings. SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated LM3646EVM User's Guide 15 USB Interface Board and I2C-Compatible Interface Program www.ti.com Figure 18. IVFM Mode Register 5.2 Temp and Torch Ramp Register (0x03) Use the dropdown menus to select the Torch Ramp Time, NTC trip Threshold, and to control the boost mode of operation. Figure 19. NTC and Torch Ramp Register 5.3 Flash Timing Register (0x04) Use the dropdown menus to select desired Flash Duration, Flash Ramp Time, Edge or Level Strobe mode and IVFM modulation scheme. Figure 20. Flash Timing Register 5.4 LED1 Flash Current Control Register (0x06) Use buttons F0 to F6 to select Flash Current level. The fields on the right side of the window get updated upon depression of the FX buttons. Refer to the LM3646 datasheet “Flash Mode" section for explanation of ILED1 / ILED2 flash current settings. Use the “Strobe Enable” dropdown menu to Enable / Disable the external Flash option. If “Enabled” is selected, only STROBE operations are allowed for flash. Use the “Disabled” option to flash using only I2C commands. Figure 21. LED1 Flash Current Control Register 16 LM3646EVM User's Guide SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated USB Interface Board and I2C-Compatible Interface Program www.ti.com 5.5 LED1 Torch Current Control Register (0x07) Use buttons F0 to F6 to select Torch Current level. The fields on the right side of the window get updated upon depression of the FX buttons. Refer to the LM3646 datasheet “Torch Mode” section for explanation of ILED1 / ILED2 torch current settings. Use the “Torch Enable” dropdown menu to Enable / Disable the external Torch option. If “Enabled” is selected, only External Torch operations are allowed for torch. Use the “Disabled” option to torch using only I2C commands. Figure 22. LED1 Torch Current Control Register 5.6 Max Current Control Register (0x05) Use the “Max Flash Current” and “Max Torch Current” dropdown menus to select the total flash and torch currents for both LED outputs. Refer to the LM3646 datasheet “Flash Mode” and “Torch Mode” sections for details on ILED1 / ILED2 flash and torch current settings. The “LED Short Enable” dropdown menu can be used to Enable / Disable the LED Short fault. Figure 23. Max Current Control Register NTC Log Register (0x09) Use the “NTC Short Fault” dropdown menu to Enable / Disable the NTC fault function. Use the “Fault Shutdown” dropdown menu to allow or prevent the LM3646 faults from turning off the device if a fault occurs. Selecting the “Software Reset” buttons resets all registers to their default values and initializes the LM3646. Figure 24. NTC Log Register Flags The contents of the LM3646 fault registers are read upon clicking the “Read Flags” button. The registers are cleared upon read back. SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated LM3646EVM User's Guide 17 USB Interface Board and I2C-Compatible Interface Program www.ti.com Figure 25. Flags I/O Pin Controls The LM3646 EVM provides the user with the capability to control the TORCH, STROBE and TX inputs without the need of an external supply. The user can choose between continuous pulses at a few frequencies in duty cycle increments of 5%, and a single pulse of various lengths. The “ON/OFF” buttons in the “TORCH”, “STROBE” and “TX” fields control the continuous pulse signals, while the “PULSE” buttons allow for a single pulse signal of the duration selected in the “Pulse Width” drop-down menu. Figure 26. I/O Pin Controls 18 LM3646EVM User's Guide SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Revision History www.ti.com Revision History Changes from Original (May 2013) to A Revision ........................................................................................................... Page • Changed to correct a few typos ......................................................................................................... 5 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. SNVU276A – DECEMBER 2013 – Revised July 2014 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Revision History 19 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated spacer IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated
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