LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
www.ti.com
SNVS743D – DECEMBER 1999 – REVISED MARCH 2013
LM185-2.5-N/LM285-2.5-N/LM385-2.5-N Micropower Voltage Reference Diode
Check for Samples: LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
FEATURES
Careful design of the LM185-2.5-N has made the
device exceptionally tolerant of capacitive loading,
making it easy to use in almost any reference
application. The wide dynamic operating range allows
its use with widely varying supplies with excellent
regulation.
1
•
2
•
•
•
•
•
±20 mV (±0.8%) max. Initial Tolerance (A
Grade)
Operating Current of 20 μA to 20 mA
0.6Ω Dynamic Impedance (A Grade)
Low Temperature Coefficient
Low Voltage Reference—2.5V
1.2V Device and Adjustable Device Also
Available—LM185-1.2 Series and LM185
Series, respectively
DESCRIPTION
The extremely low power drain of the LM185-2.5-N
makes it useful for micropower circuitry. This voltage
reference can be used to make portable meters,
regulators or general purpose analog circuitry with
battery life approaching shelf life. Further, the wide
operating current allows it to replace older references
with a tighter tolerance part. For applications requiring
1.2V see LM185-1.2.
The LM185-2.5-N/LM285-2.5-N/LM385-2.5-N are
micropower 2-terminal band-gap voltage regulator
diodes. Operating over a 20 μA to 20 mA current
range, they feature exceptionally low dynamic
impedance and good temperature stability. On-chip
trimming is used to provide tight voltage tolerance.
Since the LM-185-2.5-N band-gap reference uses
only transistors and resistors, low noise and good
long term stability result.
The LM185-2.5-N is rated for operation over a −55°C
to 125°C temperature range while the LM285-2.5-N is
rated −40°C to 85°C and the LM385-2.5-N 0°C to
70°C. The LM185-2.5-N/LM285-2.5-N are available in
a hermetic TO package and the LM285-2.5-N/LM3852.5-N are also available in a low-cost TO-92 molded
package, as well as SOIC and SOT-23. The LM1852.5-N is also available in a hermetic leadless chip
carrier package.
Connection Diagram
Figure 1. TO-92 Package
(Bottom View)
See Package Number LP0003A
Figure 2. SOIC Package
See Package Number D0008A
* Pin 3 is attached to the Die Attach Pad (DAP) and should be connected to Pin 2 or left floating.
Figure 3. SOT-23
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
SNVS743D – DECEMBER 1999 – REVISED MARCH 2013
www.ti.com
Figure 4. LCCC Leadless Chip Carrier
See Package Number NAJ0020A
Figure 5. TO Package
(Bottom View)
See Package Number NDU0002A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1) (2) (3)
Reverse Current
30 mA
Forward Current
10 mA
Operating Temperature Range (4)
LM185-2.5-N
−55°C to + 125°C
LM285-2.5-N
−40°C to + 85°C
LM385-2.5-N
0°C to 70°C
ESD Susceptibility (5)
2kV
−55°C to + 150°C
Storage Temperature
TO-92 Package (10 sec.)
Soldering Information
260°C
TO Package (10 sec.)
300°C
SOIC and SOT-23 Package
Vapor Phase (60 sec.)
215°C
Infrared (15 sec.)
220°C
See http://www.ti.com for other methods of soldering surface mount devices.
(1)
(2)
(3)
(4)
(5)
Refer to RETS185H-2.5 for military specifications.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
For elevated temperature operation, TJ MAX is:
LM185-N: 150°C
LM285-N: 125°C
LM385-N: 100°C
See THERMAL CHARACTERISTICS.
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
LM185
Thermal Resistance
θja (Junction to Ambient)
150°C
LM285
125°C
LM385
100°C
TO-92
TO
180°C/W (0.4″ Leads)
SOIC-8
SOT-23
440°C/W
165°C/W
283°C/W
80°C/W
N/A
N/A
170°C/W (0.125″ Leads)
θjc (Junction to Case)
2
N/A
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
www.ti.com
SNVS743D – DECEMBER 1999 – REVISED MARCH 2013
ELECTRICAL CHARACTERISTICS
LM385A-2.5-N
Parameter
Conditions
LM385AX-2.5-N
Typ
LM385AY-2.5-N
Tested Limit (2)
Reverse Breakdown
IR = 100 μA
2.500
Voltage
Design Limit (3)
2.480
V(Min)
2.520
2.500
Minimum Operating
12
18
V(Max)
2.470
V(Min)
2.530
V(Max)
20
Current
Reverse Breakdown
μA
(Max)
IMIN ≤ IR ≤ 1mA
1
1.5
Voltage Change with
Current
Units
(Limits)
mV
(Max)
1 mA ≤ IR ≤ 20 mA
10
20
mV
(Max)
Reverse Dynamic
IR = 100 μA,
Impedance
f = 20 Hz
Wideband Noise (rms)
IR = 100 μA
0.2
0.6
Ω
1.5
120
μV
20
ppm
10 Hz ≤ f ≤ 10 kHz
Long Term Stability
IR = 100 μA, T = 1000 Hr,
TA = 25°C ±0.1°C
Average Temperature Coefficient (4)
IMIN ≤ IR ≤ 20 mA
X Suffix
30
Y Suffix
50
ppm/°C
(Max)
All Others
(1)
(2)
(3)
(4)
150
Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA = TJ = 25°C.
Specified and 100% production tested.
Specified, but not 100% production tested. These limits are not used to calculate average outgoing quality levels.
The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between
the operating TMAX and TMIN, divided by TMAX–TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
3
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
SNVS743D – DECEMBER 1999 – REVISED MARCH 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
LM185-2.5-N
LM385B-2.5-N
LM185BX-2.5-N
LM185BY-2.5-N
Parameter
Conditions
Typ
LM385BX-2.5-N
LM285-2.5-N
LM285BX-2.5-N
LM385-2.5-N
LM385BY-2.5-N
Units
(Limit)
LM285BY-2.5-N
Tested Limit (1) (2) Design
Limit (3)
Reverse Breakdown TA = 25°C,
Voltage
2.5
20 μA ≤ IR ≤ 20 mA
Minimum Operating
Current
13
Tested
Limit (1)
Design
Limit (3)
Reverse Dynamic
IR = 100 μA,
Impedance
f = 20 Hz
Wideband Noise
(rms)
IR = 100 μA,
Long Term Stability
10 Hz ≤ f ≤ 10 kHz
Design
Limit (3)
2.462
2.462
2.425
V(Min)
2.538
2.538
2.575
V(Max)
30
μA
(Max)
20
30
20
30
20
15
20
1
1.5
2.0
2.5
2.0
2.5
mV
(Max)
10
20
20
25
20
25
mV
(Max)
LM385M3-2.5-N
Reverse Breakdown 20 μA ≤ IR ≤ 1 mA
Voltage Change
with Current
1 mA ≤ IR ≤ 20 mA
Tested
Limit (1)
1
Ω
120
μV
20
ppm
IR = 100 μA,
T = 1000 Hr,
TA = 25°C ±0.1°C
Average
Temperature
Coefficient (4)
IR = 100 μA
X Suffix
30
30
Y Suffix
50
50
All Others
150
ppm/°C
ppm/°C
150
150
ppm/°C
(Max)
(1)
(2)
(3)
(4)
4
Specified and 100% production tested.
A military RETS electrical specification available on request.
Specified, but not 100% production tested. These limits are not used to calculate average outgoing quality levels.
The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between
the operating TMAX and TMIN, divided by TMAX–TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
www.ti.com
SNVS743D – DECEMBER 1999 – REVISED MARCH 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Reverse Characteristics
Reverse Characteristics
Figure 6.
Figure 7.
Forward Characteristics
Temperature Drift
Figure 8.
Figure 9.
Reverse Dynamic
Impedance
Reverse Dynamic
Impedance
Figure 10.
Figure 11.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
5
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
SNVS743D – DECEMBER 1999 – REVISED MARCH 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Noise Voltage
Filtered Output Noise
Figure 12.
Figure 13.
Response Time
Figure 14.
6
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
www.ti.com
SNVS743D – DECEMBER 1999 – REVISED MARCH 2013
APPLICATIONS
Figure 15. Wide Input Range Reference
Figure 16. Micropower Reference from 9V Battery
LM385-2.5-N Applications
IQ ≃ 30 μA standby current
IQ ≃ 40 μA
Figure 17. Micropower 5V Reference
Figure 18. Micropower 10V Reference
PRECISION 1 μA to 1 mA CURRENT SOURCES
Figure 19.
METER THERMOMETERS
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
7
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
SNVS743D – DECEMBER 1999 – REVISED MARCH 2013
www.ti.com
Calibration
Calibration
1.
Short LM385-2.5-N, adjust R3 for IOUT=temp at 1μA/°K.
1.
Short LM385-2.5-N, adjust R3 for IOUT=temp at 1.8 μA/°K
2.
Remove short, adjust R2 for correct reading in centigrade
2.
Remove short, adjust R2 for correct reading in °F
Figure 20. 0°C–100°C Thermomemter
Figure 21. 0°F–50°F Thermomemter
Adjustment Procedure
1.
Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck
coefficient.
2.
Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2.
Figure 22. Micropower Thermocouple Cold Junction Compensator
(1)
8
Thermocouple Type (1)
Seebeck
Coefficient
(μV/°C)
R1
(Ω)
R2
(Ω)
Voltage Across R1
@25°C
(mV)
Voltage Across R2
(mV)
J
52.3
523
1.24k
15.60
14.32
T
42.8
432
1k
12.77
11.78
K
40.8
412
953Ω
12.17
11.17
S
6.4
63.4
150Ω
1.908
1.766
Typical supply current 50 μA
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
www.ti.com
SNVS743D – DECEMBER 1999 – REVISED MARCH 2013
Figure 23. Improving Regulation of Adjstable Regulators
Schematic Diagram
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
9
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
SNVS743D – DECEMBER 1999 – REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision C (March 2013) to Revision D
•
10
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jun-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM185H-2.5/NOPB
ACTIVE
TO
NDU
2
1000
Green (RoHS
& no Sb/Br)
Call TI | POST-PLATE
Level-1-NA-UNLIM
-55 to 125
( LM185H2.5, LM185
H2.5)
LM285BXM-2.5/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
285BX
M2.5
LM285BXMX-2.5/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
285BX
M2.5
LM285BXZ-2.5/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 85
285BX
Z2.5
LM285BYM-2.5/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
285BY
M2.5
LM285BYMX-2.5/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
285BY
M2.5
LM285BYZ-2.5/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 85
285BY
Z2.5
LM285M-2.5/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LM285
M2.5
LM285MX-2.5/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LM285
M2.5
LM285Z-2.5/LFT7
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM285Z-2.5/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-40 to 85
LM285
Z-2.5
LM385BM-2.5/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM385
BM2.5
LM385BMX-2.5/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM385
BM2.5
LM385BXM-2.5/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
385BX
M2.5
LM385BXMX-2.5/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
385BX
M2.5
LM385BXZ-2.5/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
0 to 70
385BX
Z-2.5
LM385BYM-2.5/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
385BY
M2.5
Addendum-Page 1
LM285
Z-2.5
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jun-2019
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM385BYMX-2.5/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
385BY
M2.5
LM385BYZ-2.5/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
0 to 70
385BY
Z-2.5
LM385BZ-2.5/LFT7
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM385BZ-2.5/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
0 to 70
LM385
BZ2.5
LM385M-2.5/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM385
M2.5
LM385
BZ2.5
LM385M3-2.5
NRND
SOT-23
DBZ
3
1000
TBD
Call TI
Call TI
0 to 70
R12
LM385M3-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
R12
LM385M3X-2.5/NOPB
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
R12
LM385MX-2.5/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM385
M2.5
LM385Z-2.5/LFT1
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM385
Z2.5
LM385Z-2.5/LFT2
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
LM385
Z2.5
LM385Z-2.5/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
0 to 70
LM385
Z2.5
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
工商网监
湘ICP备2023018690号
