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LM285-2.5, LM385-2.5, LM385B-2.5
SLVS023L – JANUARY 1989 – REVISED FEBRUARY 2018
LMx85-2.5, LM385B-2.5 Micropower Voltage References
1 Features
3 Description
•
•
•
The LMx85-2.5 and LM385B are micropower, twoterminal, band-gap voltage references that operate
over a 20-μA to 20-mA current range and feature
exceptionally low dynamic impedance and good
temperature stability. On-chip trimming provides tight
voltage tolerance. The band-gap reference for these
devices has low noise and long-term stability.
1
•
Operating Current Range 20 μA to 20 mA
1.5% and 3% Initial Voltage Tolerance
Reference Impedance
– LM385 1 Ω Maximum at 25°C
– All Devices 1.5 Ω Maximum Over Full
Temperature Range
Very Low Power Consumption
The design makes these devices exceptionally
tolerant of capacitive loading and, thus, easier to use
in most reference applications. The wide dynamic
operating temperature range accommodates varying
current supplies, with excellent regulation.
2 Applications
•
•
•
•
•
Portable Meter References
Portable Test Instruments
Battery-Operated Systems
Current-Loop Instrumentation
Panel Meters
The extremely low power drain of this series makes
these devices useful for micropower circuitry. These
voltage references can be used to make portable
meters, regulators, or general-purpose analog
circuitry, with battery life approaching shelf life. The
wide operating current range of these voltage
references allows them to replace older references
with tighter-tolerance parts.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LMx85D-2-5,
LM385BD-2-5
SOIC (8)
4.90 mm × 3.90 mm
LMx85LP-2-5,
LM385BLP-2-5
TO-92 (3)
4.30 mm × 4.30 mm
LM385PW-2-5,
LM385BPW-2-5
TSSOP (8)
3.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
ANODE
CATHODE
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM285-2.5, LM385-2.5, LM385B-2.5
SLVS023L – JANUARY 1989 – REVISED FEBRUARY 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
7.1
7.2
7.3
7.4
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
8
8
8
8
8
Application and Implementation .......................... 9
8.1 Application Information.............................................. 9
8.2 Typical Application .................................................... 9
8.3 System Examples ................................................... 10
9 Power Supply Recommendations...................... 11
10 Layout................................................................... 11
10.1 Layout Guidelines ................................................. 11
10.2 Layout Example .................................................... 11
11 Device and Documentation Support ................. 12
11.1
11.2
11.3
11.4
11.5
11.6
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
12
12
12
12
12
12
12 Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
Changes from Revision K (March 2016) to Revision L
Page
•
Changed ANODE pin description from: Shunt Current/Voltage input to: Common pin, normally connected to ground........ 3
•
Changed CATHODE pin description from: Common pin, normally connected to ground to: Shunt Current/Voltage input ... 3
Changes from Revision J (March 2005) to Revision K
•
2
Page
Added Features section, Device Information table, Table of Contents, Revision History section, Pin Configuration
and Functions section, Specifications section, Absolute Maximum Ratings table, ESD Ratings table, Thermal
Information table, Detailed Description section, Application and Implementation section, Power Supply
Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information section ...................................................................................................................... 1
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Copyright © 1989–2018, Texas Instruments Incorporated
Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5
LM285-2.5, LM385-2.5, LM385B-2.5
www.ti.com
SLVS023L – JANUARY 1989 – REVISED FEBRUARY 2018
5 Pin Configuration and Functions
D or PW Package
8-Pin SOIC and TSSOP
Top View
NC
NC
NC
ANODE
1
8
2
7
3
6
4
5
LP Package
3-Pin TO-92
Top View
CATHODE
NC
NC
NC
ANODE
CATHODE
NC
NC − No internal connection
NC − No internal connection
Pin Functions
PIN
NAME
ANODE
CATHODE
NC
NO.
SOIC
TSSOP
TYPE
DESCRIPTION
TO-92
4
1
I
Common pin, typically connected to ground
8
1, 2, 3, 5, 6, 7
2
O
Shunt Current/Voltage Input
3
—
No Internal Connection
Copyright © 1989–2018, Texas Instruments Incorporated
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3
LM285-2.5, LM385-2.5, LM385B-2.5
SLVS023L – JANUARY 1989 – REVISED FEBRUARY 2018
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
30
mA
Forward current
10
mA
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds
260
°C
TJ
Junction temperature
150
°C
Tstg
Storage temperature
150
°C
IR
Reverse current
IF
(1)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
IZ
Reference current
TA
Operating free-air temperature
LM285-2.5
MIN
MAX
0.02
20
–40
85
0
70
LM385-2.5, LM385B-2.5
UNIT
mA
°C
6.4 Thermal Information
LMx85-2.5, LM385B-2.5
THERMAL METRIC (1)
D (SOIC)
LP (T0-92)
PW (TSSOP)
8 PINS
3 PINS
8 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
112
157
168.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
58.5
80.3
53.7
°C/W
RθJB
Junction-to-board thermal resistance
52.1
N/A
96.4
°C/W
ψJT
Junction-to-top characterization parameter
15.8
24.6
4.5
°C/W
ψJB
Junction-to-board characterization parameter
51.7
136.2
94.7
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics (SPRA953) application report.
Submit Documentation Feedback
Copyright © 1989–2018, Texas Instruments Incorporated
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LM285-2.5, LM385-2.5, LM385B-2.5
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SLVS023L – JANUARY 1989 – REVISED FEBRUARY 2018
6.5 Electrical Characteristics
TA = 25°C unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
2.462
2.5
2.538
V
LM285-2.5
VZ
Reference voltage
α
Average temperature coefficient of
reference voltage (1)
VZ
IZ = 20 μA to 20 mA
IZ = 20 μA to 20 mA
IZ = 20 μA to 1 mA
Change in reference voltage with current
ΔVZ
IZ = 1 mA to 20 mA
ΔVZ/Δt
Long-term change in reference voltage
IZ = 100 μA
IZ(MIN)
Minimum reference current
Full range
Full range
(2)
±20
ppm/°C
TA = 25°C
1
Full range
1.5
TA = 25°C
10
Full range
30
±20
TA = 25°C
zz
Reference impedance
IZ = 100 µA
Vn
Broadband noise voltage
IZ = 100 μA, f = 10 Hz to 10 kHz
VZ
Reference voltage
IZ = 20 μA to 20 mA
α
Average temperature coefficient of
reference voltage (1)
mV
ppm/khr
8
20
0.2
0.6
Full range
µA
Ω
1.5
120
µV
LM385-2.5
VZ
IZ = 20 μA to 20 mA
IZ = 20 μA to 1 mA
Change in reference voltage with current
ΔVZ
IZ = 1 mA to 20 mA
ΔVZ/Δt
Long-term change in reference voltage
IZ = 100 μA
IZ(MIN)
Minimum reference current
Full range
2.425
Full range
(2)
2.5
2.575
±20
TA = 25°C
ppm/°C
2
Full range
2
TA = 25°C
20
Full range
30
±20
TA = 25°C
zz
Reference impedance
IZ = 100 µA
Vn
Broadband noise voltage
IZ = 100 μA, f = 10 Hz to 10 kHz
V
ppm/khr
8
20
0.4
1
Full range
mV
µA
Ω
1.5
120
µV
LM385B-2.5
VZ
Reference voltage
α
Average temperature coefficient of
reference voltage (1)
VZ
IZ = 20 μA to 20 mA
IZ = 20 μA to 20 mA
IZ = 20 μA to 1 mA
Change in reference voltage with current
ΔVZ
IZ = 1 mA to 20 mA
ΔVZ/Δt
Long-term change in reference voltage
IZ = 100 μA
IZ(MIN)
Minimum reference current
Full range
2.462
Full range
2.538
±20
2
2
TA = 25°C
20
Full range
30
±20
TA = 25°C
IZ = 100 µA
Vn
Broadband noise voltage
IZ = 100 μA, f = 10 Hz to 10 kHz
V
ppm/°C
Full range
Reference impedance
(2)
2.5
TA = 25°C
zz
(1)
(2)
ppm/khr
8
20
0.4
1
Full range
mV
1.5
120
µA
Ω
µV
The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified
temperature range.
Full range is 0°C to 70°C for the LM385-2.5 and LM385B-2.5, and −40°C to 85°C for the LM285-2.5.
Copyright © 1989–2018, Texas Instruments Incorporated
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SLVS023L – JANUARY 1989 – REVISED FEBRUARY 2018
www.ti.com
6.6 Typical Characteristics
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various
devices. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
16
∆V Z − Reference Voltage Change − mV
I R − Reverse Current − µA
100
10
1
0.5
1
1.5
2.5
2
8
4
0
−4
0.01
0.1
0
12
3
0.1
1
Figure 1. Reverse Current vs Reverse Voltage
Figure 2. Reference Voltage Change vs Reverse Current
1.6
2.525
IZ = 20 µA to 20 mA
TA = 25°C
2.52
VZ − Reference Voltage − V
V F − Forward Voltage − V
100
TA = 25°C
TA = 25°C
1.4
10
IR − Reverse Current − mA
VR − Reverse Voltage − V
1.2
1
0.8
0.6
0.4
2.51
2.505
2.5
2.495
2.49
0.2
0
0.01
2.515
2.485
0.1
1
10
2.48
− 55 − 35 − 15
100
IF − Forward Current − mA
5
25
45
65
85
105 125
TA − Free-Air Temperature − °C
Figure 3. Forward Voltage vs Forward Current
Figure 4. Reference Voltage vs Free-Air Temperature
1000
10 k
z z − Reference Impedance − Ω
z z − Reference Impedance − Ω
IZ = 100 µA
TA = 25°C
100
10
1
0.1
0.01
0.1
1
10
100
1k
100
10
1
0.1
0.01
0.1
f = 25 Hz
10
100
1000
TA = 25°C
Figure 5. Reference Impedance vs Reference Current
6
1
f − Frequency − kHz
Iz − Reference Current − mA
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Figure 6. Reference Impedance vs Frequency
Copyright © 1989–2018, Texas Instruments Incorporated
Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5
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SLVS023L – JANUARY 1989 – REVISED FEBRUARY 2018
Typical Characteristics (continued)
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various
devices. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
1400
IZ = 100 µA
TA = 25°C
Vn − Noise Voltage − nV/ Hz
1200
1000
800
600
400
200
0
10
100
1k
10 k
100 k
f − Frequency − Hz
Figure 7. Noise Voltage vs Frequency
Copyright © 1989–2018, Texas Instruments Incorporated
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7
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SLVS023L – JANUARY 1989 – REVISED FEBRUARY 2018
www.ti.com
7 Detailed Description
7.1 Overview
The LMx85-2.5 and LM385B-2.5 devices maintain a nearly constant voltage between the cathode and anode of
2.5 V when the minimum cathode current up to the recommended maximum is provided. See Recommended
Operating Conditions for recommended minimum cathode current.
7.2 Functional Block Diagram
CATHODE
Q13
600 kΩ
7.5 kΩ
Q12
Q4
Q7
200 kΩ
Q11
Q3
50 kΩ
Q10
Q1
20 pF
300 kΩ
20 pF
500 kΩ
Q9
Q2
Q5
Q6
500 Ω
100 kΩ
Q8
Q14
500 kΩ
60 kΩ
ANODE
7.3 Feature Description
A band-gap voltage reference controls a high-gain amplifier and shunt pass element to maintain a nearly
constant voltage between the cathode and anode of 2.5 V. Regulation occurs after a minimum current is
provided to power the voltage divider and amplifier. Internal frequency compensation provides a stable loop for
all capacitive loads. Floating shunt design is useful for both positive and negative regulation applications.
7.4 Device Functional Modes
The LMx85-2.5 and LM385B-2.5 devices have a single functional mode. These devices can be used as 2.5-V
fixed voltage references. The reference voltage cannot be adjusted for these devices.
For a proper Reverse Voltage to be developed, current must be sourced into the cathode of LM285. The
minimum current needed for proper regulation is denoted in Electrical Characteristics as IZ(MIN).
8
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SLVS023L – JANUARY 1989 – REVISED FEBRUARY 2018
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LMx85-2.5 and LM385B-2.5 devices create a voltage reference for use in a variety of applications including
amplifiers, power supplies, and current-sensing circuits.
8.2 Typical Application
Figure 8 shows how to use these devices to establish a 2.5-V source from a 9-V battery.
9V
221 kΩ
2.5 V
LM385-2.5
Figure 8. Reference From a 9-V Battery
8.2.1 Design Requirements
The key design requirement when using this device as a voltage reference is to supply the LM385 with a
minimum Cathode Current (IZ), as indicated in Electrical Characteristics.
8.2.2 Detailed Design Procedure
To generate a constant and stable reference voltage, a current greater than IZ(MIN) must be sourced into the
cathode of this device. This can be accomplished using a current regulating device such as LM334 or a simple
resistor. For a resistor, its value should be equal to or greater than (Vsupply - Vreference) ÷ IZ(MIN) .
8.2.3 Application Curve
Input and Output Voltage − V
4
3
Output
24 kΩ
2
VI
VO
1
0
5
Input
0
0
100
t − Time − µs
500
600
Figure 9. Device Transient Response
Copyright © 1989–2018, Texas Instruments Incorporated
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www.ti.com
8.3 System Examples
8.3.1 Thermocouple Cold-Junction Compensator
Figure 10 shows how to use the LM385-2.5 in a circuit for thermocouple cold-junction compensation.
IO ≈ 60 µA
+
Two Mercury
Cells
2.6 V −
V+
3.3 kΩ
200 kΩ ±1%
LM334
cw
R
2.00 kΩ ±1%
cw
V−
20 kΩ
500 Ω
412 Ω†
±1%
953 Ω
±1%
LM385-2.5
+
Type K
−
Meter
† Adjust for 12.17 mV at 25°C across 412 Ω
Figure 10. Thermocouple Cold-Junction Compensator
8.3.2 Generating Reference Voltage With a Constant Current Source
The LM334 device can be used to set the cathode current of the LM385-2.5 device over a wide range of input
voltages to ensure proper voltage regulation by the LM385-2.5 device.
V+
3.7 V ≤ V+ ≤ 30 V
LM334
R
V−
2.74 kΩ
2.5 V
LM385-2.5
Figure 11. Generating Reference Voltage With a Constant Current Source Device
10
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SLVS023L – JANUARY 1989 – REVISED FEBRUARY 2018
9 Power Supply Recommendations
The supply voltage should be current limited to ensure that the maximum cathode current is not exceeded.
For applications shunting high currents (30 mA maximum), pay attention to the cathode and anode trace lengths,
and adjust the width of the traces to have the proper current density.
10 Layout
10.1 Layout Guidelines
Figure 12 shows an example of a PCB layout of LMx85x-2.5. Some key Vref noise considerations are:
• It is optional to connect a low-ESR, 0.1-μF (CL) ceramic bypass capacitor on the cathode pin node.
• Decouple other active devices in the system per the device specifications.
• Using a solid ground plane helps distribute heat and reduces electromagnetic interference (EMI) noise pickup.
• Place the external components as close to the device as possible. This configuration prevents parasitic errors
(such as the Seebeck effect) from occurring.
• Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if
possible and only make perpendicular crossings when absolutely necessary.
10.2 Layout Example
Rsup
NC 1
NC 2
NC 3
8
CATHODE
7
6
4
5
NC
NC
NC
ANODE
GND
Vsup
CL
GND
Figure 12. Layout Diagram
Copyright © 1989–2018, Texas Instruments Incorporated
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11
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SLVS023L – JANUARY 1989 – REVISED FEBRUARY 2018
www.ti.com
11 Device and Documentation Support
11.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LM285-2.5
Click here
Click here
Click here
Click here
Click here
LM385-2.5
Click here
Click here
Click here
Click here
Click here
LM385B-2.5
Click here
Click here
Click here
Click here
Click here
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
12
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LM285D-2-5
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
285-25
LM285DG4-2-5
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
285-25
LM285DR-2-5
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
285-25
LM285DRG4-2-5
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
285-25
LM285LP-2-5
ACTIVE
TO-92
LP
3
1000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
285-25
LM285LPE3-2-5
ACTIVE
TO-92
LP
3
1000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
285-25
LM285LPR-2-5
ACTIVE
TO-92
LP
3
2000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
285-25
LM285LPRE3-2-5
ACTIVE
TO-92
LP
3
2000
RoHS & Green
SN
N / A for Pkg Type
-40 to 85
285-25
LM385BD-2-5
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
385B25
LM385BDE4-2-5
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
385B25
LM385BDR-2-5
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
385B25
LM385BLP-2-5
ACTIVE
TO-92
LP
3
1000
RoHS & Green
SN
N / A for Pkg Type
0 to 70
385B25
LM385BLPE3-2-5
ACTIVE
TO-92
LP
3
1000
RoHS & Green
SN
N / A for Pkg Type
0 to 70
385B25
LM385BLPR-2-5
ACTIVE
TO-92
LP
3
2000
RoHS & Green
SN
N / A for Pkg Type
0 to 70
385B25
LM385BPWR-2-5
ACTIVE
TSSOP
PW
8
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
385B25
LM385D-2-5
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
385-25
LM385DR-2-5
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
385-25
LM385DRG4-2-5
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
385-25
LM385LP-2-5
ACTIVE
TO-92
LP
3
1000
RoHS & Green
SN
N / A for Pkg Type
0 to 70
385-25
LM385LPE3-2-5
ACTIVE
TO-92
LP
3
1000
RoHS & Green
SN
N / A for Pkg Type
0 to 70
385-25
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
25-Feb-2022
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LM385LPR-2-5
ACTIVE
TO-92
LP
3
2000
RoHS & Green
SN
N / A for Pkg Type
0 to 70
385-25
LM385PWR-2-5
ACTIVE
TSSOP
PW
8
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
385-25
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of