LM4839
LM4839
Stereo 2W Audio Power Amplifiers with DC Volume Control, Bass
Boost, and Input Mux
Literature Number: SNAS132D
September 24, 2011
Stereo 2W Audio Power Amplifiers
with DC Volume Control, Bass Boost, and Input Mux
General Description
Key Specifications
The LM4839 is a monolithic integrated circuit that provides
DC volume control, and stereo bridged audio power amplifiers
capable of producing 2W into 4Ω (Note 1) with less than 1.0%
THD+N, or 2.2W into 3Ω (Note 2) with less than 1.0% THD
+N.
Boomer® audio integrated circuits were designed specifically
to provide high quality audio while requiring a minimum
amount of external components. The LM4839 incorporates a
DC volume control, stereo bridged audio power amplifiers,
selectable gain or bass boost, and an input mux making it
optimally suited for multimedia monitors, portable radios,
desktop, and portable computer applications.
The LM4839 features an externally controlled, low-power
consumption shutdown mode, and both a power amplifier and
headphone mute for maximum system flexibility and performance.
■ PO at 1% THD+N
into 3Ω (LQ & MTE)
■
into 4Ω (LQ & MTE)
■
into 8Ω (LM4839) (MT, MTE, & LQ)
■
■ Single-ended mode - THD+N at 85mW into
2.2W(typ)
2.0W(typ)
1.1W(typ)
1.0%(typ)
■ Shutdown current
0.2µA(typ)
32Ω
Features
■
■
■
■
■
■
■
Note 1: When properly mounted to the circuit board, the LM4839LQ and
LM4839MTE will deliver 2W into 4Ω. The LM4839MT will deliver 1.1W into
8Ω. See the Application Information section for LM4839LQ and LM4839MTE
usage information.
DC Volume Control Interface
Input mux
System Beep Detect
Stereo switchable bridged/single-ended power amplifiers
Selectable internal/external gain and bass boost
“Click and pop” suppression circuitry
Thermal shutdown protection circuitry
Applications
Note 2: An LM4839LQ and LM4839MTE that have been properly mounted
to the circuit board and forced-air cooled will deliver 2.2W into 3Ω.
■ Portable and Desktop Computers
■ Multimedia Monitors
■ Portable Radios, PDAs, and Portable TVs
Connection Diagrams
LLP Package
TSSOP Package
Top View
Order Number LM4839LQ
See NS Package Number LQA028AA for Exposed-DAP LLP
Top View
Order Number LM4839MT
See NS Package Number MTC28 for TSSOP
Order Number LM4839MTE
See NS Package Number MXA28A for Exposed-DAP
TSSOP
20013402
20013483
Boomer® is a registered trademark of NationalSemiconductor Corporation.
© 2011 National Semiconductor Corporation
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LM4839 Stereo 2W Audio Power Amplifiers with DC Volume Control, Bass Boost, and Input Mux
OBSOLETE
LM4839
LM4839
Absolute Maximum Ratings (Note 10)
θJA (typ)—LQA028AA
42°C/W
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
θJC (typ)—MTC28
20°C/W
θJA (typ)—MTC28
80°C/W
2°C/W
θJC (typ)—MXA28A
Supply Voltage
6.0V
Storage Temperature
-65°C to +150°C
Input Voltage
−0.3V to VDD +0.3V
Power Dissipation
Internally limited
ESD Susceptibility (Note 12)
2500V
ESD Susceptibility (Note 13)
250V
Junction Temperature
150°C
Soldering Information
Vapor Phase (60 sec.)
215°C
Infrared (15 sec.)
220°C
See AN-450 “Surface Mounting and their Effects on Product
Reliability” for other methods of soldering surface mount
devices.
3°C/W
θJC (typ)—LQA028AA
θJA (typ)—MXA28A (exposed
DAP) (Note 4)
41°C/W
θJA (typ)—MXA28A (exposed
DAP) (Note 3)
54°C/W
θJA (typ)—MXA28A (exposed
DAP) (Note 5)
59°C/W
θJA (typ)—MXA28A (exposed
DAP) (Note 6)
93°C/W
Operating Ratings
Temperature Range
TMIN ≤ TA ≤TMAX
Supply Voltage
−40°C ≤TA ≤ 85°C
2.7V≤ VDD ≤ 5.5V
Electrical Characteristics for Entire IC
(Note 7, Note 10)
The following specifications apply for VDD = 5V and TA = 25°C unless otherwise noted.
LM4839
Symbol
VDD
Parameter
Conditions
Typical
(Note 14)
Limit
(Note 15)
Supply Voltage
Units
(Limits)
2.7
V (min)
5.5
V (max)
mA (max)
IDD
Quiescent Power Supply Current
VIN = 0V, IO = 0A
15
30
ISD
Shutdown Current
Vshutdown = VDD
0.7
2.0
VIH
VIN High on all Logic Inputs
0.8 x VDD
V (min)
VIL
VIN Low on all Logic Inputs
0.2 x VDD
V (max)
μA (max)
Electrical Characteristics for Volume Attenuators
(Note 7, Note 10)
The following specifications apply for VDD = 5V and TA = 25°C unless otherwise noted.
LM4839
Symbol
Parameter
Conditions
CRANGE
Attenuator Range
Gain with VDCVol = 5.0V, No Load
CRANGE
Attenuator Range
AM
Mute Attenuation
Typical
(Note 14)
Limit
(Note 15)
Units
(Limits)
±0.75
dB (max)
Attenuation with VDCVol = 0V (BM & SE)
-75
dB (min)
Vmute = 5V, Bridged Mode (BM)
-78
dB (min)
Vmute = 5V, Single-Ended Mode (SE)
-78
dB (min)
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LM4839
Electrical Characteristics for Single-Ended Mode Operation
(Note 7, Note 10)
The following specifications apply for VDD = 5V and TA = 25°C unless otherwise noted.
LM4839
Symbol
PO
Parameter
Output Power
Conditions
Typical
(Note 14)
Limit
(Note 15)
Units
(Limits)
THD+N = 1.0%; f = 1kHz; RL = 32Ω
85
mW
THD+N = 10%; f = 1 kHz; RL = 32Ω
95
mW
0.065
%
THD+N
Total Harmonic Distortion+Noise
VOUT = 1VRMS, f=1kHz, RL = 10kΩ,
AVD = 1
PSRR
Power Supply Rejection Ratio
CB = 1.0 μF, f =120 Hz,
VRIPPLE = 200 mVrms
58
dB
SNR
Signal to Noise Ratio
POUT =75 mW, R L = 32Ω, A-Wtd Filter
102
dB
Xtalk
Channel Separation
f=1kHz, CB = 1.0 μF
65
dB
Electrical Characteristics for Bridged Mode Operation
(Note 7, Note 10)
The following specifications apply for VDD = 5V and TA = 25°C unless otherwise noted.
LM4839
Symbol
Parameter
Conditions
Typical
(Note 14)
Limit
(Note 15)
VOS
Output Offset Voltage
VIN = 0V, No Load
PO
Output Power
THD + N = 1.0%; f=1kHz; RL = 3Ω
(Note 8)
2.2
W
THD + N = 1.0%; f=1kHz; RL = 4Ω
(Note 9)(Note 15)
2
W
THD+N
Total Harmonic Distortion+Noise
±50
Units
(Limits)
1.0
mV (max)
THD = 1.5% (max);f = 1 kHz;
RL = 8Ω
1.1
W (min)
THD+N = 10%;f = 1 kHz; RL = 8Ω
1.5
W
PO = 1W, 20 Hz< f < 20 kHz,
0.3
%
PO = 340 mW, RL = 32Ω
1.0
%
CB = 1.0 µF, f = 120 Hz,
74
dB
RL = 8Ω, AVD = 2
PSRR
Power Supply Rejection Ratio
VRIPPLE = 200 mVrms; RL = 8Ω
SNR
Signal to Noise Ratio
VDD = 5V, POUT = 1.1W, RL = 8Ω, AWtd Filter
93
dB
Xtalk
Channel Separation
f=1kHz, CB = 1.0 μF
70
dB
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LM4839
Note 3: The θJA given is for an MXA28A package whose exposed-DAP is soldered to an exposed 2in 2 piece of 1 ounce printed circuit board copper.
Note 4: The θJA given is for an MXA28A package whose exposed-DAP is soldered to a 2in2 piece of 1 ounce printed circuit board copper on a bottom side layer
through 21 8mil vias.
Note 5: The θJA given is for an MXA28A package whose exposed-DAP is soldered to an exposed 1in 2 piece of 1 ounce printed circuit board copper.
Note 6: The θJA given is for an MXA28A package whose exposed-DAP is not soldered to any copper.
Note 7: All voltages are measured with respect to the ground pins, unless otherwise specified. All specifications are tested using the typical application as shown
in Figure 2.
Note 8: When driving 3Ω loads from a 5V supply the LM4839MTE exposed DAP must be soldered to the circuit board and forced-air cooled.
Note 9: When driving 4Ω loads from a 5V supply the LM4839MTE exposed DAP must be soldered to the circuit board.
Note 10: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device
is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions
which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters
where no limit is given, however, the typical value is a good indication of device performance.
Note 11: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θ JA, and the ambient temperature TA. The maximum
allowable power dissipation is PDMAX = (TJMAX − TA )/θJA. For the LM4839MT, TJMAX = 150°C, and the typical junction-to-ambient thermal resistance, when board
mounted, is 80°C/W assuming the MTC28 package.
Note 12: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 13: Machine Model, 220 pF–240 pF discharged through all pins.
Note 14: Typicals are measured at 25°C and represent the parametric norm.
Note 15: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. Limits are guaranteed to National's AOQL (Average
Outgoing Quality Level).
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LM4839
FIGURE 1. Typical Application Circuit ( MT & MTE pinout )
20013403
Typical Application
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LM4839
Truth Table for Logic Inputs
(Note 16)
Single-Ended
Output
Mute
Mux Control
HP Sense
Inputs Selected
Bridged Output
0
0
0
Left In 1, Right In 1
Vol. Adjustable
-
0
0
1
Left In 1, Right In 1
Muted
Vol. Adjustable
0
1
0
Left In 2, Right In 2
Vol. Adjustable
-
0
1
1
Left In 2, Right In 2
Muted
Vol. Adjustable
1
X
X
-
Muted
Muted
Note 16: If system beep is detected on the Beep in pin (pin 11) and beep is fed to inputs, the system beep will be passed through the bridged amplifier regardless
of the logic of the Mute, HP sense, or DC Volume Control pins.
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LM4839
Typical Performance Characteristics
MTE Specific Characteristics
LM4839MTE
THD+N vs Output Power
LM4839MTE
THD+N vs Frequency
20013471
20013470
LM4839MTE
THD+N vs Output Power
LM4839MTE
THD+N vs Frequency
20013472
20013473
LM4839MTE
Power Dissipation vs Output Power
LM4839MTE (Note 17)
Power Derating Curve
20013465
20013464
Note 17: These curves show the thermal dissipation ability of the LM4839MTE at different ambient temperatures given these conditions:
500LFPM + 2in2: The part is soldered to a 2in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
2in2on bottom: The part is soldered to a 2in2, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias.
2in2: The part is soldered to a 2in2, 1oz. copper plane.
1in2: The part is soldered to a 1in2, 1oz. copper plane.
Not Attached: The part is not soldered down and is not forced-air cooled.
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LM4839
Typical Performance Characteristics
Non-MTE Specific Characteristics
THD+N vs Frequency
THD+N vs Frequency
20013457
20013458
THD+N vs Frequency
THD+N vs Frequency
20013414
20013415
THD+N vs Frequency
THD+N vs Frequency
20013416
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20013417
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LM4839
THD+N vs Frequency
THD+N vs Frequency
20013418
20013419
THD+N vs Frequency
THD+N vs Frequency
20013420
20013421
THD+N vs Frequency
THD+N vs Output Power
20013424
20013422
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LM4839
THD+N vs Output Power
THD+N vs Output Power
20013425
20013426
THD+N vs Output Power
THD+N vs Output Power
20013427
20013428
THD+N vs Output Power
THD+N vs Output Power
20013430
20013429
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LM4839
THD+N vs Output Power
THD+N vs Output Power
20013431
20013432
THD+N vs Output Power
THD+N vs Output Power
20013434
20013433
THD+N vs Output Voltage
Docking Station Pins
THD+N vs Output Voltage
Docking Station Pins
20013460
20013459
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LM4839
Output Power vs
Load Resistance
Output Power vs
Load Resistance
20013462
20013406
Output Power vs
Load Resistance
Power Supply
Rejection Ratio
20013435
20013407
Dropout Voltage
Output Power vs
Load Resistance
20013453
20013408
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LM4839
Noise Floor
Noise Floor
20013442
20013441
Volume Control
Characteristics
Power Dissipation vs
Output Power
20013436
20013451
Power Dissipation vs
Output Power
External Gain/Bass Boost
Characteristics
20013452
20013461
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LM4839
Power Derating Curve
Crosstalk
20013449
20013463
Crosstalk
Output Power
vs Supply voltage
20013450
20013454
Output Power
vs Supply Voltage
Supply Current
vs Supply Voltage
20013456
20013409
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LM4839
Typical Performance Characteristics
Output Power vs
Load Resistance
Output Power vs
Load Resistance
20013462
20013406
Output Power vs
Load Resistance
Power Supply
Rejection Ratio
20013435
20013407
Dropout Voltage
Output Power vs
Load Resistance
20013453
20013408
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LM4839
Noise Floor
Noise Floor
20013442
20013441
Volume Control
Characteristics
Power Dissipation vs
Output Power
20013436
20013451
Power Dissipation vs
Output Power
External Gain/
Bass Boost
Characteristics
20013452
20013461
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LM4839
Power Derating Curve
Crosstalk
20013449
20013463
Crosstalk
Output Power
vs Supply voltage
20013450
20013454
Output Power
vs Supply Voltage
Supply Current
vs Supply Voltage
20013456
20013409
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LM4839
Poor power supply regulation adversely affects maximum
output power. A poorly regulated supply's output voltage decreases with increasing load current. Reduced supply voltage
causes decreased headroom, output signal clipping, and reduced output power. Even with tightly regulated supplies,
trace resistance creates the same effects as poor supply regulation. Therefore, making the power supply traces as wide
as possible helps maintain full output voltage swing.
Application Information
EXPOSED-DAP MOUNTING CONSIDERATIONS
The LM4839's exposed-DAP (die attach paddle) packages
(MTE, LQ) provide a low thermal resistance between the die
and the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding PCB
copper traces, ground plane and, finally, surrounding air. The
result is a low voltage audio power amplifier that produces
2.1W at ≤ 1% THD with a 4Ω load. This high power is
achieved through careful consideration of necessary thermal
design. Failing to optimize thermal design may compromise
the LM4839's high power performance and activate unwanted, though necessary, thermal shutdown protection.
The MTE and LQ packages must have their exposed DAPs
soldered to a grounded copper pad on the PCB. The DAP's
PCB copper pad is connected to a large plane of continuous
unbroken copper. This plane forms a thermal mass and heat
sink and radiation area. Place the heat sink area on either
outside plane in the case of a two-sided PCB, or on an inner
layer of a board with more than two layers. Connect the DAP
copper pad to the inner layer or backside copper heat sink
area with 32(4x8) (MTE) or 6(3x2) (LQ) vias. The via diameter
should be 0.012in–0.013in with a 1.27mm pitch. Ensure efficient thermal conductivity by plating-through and solder-filling
the vias.
Best thermal performance is achieved with the largest practical copper heat sink area. If the heatsink and amplifier share
the same PCB layer, a nominal 2.5in2 (min) area is necessary
for 5V operation with a 4Ω load. Heatsink areas not placed on
the same PCB layer as the LM4839 should be 5in2 (min) for
the same supply voltage and load resistance. The last two
area recommendations apply for 25°C ambient temperature.
Increase the area to compensate for ambient temperatures
above 25°C. In systems using cooling fans, the LM4839MTE
can take advantage of forced air cooling. With an air flow rate
of 450 linear-feet per minute and a 2.5in2 exposed copper or
5.0in2 inner layer copper plane heatsink, the LM4839MTE can
continuously drive a 3Ω load to full power. The LM4839LQ
achieves the same output power level without forced air cooling. In all circumstances and conditions, the junction temperature must be held below 150°C to prevent activating the
LM4839's thermal shutdown protection. The LM4839's power
de-rating curve in the Typical Performance Characteristics shows the maximum power dissipation versus temperature. Example PCB layouts for the exposed-DAP TSSOP and
LQ packages are shown in the Demonstration Board Layout section. Further detailed and specific information concerning PCB layout, fabrication, and mounting an LQ (LLP)
package is available in National Semiconductor's AN1187.
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4839 output stage consists of
two pairs of operational amplifiers, forming a two-channel
(channel A and channel B) stereo amplifier. (Though the following discusses channel A, it applies equally to channel B.)
Figure 1 shows that the first amplifier's negative (-) output
serves as the second amplifier's input. This results in both
amplifiers producing signals identical in magnitude, but 180°
out of phase. Taking advantage of this phase difference, a
load is placed between −OUTA and +OUTA and driven differentially (commonly referred to as “bridge mode”). This
results in a differential gain of
AVD = 2 * (Rf/R i)
Bridge mode amplifiers are different from single-ended amplifiers that drive loads connected between a single amplifier's
output and ground. For a given supply voltage, bridge mode
has a distinct advantage over the single-ended configuration:
its differential output doubles the voltage swing across
the load. This produces four times the output power when
compared to a single-ended amplifier under the same conditions. This increase in attainable output power assumes that
the amplifier is not current limited or that the output signal is
not clipped. To ensure minimum output signal clipping when
choosing an amplifier's closed-loop gain, refer to the Audio
Power Amplifier Design section.
Another advantage of the differential bridge output is no net
DC voltage across the load. This is accomplished by biasing
channel A's and channel B's outputs at half-supply. This eliminates the coupling capacitor that single supply, single-ended
amplifiers require. Eliminating an output coupling capacitor in
a single-ended configuration forces a single-supply
amplifier's half-supply bias voltage across the load. This increases internal IC power dissipation and may permanently
damage loads such as speakers.
POWER DISSIPATION
Power dissipation is a major concern when designing a successful single-ended or bridged amplifier. Equation (2) states
the maximum power dissipation point for a single-ended amplifier operating at a given supply voltage and driving a specified output load.
PCB LAYOUT AND SUPPLY REGULATION
CONSIDERATIONS FOR DRIVING 3Ω AND 4Ω LOADS
Power dissipated by a load is a function of the voltage swing
across the load and the load's impedance. As load impedance
decreases, load dissipation becomes increasingly dependent
on the interconnect (PCB trace and wire) resistance between
the amplifier output pins and the load's connections. Residual
trace resistance causes a voltage drop, which results in power
dissipated in the trace and not in the load as desired. For example, 0.1Ω trace resistance reduces the output power dissipated by a 4Ω load from 2.1W to 2.0W. This problem of
decreased load dissipation is exacerbated as load impedance
decreases. Therefore, to maintain the highest load dissipation
and widest output voltage swing, PCB traces that connect the
output pins to a load must be as wide as possible.
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PDMAX = (VDD)2/(2π2RL)
Single-Ended
(2)
However, a direct consequence of the increased power delivered to the load by a bridge amplifier is higher internal
power dissipation for the same conditions.
The LM4839 has two operational amplifiers per channel. The
maximum internal power dissipation per channel operating in
the bridge mode is four times that of a single-ended amplifier.
From Equation (3), assuming a 5V power supply and a 4Ω
load, the maximum single channel power dissipation is 1.27W
or 2.54W for stereo operation.
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Bridge Mode
(3)
The LM4839's power dissipation is twice that given by Equation (2) or Equation (3) when operating in the single-ended
mode or bridge mode, respectively. Twice the maximum power dissipation point given by Equation (3) must not exceed the
power dissipation given by Equation (4):
PDMAX′ = (TJMAX − TA)/θJA
(4)
The LM4839's TJMAX = 150°C. In the LQ package soldered to
a DAP pad that expands to a copper area of 5in2 on a PCB,
the LM4839's θJA is 20°C/W. In the MTE package soldered to
a DAP pad that expands to a copper area of 2in2 on a PCB,
the LM4839's θJA is 41°C/W. For the LM4839MT package,
θJA = 80°C/W. At any given ambient temperature TA, use
Equation (4) to find the maximum internal power dissipation
supported by the IC packaging. Rearranging Equation (4) and
substituting PDMAX for PDMAX′ results in Equation (5). This
equation gives the maximum ambient temperature that still
allows maximum stereo power dissipation without violating
the LM4839's maximum junction temperature.
TA = TJMAX – 2*PDMAX θJA
PROPER SELECTION OF EXTERNAL COMPONENTS
Optimizing the LM4839's performance requires properly selecting external components. Though the LM4839 operates
well when using external components with wide tolerances,
best performance is achieved by optimizing component values.
The LM4839 is unity-gain stable, giving a designer maximum
design flexibility. The gain should be set to no more than a
given application requires. This allows the amplifier to achieve
minimum THD+N and maximum signal-to-noise ratio. These
parameters are compromised as the closed-loop gain increases. However, low gain circuits demand input signals with
greater voltage swings to achieve maximum output power.
Fortunately, many signal sources such as audio CODECs
have outputs of 1VRMS (2.83VP-P). Please refer to the Audio
Power Amplifier Design section for more information on selecting the proper gain.
(5)
For a typical application with a 5V power supply and an 4Ω
load, the maximum ambient temperature that allows maximum stereo power dissipation without exceeding the maximum junction temperature is approximately 99°C for the LQ
package and 45°C for the MTE package.
TJMAX = PDMAX θJA + TA
(6)
Equation (6) gives the maximum junction temperature
TJMAX. If the result violates the LM4839's TJMAX150°C, reduce
the maximum junction temperature by reducing the power
supply voltage or increasing the load resistance. Further allowance should be made for increased ambient temperatures.
The above examples assume that a device is a surface mount
part operating around the maximum power dissipation point.
Since internal power dissipation is a function of output power,
higher ambient temperatures are allowed as output power or
duty cycle decreases.
If the result of Equation (2) is greater than that of Equation (3),
then decrease the supply voltage, increase the load
impedance, or reduce the ambient temperature. If these measures are insufficient, a heat sink can be added to reduce
θJA. The heat sink can be created using additional copper
area around the package, with connections to the ground pin
(s), supply pin and amplifier output pins. External, solder attached SMT heatsinks such as the Thermalloy 7106D can
also improve power dissipation. When adding a heat sink, the
θJA is the sum of θJC, θCS, and θSA. (θJC is the junction-to-case
thermal impedance, θCS is the case-to-sink thermal
impedance, and θSA is the sink-to-ambient thermal
impedance.) Refer to the Typical Performance Characteristics curves for power dissipation information at lower output
power levels.
Input Capacitor Value Selection
Amplifying the lowest audio frequencies requires a high value
input coupling capacitor (0.33µF in Figure 1). A high value
capacitor can be expensive and may compromise space efficiency in portable designs. In many cases, however, the
speakers used in portable systems, whether internal or external, have little ability to reproduce signals below 150Hz.
Applications using speakers with this limited frequency response reap little improvement by using a large input capacitor.
Besides effecting system cost and size, the input coupling
capacitor has an affect on the LM4835's click and pop performance. When the supply voltage is first applied, a transient
(pop) is created as the charge on the input capacitor changes
from zero to a quiescent state. The magnitude of the pop is
directly proportional to the input capacitor's size. Higher value
capacitors need more time to reach a quiescent DC voltage
(usually VDD/2) when charged with a fixed current. The
amplifier's output charges the input capacitor through the
feedback resistor, Rf. Thus, pops can be minimized by selecting an input capacitor value that is no higher than necessary to meet the desired −3dB frequency.
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LM4839
PDMAX = 4 * (VDD)2/(2π2RL)
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply rejection. Applications that employ a 5V regulator typically use a
10 µF in parallel with a 0.1 µF filter capacitor to stabilize the
regulator's output, reduce noise on the supply line, and improve the supply's transient response. However, their presence does not eliminate the need for a local 1.0 µF tantalum
bypass capacitance connected between the LM4839's supply
pins and ground. Do not substitute a ceramic capacitor for the
tantalum. Doing so may cause oscillation. Keep the length of
leads and traces that connect capacitors between the
LM4839's power supply pin and ground as short as possible.
Connecting a 1µF capacitor, CB, between the BYPASS pin
and ground improves the internal bias voltage's stability and
improves the amplifier's PSRR. The PSRR improvements increase as the bypass pin capacitor value increases. Too large
a capacitor, however, increases turn-on time and can compromise the amplifier's click and pop performance. The selection of bypass capacitor values, especially CB, depends on
desired PSRR requirements, click and pop performance (as
explained in the section, Proper Selection of External Components), system cost, and size constraints.
LM4839
These 20K resistors are shown in Figure 1 (RIN, RF ) and
they set each input amplifier's gain to -1. Use Equation 8 to
determine the input and feedback resistor values for a desired
gain.
As shown in Figure 1, the input resistors (RIN = 20K) and the
input capacitosr (CIN = 0.33µF) produce a −6dB high pass
filter cutoff frequency that is found using Equation (7).
- Av = RF / Ri
(7)
Adjusting the input amplifier's gain sets the minimum gain for
that channel. Although the single ended outputs of the Bridge
Output Amplifiers can be used to drive line level outputs, it is
recommended that the R & L Dock Outputs simpler signal
path be used for better performance.
As an example when using a speaker with a low frequency
limit of 150Hz, the input coupling capacitor using Equation (7),
is 0.063µF. The 0.33µF input coupling capacitor shown in
Figure 1allows the LM4839 to drive high efficiency, full range
speaker whose response extends below 30Hz.
STEREO-INPUT MULTIPLEXER (STEREO MUX)
The LM4839 has two stereo inputs. The MUX CONTROL pin
controls which stereo input is active. Applying 0V to the MUX
CONTROL pin selects stereo input 1. Applying VDD to the
MUX CONTROL pin selects stereo input 2.
OPTIMIZING CLICK AND POP REDUCTION
PERFORMANCE
The LM4839 contains circuitry that minimizes turn-on and
shutdown transients or “clicks and pops”. For this discussion,
turn-on refers to either applying the power supply voltage or
when the shutdown mode is deactivated. While the power
supply is ramping to its final value, the LM4839's internal amplifiers are configured as unity gain buffers. An internal current
source changes the voltage of the BYPASS pin in a controlled, linear manner. Ideally, the input and outputs track the
voltage applied to the BYPASS pin. The gain of the internal
amplifiers remains unity until the voltage on the bypass pin
reaches 1/2 VDD . As soon as the voltage on the bypass pin
is stable, the device becomes fully operational. Although the
BYPASS pin current cannot be modified, changing the size of
CB alters the device's turn-on time and the magnitude of
“clicks and pops”. Increasing the value of CB reduces the
magnitude of turn-on pops. However, this presents a tradeoff:
as the size of CB increases, the turn-on time increases. There
is a linear relationship between the size of CB and the turn-on
time. Here are some typical turn-on times for various values
of CB:
CB
BEEP DETECT FUNCTION
Computers and notebooks produce a system "beep" signal
that drives a small speaker. The speaker's auditory output
signifies that the system requires user attention or input. To
accommodate this system alert signal, the LM4839's beep
input pin is a mono input that accepts the beep signal. Internal
level detection circuitry at this input monitors the beep signal's
magnitude. When a signal level greater than VDD/2 is detected
on the BEEP IN pin, the bridge output amplifiers are enabled.
The beep signal is amplified and applied to the load connected to the output amplifiers. A valid beep signal will be applied
to the load even when MUTE is active. Use the input resistors
connected between the BEEP IN pin and the stereo input pins
to accommodate different beep signal amplitudes. These resistors are shown as 200kΩ devices in Figure 1. Use higher
value resistors to reduce the gain applied to the beep signal.
The resistors must be used to pass the beep signal to the
stereo inputs. The BEEP IN pin is used only to detect the beep
signal's magnitude: it does not pass the signal to the output
amplifiers. The LM4839's shutdown mode must be deactivated before a system alert signal is applied to the BEEP IN pin.
TON
0.01µF
2ms
0.1µF
20ms
0.22µF
44ms
0.47µF
94ms
1.0µF
200ms
MICRO-POWER SHUTDOWN
The voltage applied to the SHUTDOWN pin controls the
LM4839's shutdown function. Activate micro-power shutdown
by applying VDD to the SHUTDOWN pin. When active, the
LM4839's micro-power shutdown feature turns off the
amplifier's bias circuitry, reducing the supply current. The logic threshold is typically VDD/2. The low 0.7 µA typical shutdown current is achieved by applying a voltage that is as near
as VDD as possible, to the SHUTDOWN pin. A voltage that is
less than VDD may increase the shutdown current. Logic Level
Truth Table shows the logic signal levels that activate and
deactivate micro-power shutdown and headphone amplifier
operation.
There are a few ways to control the micro-power shutdown.
These include using a single-pole, single-throw switch, a microprocessor, or a microcontroller. When using a switch,
connect an external 10kΩ pull-up resistor between the SHUTDOWN pin and VDD. Connect the switch between the SHUTDOWN pin and ground. Select normal amplifier operation by
closing the switch. Opening the switch connects the SHUTDOWN pin to VDD through the pull-up resistor, activating
micro-power shutdown. The switch and resistor guarantee
that the SHUTDOWN pin will not float. This prevents unwanted state changes. In a system with a microprocessor or a
microcontroller, use a digital output to apply the control volt-
DOCKING STATION
Applications such as notebook computers can take advantage of a docking station to connect to external devices such
as monitors or audio/visual equipment that sends or receives
line level signals. The LM4839 has two outputs, Right Dock
and Left Dock which connect to outputs of the internal input
amplifiers that drive the volume control inputs. These input
amplifiers can drive loads of >1kΩ (such as powered speakers) with a rail-to-rail signal. Since the output signal present
on the RIGHT DOCK and LEFT DOCK pins is biased to
VDD/2, coupling capacitors should be connected in series with
the load. Typical values for the coupling capacitors are 0.33µF
to 1.0µF. If polarized coupling capacitors are used, connect
their "+" terminals to the respective output pin.
Since the DOCK outputs precede the internal volume control,
the signal amplitude will be equal to the input signal's magnitude and cannot be adjusted. However, the input amplifier's
closed-loop gain can be adjusted using external resistors.
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200134 Version 5 Revision 5
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LM4839
age to the SHUTDOWN pin. Driving the SHUTDOWN pin with
active circuitry eliminates the need for a pull up resistor.
TABLE 1. Logic Level Truth Table for SHUTDOWN, HP-IN, and MUX Operation
SHUTDOWN
PIN
HP-IN PIN
MUX CHANNEL
SELECT PIN
OPERATIONAL MODE
(MUX INPUT CHANNEL #)
Logic Low
Logic Low
Logic Low
Bridged Amplifiers (1)
Logic Low
Logic Low
Logic High
Bridged Amplifiers (2)
Logic Low
Logic High
Logic Low
Single-Ended Amplifiers (1)
Logic Low
Logic High
Logic High
Single-Ended Amplifiers (2)
Logic High
X
X
Micro-Power Shutdown
MUTE FUNCTION
The LM4839 mutes the amplifier and DOCK outputs when
VDD is applied to pin 5, the MUTE pin. Even while muted, the
LM4839 will amplify a system alert (beep) signal whose magnitude satisfies the BEEP DETECT circuitry. Applying 0V to
the MUTE pin returns the LM4839 to normal, unmated operation. Prevent unanticipated mute behavior by connecting the
MUTE pin to VDD or ground. Do not let the mute pin float.
HP SENSE FUNCTION ( Head Phone In )
Applying a voltage between 4V and VDD to the LM4839's HPIN headphone control pin turns off the amps that drive the left
out "+" and right out "+" pins. ( Pins 15 and 20 on the MT/MTE
& 12 and 25 on the LQ ). This action mutes a bridged-connected load. Quiescent current consumption is reduced when
the IC is in this single-ended mode.
Figure 2 shows the implementation of the LM4839's headphone control function. With no headphones connected to the
headphone jack, the R1-R2 voltage divider sets the voltage
applied to the HP Sense pin at approximately 50mV. This
50mV puts the LM4839 into bridged mode operation. The
output coupling capacitor blocks the amplifier's half supply DC
voltage, protecting the headphones.
The HP-IN threshold is set at 4V. While the LM4839 operates
in bridged mode, the DC potential across the load is essentially 0V. Therefore, even in an ideal situation, the output
swing cannot cause a false single-ended trigger. Connecting
headphones to the headphone jack disconnects the headphone jack contact pin from R2 and allows R1 to pull the HP
Sense pin up to VDD through R4. This enables the headphone
function, turns off both of the "+" output amplifiers and mutes
the bridged speaker. The amplifier then drives the headphones, whose impedance is in parallel with resistors R2 and
R3. These resistors have negligible effect on the LM4839's
output drive capability since the typical impedance of headphones is 32Ω.
Figure 2 also shows the suggested headphone jack electrical
connections. The jack is designed to mate with a three-wire
plug. The plug's tip and ring should each carry one of the two
stereo output signals, whereas the sleeve should carry the
ground return. A headphone jack with one control pin contact
is sufficient to drive the HP-IN pin when connecting headphones.
A microprocessor or a switch can replace the headphone jack
contact pin. When a microprocessor or switch applies a voltage greater than 4V to the HP-IN pin, a bridge-connected
speaker is muted and the single ended output amplifiers A1
and A2 will drive a pair of headphones.
20013404
FIGURE 2. Headphone Sensing Circuit (MT/MTE Pinout)
BASS BOOST FUNCTION
The Bass Boost Function can be toggled by changing the
logic at the Bass Boost Select pin. A logic low will switch the
power amplifiers to bass boost mode. In bass boost mode,
the low frequency gain of the ampflifier is set by the external
CBS capacitor in Figure 1. Where as a logic high sets the
amplifiers to unity gain.
In some cases, a designer may want to improve the low frequency response of the bridged amplifier or incorporate a
bass boost feature. This bass boost can be useful in systems
where speakers are housed in small enclosures. If the designer wishes to dsiable the bass boost feature, pin 19 ( MT/
MTE packages ) can be tied to VDD.
When the bass boost is enabled, the output amplifiers will be
internally set at a gain of 2 at low frequencies (gain of 4 in
bridged mode). As shown in Figure 1, CBS sets the cutoff
frequency for the bass boost. At low frequencies, the capacitor will be virtually an open circuit. At high frequencies, the
capacitor will be virtually a short circuit. As a result of this, the
gain of the bridge amplifier is increased as low frequencies.
A first order pole is formed with a corner frequency at:
fc = 1/(2π10kΩCBS)
With CBS = 0.1uF, a first order pole is formed with a corner
frequency of 160Hz.
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200134 Version 5 Revision 5
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LM4839
of the step width, as shown in Volume Control Characterization Graph (DS200133-40).
For highest accuracy, the voltage shown in the 'recommended voltage' column of the table is used to select a desired gain.
This recommended voltage is exactly halfway between the
two nearest transitions to the next highest or next lowest gain
levels.
The gain levels are 1dB/step from 0dB to -6dB, 2dB/step from
-6dB to -36dB, 3dB/step from -36dB to -47dB, 4dB/step from
-47db to -51dB, 5dB/step from -51dB to -66dB, and 12dB to
the last step at -78dB.
DC VOLUME CONTROL
The LM4839 has an internal stereo volume control whose
setting is a function of the DC voltage applied to the DC VOL
CONTROL pin.
The LM4839 volume control consists of 31 steps that are individually selected by a variable DC voltage level on the
volume control pin. The range of the steps, controlled by the
DC voltage, are from 0dB - 78dB. Each gain step corresponds
to a specific input voltage range, as shown in table 2.
To minimize the effect of noise on the volume control pin,
which can affect the selected gain level, hysteresis has been
implemented. The amount of hysteresis corresponds to half
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200134 Version 5 Revision 5
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LM4839
Volume Control Table ( Table 2 )
Gain
(dB)
Voltage Range (% of Vdd)
Voltage Range (Vdd = 5)
Voltage Range (Vdd = 3)
Low
High
Recommended Low
High
Recommended Low
High
Recommended
0
77.5%
100.00%
100.000%
3.875
5.000
5.000
2.325
3.000
3.000
-1
75.0%
78.5%
76.875%
3.750
3.938
3.844
2.250
2.363
2.306
-2
72.5%
76.25%
74.375%
3.625
3.813
3.719
2.175
2.288
2.231
-3
70.0%
73.75%
71.875%
3.500
3.688
3.594
2.100
2.213
2.156
-4
67.5%
71.25%
69.375%
3.375
3.563
3.469
2.025
2.138
2.081
-5
65.0%
68.75%
66.875%
3.250
3.438
3.344
1.950
2.063
2.006
-6
62.5%
66.25%
64.375%
3.125
3.313
3.219
1.875
1.988
1.931
-8
60.0%
63.75%
61.875%
3.000
3.188
3.094
1.800
1.913
1.856
-10
57.5%
61.25%
59.375%
2.875
3.063
2.969
1.725
1.838
1.781
-12
55.0%
58.75%
56.875%
2.750
2.938
2.844
1.650
1.763
1.706
-14
52.5%
56.25%
54.375%
2.625
2.813
2.719
1.575
1.688
1.631
-16
50.0%
53.75%
51.875%
2.500
2.688
2.594
1.500
1.613
1.556
-18
47.5%
51.25%
49.375%
2.375
2.563
2.469
1.425
1.538
1.481
-20
45.0%
48.75%
46.875%
2.250
2.438
2.344
1.350
1.463
1.406
-22
42.5%
46.25%
44.375%
2.125
2.313
2.219
1.275
1.388
1.331
-24
40.0%
43.75%
41.875%
2.000
2.188
2.094
1.200
1.313
1.256
-26
37.5%
41.25%
39.375%
1.875
2.063
1.969
1.125
1.238
1.181
-28
35.0%
38.75%
36.875%
1.750
1.938
1.844
1.050
1.163
1.106
-30
32.5%
36.25%
34.375%
1.625
1.813
1.719
0.975
1.088
1.031
-32
30.0%
33.75%
31.875%
1.500
1.688
1.594
0.900
1.013
0.956
-34
27.5%
31.25%
29.375%
1.375
1.563
1.469
0.825
0.937
0.881
-36
25.0%
28.75%
26.875%
1.250
1.438
1.344
0.750
0.862
0.806
-39
22.5%
26.25%
24.375%
1.125
1.313
1.219
0.675
0.787
0.731
-42
20.0%
23.75%
21.875%
1.000
1.188
1.094
0.600
0.712
0.656
-45
17.5%
21.25%
19.375%
0.875
1.063
0.969
0.525
0.637
0.581
-47
15.0%
18.75%
16.875%
0.750
0.937
0.844
0.450
0.562
0.506
-51
12.5%
16.25%
14.375%
0.625
0.812
0.719
0.375
0.487
0.431
-56
10.0%
13.75%
11.875%
0.500
0.687
0.594
0.300
0.412
0.356
-61
7.5%
11.25%
9.375%
0.375
0.562
0.469
0.225
0.337
0.281
-66
5.0%
8.75%
6.875%
0.250
0.437
0.344
0.150
0.262
0.206
-78
0.0%
6.25%
0.000%
0.000
0.312
0.000
0.000
0.187
0.000
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200134 Version 5 Revision 5
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LM4839
pass band magnitude variation limit, the low frequency response must extend to at least one-fifth the lower bandwidth
limit and the high frequency response must extend to at least
five times the upper bandwidth limit. The gain variation for
both response limits is 0.17dB, well within the ±0.25dB desired limit. The results are an
Audio Power Amplifier Design
Audio Amplifier Design: Driving 1W into an 8Ω Load
The following are the desired operational parameters:
Power Output:
1 WRMS
Load Impedance:
8Ω
1 VRMS
Input Level:
Input Impedance:
Bandwidth:
20 kΩ
100 Hz−20 kHz ± 0.25 dB
(13)
fH = 20kHz x 5 = 100kHz
(14)
and an
The design begins by specifying the minimum supply voltage
necessary to obtain the specified output power. One way to
find the minimum supply voltage is to use the Output Power
vs Supply Voltage curve in the Typical Performance Characteristics section. Another way, using Equation (11), is to
calculate the peak output voltage necessary to achieve the
desired output power for a given load impedance. To account
for the amplifier's dropout voltage, two additional voltages,
based on the Dropout Voltage vs Supply Voltage in the Typical Performance Characteristics curves, must be added to
the result obtained by Equation (11). The result is Equation
(12).
As mentioned in the Selecting Proper External Components section, Ri (Right & Left) and Ci (Right & Left) create a
highpass filter that sets the amplifier's lower bandpass frequency limit. Find the coupling capacitor's value using Equation (17).
Ci≥ 1/(2πR ifL)
1/(2π*20kΩ*20Hz) = 0.397μF
The product of the desired high frequency cutoff (100kHz in
this example) and the differential gain AVD, determines the
upper passband response limit. With AVD = 3 and fH = 100kHz,
the closed-loop gain bandwidth product (GBWP) is 300kHz.
This is less than the LM4839's 3.5MHz GBWP. With this margin, the amplifier can be used in designs that require more
differential gain while avoiding performance,restricting bandwidth limitations.
The Output Power vs Supply Voltage graph for an 8Ω load
indicates a minimum supply voltage of 4.6V. This is easily met
by the commonly used 5V supply voltage. The additional voltage creates the benefit of headroom, allowing the LM4839 to
produce peak output power in excess of 1W without clipping
or other audible distortion. The choice of supply voltage must
also not create a situation that violates of maximum power
dissipation as explained above in the Power Dissipation
section.
After satisfying the LM4839's power dissipation requirements,
the minimum differential gain needed to achieve 1W dissipation in an 8Ω load is found using Equation (13).
Recommended Printed Circuit
Board Layout
Figures 4 through 8 show the recommended four-layer PC
board layout that is optimized for the 8-pin LQ-packaged
LM4839 and associated external components. This circuit is
designed for use with an external 5V supply and 4Ω speakers.
This circuit board is easy to use. Apply 5V and ground to the
board's VDD and GND pads, respectively. Connect 4Ω speakers between the board's −OUTA and +OUTA and OUTB and
+OUTB pads.
(12)
Thus, a minimum overall gain of 2.83 allows the LM4839's to
reach full output swing and maintain low noise and THD+N
performance.
The last step in this design example is setting the amplifier's
−3dB frequency bandwidth. To achieve the desired ±0.25dB
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200134 Version 5 Revision 5
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Use a 0.39μF capacitor, the closest standard value.
(11)
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(15)
The result is
(10)
VDD ≥ (VOUTPEAK+ (VODTOP + VODBOT))
fL = 100Hz/5 = 20Hz
Print Date/Time: 2011/09/24 09:56:40
LM4839
20013478
FIGURE 3. Recommended LQ PC Board Layout:Component-Side Silkscreen
20013479
FIGURE 4. Recommended LQ PC Board Layout:Component-Side Layout
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200134 Version 5 Revision 5
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LM4839
20013480
FIGURE 5. Recommended LQ PC Board Layout:
Upper Inner-Layer Layout
20013481
FIGURE 6. Recommended LQ PC Board Layout:
Lower Inner-Layer Layout
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200134 Version 5 Revision 5
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LM4839
20013482
FIGURE 7. Recommended LQ PC Board Layout:
Bottom-Side Layout
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200134 Version 5 Revision 5
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LM4839
Analog Audio LM4839 LLP28 Eval Board (LQ Package)
Assembly Part Number: 980011368-100
Revision: A1
Bill of Material
Item
Part Number
Part Description
1
551011368-001
LM4838 Eval Board PCB etch 1
001
Qty Ref Designator
10
482911368-001
LM4838 28L LLP
1
U4
20
151911368-001
Cer Cap 0.068µF 50V 10%
1206
2
CBB1, CBB2
25
152911368-001
Tant Cap 0.1µF 10V 10% Size 3
= A 3216
CS1, CS2, CV
26
152911368-002
Tant Cap 0.33µF 10V 10%
Size = A 3216
Cin1, Cin2, Cin3, Cin4, (Cin5 CBEEPIN- not seen on Fig 1,
only exists on LQ Demo
Board)
27
152911368-003
Tant Cap 1µF 16V 10% Size = 3
A 3216
CB, C01, C02
28
152911368-004
Tant Cap 10µF 10V 10% Size 1
= C 6032
CS3
29
152911368-005
Tant Cap 220µF 16V 10% Size 2
= D 7343
Cout1, Cout2
30
472911368-001
Res 150Ohm 1/8W 1% 1206
2
RL1, RL2
31
472911368-002
Res 20k Ohm 1/8W 1% 1206
10
Rin1, Rin2, RF1, RF2
5
Remark
Rl1, Rl2, RBS1, RBS2
Rdock1, Rdock2
32
472911368-003
Res 100k Ohm 1/8W 1% 1206 2
RS, RPU
33
472911368-004
Res 200k Ohm 1/16W 1% 0603 2
Rbeep1, Rbeep2
40
131911368-001
Stereo Headphone Jack W/
Switch
1
U2
Mouser #
161-3500
41
131911368-002
Slide Switch
4
Mode, Mute, Gain, SD
Mouser #
10SP003
42
131911368-003
Potentiometer
1
U1
Mouser #
317-290-100K
43
131911368-004
RCA Jack
3
RightIn, BeepIn, LeftIn
Mouser #
16PJ097
44
131911368-005
Banana Jack, Black
3
GND, Right Out-, Left Out-
Mouser #
ME164-6219
45
131911368-006
Banana Jack, Red
3
Vdd, Right Out+, Left Out+
Mouser #
ME164-6218
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200134 Version 5 Revision 5
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LM4839
Recommended Printed Circuit
Board Layout - MT/MTE Packages
20013484
Top Layer SilkScreen + Pad - ( Not to Scale )
20013485
Top Layer - ( Not to Scale )
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200134 Version 5 Revision 5
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LM4839
20013486
Layer 2 - ( Not to Scale )
20013487
Layer 3 - ( Not to scale )
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200134 Version 5 Revision 5
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LM4839
20013488
Bottom Layer - ( Not to scale )
Analog Audio LM4839 MSOP Eval Board
Assembly Part Number: 980011373-100
Revision: A
Bill of Material
Item Part Number
Part Description
Qty Ref Designator (on PCB) Remark
1
551011373-001 LM4839 Eval Board PCB etch 001
1
10
482911373-001 LM4839 MSOP
1
20
151911368-001 Cer Cap 0.068µF 50V 10% 1206
2
CBB (2)
25
152911368-001 Tant Cap 0.1µF 10V 10% Size = A 3216
2
CS (2)
26
152911368-002 Tant Cap 0.33µF 10V 10% Size = A 3216 4
CIN (4)
27
152911368-003 Tant Cap 1µF 16V 10% Size = A 3216
1
CBYPASS
28
152911368-004 Tant Cap 10µF 10V 10% Size = C 6032
1
CS1
29
152911368-005 Tant Cap 220µF 16V 10% Size = D 7343
2
COUT R, COUT L
30
472911368-001 Res 1KΩ 1/8W 1% 1206
2
RL (2)
31
472911368-002 Res 20K Ohm 1/8W 1% 1206
8
RIN, RF
32
472911368-003 Res 100K Ohm 1/8W 1% 1206
2
R5, RPU
33
472911368-004 Res 200K Ohm 1/16W 1% 0603
4
RBEEP (R)
40
131911368-001 Stereo Headphone Jack W/ Switch
1
41
131911368-002 Slide Switch
4
mute, max,SD, BASS
Mouser # 10SP003
42
131911368-003 Potentiometer
1
Volume Control
Mouser # 317-2090-100K
43
131911368-004 RCA Jack
5
Mouser # 16PJ097
44
131911368-005 Banana Jack, Black
3
Mouser # ME164-6219
45
131911368-006 Banana Jack, Red
3
Mouser # ME164-6218
Mouser # 161-3500
31
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www.national.com
LM4839
Physical Dimensions inches (millimeters) unless otherwise noted
LLP Package
Order Number LM4839LQ
NS Package Number LQA028AA For Exposed-DAP LLP
www.national.com
32
200134 Version 5 Revision 5
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LM4839
TSSOP Package
Order Number LM4839MT
NS Package Number MTC28 for TSSOP
Exposed-DAP TSSOP Package
Order Number LM4839MTE
NS Package Number MXA28A for Exposed-DAP TSSOP
33
200134 Version 5 Revision 5
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LM4839 Stereo 2W Audio Power Amplifiers with DC Volume Control, Bass Boost, and Input Mux
Notes
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